1.3 Contact Information and Support ............................................................................................................. 6
1.4 Text Conventions ..................................................................................................................................... 6
1.6 Related Documents ................................................................................................................................. 7
2.5 Power Modes ........................................................................................................................................... 8
LS Power Mode ................................................................................................................................ 9
DS Power Mode ............................................................................................................................... 9
DH0 Power Mode ............................................................................................................................. 9
DH1 Power Mode ............................................................................................................................. 9
DH2 Power Mode ............................................................................................................................. 9
PSM Current Draw ........................................................................................................................... 9
eDRX Current Draw ........................................................................................................................ 10
2.6 Certification and Regulatory ................................................................................................................... 11
2.7 Power Supply Range ............................................................................................................................. 11
2.8 Temperature Range ............................................................................................................................... 11
3 Power ....................................................................................................................................................................... 22
3.1 Power Up Sequence .............................................................................................................................. 22
3.2 Power Down Sequence .......................................................................................................................... 22
3.3 Power Supply Scenarios (by Battery Type) ............................................................................................ 22
6.1 Main Antenna ......................................................................................................................................... 25
6.2 MIPI RFFE for Antenna Tuning .............................................................................................................. 26
8.1 FCC Test Data........................................................................................................................................ 29
8.2 ISED Test Data....................................................................................................................................... 29
Table 2 Power supply range ............................................................................................................................................. 11
Table 3 Temperature range .............................................................................................................................................. 11
Table 5 I/Os with PU/PD ................................................................................................................................................... 21
Table 6 Special UART signals for certification/testing ..................................................................................................... 22
Table 7 PMU system signals ............................................................................................................................................ 23
This document introduces the Murata Type1SC LTE CatM1/NB1 module and presents some possible and
recommended guidelines for developing new products based on this module. The information given should be
used as a guide and a starting point for properly developing products with the Murata module.
1.2 Audience
This document is intended for Murata customers, especially system architects and HW engineers, to design
products based on the Murata Type1SC module.
1.3 Contact Information and Support
For general contact, technical support services, technical questions and report documentation errors contact
Murata Technical Support at techhelp@murata.com
Please keep us informed of your comments and suggestions for improvements. Murata will take into
consideration any and all feedback from the users of this information.
1.4 Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.
Caution/Warning
Alerts the user to important points about using the product; if these points are not followed, the product
and end user equipment may fail or malfunction.
Tip/Information – Provides advice and suggestions that may be useful when using the product.
Type1SC is Murata’s new LTE series for IoT applications. The module can be used as a wireless communication
front-end for wearable products, offering mobile communication features to an external host CPU through its
interfaces.
Note: NB1 will be supported in a future firmware release.
2.1 High Level Block Diagram
The following block diagram illustrates the module which contains the ALT1250 LTE Cat M1/NB1 SoC, RF FEM,
128 MBits flash and clocks.
Figure 1 Module block diagram
2.2 Supported bands
The module supports the following bands:
Table 1 Supported bands
ASEAN
2.3 Tx Output Power
The LTE bands in the 1SC module meet the 3GPP spec for a Power Class 3 device (23 dBm).
2.4 Rx Sensitivity
The receive sensitivity of the module will be around -103 dBm.
2.5 Power Modes
The 1SC module has the following power modes
•LS: Provides very fast entry and recovery time and is mainly used for very short sleeps. It is used for CDRX
mode during the networking process.
• DS: Provides fast recovery and entry time and is mainly used during the IDRX networking mode.
• DH2: Provides medium entry and recovery time and is mainly used during the EDRX and IDRX networking
modes.
• DH1: Same as DH2, however IO logic is not retained.
• DH05: Provides long entry and recovery times and is mainly used for very long inactivity intervals like PSM.
The IO output values are retained in this mode.
•DH0: Same as DH05, however IO output values are not retained.
The device chooses the described power modes according to the networking state and the maximum allowed chip
power mode configuration.
An application note will be provided to show how to configure the module and the R&S CMW500 to test the different
power modes.
LS Power Mode
Only one of the following pins can be used to wake up the device
• RTC Expiration
• PMU_POWER_BUTTON
• PMU_WAKEUP
• PMU_SHUTDOWN
• AntiTamper
Other digital interface pins can also be configured to wake up the system (up to 10 GPIO’s can be used). Serial
interface pins are not active in this mode
DS Power Mode
This mode is the same as LS, but requires lower power consumption due to the unused reference clock.
The average current draw in this mode of operation is 2.5mA.
DH0 Power Mode
The following occurs in the DH0 power mode:
• All digital logic is powered down
• Memories are not retained
• IO’s are not stored
• The RTC is on
• One of the following dedicated pins is used to wake from this mode:
o RTC Expiration
o PMU_POWER_BUTTON
o PMU_WAKEUP
o PMU_SHUTDOWN
o AntiTamper
The average current draw in this mode of operation is 1.7uA.
DH1 Power Mode
This mode is similar to DH0, however it enables memory retention to store the system sate. A Wakeup event will
only initiate a boot flow in a case of state full configuration
The average current draw in this mode of operation is 48uA.
DH2 Power Mode
This mode is similar to DH1, however it also enables output IOs to latch and wakeup from digital inputs (up to 10
GPIO’s can be used)
The current draw is similar to DH1, but will depend on the extra current draw of the GPIOs.
PSM Current Draw
Currently the PSM mode of operation is not optimized so the current draw will vary. This will be fixed in a future
version of firmware. This figure below represents the worst-case condition (This was tested with RK _50). Current
ideal conditions the average current should be 33.76mA.
eDRX Current Draw
The SIM card will have a major impact on this feature. Network Carriers will support different modes of operation.
The R&S test SIM for the CMW500 does not support SIM deactivation during eDRX cycles. This caused the number
to be significantly greater than a setup with a deactivation mode. The feature below shows result using the
CMW500 test SIM. Under good conditions using a SIM that can be deactivated, the current draw could be as low
as 86uA instead of 377uA for this setup. This setup was using an eDRX cycle of 81.92 s (8 HF).
If not used, all pins except the following should be left disconnected.
Table 5 I/Os with PU/PD
The PMU_VRTC pin must not be used by any external component other than pull-ups for the
PMU_SHUTDOWN and PMU_POWER_BUTTON pins. It is prohibited to use the PMU_VRTC pin for any
other purpose.
The UARTs Port A (20, 21, 22, 74) and Port C (43, 45, 46, 94) signals should be brought out for control and
logging during certification/testing with PC tools.
The battery can supply the entire system (ALT1250 + FEM), without additional external power conditioning circuits.
CR17450 Battery (2.2 ~ 3.0 V)
The ALT1250 can be fully functional without additional external power conditioning circuits. However, the FEM
requires a higher voltage supply, so an external boost circuit is required to supply VBAT_FEM.
Boost converter such as TPS61021A may be turned on/off by the DCDC enable signal, AUX_ADC4 (pin
33, active high).
AA Lithium Battery (1.0 ~ 1.5 V)
For battery range of 1.0 – 1.5 V, both ALT1250 and FEM require an additional boost circuit.
VBAT: ultra low I
synchronous boost converter such as TPS61098x may be used
Q
VBAT_FEM: boost converter such as TPS61021A may be turned on/off by the DCDC enable signal,
AUX_ADC4 (pin 33, active high).
3.4 PMU
ALT1250 includes integrated PMU which supplies current for all ALT1250 blocks, IOs, Flash, TCXO and UICC.
Output
Application Note: LBAD0XX1SC, v0.4 7/1/19 Page 23 of 29 www.murata.com
PMU_SHUTDOWN
This pin has the highest priority compared to other chip functionalities, therefore asserting it will always force a
hard reset
3.4.1.1 External circuitry on PMU_SHUTDOWN
There are three use cases for PMU_SHUTDOWN pin connection:
1. Controlled by external host.
2. Controlled by mechanical switch.
3. Not used.
3.4.1.2 PMU_SHUTDOWN connected to external host
In this use case it is the responsibility of the host to drive this pin with proper voltage at all times (1.8V/0V).
In case of internal pull at the host IO, it is recommended to disable it when driving this pin to GND.
LTE CAT-M1/NB1 ALT1250 Based Chipset Power
Altair Semiconductor Proprietary and Confidential 45
3.4.1.3 PMU_SHUTDOWN connected to mechanical switch
In this case, when button is not pushed, the pin can be pulled up either by external 1.8V source or by PMU_VRTC.
If current during the time when button is pushed is a concern then some pullup disconnection circuitry should be
externally triggered when PMU_SHUTDOWN pin is being directed to GND
3.4.1.4 PMU_SHUTDOWN is not used
In this case PMU_SHUTDOWN pin should be tied directly to PMU_VRTC
This pin requires an external PU resistor, please see Table 5 more information.
The host connected to this pin should always keep the state of this pin (high/low) at a known state (not
floating) according to the required functionality.
PMU_POWER_BUTTON
This pin requires an external PU resistor, please see Table 5 more information.
The host connected to this pin should always keep the state of this pin (high/low) at a known state (not
floating) according to the required functionality.
PMU_WAKEUP
This pin wakes-up the system from low power state.
4 SIM Interface
Since all digital IOs in Type1SC are in 1.8V domain, the module will support 1.8V SIM cards (Class-C).
For 3.0V SIM card support, an external voltage translator will be required.
5 Host Interface
Type1SC uses the following signals for the host interface. The UART interface is necessary for communication
between the host and Type1SC.
The device reset status signal can be used by the host to detect that the modem has completed a reset so
that the host can properly reset its internal state.
The module has been FCC/IC/ETSI certified. However, since this is a module that does not have an RF
connector, an FCC Class 2 Permissive Change will be required to add the antenna to the grant.
6.1 Main Antenna
The antenna connection and board layout design are the most important aspect in the full product design as they
strongly affect the product overall performances, hence read carefully and follow the requirements and the
guidelines for a proper design. The antenna and antenna transmission line on PCB for a Type 1SC device shall
fulfill the following requirements:
Maximum permitted antenna gain including cable loss should be determined from Tables 8.1 and 8.2. Failure to
follow these guidelines wil result in radiated RF levels that exceed FCC MPE limits.
6.2 MIPI RFFE for Antenna Tuning
MIPI RFFE, is a dedicated control interface for the RF front-end subsystem. This interface allows antenna
designer to optimize antenna performance for different LTE bands. They can tune the antenna for different bands
by using a compliant MIPI RFFE switch. Currently the module only supports the Sony Switch (CXA4472GC-E).
The following signals are used for the MIPI interface.
RFFE_SCLK, RFFE_SDATA, RFFE_VDDIO_OUT
6.3 GPS Coexistence
Two pins are provided for GPS coexistence. AUX_ADC1 is used for GNSS coexistence indicator and
FLASH0_CS_N1 is used for GNSS SFN indication.
Other advanced GPS coexistence features will be available in a future firmware release.
7 APPLICATION PCB DESIGN
The Type 1SC modules have been designed to be compliant with a standard lead-free SMT process.
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Temperature (TL)
TBD
TBD
TBD
Antenna Installation Guidelines
• Install the antenna in a place covered by the LTE signal.
• If the device antenna is located farther than 20cm from the human body and there are no co-located
transmitter then the Murata FCC/IC approvals can be re-used by the end product.
• If the device antenna is located closer than 20cm from the human body or there are co-located transmitter
then the additional FCC/IC testing may be required for the end product (Murata FCC/IC approvals cannot
be reused).
• Antenna shall not be installed inside metal cases.
• Antenna shall be installed also according to antenna manufacturer instructions.
PCB Design Guidelines
When using the Type 1SC, since there's no antenna connector on the module, the antenna must be connected to
the Type 1SC antenna pad by means of a transmission line implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the Type 1SC, then a PCB line is needed
in order to connect with it or with its connector.
This transmission line shall fulfil the following requirements:
The transmission line should be designed according to the following guidelines:
• Ensure that the antenna line impedance is 50 ohm;
• Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less than 0.3
dB;
• Antenna line must have uniform characteristics, constant cross section; avoid meanders and abrupt
curves;
• Keep, if possible, one layer of the PCB used only for the Ground plane;
• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other signal
• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing
vias every 2mm at least;
• Place EM noisy devices as far as possible from Type 1SC antenna line;
• Keep the antenna line far away from the Type 1SC power supply lines;
• If you have EM noisy devices around the PCB hosting the Type 1SC, such as fast switching ICs, take
care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with
Ground planes, or shield it with a metal frame cover.
• If you don't have EM noisy devices around the PCB of Type 1SC, by using a micro strip on the superficial
copper layer for the antenna line, the line attenuation will be lower than a buried one;
Transmission line design
The placement of components has been chosen properly, to keep the line length as short as possible, thus leading
to lowest power losses possible.
This device has Single Modular Approval. This device is approved for mobile and fixed use with respect to RF
exposure compliance, and may only be marketed to OEM installers. The antenna(s) used for this transmitter, as
described in this filing, must be installed to provide a separation distance of at least 20 cm from all persons.
Installers and end-users must be provided with operating conditions for satisfying RF exposure
compliance. Maximum permitted antenna gain including cable loss should be determined from tables 8.1 and 8.2.
Failure to follow these guidelines will result in radiated RF levels that exceed FCC MPE limits