Page 1
Wi-Fi Network Controller Module
SyChip SN8200
User Manual
And Datasheet
Version: 0.61
February 7, 2012
Note: SyChip, LLC. reserves the right to make changes in specifications at any time and without notice. The
information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed
by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license
is generated under any rights of SyChip or its supporters unless specifically agreed.
Page 2
Table of Contents
1 SYSTEM DESCRIPTIONS ..................................................................................................................................... 5
1.1 A
1.2 M
1.3 B
1.4 A
PPLICATIONS
ODULE SUMMARY
LOCK DIAGRAM
CRONYMS
........................................................................................................................................................ 5
............................................................................................................................................................. 6
............................................................................................................................................... 5
................................................................................................................................................... 6
2 MECHANICAL SPECIFICATIONS ..................................................................................................................... 7
2.1 M
2.2 M
2.3 M
2.4 M
ODULE DIMENSION
ODULE TOP AND SIDE VIEW
ODULE FOOTPRINT (TOP VIEW
ODULE PIN-OUT
.............................................................................................................................................. 7
................................................................................................................................. 7
................................................................................................................................................... 9
) ............................................................................................................................ 8
3 DC ELECTRICAL SPECIFICATIONS .............................................................................................................. 11
3.1 T
YPICAL POWER CONSUMPTION
........................................................................................................................... 11
4 RF SPECIFICATIONS .......................................................................................................................................... 12
4.1 DC/RF C
4.2 DC/RF C
4.3 DC/RF C
HARACTERISTICS FOR
HARACTERISTICS FOR
HARACTERISTICS FOR
IEEE 802.11B ..................................................................................................... 12
IEEE 802.11G ..................................................................................................... 13
IEEE 802.11N ..................................................................................................... 14
5 ENVIRONMENTAL SPECIFICATIONS ........................................................................................................... 15
5.1 A
5.2 R
BSOLUTE MAXIMUM RATINGS
ECOMMENDED OPERATING CONDITIONS
............................................................................................................................ 15
............................................................................................................ 15
6 APPLICATION INFORMATION........................................................................................................................ 16
6.1 E
XTERNAL DIGITAL INTERFACES
.......................................................................................................................... 16
6.1.1 Reference connection for UART host interface .......................................................................................... 16
6.1.2 Reference connection for the SPI host interface ........................................................................................ 17
6.2 R
6.3 H
6.4 M
ECOMMENDED HOST (CUSTOMER) CIRCUIT BOARD
OST
PCB
LAYOUT RECOMMENDATIONS
ODULE LOCATION
............................................................................................................................................. 19
............................................................................................................. 18
PCB
PATTERN
..................................................................... 18
6.4.1 Location in x-y plane .................................................................................................................................. 20
6.4.2 Location in z-plane ..................................................................................................................................... 20
7 ASSEMBLY INFORMATION ............................................................................................................................. 21
7.1 L
EAD-FREE SOLDERING REFLOW PROFILE
............................................................................................................. 21
8 PACKAGING AND MARKING INFORMATION ............................................................................................ 22
8.1 C
8.2 M
ARRIER TAPE DIMENSIONS
ODULE MARKING INFORMATION
................................................................................................................................. 22
....................................................................................................................... 22
9 ORDERING INFORMATION ............................................................................................................................. 23
10 ROHS DECLARATION ........................................................................................................................................ 23
11 REGULATORY INFORMATION ....................................................................................................................... 23
11.1 FCC N
11.2 FCC L
11.3 RF E
11.4 IC N
11.5 IC L
11.6 CE N
OTICE
(USA) ........................................................................................................................................ 23
ABELING REQUIREMENTS
XPOSURE
OTICE (CANADA
ABELING REQUIREMENTS
OTICE (EUROPE
.................................................................................................................................................. 24
) ...................................................................................................................................... 24
) ...................................................................................................................................... 25
...................................................................................................................... 24
......................................................................................................................... 25
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Page 3
11.7 CE L
ABELING REQUIREMENTS
........................................................................................................................ 25
12 TECHNICAL SUPPORT CONTACT ................................................................................................................. 26
13 DISCLAIMER ........................................................................................................................................................ 26
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Page 4
LIST OF FIGURES
F
IGURE 1
F
IGURE 2 MODULE TOP AND SIDE VIEW
F
IGURE 3 DETAILED MECHANICAL DATA (TOP VIEW
F
IGURE 4
F
IGURE 5
F
IGURE 6 RECOMMENDED HOST (CUSTOMER)
F
IGURE 7 RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE
F
IGURE 8 RECOMMENDED LOCATIONS IN XY-PLANE
F
IGURE 9 LOCATIONS NOT RECOMMENDED IN XY-PLANE
F
IGURE 10 RECOMMENDED LOCATIONS IN Z-PLANE
F
IGURE 11 LOCATIONS NOT RECOMMENDED IN XY-PLANE
F
IGURE 12 REFLOW PROFILE PATTERN
F
IGURE 13 CARRIER TAPE DIMENSIONS
F
IGURE 14 MODULE MARKING DETAIL
SN8200 M
UART H
SPI H
ODULE BLOCK DIAGRAM
OST INTERFACE REFERENCE DIAGRAM
OST INTERFACE REFERENCE DIAGRAM
.............................................................................................................................. 21
............................................................................................................................. 22
.............................................................................................................................. 22
..................................................................................................................... 6
.............................................................................................................................. 7
) .......................................................................................................... 8
................................................................................................. 16
...................................................................................................... 17
PCB P
ATTERN
............................................................................................ 18
.......................................................................................................... 20
.................................................................................................. 20
........................................................................................................... 20
................................................................................................ 20
LIST OF TABLES
T
ABLE 1 MODULE CONNECTOR SIGNAL DESCRIPTION
T
ABLE 2 TYPICAL POWER CONSUMPTION
T
ABLE 3
T
ABLE 4
T
ABLE 5
T
ABLE 6 ABSOLUTE MAXIMUM RATING
T
ABLE 7 RECOMMENDED OPERATING CONDITIONS
T
ABLE 8 REFLOW PROFILE RECOMMENDATION
DC/RF C
DC/RF C
DC/RF C
HARACTERISTICS FOR
HARACTERISTICS FOR
HARACTERISTICS FOR
.......................................................................................................................... 11
IEEE 802.11B .................................................................................................... 12
IEEE 802.11G ..................................................................................................... 13
IEEE 802.11N ..................................................................................................... 14
............................................................................................................................ 15
........................................................................................................ 9
........................................................................................................... 15
................................................................................................................. 21
..................................................... 19
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Page 5
1 System Descriptions
1.1 Applications
SN8200 is a complete low power self-contained embedded wireless solution to address the
connectivity demand in M2M applications. It integrates micro-controller, Wi-Fi BB/MAC/RF IC,
RF front end, clocks, and on-board antenna into a small form factor module. SN8200 can be
controlled by a host device through a serial interface; it can also serve as a standalone Wi-Fi
station or network controller. Thus, it can be used to enable wireless connectivity to the simplest
products with minimal engineering resources.
The SN8200 provides standard IEEE802.11 b/g/n functions. The integrated MCU supports
Broadcom WICED™ software. It can be used for a variety of different applications, such as
wireless sensor node, serial to Wi-Fi transceiver, Wi-Fi network controller, Wi-Fi gateway/bridges
plus internet server.
When used in a system where the SN8200 is controlled by a host CPU, the serial host interface
makes it very easy to integrate. When used in a system without a host CPU, the integrated ARM
Cortex-M3 can be used to run a variety of applications.
The SN8200 Wi-Fi module can be used for Wi-Fi gateway if combined with other radio module.
For example, one can design a Zigbee Wi-Fi gateway by combine SN8200 with SyChip SN3020
Zigbee module. SyChip provides a reference design to enable the OEM customer. This gateway
design can be used for low cost and low power consumption applications like Home Area
Networks.
1.2 Module Summary
• 2.4GHz IEEE 802.11b/g/n radio technology
• Dimension: 30.5 mm × 19.4 mm × 2.8 mm
• On-board antenna
• Transmit power: +17 dBm @ b mode/11Mbps
• Max receive sensitivity: -96dBm
• MCU: ARM Cortex-M3
• Diverse serial interface: UART, SPI
• Sensor applications support: ADC, DAC, I2C, GPIO
• Operating temperature range: -30ºC to 85ºC
• RoHS compliant
• MSL Level 3
• FCC/IC certified; CE compliant
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1.3 Block Diagram
Figure 1 SN8200 Module Block Diagram
1.4 Acronyms
ADC Analog to Digital Converter
GPIO General-Purpose Input-Output
I2C Intelligent Interface Controller
ISM Industrial, Scientific and Medical
MAC Medium Access Control
MSL Moisture Sensitivity Level
PER Packet Error Rate
ROHS Restriction of Hazardous Substances
SPI Serial Peripheral Interface
UART Universal Asynchronous Receiver-Transmitter
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2 Mechanical Specifications
2.1 Module dimension
Parameter Typical Units
Dimension (LxWxH) 30.5 x 19.4 x 2.8 mm
Dimension tolerances (LxWxH) ±0.2 mm
2.2 Module top and side view
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Figure 2 Module Top and Side View
Page 8
2.3 Module footprint (top view)
Figure 3 Detailed Mechanical Data (top view)
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2.4 Module Pin-out
Pin # Pin name I/O Description
1 GND - Ground
Table 1 Module Connector Signal Description
2
OSC32_IN
3 OSC32_OUT I/O 32KHz Crystal output
4 WIFI_VDD_EN I/O Enable Wi-Fi VDD
5 ADC3 I/O General purpose I/O or ADC3
6 ADC4 I/O General purpose I/O or ADC4
7 ADC5 I/O General purpose I/O or ADC5
8 VDD PI DC supply for MCU and I/O
9 ADC6 I/O General purpose I/O or ADC6
10 DAC2 I/O General purpose I/O or DAC2
11 DAC1 I/O General purpose I/O or DAC1
12 ADC1 I/O General purpose I/O or ADC1
13 Reserved - No connect
14 Reserved - No connect
15 GND - Ground
16 GND - Ground
17 GND - Ground
18 GND - Ground
I/O 32KHz Crystal input
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19 GND - Ground
20 GND - Ground
21 GND - Ground
22 GND - Ground
23 GND - Ground
24 GND - Ground
25 GND - Ground
26 VDD_WIFI_IN PI Wi-Fi power supply
27 Reserved - No connect
28 Reserved - No connect
29 Reserved - No connect
30 WIFI_SLEEP_CLK_IN I 32KHz Wi-Fi sleep clock input
Page 10
Pin # Pin name I/O Description
31 GND - Ground
32 UART_TX I/O General purpose I/O or UART_TX
33 UART_RX I/O General purpose I/O or UART_RX
34 UART_CTS I/O General purpose I/O or UART_CTS
35 UART_RTS I/O General purpose I/O or UART_RTS
36 JTMS I/O General purpose I/O or JTMS
37 JTDI/SPI_NSS I/O General purpose I/O or JTDI or SPI_NSS
38 JTCK I/O General purpose I/O or JTCK
39 Ground - Ground
40 JTDO/SPI_SCK I/O General purpose I/O or JTDO or SPI_SCK
41
42 SPI_MOSI I/O General purpose I/O or SPI_MOSI
43 I2C_SCL I/O General purpose I/O or I2C_SCL
44 I2C_SDA I/O General purpose I/O or I2C_SDA
45
46 ADC2 I/O General purpose I/O or ADC2
47 MICRO_RST_N I Module reset
48
49 GND - Ground
51 GND
52 GND
53 GND
54 GND
55 GND
56 GND
JTRST/SPI_MISO
BOOT
VBAT
I/O General purpose I/O or JTRST or
SPI_MISO
Normal operation if connected to ground
-
at power up.
Power supply for backup circuitry when
PI
VDD is not present
- Ground
- Ground
- Ground
- Ground
- Ground
- Ground
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57 GND
58 GND
59 GND
60 GND
61 Reserved - No connect
62 GND - Ground
- Ground
- Ground
- Ground
- Ground
Page 11
3 DC Electrical Specifications
3.1 Typical Power Consumption
Condition: 25C, includes both Wi-Fi chip and microcontroller
Table 2 Typical Power Consumption
Item Condition
Values Units
Min Typ Max
11b
11g
11n
Receive mode
Transmit mode
(1024 byte, 20usec
interval)
Receive mode
Transmit mode
(1024 byte, 20usec
interval)
Receive mode
Transmit mode
(1024 byte, 20usec
interval)
110
11Mbps
310
110 mA
54Mbps
210 mA
110
MCS7
200
mA
mA
mA
mA
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4 RF Specifications
4.1 DC/RF Characteristics for IEEE 802.11b
Conditions: 25deg.C, VDD_WIFI_IN=3.6V, VDD= 3.3V (11Mbps mode unless otherwise
specified.)
Measured at 50Ω terminal load connected to the RF connector
Table 3 DC/RF Characteristics for IEEE 802.11b
Parameters Specification
Modulation DSSS/CCK
Physical layer data rate 1,2,5.5,11Mbps
RF Characteristics Min Typ. Max. Unit
Frequency range 2400 -- 2483.5 MHz
Carrier frequency error -20 -- +20 ppm
Transmit output power 17 -- dBm
Spectrum mask
1st side lobes -- -- -30 dBr
2nd side lobes -- -- -50 dBr
Power-on and Power-down ramp -- -- 2 usec
RF Carrier Suppression 15 -- -- dBc
Modulation accuracy (EMV) -- -- 35 %
Outband spurious emissions
30MHz to 1GHz (BW=100KHz) -96 dBm
1GHz to 12.75GHz (BW=1MHz)
1.8GHz to 1.9GHz (BW=1MHz)
5.15GHz to5.3GHz (BW=1MHz)
Receive sensitivity
1Mbps (FER≤ 8%) -- -96 -94 dBm
11Mbps (FER≤ 8%) -- -88 -86
Maximum input level (FER≤ 8%) -9.5 -- -- dBm
Adjacent channel rejection (FER≤ 8%) 35 dB
-41 dBm
-65 dBm
-85 dBm
dBm
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4.2 DC/RF Characteristics for IEEE 802.11g
Conditions: 25deg.C, VDD_WIFI_IN=3.6V, VDD= 3.3V (54Mbps mode unless otherwise
specified.)
Measured at 50Ω terminal load connected to the RF connector
Table 4 DC/RF Characteristics for IEEE 802.11g
Parameters Specification
Standard conformance IEEE 802.11 g
Modulation OFDM
Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps
RF Characteristics Min Typ. Max. Unit
Frequency range 2400 -- 2483.5 MHz
Carrier frequency error -20 -- +20 ppm
Transmit output power 13.5 -- dBm
Spectrum mask
9MHz to 11MHz (0dB ~ -20dB) 0 - dB
11MHz to 20MHz (-20dB ~ -28dB) 0 - dB
20MHz to 30MHz (-28dB ~ -40dB) 0 - dB
30MHz to 33MHz (-40dB) 0 - dB
Constellation Error (EVM) -- -- -25 dB
Outband spurious emissions
30MHz to 1GHz (BW=100KHz) -96 dBm
1GHz to 12.75GHz (BW=1MHz)
1.8GHz to 1.9GHz (BW=1MHz)
5.15GHz to5.3GHz (BW=1MHz)
Received sensitivity
6Mbps (PER≤ 10%) -- -89 -87 dBm
54Mbps (PER ≤ 10%) -- -74 -72 dBm
Maximum input level (PER ≤ 10%) -13 -- -- dBm
Adjacent channel rejection (PER ≤ 10%) -1 dB
-41 dBm
-65 dBm
-85 dBm
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4.3 DC/RF Characteristics for IEEE 802.11n
Conditions: 25deg.C, VDD_WIFI_IN=3.6V, VDD= 3.3V (65Mbps mode unless otherwise
specified.)
Measured at 50Ω terminal load connected to the RF connector
Table 5 DC/RF Characteristics for IEEE 802.11n
Parameters Specification
Standard conformance IEEE 802.11 n
Modulation OFDM
Data rate 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
RF Characteristics Min Typ. Max. Unit
Frequency range 2400 -- 2483.5 MHz
Carrier frequency error -20 -- +20 ppm
Power level 12.5 -- dBm
Spectrum mask
9MHz to 11MHz (0dB ~ -20dB) 0 - dB
11MHz to 20MHz (-20dB ~ -28dB) 0 - dB
20MHz to 30MHz (-28dB ~ -45dB) 0 - dB
30MHz to 33MHz (-45dB) 0 - dB
Constellation Error (EVM) -- -- -28 dB
Outband spurious emissions
30MHz to 1GHz (BW=100KHz) -96 dBm
1GHz to 12.75GHz (BW=1MHz)
1.8GHz to 1.9GHz (BW=1MHz)
5.15GHz to5.3GHz (BW=1MHz)
Received sensitivity
65Mbps (PER ≤ 10%) -- -71 -69 dBm
Maximum input level (PER ≤ 10%) -13 dB
Adjacent channel rejection (PER ≤ 10%) -2 dB
-41 dBm
-65 dBm
-85 dBm
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5 Environmental Specifications
5.1 Absolute maximum ratings
Table 6 Absolute Maximum Rating
Symbol Description Min Max Unit
Top
Tst
VDD Power supply 0 4.0 V
VBAT
VDD_WiFi Wi-Fi Power supply 0 6.0 V
RFin RF input power 0 dBm
MSL Moisture Sensitivity Level 3
RoHS Restriction of Hazardous Substances Compliant
Operating temperature -30 85
Storage temperature -40 85
Power supply for backup circuitry
when VDD is not present
5.2 Recommended Operating Conditions
Table 7 Recommended Operating Conditions
VDD 2.4 3.3 3.6
VBAT 2.0 3.3 3.6
VDD_WiFi 3.4 3.6 4.0
Min (V) Typical (V) Max (V)
°C
°C
0 4.0 V
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6 Application Information
6.1 External digital interfaces
6.1.1 Reference connection for UART host interface
Figure 4 illustrates the connections between SN8200 module and the host MCU via UART
interface. A level shifter may be needed if the host UART interface level does not match with
SN8200.
Figure 4 UART Host Interface Reference Diagram
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Page 17
6.1.2 Reference connection for the SPI host interface
Figure 5 illustrates the connections between SN8200 module and the host MCU via SPI interface.
Figure 5 SPI Host Interface Reference Diagram
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6.2 Recommended host (customer) circuit board PCB pattern
Figure 6 Recommended Host (customer) PCB Pattern
6.3 Host PCB layout recommendations
The SN8200 module has an onboard antenna therefore it requires careful host PCB layout
underneath the module such that the radio can achieve its best RF performance. Refer to Figure 7
for the requirements.
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Page 19
Figure 7 Recommended Host Circuit Board Design underneath the Module
Notes:
1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of the
customer circuit board should be free of any metal objects. Specifically, there should be no
ground plane, traces or metal shield case.
2. The area in ‘Zone2’ on the top layer of the customer circuit board should have ground only
with no signal traces.
6.4 Module Location
For optimum EIRP, customer is advised to use the recommended module location on their host
circuit board.
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Page 20
Metal
6.4.1 Location in x-y plane
Antenna
Antenna Connector
No GND in this area (See Fig.8)
Shield Case
6.4.2 Location in z-plane
Module
Figure 8 Recommended Locations in xy-plane
Figure 9 Locations Not Recommended in xy-plane
Metal
Antenna Connector Antenna
Mother Board
Page 20 of 28 SN8200 User Manual and Datasheet v0.61
Figure 10 Recommended Locations in z-plane
Metal
Metal
Metal
Figure 11 Locations Not Recommended in xy-plane
Page 21
7 Assembly Information
7.1 Lead-free soldering reflow profile
The lead-free solder reflow profile is recommended in the table & graph below. The profile is
used to attach the module to its host PCB.
The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to the
module weight.
Table 8 Reflow Profile Recommendation
Ramp up rate 3oC/second max
Maximum time maintained above 217oC 120 seconds
Peak temperature 250oC
Maximum time within 5oC of peak temperature 20 seconds
Ramp down rate 6oC/second max
Reflow Profile
250
200
150
100
Temperature, C
50
0
Time, seconds
Figure 12 Reflow Profile Pattern
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8 Packaging and Marking Information
8.1 Carrier Tape Dimensions
Figure 13 Carrier Tape Dimensions
8.2 Module Marking Information
The following marking information may be printed on a permanent label affixed to the module
shield or permanently laser written into the module shield itself. The 2D barcode is used for
internal purposes. A pin 1 ID is stamped into the shield.
Figure 14 Module Marking Detail
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9 Ordering Information
Table 9 Ordering Information
SyChip Model
Product
Evaluation Development Kit SN8200EVK 88-00151-85 1 pc
Module in Tape & Reel SN8200 88-00151-00 400 pcs
Number
SyChip Part
Number
Standard Order
Increment
10 RoHS Declaration
To the best of our present knowledge, given our supplier declarations, this product does not contain
substances that are banned by Directive 2002/95/EC or contain a maximum concentration of 0.1%
by weight in homogeneous materials for
• Lead and lead compounds
• Mercury and mercury compounds
• Chromium (VI)
• PBB (polybrominated biphenyl)
• PBDE (polybrominated biphenyl ether)
And a maximum concentration of 0.01% by weight in homogeneous materials for
• Cadmium and cadmium compounds
11 Regulatory Information
SN8200 has obtained the certifications described below.
11.1 FCC Notice (USA)
This device complies with Part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
The FCC requires the OEM to be notified that any changes or modifications not expressly approved
by SyChip, LLC may void the user’s authority to operate the equipment. While an application of the
SN8200 module in a product is not required to obtain a new FCC authorization for the module, this
does not preclude the possibility that some other form of authorization or testing may be required for
that end product.
This device using the integrated antenna has been tested to comply with FCC CFR Part 15. The
device meets the requirements for modular transmitter approval as detailed in the FCC public notice
DA00.1407.
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Page 24
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures: reorient or relocate the receiving antenna, increase the separation between the equipment
and receiver, connect the equipment into an outlet on a circuit different from that to which the
receiver is connected, or consult the dealer or an experienced radio/TV technician for help.
11.2 FCC Labeling Requirements
When integrating the SN8200 into a product the FCC labeling requirements must be met. This
includes a clearly visible label on the outside of the finished product specifying the SN8200 FCC
identifier (FCC ID:QPU8200) as well as the notice above. The exterior label can use wording such
as “Contains Transmitter Module FCC ID:QPU8200” or “Contains FCC ID:QPU8200” although
any similar wording that expresses the same meaning may be used.
11.3 RF Exposure
This module has been certified for remote and base radio applications and is not intended to be
operated within 20cm of the body. If the module will be used for portable applications, the device
must undergo SAR testing.
The following statement must be included as a CAUTION statement in manuals for the products to
alert users on FCC RF exposure compliance:
“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a
separation distance of 20cm or more should be maintained between the antenna of this device and
persons during operation. To ensure compliance, operations at closer distances than this are not
recommended.”
11.4 IC Notice (Canada)
The term “IC” before the certification/registration number only signifies that the Industry Canada
technical specifications were met.
Le terme “IC” devant le numéro de certification /d’enregistrement signifie seulement que les
spécifications techniques Industrie Canada ont été respectées.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
The following two conditions: (1) this device may not cause interference, and (2) this device must
accept any interference, including interference that may cause undesired operation of the device.
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Page 25
Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son
utilisation est soumise à Les deux conditions suivantes: (1) cet appareil ne peut pas provoquer
d'interférences et (2) cet appareil doit accepter Toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement du dispositif.
This device complies with Health Canada’s Safety Code 6 / IC RSS-210. The installer of this device
should ensure that RF radiation is not emitted in excess of the Health Canada’s requirement.
Information can be obtained at: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-
lignes_direct-eng.php
Cet appareil est conforme avec Santé Canada Code de sécurité 6 / IC RSS-210. Le programme
d'installation de cet appareil doit s'assurer que les rayonnements RF n'est pas émis au-delà de
l'exigence de Santé Canada. Les informations peuvent être obtenues: http://www.hc-sc.gc.ca/ewhsemt/pubs/radiation/radio_guide-lignes_direct-eng.php
11.5 IC Labeling Requirements
The host device should be properly labeled to identify the module within the host device. The
Industry Canada certification label of a module shall be clearly visible at all times when installed in
the host device, otherwise the host device must be labeled to display the Industry Canada
certification number of the module, preceded by the words “Contains transmitter module”, or the
word “Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC:4523A-SN8200,
where 4523A-SN8200 is the module’s certification number.
11.6 CE Notice (Europe)
This device has been tested and certified for use in the European Union.
If this device is used in a product, the OEM has responsibility to verify compliance of the final
product to the EU standards. A Declaration of Conformity must be issued and kept on file as
described in Annex II of the Radio and Telecommunications Terminal Equipment Directive.
11.7 CE Labeling Requirements
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Please refer to the appropriate marking below:
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Page 26
12 Technical Support Contact
SyChip LLC
2805 Dallas Parkway, Suite 400
Plano, TX 75093
USA
Tel: (972) 202-8900
Fax: (972) 633-0327
Note: SyChip LLC is an operating unit within Murata Wireless Solutions
13 Disclaimer
Please read this notice before using the SN8200 product.
1. Please note that the only warranty that SyChip LLC (“SyChip”) provides regarding the
products is its conformance to the specifications provided herein. Accordingly, SyChip shall not be
responsible for any defects in products or equipment incorporating such products, which are caused
under the conditions other than those specified in this specification.
SYCHIP HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS,
EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF
FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST
INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. YOU AGREE TO INDEMNIFY
AND DEFEND SYCHIP AND ITS AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS
AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION,
ATTORNEY FEES AND COSTS, DUE TO THE USE OF PRODUCTS.
2. The product is designed and manufactured for general applications, and not for any particular
application, so testing and use of the product shall be conducted at your own risk and responsibility.
Specifically, please observe the following:
i) Please conduct validation and verification of the products in actual condition of
mounting and operating environment before commercial shipment of the
equipment.
ii) Please pay attention to minimize any mechanical vibration or shock, not to drop
the product or a substrate that contains the product during transportation.
iii) Since the application of static electricity or overvoltage may cause a defect in the
product or deterioration of its reliability, caution must be taken against exposure
to any static electricity generated by electrified items such as work benches,
soldering irons, tools, carrying containers, etc.
iv) Caution shall be taken to avoid overstress to the product during and after the
soldering process.
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Page 27
v) Since the applied soldering method may deteriorate the reliability, thorough
evaluation is recommended.
vi) In case the product is to be used in equipment or electric circuit that requires high
safety or reliability function or performance, sufficient reliability evaluation
checks for safety shall be performed before commercial shipment and moreover,
due consideration to install a protective circuit is strongly recommended at
customer's design stage. Please provide an appropriate fail-safe function on your
product to prevent any damages that may be caused by the abnormal function or
the failure of our product.
Notwithstanding the foregoing, the product shall not be used in any application listed below which
requires especially high reliability for the prevention of such defect as may directly cause damage to
the third party's life, body or property.
- Aircraft equipment
- Aerospace equipment
- Undersea equipment
- Power plant control equipment
- Medical equipment
- Transportation equipment (vehicles, trains, ships, etc.)
- Traffic signal equipment
- Disaster prevention / crime prevention equipment
- Application of similar complexity and/or reliability requirements to the applications listed in the
above.
3. SyChip’s warranty as provided in Clause 1 above that the products comply with descriptions
expressly specified in the specifications shall be effective for a period of six (6) months from the
date of delivery. SyChip shall not be liable for any defects that occur in dry packed products that are
installed more than six (6) months after shipment.
SyChip’s liability under this warranty shall be limited to products that are returned during the
warranty period to the address designated by SyChip and that are determined by SyChip not to
conform to such warranty. If SyChip elects to repair or replace such products, SyChip shall have
reasonable time to repair such products or provide replacements. Repaired products shall be
warranted for the remainder of the original warranty period. Replaced products shall be warranted
for a new full warranty period.
For avoidance of doubt, SyChip shall not be liable for any defects that are caused by neglect, misuse
or mistreatment by an entity other than SyChip including improper installation or testing, or for any
products that have been altered or modified in any way by an entity other than SyChip. Moreover,
SyChip shall not be liable for any defects that result from your or third party’s design, specifications
or instructions for such products.
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4. Testing and other quality control techniques are used to the extent SyChip deems necessary.
Unless mandated by government requirements, SyChip does not necessarily test all parameters of
each product.
5. End of Life - Please note that we may discontinue the manufacture of products, due to
reasons such as, but not limited to, end of supply of materials and/or components from our suppliers.
Page 28 of 28 SN8200 User Manual and Datasheet v0.61
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