Murata Electronics North America 3020 Users Manual

IEEE802.15.4/ZigBee

Smart Energy Module

SyChip SN3020

User Manual

and Datasheet

Version: 1.0

February 3, 2011

Confidential Information

Note: SyChip, Inc. reserves the right to make changes in specifications at anytime and without notice. The information
furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed b y Sychip fo r
its use, nor any infringements of patents or other righ ts of third parties resulting from its use. No license is generated
under any rights of SyChip or its supporters unless specifically agreed.

Table of Contents

1 SYSTEM DESCRIPTIONS.....................................................................................................................................4

1.1 APPLICATIONS ................................................................................................................................................... 4

1.2 MODULE SUMMARY .......................................................................................................................................... 4

1.3 BLOCK DIAGRAM .............................................................................................................................................. 5

1.4 ACRONYMS........................................................................................................................................................ 5

2 MECHANICAL SPECIFICATIONS.....................................................................................................................6

2.1 MODULE DIMENSION......................................................................................................................................... 6

2.2 MODULE TOP AND SIDE VIEW............................................................................................................................. 6

2.3 MODULE BOTTOM VIEW ..................................................................................................................................... 7

2.4 DETAILED MECHANICAL DATA (TOP VIEW) ........................................................................................................ 8

2.5 MODULE PIN-OUT.............................................................................................................................................. 9

3 DC ELECTRICAL SPECIFICATIONS..............................................................................................................12

3.1 TYPICAL POWER CONSUMPTION ...................................................................................................................... 12

3.2 DIGITAL IO SPECIFICATION ............................................................................................................................. 12

4 RF SPECIFICATIONS..........................................................................................................................................13

5 ENVIRONMENTAL SPECIFICATIONS........................................................................................................... 14

5.1 ABSOLUTE MAXIMUM RATINGS ....................................................................................................................... 14

5.2 OPERATION CONDITIONS.................................................................................................................................. 14

6 APPLICATION INFORMATION........................................................................................................................15

6.1 REFERENCE CONNECTION FOR UART HOST INTERFACE .................................................................................. 15

6.2 REFERENCE CONNECTION FOR THE SPI HOST INTERFACE ................................................................................ 16

6.3 RECOMMENDED HOST (CUSTOMER) CIRCUIT BOARD PCB PATTERN ................................................................ 17

6.4 HOST PCB LAYOUT RECOMMENDATIONS ........................................................................................................ 17

6.5 MODULE LOCATION......................................................................................................................................... 18

6.5.1 Location in x-y plane..................................................................................................................................19

6.5.2 Location in z-plane.....................................................................................................................................19

7 ASSEMBLY INFORMATION .............................................................................................................................20

7.1 LEAD-FREE SOLDERING REFLOW PROFILE ........................................................................................................20

8 PACKAGE INFORMATION ...............................................................................................................................21

8.1 TAPE AND REEL SPECIFICATION ....................................................................................................................... 21

8.2 MODULE MARKING ..........................................................................................................................................22

9 ORDERING INFORMATION .............................................................................................................................23

10 ROHS DECLARATION........................................................................................................................................23

11 REGULATORY INFORMATION.......................................................................................................................23

11.1 FCC NOTICE (USA) ........................................................................................................................................ 23

11.1.1 FCC Labeling Requirements.................................................................................................................24

11.1.2 RF Exposure..........................................................................................................................................24

11.2 IC NOTICE (CANADA)...................................................................................................................................... 25

11.3 CE NOTICE (EUROPE)...................................................................................................................................... 25

12 TECHNICAL SUPPORT CONTACT.................................................................................................................26

13 REFERENCES.......................................................................................................................................................26

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List of Figures

FIGURE 1 SN3020 MODULE BLOCK DIAGRAM ..................................................................................................................... 5

FIGURE 2 MODULE TOP AND SIDE VIEW ..............................................................................................................................6

FIGURE 3 MODULE BOTTOM VIEW ...................................................................................................................................... 7

FIGURE 4 DETAILED MECHANICAL DATA (TOP VIEW) ..........................................................................................................8

FIGURE 5 UART HOST INTERFACE REFERENCE DIAGRAM .................................................................................................15

FIGURE 6 SPI HOST INTERFACE REFERENCE DIAGRAM ......................................................................................................16

FIGURE 7 RECOMMENDED HOST (CUSTOMER) PCB PATTERN ............................................................................................ 17

FIGURE 8 RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE .................................................... 18

FIGURE 9 RECOMMENDED LOCATIONS IN XY-PLANE .......................................................................................................... 19

FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY-PLANE ................................................................................................ 19

FIGURE 11 RECOMMENDED LOCATIONS IN Z-PLANE ........................................................................................................... 19

FIGURE 12 LOCATIONS NOT RECOMMENDED IN XY-PLANE ................................................................................................ 19

FIGURE 13 REFLOW PROFILE PATTERN............................................................................................................................... 20

FIGURE 14 TAPE DIMENSIONS............................................................................................................................................. 21

SyChip/Murata Confidential Page 3 of 26 SN3020 User Manual 1.0

1 System Descriptions

1.1 Applications

SyChip’s SN3020 module is a standard-based wireless transceiver targeting the Smart Energy
market with low power consumption, high transmit power (20 dBm typ.) and high receiver
sensitivity (-103 dBm). It is based upon the IEEE 802.15.4 wireless network specification. The
module can be used to develop applications supporting the ZigBee PRO Smart Energy application
profile. The SN3020 module operates in the 2.4 GHz unlicensed ISM frequency band for
worldwide deployment.

1.2 Module Summary

• Dimensions: 27.20 x 14.75 x 2.90 mm

• Ember EM357 high-performance, integrated ZigBee/802.15.4 chipset

• Supply voltage: 2.4V to 3.4V

• Data logging memory: 8 Mbits serial flash

3

• Security: 128-bit AES

• Antenna: on-module

• Host Interface: SPI, UART

• Meter interface: I2C, GPIO

• ADC ports: 6 x 14-bit

• RoHS compliant

• MSL JEDEC level 3

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(

)

)

1.3 Block Diagram

Antenna

Switch

Connector

Balun

Balun

(ZigBee IC)

EM357

SPI I/F

UART I/F

nRESET

JTAG

SPDT

LPF

PA

LNA

VREG OUT (1.8V

Serial Flash

8Mbit

XTAL

GPIO I/F

(24MHz)

Figure 1 SN3020 Module Block Diagram

1.4 Acronyms

ADC Analog to Digital Converter

AMR Automatic Meter Reading

GPIO General-Purpose Input-Output

I2C Intelligent Interface Controller

ISM Industrial, Scientific and Medical

MAC Medium Access Control

MSL Moisture Sensitivity Level

PER Packet Error Rate

ROHS Restriction of Hazardous Substances

SPI Serial Peripheral Interface

UART Universal Asynchronous Receiver-Transmitter

WPAN Wireless Personal Area Network

SyChip/Murata Confidential Page 5 of 26 SN3020 User Manual 1.0

2 Mechanical Specifications

2.1 Module Dimension

Parameter Typical Units

Dimension (LxWxH) 27.20 x 14.75 x 2.90 mm

Dimension tolerances (LxWxH) ±0.20 x ±0.20 x ±0.15 mm

2.2 Module top and side view

Figure 2 Module Top and Side View

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2.3 Module bottom view

Figure 3 Module Bottom View

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2.4 Detailed mechanical data (top view)

Pin 32

Pin 20

Pin 13

Pin 1

Figure 4 Detailed Mechanical Data (top view)

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