Murata Electronics North America 2100 Users Manual
SN2100
Bluetooth Class 1 Module
User Manual
And Datasheet
Version: 0.62
April 10, 2012
Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The
information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed
by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license
is generated under any rights of SyChip or its supporters unless specifically agreed.
Revision
Date
Author
Change Description
0.1
Jul-07-2011
Release the first datasheet.
0.5
Nov-15-2011
N. Nagayama
Update the block diagram / BT IC product number
Update the SyChip Part Number
0.6
Jan-05-2012
Viet H.
Update the spec table
0.61
Jan-31-2012
Yong Fang
Added disclaimer
0.62
Apr-10-2012
JAG
Added packaging, labeling and regulatory information
Revision History
SyChip/Murata Confidential Page 2 of 27 SN2100 Datasheet V0.62
Table of Contents
1 SYSTEM DESCRIPTIONS ......................................................................................................................... 5
1.1 APPLICATIONS .......................................................................................................................................... 5
1.2 MODULE SUMMARY .................................................................................................................................. 5
1.3 BLOCK DIAGRAM ...................................................................................................................................... 6
2 MECHANICAL SPECIFICATIONS ............................................................................................................ 7
2.1 MODULE DIMENSION ................................................................................................................................. 7
2.2 MODULE TOP AND SIDE VIEW ..................................................................................................................... 7
2.3 MODULE BOTTOM VIEW ............................................................................................................................. 8
2.4 DETAILED MECHANICAL DATA (TOP VIEW) ................................................................................................... 9
2.5 MODULE PIN-OUT ................................................................................................................................... 10
3 DC ELECTRICAL SPECIFICATIONS ..................................................................................................... 12
3.1 TYPICAL POWER CONSUMPTION .............................................................................................................. 12
3.2 DIGITAL IO SPECIFICATION ...................................................................................................................... 12
4 RF SPECIFICATIONS .............................................................................................................................. 13
4.1 BLUETOOTH SPECIFICATION .................................................................................................................... 13
4.2 RF CHARACTERISTICS (TX) .................................................................................................................... 13
4.3 RF CHARACTERISTICS (RX) .................................................................................................................... 15
5 ENVIRONMENTAL SPECIFICATIONS ................................................................................................... 16
5.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 16
5.2 OPERATION CONDITIONS ......................................................................................................................... 16
6 APPLICATION INFORMATION ............................................................................................................... 17
6.1 HOST PCB LAYOUT RECOMMENDATIONS ................................................................................................. 17
6.2 MODULE LOCATION ................................................................................................................................ 18
6.2.1 Location in x-y plane .................................................................................................................... 18
6.2.2 Location in z-plane ...................................................................................................................... 19
7 ASSEMBLY INFORMATION ................................................................................................................... 20
7.1 LEAD-FREE SOLDERING REFLOW PROFILE ................................................................................................ 20
8 PACKAGE INFORMATION ..................................................................................................................... 21
8.1 TAPE AND REEL SPECIFICATION ............................................................... ERROR! BOOKMARK NOT DEFINED.
8.2 MODULE MARKING .................................................................................. ERROR! BOOKMARK NOT DEFINED.
9 ORDERING INFORMATION .................................................................................................................... 22
10 ROHS DECLARATION ............................................................................................................................ 22
11 TECHNICAL SUPPORT CONTACT ........................................................................................................ 22
12 DISCLAIMER .................................................................................ERROR! BOOKMARK NOT DEFINED.
SyChip/Murata Confidential Page 3 of 27 SN2100 Datasheet V0.62
LIST OF FIGURES
FIGURE 1 SN2100 MODULE BLOCK DIAGRAM .................................................................................................................. 6
FIGURE 2 MODULE TOP AND SIDE VIEW ............................................................................................................................ 7
FIGURE 3 MODULE BOTTOM VIEW ..................................................................................................................................... 8
FIGURE 4 DETAILED MECHANICAL DATA (TOP VIEW) ......................................................................................................... 9
FIGURE 5 RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE ................................................ 17
FIGURE 6 RECOMMENDED LOCATIONS IN XY-PLANE ....................................................................................................... 18
FIGURE 7 LOCATIONS NOT RECOMMENDED IN XY-PLANE ............................................................................................... 18
FIGURE 8 RECOMMENDED LOCATIONS IN Z-PLANE .......................................................................................................... 19
FIGURE 9 LOCATIONS NOT RECOMMENDED IN XY-PLANE ............................................................................................... 19
FIGURE 10 REFLOW PROFILE PATTERN .......................................................................................................................... 20
FIGURE 11 CARRIER TAPE DIMENSIONS .......................................................................................................................... 21
FIGURE 12 MODULE MARKING DETAIL ............................................................................................................................. 21
LIST OF TABLES
TABLE 1 MODULE CONNECTOR SIGNAL DESCRIPTION .................................................................................................... 10
TABLE 2 TYPICAL POWER CONSUMPTION ........................................................................................................................ 12
TABLE 3 DIGITAL IO SPECIFICATION ................................................................................................................................ 12
TABLE 4 RF SPECIFICATIONS ........................................................................................................................................... 13
TABLE 5 RF SPECIFICATIONS ........................................................................................................................................... 15
TABLE 6 ABSOLUTE MAXIMUM RATING ............................................................................................................................ 16
TABLE 7 RECOMMENDED OPERATING CONDITIONS ........................................................................................................ 16
TABLE 8 REFLOW PROFILE RECOMMENDATION .............................................................................................................. 20
TABLE 9 ORDERING INFORMATION ................................................................................................................................ ... 22
SyChip/Murata Confidential Page 4 of 27 SN2100 Datasheet V0.62
System Descriptions
1.1 Applications
SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with onboard antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO
and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s
design. The SN2100 offers total 110 dB link budget, which is significantly better than most
of the Bluetooth® modules do in the market. This makes it a good fit for industrial control
application that usually requires longer distance coverage. The module offers extended
product life and industrial standard operating temperature range to fit the industrial usage.
The SN2100 offers standard HCI interface to the host CPU.
1.2 Module Summary
Bluetooth V4.0
Power Grade: Class 1
Dimensions: 17.5mm x 16.0mm x 2.0 mm
Supply voltage: 2.2V to 3.3V
Antenna: on-module
32kHz clock circuit : on-module
Host Interface : UART/PCM
RoHS compliant
MSL JEDEC level 3
FCC/IC certified; CE compliant
SyChip/Murata Confidential Page 5 of 27 SN2100 Datasheet V0.62
1.3 Block Diagram
Figure 1 SN2100 Module Block Diagram
SyChip/Murata Confidential Page 6 of 27 SN2100 Datasheet V0.62
Parameter
Typical
Unit
Dimension (LxWxH)
17.5 x 16.0 x 2.0
mm
Dimension tolerances (LxWxH)
+/- 0.2 mm
mm
2 Mechanical Specifications
2.1 Module Dimension
2.2 Module top and side view
SyChip/Murata Confidential Page 7 of 27 SN2100 Datasheet V0.62
UNIT : mm
Figure 2 Module Top and Side View
2.3 Module bottom view
Figure 3 Module Bottom View
SyChip/Murata Confidential Page 8 of 27 SN2100 Datasheet V0.62
2.4 Detailed mechanical data (top view)
Figure 4 Detailed Mechanical Data (top view)
SyChip/Murata Confidential Page 9 of 27 SN2100 Datasheet V0.62
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