Murata Electronics North America 2100 Users Manual

SN2100

Bluetooth Class 1 Module

User Manual

And Datasheet

Version: 0.62

April 10, 2012

Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The
information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed
by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license
is generated under any rights of SyChip or its supporters unless specifically agreed.

Revision

Date

Author

Change Description

0.1

Jul-07-2011

Release the first datasheet.

0.5

Nov-15-2011

N. Nagayama

Update the block diagram / BT IC product number
Update the SyChip Part Number

0.6

Jan-05-2012

Viet H.

Update the spec table

0.61

Jan-31-2012

Yong Fang

Added disclaimer

0.62

Apr-10-2012

JAG

Added packaging, labeling and regulatory information

Revision History

SyChip/Murata Confidential Page 2 of 27 SN2100 Datasheet V0.62

Table of Contents

1 SYSTEM DESCRIPTIONS ......................................................................................................................... 5

1.1 APPLICATIONS .......................................................................................................................................... 5

1.2 MODULE SUMMARY .................................................................................................................................. 5

1.3 BLOCK DIAGRAM ...................................................................................................................................... 6

2 MECHANICAL SPECIFICATIONS ............................................................................................................ 7

2.1 MODULE DIMENSION ................................................................................................................................. 7

2.2 MODULE TOP AND SIDE VIEW ..................................................................................................................... 7

2.3 MODULE BOTTOM VIEW ............................................................................................................................. 8

2.4 DETAILED MECHANICAL DATA (TOP VIEW) ................................................................................................... 9

2.5 MODULE PIN-OUT ................................................................................................................................... 10

3 DC ELECTRICAL SPECIFICATIONS ..................................................................................................... 12

3.1 TYPICAL POWER CONSUMPTION .............................................................................................................. 12

3.2 DIGITAL IO SPECIFICATION ...................................................................................................................... 12

4 RF SPECIFICATIONS .............................................................................................................................. 13

4.1 BLUETOOTH SPECIFICATION .................................................................................................................... 13

4.2 RF CHARACTERISTICS (TX) .................................................................................................................... 13

4.3 RF CHARACTERISTICS (RX) .................................................................................................................... 15

5 ENVIRONMENTAL SPECIFICATIONS ................................................................................................... 16

5.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 16

5.2 OPERATION CONDITIONS ......................................................................................................................... 16

6 APPLICATION INFORMATION ............................................................................................................... 17

6.1 HOST PCB LAYOUT RECOMMENDATIONS ................................................................................................. 17

6.2 MODULE LOCATION ................................................................................................................................ 18

6.2.1 Location in x-y plane .................................................................................................................... 18

6.2.2 Location in z-plane ...................................................................................................................... 19

7 ASSEMBLY INFORMATION ................................................................................................................... 20

7.1 LEAD-FREE SOLDERING REFLOW PROFILE ................................................................................................ 20

8 PACKAGE INFORMATION ..................................................................................................................... 21

8.1 TAPE AND REEL SPECIFICATION ............................................................... ERROR! BOOKMARK NOT DEFINED.

8.2 MODULE MARKING .................................................................................. ERROR! BOOKMARK NOT DEFINED.

9 ORDERING INFORMATION .................................................................................................................... 22

10 ROHS DECLARATION ............................................................................................................................ 22

11 TECHNICAL SUPPORT CONTACT ........................................................................................................ 22

12 DISCLAIMER .................................................................................ERROR! BOOKMARK NOT DEFINED.

SyChip/Murata Confidential Page 3 of 27 SN2100 Datasheet V0.62

LIST OF FIGURES

FIGURE 1 SN2100 MODULE BLOCK DIAGRAM .................................................................................................................. 6

FIGURE 2 MODULE TOP AND SIDE VIEW ............................................................................................................................ 7

FIGURE 3 MODULE BOTTOM VIEW ..................................................................................................................................... 8

FIGURE 4 DETAILED MECHANICAL DATA (TOP VIEW) ......................................................................................................... 9

FIGURE 5 RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE ................................................ 17

FIGURE 6 RECOMMENDED LOCATIONS IN XY-PLANE ....................................................................................................... 18

FIGURE 7 LOCATIONS NOT RECOMMENDED IN XY-PLANE ............................................................................................... 18

FIGURE 8 RECOMMENDED LOCATIONS IN Z-PLANE .......................................................................................................... 19

FIGURE 9 LOCATIONS NOT RECOMMENDED IN XY-PLANE ............................................................................................... 19

FIGURE 10 REFLOW PROFILE PATTERN .......................................................................................................................... 20

FIGURE 11 CARRIER TAPE DIMENSIONS .......................................................................................................................... 21

FIGURE 12 MODULE MARKING DETAIL ............................................................................................................................. 21

LIST OF TABLES

TABLE 1 MODULE CONNECTOR SIGNAL DESCRIPTION .................................................................................................... 10

TABLE 2 TYPICAL POWER CONSUMPTION ........................................................................................................................ 12

TABLE 3 DIGITAL IO SPECIFICATION ................................................................................................................................ 12

TABLE 4 RF SPECIFICATIONS ........................................................................................................................................... 13

TABLE 5 RF SPECIFICATIONS ........................................................................................................................................... 15

TABLE 6 ABSOLUTE MAXIMUM RATING ............................................................................................................................ 16

TABLE 7 RECOMMENDED OPERATING CONDITIONS ........................................................................................................ 16

TABLE 8 REFLOW PROFILE RECOMMENDATION .............................................................................................................. 20

TABLE 9 ORDERING INFORMATION ................................................................................................................................ ... 22

SyChip/Murata Confidential Page 4 of 27 SN2100 Datasheet V0.62

System Descriptions

1.1 Applications

SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on­board antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO
and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s
design. The SN2100 offers total 110 dB link budget, which is significantly better than most
of the Bluetooth® modules do in the market. This makes it a good fit for industrial control
application that usually requires longer distance coverage. The module offers extended
product life and industrial standard operating temperature range to fit the industrial usage.
The SN2100 offers standard HCI interface to the host CPU.

1.2 Module Summary

 Bluetooth V4.0
 Power Grade: Class 1
 Dimensions: 17.5mm x 16.0mm x 2.0 mm
 Supply voltage: 2.2V to 3.3V
 Antenna: on-module
 32kHz clock circuit : on-module
 Host Interface : UART/PCM
 RoHS compliant
 MSL JEDEC level 3
 FCC/IC certified; CE compliant

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1.3 Block Diagram

Figure 1 SN2100 Module Block Diagram

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Parameter

Typical

Unit

Dimension (LxWxH)

17.5 x 16.0 x 2.0

mm

Dimension tolerances (LxWxH)

+/- 0.2 mm

mm

2 Mechanical Specifications

2.1 Module Dimension

2.2 Module top and side view

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UNIT : mm

Figure 2 Module Top and Side View

2.3 Module bottom view

Figure 3 Module Bottom View

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2.4 Detailed mechanical data (top view)

Figure 4 Detailed Mechanical Data (top view)

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Pin #

Pin name

I/O

Description

1

GND

-

Ground

2

VIN I Module Power Supply

3

Reserved

O

Internal for debugging use only

4

HCI_CTS

I

HCI UART Clear-To-Send.
Module is allowed to send data when HCI_CTS is
low.

5

HCI_TX

O

HCI UART data transmit

6

HCI_RTS

O

HCI UART Request-To-Send
Host is allowed to send data when RTS is low.

7

HCI_RX

I

HCI UART data receive

8

nRESET

I

Shutdown input (Active Low)

9

GND

-

Ground

10

AUD_IN

I

PCM Data Input

11

AUD_OUT

O

PCM Data Output

12

AUD_CLK

I/O

PCM Clock

13

AUD_SYNC

I/O

PCM Frame Sync

14

GND

-

Ground

15

GND

-

Ground

16

GND

-

Ground

17

GND

-

Ground

18

GND

-

Ground

19

GND

-

Ground

20

GND

-

Ground

21

GND

-

Ground

22

GND

-

Ground

23

GND

-

Ground

24

GND

-

Ground

25

GND

-

Ground

26

Reserved

-

Internal use only

27

GND

-

Ground

28

GND

-

Ground

2.5 Module Pin-out

Table 1 Module Connector Signal Description

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Pin #

Pin name

I/O

Description

29

GND

-

Ground

30

GND

-

Ground

31

GND

-

Ground

32

GND

-

Ground

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Item

Condition

Values

Units

Min

Typ

Max

Standby mode (after
send script)

VIN = 3.0V, TEMP = 25°C

-

3.5

-

mA

DH1 Packet 50% Rx/Tx slot
duty 1 cycle Average

VIN = 3.0V, TEMP = 25°C

-

60 - mA

DH5 Packet 50% Rx/Tx slot
duty 1 cycle Average

VIN = 3.0V, TEMP = 25°C

-

87 - mA

TX maximum current

VIN = 3.0V, TEMP = 25°C

-

150 - mA

RX maximum current

VIN = 3.0V, TEMP = 25°C

-

50 - mA

Item

Condition

Symbol

Min

Max

UNIT

High Level Input Voltage

VIH

0.65 x VDD

VDD

V

Low Level Input Voltage

VIL

0

0.35 x VDD

V

High Level Output Voltage

At 2/4/8 mA

VOH

0.8 x VDD

VDD

V

At 0.1 mA

VDD – 0.2

VDD

V

Low Level output Voltage

At 2/4/8 mA

VOL

0

0.2 x VDD

V

At 0.1 mA

0

0.2

V

3 DC Electrical Specifications

3.1 Typical Power Consumption

Table 2 Typical Power Consumption

3.2 Digital IO Specification

VIN = 3.0V, TEMP = 25°C, unless otherwise stated

VDD : 1.8V

Table 3 Digital IO Specification

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Parameter

Contents

Bluetooth Specification

Ver.4.0

Channel Spacing

1 MHz

The number of channel

79

Power Class

1

Parameter

Min

Typ

Max

BT Spec

Units

Output Power

-

18 - 20

(1)

dBm

Operation Frequency range (RX/TX)

2402

-

2480

-

MHz

-20 dB bandwidth

-

0.928 - 1

MHz

Adjacent Channel Power

[M-N] = 2

-

-40 - <-20

dBm

[M-N] >= 3

-

-43 - <-40

dBm

Modulation Characteristics

Modulation delta f1 avg

-

159

-

140< <175

kHz

Modulation delta f2 max

-

136 - 115<

kHz

Modulation delta f2 avg/delta f1 avg

-

0.9 - 0.8<

-

Initial Carrier Frequency Tolerance

-

-2

-

-75< <75

kHz

Carrier Frequency Drift

1 slot

-25 2 -

-25< <25

kHz

3 slot

-40 1 -

-40< <40

kHz

5 slot

-40 1 -

-40< <40

kHz

Maximum drift rate

-20

0.5

-

-20< <20

kHz/50 us

Out of Band Spurious Emissions

30 – 1000 MHz (Operation Mode)

-

-50 - <-36

dBm

1000 – 12750 MHz (Operation Mode)

-

-52 - <-30

dBm

1800 – 1900 MHz (Operation Mode)

-

-54 - <-47

dBm

4 RF Specifications

4.1 Bluetooth Specification

4.2 RF Characteristics (TX)

VIN = 3.0V, TEMP = 25°C, at 50Ω terminal load connected to the RF connector

Table 4 RF Specifications

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5150 – 5300 MHz (Operation Mode)

-

-54 - <-47

dBm

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Parameter

Min

Typ

Max

BT Spec

Units

Sensitivity (BER <= 0.1%)

-

-92 - < -70

dBm

C/I Performance (BER <= 0.1%)

Co-channel ratio (-60 dBm input)

-

10 - < 11

dB

1MHz ratio (-60dBm input)

-

-7 - < 0

dB

2MHz ratio (-60dBm input)

-

-21 - < -30

dB

3MHz ratio (-67dBm input)

-

-44 - < -40

dB

Blocking Performance (BER <= 0.1%)

30MHz – 2000MHz

-5 - -

-10<

dBm

2000MHz – 2400MHz

-5 - -

-27<

dBm

2500MHz – 3000MHz

-5 - -

-27<

dBm

3000MHz – 12750MHz

-5 - -

-10<

dBm

Intermodulation Performance
(BER <= 0.1%, -64 dBm input)

-

-36 - -39<

dBm

Maximum Input Level

-4 - -

-20<

dBm

4.3 RF Characteristics (RX)

VIN = 3.0V, TEMP = 25°C, at 50Ω terminal load connected to the RF connector

Table 5 RF Specifications

(1) It is EIRP.

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Symbol

Description

Min

Max

Units

Top

Operating temperature

-40

85

C

Tst

Storage temperature

-40

85

C

VIN

Power supply

-0.3

5.0

V

MSL

Moisture Sensitivity Level

3

RoHS

Restriction of Hazardous Substances

Compliant

Symbol

Parameter

Min

Typ

Max

Units

VIN

Power supply

2.2

3.0

3.3

V

Top

Operating temperature

-40

-

85

C

5 Environmental Specifications

5.1 Absolute maximum ratings

Table 6 Absolute Maximum Rating

5.2 Operation conditions

Table 7 Recommended Operating Conditions

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Zone 1

Zone 2

6 Application Information

6.1 Host PCB layout recommendations

The SN3020 module has an onboard antenna therefore it requires some special host
PCB layout underneath the module such that the radio can achieve its best RF
performance. Refer to Figure 5 for the requirements.

Figure 5 Recommended Host Circuit Board Design underneath the Module

Notes:

1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of
the customer circuit board should be free of any metal objects. Specifically, there
should be no ground plane, traces, or metal shield case.

2. The area in ‘Zone2’ on the top layer of the customer circuit board should have
ground only with no signal traces.

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Antenna Connector

Antenna

Shield Case

No GND in this area (See Fig.8)

6.2 Module Location

For optimum EIRP, customer is advised to use the recommended module location on
their respective PCB.

6.2.1 Location in x-y plane

Figure 6 Recommended Locations in xy-plane

Figure 7 Locations Not Recommended in xy-plane

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Antenna Connector

Antenna

Metal

Module

Mother Board

Metal

Metal

Metal

Metal

6.2.2 Location in z-plane

Figure 9 Locations Not Recommended in xy-plane

Figure 8 Recommended Locations in z-plane

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Ramp up rate

3oC/second max

Maximum time maintained above 217oC

120 seconds

Peak temperature

250oC

Maximum time within 5oC of peak temperature

20 seconds

Ramp down rate

6oC/second max

Reflow Profile

0

50

100

150

200

250

Time, seconds

Temperature, C

7 Assembly Information

7.1 Lead-free soldering reflow profile

The lead-free solder reflow profile is recommended in the table & graph below. The
profile is used to attach the module to its host PCB.

The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to
the module weight.

Table 8 Reflow Profile Recommendation

Figure 10 Reflow Profile Pattern

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8 Packaging and Marking Information

8.1 Carrier Tape Dimensions

Figure 11 Carrier Tape Dimensions

8.2 Module Marking Information

The following marking information may be printed on a permanent label affixed to the
module shield or permanently laser written into the module shield itself. The 2D barcode
is used for internal purposes. A pin 1 ID is stamped into the shield.

Figure 12 Module Marking Detail

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Product

SyChip Model

Number

SyChip Part

Number

Standard Order

Increment

Evaluation/Development Kit

SN2100EVK

88-0150-85

1 pc

Module in Tape and Reel

SN2100

88-0150-00

500 pcs

9 Ordering Information

Table 9 Ordering Information

10 RoHS Declaration

Given supplier declarations, this product does not contain substances that are banned by
Directive 2002/95/EC or contains a maximum concentration of 0.1% by weight in
homogeneous materials for

 Lead and lead compounds
 Mercury and mercury compounds
 Chromium (VI)
 PBB (polybrominated biphenyl)
 PBDE (polybrominated biphenyl ether)

And a maximum concentration of 0.01% by weight in homogeneous materials for

 Cadmium and cadmium compounds

11 Regulatory Information

SN2100 has obtained the certifications described below.

11.1 FCC Notice (USA)

This device using the integrated antenna has been tested to comply with FCC CFR Part

15. The device meets the requirements for modular transmitter approval as detailed in the
FCC public notice DA00.1407. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

The FCC requires the OEM (original equipment manufacturer) to be notified that any

changes or modifications not expressly approved by SyChip, L.L.C may void the user’s

authority to operate the equipment. While an application of the SN2100 module in a
product is not required to obtain a new FCC authorization for the module, this does not
preclude the possibility that some other form of authorization or testing may be required for
that end product.

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This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
reorient or relocate the receiving antenna, increase the separation between the equipment
and receiver, connect the equipment into an outlet on a circuit different from that to which
the receiver is connected, or consult the dealer or an experienced radio/TV technician for
help.

11.2 FCC Labeling Requirements

When integrating the SN2100 into a product, the FCC labeling requirements must be met
by the OEM. This includes placing a clearly visible label on the outside of the finished
product specifying the SN2100 FCC identifier (FCC ID:QPU2100) as well as the underlined
FCC Notice above. The exterior label can use wording such as “Contains Transmitter

Module FCC ID:QPU2100” or “Contains FCC ID:QPU2100” although any similar wording

that expresses the same meaning may be used.

11.3 RF Exposure

This module has been certified for remote and base radio applications and is not intended
to be operated within 20cm of the body. If the module will be used for portable applications,
the device must undergo SAR testing.

The following statement must be included as a CAUTION statement in manuals for the
products to alert users on FCC RF exposure compliance:

“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a

separation distance of 20cm or more should be maintained between the antenna of this
device and persons during operation. To ensure compliance, operations at closer distances
than this are not recommended.”

11.4 IC Notice (Canada)

The term “IC” before the certification/registration number only signifies that the Industry
Canada technical specifications were met.

Le terme “IC” devant le numéro de certification /d’enregistrement signifie seulement que les

spécifications techniques Industrie Canada ont été respectées.

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This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.

Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s).
Son utilisation est soumise à Les deux conditions suivantes: (1) cet appareil ne peut pas
provoquer d'interférences et (2) cet appareil doit accepter Toute interférence, y compris les
interférences qui peuvent causer un mauvais fonctionnement du dispositif.

This device complies with Health Canada’s Safety Code 6 / IC RSS-210. The installer of

this device should ensure that RF radiation is not emitted in excess of the Health Canada’s

requirement. Information can be obtained at: http://www.hc-sc.gc.ca/ewh-

semt/pubs/radiation/radio_guide-lignes_direct-eng.php

Cet appareil est conforme avec Santé Canada Code de sécurité 6 / IC RSS-210. Le
programme d'installation de cet appareil doit s'assurer que les rayonnements RF n'est pas
émis au-delà de l'exigence de Santé Canada. Les informations peuvent être obtenues:
http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php

11.5 IC Labeling Requirements

The host device should be properly labeled to identify the module within the host device.
The Industry Canada certification label of a module shall be clearly visible at all times when
installed in the host device, otherwise the host device must be labeled to display the

Industry Canada certification number of the module, preceded by the words “Contains
transmitter module”, or the word “Contains”, or similar wording expressing the same

meaning, as follows:
Contains transmitter module IC:4523A-SN2100,

where 4523A-SN2100 is the module’s certification number.

11.6 CE Notice (Europe)

This device has been tested and certified for use in the European Union.
If this device is used in a product, the OEM has responsibility to verify compliance of the

final product to the EU standards. A Declaration of Conformity must be issued and kept on
file as described in Annex II of the Radio and Telecommunications Terminal Equipment
Directive.

11.7 CE Labeling Requirements

The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the
Directive. Given that the operating frequency band is not harmonized by a few European

countries, the restriction or alert sign must be placed alongside the ‘CE’ mark as shown

below. The restriction is that, if the radio is operated outdoors in the 2450-2483.5 MHz

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band, the power must be limited to 10 mW instead of 100 mW. The OEM must account for
this and the product must have the alert mark. It does not require country notifications,
however.

12 Technical Support Contact

SyChip, LLC
2805 Dallas Parkway, Suite 400
Plano, TX 75093
USA
Tel: [phone]
Fax: [phone]

Note: SyChip, LLC is an operating unit within Murata Wireless Solutions

13 Disclaimer

Please read this notice before using the SN2100 product.

1. Please note that the only warranty that SyChip LLC (“SyChip”) provides regarding
the products is its conformance to the specifications provided herein. Accordingly, SyChip
shall not be responsible for any defects in products or equipment incorporating such
products, which are caused under the conditions other than those specified in this
specification.

SYCHIP HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE
PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY
WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT­FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. YOU
AGREE TO INDEMNIFY AND DEFEND SYCHIP AND ITS AFFILIATES AGAINST ALL
CLAIMS, DAMAGES, COSTS AND EXPENSES THAT MAY BE INCURRED, INCLUDING
WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF
PRODUCTS.

2. The product is designed and manufactured for general applications, and not for any
particular application, so testing and use of the product shall be conducted at your own risk
and responsibility. Specifically, please observe the following:

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i) Please conduct validation and verification of the products in actual

condition of mounting and operating environment before commercial
shipment of the equipment.

ii) Please pay attention to minimize any mechanical vibration or shock, not to

drop the product or a substrate that contains the product during
transportation.

iii) Since the application of static electricity or overvoltage may cause a

defect in the product or deterioration of its reliability, caution must be
taken against exposure to any static electricity generated by electrified
items such as work benches, soldering irons, tools, carrying containers,
etc.

iv) Caution shall be taken to avoid overstress to the product during and after

the soldering process.

v) Since the applied soldering method may deteriorate the reliability,

thorough evaluation is recommended.

vi) In case the product is to be used in equipment or electric circuit that

requires high safety or reliability function or performance, sufficient
reliability evaluation checks for safety shall be performed before
commercial shipment and moreover, due consideration to install a
protective circuit is strongly recommended at customer's design stage.
Please provide an appropriate fail-safe function on your product to prevent
any damages that may be caused by the abnormal function or the failure
of our product.

Notwithstanding the foregoing, the product shall not be used in any application listed below
which requires especially high reliability for the prevention of such defect as may directly
cause damage to the third party's life, body or property.

- Aircraft equipment

- Aerospace equipment

- Undersea equipment

- Power plant control equipment

- Medical equipment

- Transportation equipment (vehicles, trains, ships, etc.)

- Traffic signal equipment

- Disaster prevention / crime prevention equipment

- Application of similar complexity and/or reliability requirements to the applications listed in
the above.

3. SyChip’s warranty as provided in Clause 1 above that the products comply with
descriptions expressly specified in the specifications shall be effective for a period of six (6)
months from the date of delivery. SyChip shall not be liable for any defects that occur in
dry packed products that are installed more than six (6) months after shipment.

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SyChip’s liability under this warranty shall be limited to products that are returned during
the warranty period to the address designated by SyChip and that are determined by
SyChip not to conform to such warranty. If SyChip elects to repair or replace such
products, SyChip shall have reasonable time to repair such products or provide
replacements. Repaired products shall be warranted for the remainder of the original
warranty period. Replaced products shall be warranted for a new full warranty period.

For avoidance of doubt, SyChip shall not be liable for any defects that are caused by
neglect, misuse or mistreatment by an entity other than SyChip including improper
installation or testing, or for any products that have been altered or modified in any way by
an entity other than SyChip. Moreover, SyChip shall not be liable for any defects that result
from your or third party’s design, specifications or instructions for such products.

4. Testing and other quality control techniques are used to the extent SyChip deems
necessary. Unless mandated by government requirements, SyChip does not necessarily
test all parameters of each product.

5. End of Life - Please note that we may discontinue the manufacture of products, due
to reasons such as, but not limited to, end of supply of materials and/or components from
our suppliers.

SyChip/Murata Confidential Page 27 of 27 SN2100 Datasheet
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