Murata GRM, GRJ, GR3, GR4, GR7 User Manual

!Caution/Notice

GRM, GR3, GRJ, GR4, GR7, GJM,
GQM, GA2, GA3, LLL, LLA, LLM,
LLR, NFM, KRM, KR3, GMA, GMD

!Caution

Notice

Storage and Operation Conditions

Rating

1. Temperature Dependent Characteristics

2. Measurement of Capacitance

3. Applied Voltage and Applied Current

4. Type of Applied Voltage and
Self-heating Temperature

5. DC Voltage and AC Voltage Characteristics

6. Capacitance Aging

7. Vibration and Shock

Soldering and Mounting

1. Mounting Position

2. Information before Mounting

3. Maintenance of the Mounting
(pick and place) Machine

4-1. Reflow Soldering

4-2. Flow Soldering

4-3. Correction of Soldered Portion

5. Washing

6. Electrical Test on Printed Circuit Board

7. Printed Circuit Board Cropping

8. Assembly

9. Die Bonding/Wire Bonding

Other

1. Under Operation of Equipment

2. Other

Rating

1. Operating Temperature

2. Atmosphere Surroundings
(gaseous and liquid)

3. Piezo-electric Phenomenon

Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

2. Land Dimensions

3. Board Design

2. Adhesive Application

3. Adhesive Curing

4. Flux for Flow Soldering

5. Flow Soldering

6. Reflow Soldering

7. Washing

8. Coating

Other

1. Transportation

2. Characteristics Evaluation
in the Actual System

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

1. The performance of chip multilayer ceramic capacitors
and chip EMIFIL NFM series (henceforth just “capacitors”)
may be aected by the storage conditions.
Please use them promptly aer delivery.
1-1. Maintain appropriate storage for the capacitors using

the following conditions: Room Temperature of +5 to
+40°C and a Relative Humidity of 20 to 70%.
High temperature and humidity conditions and/or
prolonged storage may cause deterioration of the
packaging materials. If more than six months have
elapsed since delivery, check packaging, mounting,
etc. before use.
In addition, this may cause oxidation of the electrodes.
If more than one year has elapsed since delivery, also
check the solderability before use.

1-2. Corrosive gas can react with the termination

(external) electrodes or lead wires of capacitors, and
result in poor solderability. Do not store the
capacitors in an atmosphere consisting of corrosive
gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine,
ammonia gas, etc.).

1-3. Due to moisture condensation caused by rapid

humidity changes, or the photochemical change
caused by direct sunlight on the terminal electrodes
and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store
capacitors under direct sunlight or in high humidity
conditions.

Storage and Operation Conditions

1. Temperature Dependent Characteristics

1. The electrical characteristics of a capacitor can change
with temperature.
1-1. For capacitors having larger temperature

dependency, the capacitance may change with
temperature changes.
The following actions are recommended in order to
ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating

temperature range.

(2) The capacitance may change within the rated

temperature.
When you use a high dielectric constant type
capacitor in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant
circuit), please carefully consider the temperature
characteristics, and carefully confirm the various
characteristics in actual use conditions and the
actual system.

[Example of Temperature Characteristics X5R (R6)]

Sample: 22μF, Rated Voltage 4VDC

[Example of Temperature Characteristics X7R (R7)]

Sample: 0.1μF, Rated Voltage 50VDC

-20

-15

-10

-5

0

5

10

15

20

Temperature (°C)

-75 -50 -25 0 25 50 75 100

Capacitance Change (%)

-20

-15

-10

-5

0

5

10

15

20

Temperature (°C)

-75 -50 -25 0 25 50 75 100 125 150

Capacitance Change (%)

2. Measurement of Capacitance

1. Measure capacitance with the voltage and frequency
specified in the product specifications.
1-1. The output voltage of the measuring equipment may

decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured
voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant

type capacitors change depending on the AC voltage
applied. Please consider the AC voltage
characteristics when selecting a capacitor to be used
in an AC circuit.

Rating

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

3. Applied Voltage and Applied Current

1. Do not apply a voltage to the capacitor that exceeds the

rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor

shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage,

the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the
peak-to-peak voltage shall not exceed the rated
DC voltage.

(2) Abnormal voltages (surge voltage, static

electricity, pulse voltage, etc.) shall not exceed
the rated DC voltage.

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may
result in an electrical short circuit caused by the
breakdown of the internal dielectric layers.
The time duration until breakdown depends on the
applied voltage and the ambient temperature.

2. Use a safety standard certified capacitor in a power

supply input circuit (AC filter), as it is also necessary to
consider the withstand voltage and impulse withstand
voltage defined for each device.

<Applicable to NFM Series>

3. The capacitors also have rated currents.
The current flowing between the terminals of a capacitor
shall be less than or equal to the rated current. Using the
capacitor beyond this range could lead to excessive heat.

Typical Voltage Applied to the DC Capacitor

(E: Maximum possible applied voltage.)

DC Voltage DC Voltage+AC AC Voltage Pulse Voltage

E

0

E

0

E

0

E

0

4. Type of Applied Voltage and Self-heating Temperature

1. Confirm the operating conditions to make sure that no large
current is flowing into the capacitor due to the continuous
application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage
circuit or a pulse voltage circuit, the AC current or pulse
current will flow into the capacitor; therefore check the
self-heating condition.
Please confirm the surface temperature of the capacitor so
that the temperature remains within the upper limits of the
operating temperature, including the rise in temperature due
to self-heating. When the capacitor is used with a
high-frequency voltage or pulse voltage, heat may be
generated by dielectric loss.

<Applicable to Rated Voltage of less than 100VDC>

1-1. The load should be contained so that the self-heating of

the capacitor body remains below 20°C, when
measuring at an ambient temperature of 25°C.

1

10

100

0123456

Current (Ar.m.s.)

[Example of Temperature Rise (Heat Generation)
in Chip Multilayer Ceramic Capacitors in Contrast
to Ripple Current]
Sample: R (R1) characteristics 10μF,

Rated voltage: DC10V

Temperature Rise (°C)

Ripple Current

100kHz

500kHz

1MHz

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

<Applicable to Temperature Characteristics X7R (R7),
X7T (D7), X7T (W0) beyond Rated Voltage of 200VDC>

1-2. The load should be contained so that the self-heating

of the capacitor body remains below 20°C, when
measuring at an ambient temperature of 25°C. In
addition, use a K thermocouple of ø0.1mm with less
heat capacity when measuring, and measure in a
condition where there is no eect from the radiant
heat of other components or air flow caused by
convection. Excessive generation of heat may cause
deterioration of the characteristics and reliability of the
capacitor. (Absolutely do not perform measurements
while the cooling fan is operating, as an accurate
measurement may not be performed.)

<Applicable to Temperature Characteristics U2J (7U),
C0G (5C) beyond Rated Voltage of 200VDC>

1-3. Since the self-heating is low in the low loss series, the

allowable power becomes extremely high compared to
the common X7R (R7) characteristics.
However, when a load with self-heating of 20°C is
applied at the rated voltage, the allowable power may
be exceeded. When the capacitor is used in a
high-frequency voltage circuit of 1kHz or more, the
frequency of the applied voltage should be less than
500kHz sine wave (less than 100kHz for a product
with rated voltage of DC3.15kV), to limit the voltage
load so that the load remains within the derating
shown in the following figure. In the case of non-sine
wave, high-frequency components exceeding the
fundamental frequency may be included. In such a case,
please contact Murata. The excessive generation of
heat may cause deterioration of the characteristics
and reliability of the capacitor.
(Absolutely do not perform measurements while the
cooling fan is operating, as an accurate measurement
may not be performed.)

The surface temperature of the capacitor: 125°C or less

(including self-heating)

[The sine-wave frequency VS allowable voltage]

C0G (5C) char., Rated Voltage: DC250V

0805/2012 (in inch/mm) size

C0G (5C) char., Rated Voltage: DC250V

1206/3216 (in inch/mm) size

Frequency [kHz]

100

(200)

Allowable Voltage [Vp-p]

1000

1000100101

to 330pF

C0G (5C) char., Rated Voltage: DC200V

C0G (5C) char., Rated Voltage: DC500V

Frequency [kHz]

100

(500)

Allowable Voltage [Vp-p]

1000

1000100101

to 560pF

820pF

680pF

1,000pF

C0G char., Rated Voltage: DC630V

Continued from the preceding page.

Continued on the following page.

C0G char., Rated Voltage: DC1kV

100010010

10

1000

100

Frequency [kHz]

Allowable voltage [Vp-p]

4,700pF

to 3,900pF

6,800pF

10,000pF

15,000pF

100010010

10

1000

100

Frequency [kHz]

Allowable voltage [Vp-p]

4,700pF

to 3,900pF

100010010

100

1000

(630V)

560pF

to 470pF

680pF

820pF

1,000pF

1,500pF

2,200pF

3,300pF

Frequency [kHz]

Allowable voltage [Vp-p]

100010010

100

10000

1000

Frequency [kHz]

Allowable voltage [Vp-p]

220pF

to 100pF

1,000pF

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

U2J (7U) char., Rated Voltage: DC3.15kV

Allowable Voltage [Vp-p]

Frequency [kHz]

1000100101

1000

(3150)

10000

to 33pF

47pF

100pF

100

1000

10000

U2J (7U) char., Rated Voltage: DC2kV

Allowable Voltage [Vp-p]

Frequency [kHz]

1000(500)100101

to 100pF

150pF
220pF

U2J (7U) char., Rated Voltage: DC630V

Frequency [kHz]

1000100101

10

100

Allowable Voltage [Vp-p]

1000

1,000pF

to 680pF

2,200pF

4,700pF

10,000pF

22,000pF

47,000pF

Frequency [kHz]

U2J (7U) char., Rated Voltage: DC1kV

1000100101

10

100

Allowable Voltage [Vp-p]

10000

1000

1,000pF

to 470pF

10,000pF

4,700pF

2,200pF

U2J (7U) char., Rated Voltage: DC500VU2J (7U) char., Rated Voltage: DC200V

Frequency [kHz]

1000100101

10

100

(200)

Allowable Voltage [Vp-p]

1000

Frequency [kHz]

1000100101

10

100

(250)

Allowable Voltage [Vp-p]

1000

Frequency [kHz]

1000100101

10

100

(500)

Allowable Voltage [Vp-p]

1000

U2J (7U) char., Rated Voltage: DC250V

to 2,200pF

4,700pF

4,700pF

10,000pF

10,000pF

22,000pF

22,000pF

47,000pF

47,000pF

to 2,200pF

2,200pF

4,700pF

10,000pF

22,000pF

47,000pF

to 1,000pF

[The sine-wave frequency VS allowable voltage]

The surface temperature of the capacitor: 125°C or less

(including self-heating)

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

5. DC Voltage and AC Voltage Characteristics

1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change

sharply depending on the applied voltage (see figure).
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change

caused by the applied voltage is within the
allowed range.

(2) In the DC voltage characteristics, the rate of

capacitance change becomes larger as voltage
increases, even if the applied voltage is below the
rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.

2. The capacitance values of high dielectric constant type
capacitors changes depending on the AC voltage applied.
Please consider the AC voltage characteristics when
selecting a capacitor to be used in an AC circuit.

-60

-50

-40

-30

-20

-10

0

10

20

30

0 0.5 1 1.5 2

AC Voltage (Vr.m.s.)

-100

-80

-60

-40

-20

0

20

0 1020304050

DC Voltage (V)

[Example of DC Voltage Characteristics]
Sample: X7R (R7) Characteristics 0.1μF,

Rated Voltage 50VDC

[Example of AC Voltage Characteristics]
Sample: X7R (R7) Characteristics 10μF,

Rated Voltage 6.3VDC

Capacitance Change (%)Capacitance Change (%)

6. Capacitance Aging

1. The high dielectric constant type capacitors have an
Aging characteristic in which the capacitance value
decreases with the passage of time.
When you use high dielectric constant type capacitors in
a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully
consider the characteristics of these capacitors, such as
their aging, voltage, and temperature characteristics. In
addition, check capacitors using your actual appliances at
the intended environment and operating conditions.

-40

-30

-20

-10

0

10

20

10 100 1000 10000

Time (h)

Capacitance Change (%)

[Example of Change Over Time (Aging Characteristics)]

C0G (5C)

X7R (R7)

X5R (R6)

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

7. Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its
condition, and any generation of resonance.
Please mount the capacitor so as not to generate
resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause
damage or a crack in the dielectric material of the
capacitor.
Do not use a dropped capacitor because the quality and
reliability may be deteriorated.

3. When printed circuit boards are piled up or handled, the
corner of another printed circuit board should not be
allowed to hit the capacitor, in order to avoid a crack or
other damage to the capacitor.

Floor

Crack

Crack

Mounting printed circuit board

Soldering and Mounting

1. Confirm the best mounting position and direction that
minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the

stress imposed on the chip during flexing or bending
of the board.

<Applicable to NFM Series>

2. If you mount the capacitor near components that
generate heat, take note of the heat from the other
components and carefully check the self-heating of the
capacitor before using.
If there is significant heat radiation from other
components, it could lower the insulation resistance of
the capacitor or produce excessive heat.

1. Mounting Position

Locate chip
horizontal to
the direction in
which stress
acts.

It is eective to implement the following measures, to reduce stress
in separating the board.
It is best to implement all of the following three measures; however,
implement as many measures as possible to reduce stress.

[Component Direction]

[Chip Mounting Close to Board Separation Point]

When a capacitor is mounted near a screw hole, it may be aected
by the board deflection that occurs during the tightening of the
screw. Mount the capacitor in a position as far away from the
screw holes as possible.

[Mounting Capacitors Near Screw Holes]

A

B

D

C

Perforation

(Bad Example) (Good Example)

Slit

Contents of Measures Stress Level

A > B(2) Add slits in the board separation part.

A > D *1

(1)

Turn the mounting direction of the component
parallel to the board separation surface.

A > C

(3)

Keep the mounting position of the component
away from the board separation surface.

Screw Hole

Recommended

A > D is valid when stress is added vertically to the perforation as with

Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore

A > D is invalid.

*1

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not
applied to the capacitors. Check the mounting in the
actual device under actual use conditions ahead of time.

1-1. In mounting the capacitors on the printed circuit

board, any bending force against them shall be kept
to a minimum to prevent them from any damage or
cracking. Please take into account the following
precautions and recommendations for use in your
process.
(1) Adjust the lowest position of the pickup nozzle so

as not to bend the printed circuit board.

2. Dirt particles and dust accumulated in the suction nozzle
and suction mechanism prevent the nozzle from moving
smoothly. This creates excessive force on the capacitor
during mounting, causing cracked chips. Also, the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked, and replaced periodically.

<Applicable to ZRB Series>

3. To adjust the inspection tolerance for automated
appearance sorting machine of mounting position,
because ZRB series are easier to shi the mounting
position than standard MLCC.

4. To check the overturn and reverse of chip.

5. To control mounting speed carefully, because ZRB series
is heavier than standard MLCC.

Board Guide

[Correct]

Suction Nozzle

Board

Support Pin

[Incorrect]

Deflection

2. Information before Mounting

1. Do not re-use capacitors that were removed from the
equipment.

2. Confirm capacitance characteristics under actual applied
voltage.

3. Confirm the mechanical stress under actual process and
equipment use.

4. Confirm the rated capacitance, rated voltage and other
electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that
were in long-term storage.

6. Prior to measuring capacitance, carry out a heat
treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.

8. We have also produced a DVD which shows a summary of
our recommendations, regarding the precautions for
mounting. Please contact our sales representative to
request the DVD.

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

4-1. Reflow Soldering

1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature dierential between the solder and
the components surface (ΔT) as small as possible.

2. When components are immersed in solvent aer mounting,
be sure to maintain the temperature dierence (ΔT)
between the component and the solvent within the range
shown in table 1.

Recommended Conditions

[Example of Temperature Conditions for Reflow Soldering]

[Allowable Reflow Soldering Temperature and Time]

In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.

Temperature
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder

Soldering Time (s)

260

270

280

250

240

230

220

0 30 60 90 120

Soldering Temperature (°C)

Peak Temperature

Atmosphere

Pb-Sn Solder

230 to 250°C

Air

Lead Free Solder

240 to 260°C

Air or N2

60-120 seconds 30-60 seconds

ΔT

Gradual
Cooling

Soldering

Preheating

220°C (200°C)

190°C (170°C)
170°C (150°C)
150°C (130°C)

Time

Temperature (°C)

Peak Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

3. When a capacitor is mounted at a temperature lower
than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can
occur. Consider factors such as the placement of
peripheral components and the reflow temperature
setting to prevent the capacitor’s reflow temperature
from dropping below the peak temperature specified. Be
sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur.

F0-.',1-*"#05#22 '*'27
F-*"#04-'"1
F-11' *#-!!300#,!#-$5&'1)#0',%
F0-.', -,"',%120#,%2&
F0-.',1#*$Q*'%,+#,2.0-.#02'#1
F-11' *#-!!300#,!#-$2-+ 12-,#1,"G-01&'x',%-,

the land patterns of the circuit board

GRM/GJM/GQM/GR3/
GRJ/KRM/LLR/NFM/GR7

02/03/15/18/21/31

LLL

02/03/15/18/1U/21/31

ZRB 15/18

GR3/GRJ/GRM/KR3/KRM
GA2/GA3/GR4

32/42/43/52/55

LLA/LLM 18/21/31

GQM 22

ΔT

<
=

190°C

ΔT

<
=

130°C

Series

Chip Dimension Code

(L/W)

Temperature

Dierential

Table 1

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to

the PCB.

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a

excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.

4-2. Too little solder paste results in a lack of adhesive

strength on the termination, which may result in
chips breaking loose from the PCB.

4-3. Please confirm that solder has been applied

smoothly to the termination.

<Applicable to NFM Series>

Continued from the preceding page.

Continued on the following page.

100-150μm: NFM15/18/21/3D/31
100-200μm: NFM41

[Guideline of solder paste thickness]

2.6

2.5

4.4

1.0

0.6

1.2

NFM21PS

2.0

2.5

3.9

1.0

0.6

0.8

NFM3DCC/3DPC

NFM31PC/31KC

NFM18PS

2.6

3.5

5.5

1.5

0.6

1.0

NFM41CC/41PC

NFM15CC/15PC

2.2

1.0

0.4

0.6

1.2

NFM18CC/18PC

0.4

NFM21CC/21PC

1.4

2.6

0.6

0.8

0.6

1.9

0.8

0.4

0.1

1.2

1.20.05

2.0

0.85

1.85

0.6

1.6

1.2

2.6

1.25

0.4

1.8

0.8

0.25

0.7

1.3

0.25

0.3

0.75

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the

thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.

[Example of Temperature Conditions for Flow Soldering]

[Allowable Flow Soldering Temperature and Time]

In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.

Soldering Time (s)

260

270

280

250

240

230

220

010203040

Soldering Temperature (°C)

Up to Chip Thickness

Adhesive

Recommended Conditions

Soldering Peak Temperature

Atmosphere

Pb-Sn Solder

240 to 250°C

Air

Lead Free Solder

250 to 260°C

Preheating Peak Temperature

90 to 110°C

100 to 120°C

140 to 160°C (NFM)

Air or N

2

30-90 seconds 5 seconds max.

ΔT

Gradual
Cooling

Soldering

Preheating

Preheating
Peak
Temperature

Time

Temperature (°C)

Soldering
Peak
Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4-2. Flow Soldering

1. Do not apply flow soldering to chips not listed in table 2.

2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required
to keep the temperature dierential between the solder
and the components surface (ΔT) as low as possible.

3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and
terminations.

4. When components are immersed in solvent aer
mounting, be sure to maintain the temperature
dierential (ΔT) between the component and solvent
within the range shown in the table 2.

in section

GR3/GRM

GQM

LLL

GRJ

NFM

18/21/31

18/21

21/31

18/21/31

3D/31/41

ΔT

<
=

150°C

Series

Chip Dimension

Code (L/W)

Temperature

Dierential

Table 2

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

Solder Amount

in section

4-3. Correction of Soldered Portion

When sudden heat is applied to the capacitor, distortion
caused by the large temperature dierence occurs
internally, and can be the cause of cracks. Capacitors also
tend to be aected by mechanical and thermal stress
depending on the board preheating temperature or the
soldering fillet shape, and can be the cause of cracks. Please
refer to "1. PCB Design" or "3. Optimum solder amount" for
the solder amount and the fillet shapes.
Do not correct with a soldering iron for ZRB series.
Correction with a soldering iron for ZRB series may cause
loss suppress acoustic noise, because the solder amount
become excessive.

1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure

to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3.
A hot plate, hot air type preheater, etc. can be used
for preheating.

1-2. Aer soldering, do not allow the component/PCB to

cool down rapidly.

1-3. Perform the corrections with a soldering iron as

quickly as possible. If the soldering iron is applied too
long, there is a possibility of causing solder leaching
on the terminal electrodes, which will cause
deterioration of the adhesive strength and other
problems.

2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air
heating by a spot heater heats the overall component and
board, therefore, it tends to lessen the thermal shock. In
the case of a high density mounted board, a spot heater
can also prevent concerns of the soldering iron making
direct contact with the component.

2-1. If the distance from the hot air outlet of the spot

heater to the component is too close, cracks may
occur due to thermal shock. To prevent this problem,
follow the conditions shown in Table 4.

2-2. In order to create an appropriate solder fillet shape, it is

recommended that hot air be applied at the angle shown
in Figure 1.

3. Optimum solder amount when re-working with a soldering iron

3-1. If the solder amount is excessive, the risk of cracking is

higher during board bending or any other stressful
condition.
Too little solder amount results in a lack of adhesive
strength on the termination, which may result in chips
breaking loose from the PCB.
Please confirm that solder has been applied smoothly and
rising to the end surface of the chip.

Table 3

GJM/GQM/GR3/GRJ/GRM/GR7

ΔT

<
=

190°C

ΔT

<
=

130°C

350°C max.

280°C max.

150°C min.

150°C min.

Air

Air

*Applicable for both Pb-Sn and Lead Free Solder.

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

*Please manage ΔT in the temperature of soldering iron and the preheating temperature.

GRJ/GRM/GR4/GA2/GA3

GQM

03/15/18/21/31

NFM

ΔT

<
=

190°C

350°C max.

340°C max.

150°C min. Air

3D/41

15

32/42/43/52/55

22

Table 4

Hot Air Application Angle

45° *Figure 1

Distance

5mm or more

Hot Air Temperature Nozzle Outlet

400°C max.

Application Time

Less than 10 seconds
(1206 (3216M) size or smaller)

Less than 30 seconds
(1210 (3225M) size or larger)

an Angle of 45°

One-hole Nozzle

[*Figure 1]

Series

Chip Dimension Code

(L/W)

Temperature

Dierential (ΔT)

Atmosphere

Temperature of

Soldering Iron Tip

Preheating

Temperature

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

3-2. A soldering iron with a tip of ø3mm or smaller should

be used. It is also necessary to keep the soldering iron
from touching the components during the re-work.

3-3. Solder wire with ø0.5mm or smaller is required for

soldering.

<Applicable to KR3/KRM Series>

4. For the shape of the soldering iron tip, refer to the figure
on the right.
Regarding the type of solder, use a wire diameter of
ø0.5mm or less (rosin core wire solder).

4-1. How to Apply the Soldering Iron

Apply the tip of the soldering iron against the lower
end of the metal terminal.

1) In order to prevent cracking caused by sudden
heating of the ceramic device, do not touch the
ceramic base directly.

2) In order to prevent deviations and dislocating of
the chip, do not touch the junction of the chip and
the metal terminal, and the metal portion on the
outside directly.

4-2. Appropriate Amount of Solder

The amount of solder for corrections by soldering iron,
should be lower than the height of the lower side of
the chip.

Cross Section

17 26

(in mm)

R0.5

ø6.5

Apply the tip of the soldering iron only
on the terminal portion, without touching
the body of the chip.

Tip of Soldering Iron
Tip temperature: 350°C or less/
5 sec. or less/60W or less

Copper Land

Wire Solder

6. Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when
inspecting the electrical performance of a capacitor aer
mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the

pressure of a test-probe, etc.
The thrusting force of the test probe can flex the
PCB, resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing. Install support pins as
close to the test-probe as possible.

1-2. Avoid vibration of the board by shock when a

test-probe contacts a printed circuit board.

7. Printed Circuit Board Cropping

1. Aer mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that causes bending
or twisting the board.

1-1. In cropping the board, the stress as shown at right

may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the
insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.

[Not Recommended]

[Recommended]

Peeling

Test-probe

Support Pin

Test-probe

[Bending]

[Twisting]

5. Washing

Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process, test
your cleaning equipment/process to insure it does not
degrade the capacitors.

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

2. Check the cropping method for the printed circuit board
in advance.

2-1. Printed circuit board cropping shall be carried out by

using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical
stress that can occur to the board.

Level of stress on board

Board Separation Method

High

Hand Separation

Nipper Separation

Medium

(1) Board Separation Jig

Medium

(2) Disc Separator

Low

Recommended

Notes

Hand and nipper
separation apply a high
level of stress.
Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Board handling

· Layout of slits

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

(3) Router Type Separator

Board Separation Apparatus

* When a board separation jig or disc separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors

may crack. Use router type separator if at all possible.

(1) Example of a suitable jig

[In the case of Single-side Mounting]
An outline of the board separation jig is shown as
follows. Recommended example: Stress on the
component mounting position can be minimized by
holding the portion close to the jig, and bend in the
direction towards the side where the capacitors
are mounted. Not recommended example: The risk
of cracks occurring in the capacitors increases due
to large stress being applied to the component
mounting position, if the portion away from the jig
is held and bent in the direction opposite the side
where the capacitors are mounted.

[Outline of Jig]

Load Point

Load Point

Board Cropping Jig

V-groove

Printed Circuit Board

Components

Components

Printed Circuit Board

Direction of Load

Direction of Load

Printed Circuit Board

Not RecommendedRecommended

[In the case of Double-sided Mounting]
Since components are mounted on both sides of the
board, the risk of cracks occurring can not be
avoided with the above method.
Therefore, implement the following measures to
prevent stress from being applied to the
components.

(Measures)
(1) Consider introducing a router type separator.

If it is dicult to introduce a router type separator,
implement the following measures. (Refer to item 1.
Mounting Position)

(2) Mount the components parallel to the board

separation surface.

(3) When mounting components near the board

separation point, add slits in the separation position
near the component.

(4) Keep the mounting position of the components

away from the board separation point.

Hand Separation

gq* q* n

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

(2) Example of a Disc Separator

An outline of a disc separator is shown as follows.
As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the
V-grooves on the printed circuit board to
separate the board.
In the following case, board deflection stress will
be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom

blades are misaligned, such as deviating in the
top-bottom, le-right or front-rear directions

(2) The angle of the V groove is too low, depth of

the V groove is too shallow, or the V groove is

misaligned top-bottom
IF V groove is too deep, it is possible to brake
when you handle and carry it. Carefully design
depth of the V groove with consideration about
strength of material of the printed circuit board.

V-groove

Printed Circuit Board

[Outline of Machine]

[Principle of Operation]

[Cross-section Diagram]

Top Blade

Top Blade

Bottom Blade

Bottom Blade

Top Blade

Bottom Blade

Top Blade

Bottom Blade

Top Blade

Bottom Blade

Top Blade

Printed Circuit Board

V-groove

Recommended

Not Recommended

Top-bottom Misalignment Le-right Misalignment Front-rear Misalignment

(3) Example of Router Type Separator

The router type separator performs cutting by a
router rotating at a high speed. Since the board
does not bend in the cutting process, stress on
the board can be suppressed during board
separation.
When attaching or removing boards to/from the
router type separator, carefully handle the boards
to prevent bending.

[Outline Drawing]

Example of Recommended

V-groove Design

Not Recommended

Le-right Misalignment Low-Angle Depth too Shallow Depth too Deep

Router

Disc Separator

V-groove Design

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

1. Handling
If a board mounted with capacitors is held with one hand,
the board may bend. Firmly hold the edges of the board
with both hands when handling.
If a board mounted with capacitors is dropped, cracks
may occur in the capacitors.
Do not use dropped boards, as there is a possibility that
the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting
other components on the back side of the board
aer capacitors have been mounted on the opposite
side.
When the bottom dead point of the suction nozzle is
set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and
cracks may occur in the capacitors.

· Aer the board is straightened, set the bottom
dead point of the nozzle on the upper surface of the
board.

· Periodically check and adjust the bottom dead point.

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.)
into boards, bending the board may cause cracks in
the capacitors or cracks in the solder.
Pay attention to the following.

· Increase the size of the holes to insert the leads, to
reduce the stress on the board during insertion.

· Fix the board with support pins or a dedicated jig
before insertion.

· Support below the board so that the board does not
bend. When using support pins on the board,
periodically confirm that there is no dierence in
the height of each support pin.

2-3. Attaching/Removing Sockets and/or Connectors

Insertion and removal of sockets and connectors,
etc., might cause the board to bend. Please insure
that the board does not warp during insertion and
removal of sockets and connectors, etc., or the
bending may damage mounted components on the
board.

2-4. Tightening Screws

The board may be bent, when tightening screws, etc.
during the attachment of the board to a shield or
chassis.
Pay attention to the following items before
performing the work.

· Plan the work to prevent the board from bending.

· Use a torque screwdriver, to prevent
over-tightening of the screws.

· The board may bend aer mounting by reflow
soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when
tightening the screws.

8. Assembly

Continued from the preceding page.

Continued on the following page.

Suction Nozzle

Component with Leads

Socket

Screwdriver

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

1-1. Do not touch a capacitor directly with bare hands

during operation in order to avoid the danger of an
electric shock.

1-2. Do not allow the terminals of a capacitor to come in

contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid,
including any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will

operate is under the specified conditions.
Do not use the equipment under the following
environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or

radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide,

sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the

specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any

conditions that can cause condensation.

Other

<Applicable to GMA or GMD Series>

1. Die Bonding of Capacitors
1-1. Use the following materials for the Brazing alloys:

Au-Sn (80/20) 300 to 320 °C in N

2 atmosphere

1-2. Mounting

(1) Control the temperature of the substrate so it

matches the temperature of the brazing alloy.

(2) Place the brazing alloy on the substrate and place

the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.

2. Wire Bonding
2-1. Wire

Gold wire: 25 micro m (0.001 inch) diameter

2-2. Bonding

(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150 to 200 °C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other

devices with gold wire.

9. Die Bonding/Wire Bonding

1. Under Operation of Equipment

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or

smell, immediately turn o or unplug the
equipment.
If the equipment is not turned o or unplugged, the
hazards may be worsened by supplying continuous
power.

(2) In this type of situation, do not allow face and

hands to come in contact with the capacitor or
burns may be caused by the capacitor's high
temperature.

2-2. Disposal of Waste

When capacitors are disposed of, they must be burned
or buried by an industrial waste vendor with the
appropriate licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending
of the board may cause deterioration of the
insulation resistance, and result in a short.
If the circuit being used may cause an electrical
shock, smoke or fire when a capacitor is shorted,
be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.

(2) Capacitors used to prevent electromagnetic

interference in the primary AC side circuit, or as a
connection/insulation, must be a safety standard
certified product, or satisfy the contents stipulated
in the Electrical Appliance and Material Safety Law.
Install a fuse for each line in case of a short.

(3) The GJM, GMA, GMD, GQM, GR3, GRJ, GRM, KR3,

KRM, LLA, LLL, LLM, LLR, NFM and ZRB series are
not safety standard certified products.

2-4. Test Condition for AC Withstanding Voltage

(1) Test Equipment

Test equipment for AC withstanding voltage
should be made with equipment capable of
creating a wave similar to a 50/60Hz sine wave.

(2) Voltage Applied Method

The capacitor's lead or terminal should be firmly
connected to the output of the withstanding
voltage test equipment, and then the voltage
should be raised from near zero to the test
voltage.
If the test voltage is applied directly to the
capacitor without raising it from near zero, it
should be applied with the zero cross. *At the end
of the test time, the test voltage should be
reduced to near zero, and then capacitor's lead or
terminals should be taken o the output of the
withstanding voltage test equipment.
If the test voltage applied directly to the
capacitor without raising it from near zero, surge
voltage may occur and cause a defect.

*ZERO CROSS is the point where voltage sine wave

passes 0V. - See the figure at right -

2-5. Remarks

Failure to follow the cautions may result, worst case,
in a short circuit and smoking when the product is
used.
The above notices are for standard applications and
conditions. Contact us when the products are used in
special mounting conditions.
Select optimum conditions for operation as they
determine the reliability of the product aer
assembly.
The data herein are given in typical values, not
guaranteed ratings.

2. Other

Continued from the preceding page.

0V

zero cross

Voltage sine wave

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

1. Operating Temperature

1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum

operating temperature.
It is necessary to select a capacitor with a suitable
rated temperature that will cover the operating
temperature range.
It is also necessary to consider the temperature
distribution in equipment and the seasonal
temperature variable factor.

1-2. Consider the self-heating factor of the capacitor.

The surface temperature of the capacitor shall not
exceed the maximum operating temperature including
self-heating.

2. Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable,

operating environments may deteriorate due to the
corrosion of the terminations and the penetration of
moisture into the capacitor.

1-2. The same phenomenon as the above may occur when

the electrodes or terminals of the capacitor are subject
to moisture condensation.

1-3. The deterioration of characteristics and insulation

resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when the
capacitor is exposed to corrosive or volatile gases or
solvents for long periods of time.

3. Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC
or pulse circuits, the capacitor itself vibrates at specific
frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is
added to the capacitor, noise may occur.

Rating

Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are

susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.

1-2. There is a possibility of chip cracking caused by PCB

expansion/contraction with heat, because stress on
a chip is dierent depending on PCB material and
structure. When the thermal expansion coecient
greatly diers between the board used for mounting
and the chip, it will cause cracking of the chip due to
the thermal expansion and contraction.
When capacitors are mounted on a fluorine resin
printed circuit board or on a single-layered glass
epoxy board, it may also cause cracking of the chip
for the same reason.

<Applicable to NFM Series>

1-3. Because noise is suppressed by shunting unwanted

high-frequency components to the ground, when
designing a land for the NFM series, design the
ground pattern to be as large as possible in order to
better bring out this characteristic.
As shown in the figure below, noise countermeasures
can be made more eective by using a via to connect
the ground pattern on the chip mounting surface to a
larger ground pattern on the inner layer.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

2. Land Dimensions
2-1. Please refer to the land dimensions in table 1 for flow

soldering, table 2 for reflow soldering, table 3 for
reflow soldering for ZRB Series, table 4 for reflow
soldering for LLA Series, table 5 for reflow soldering
for LLM Series.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.

GQM/GR3/GRJ/GRM

GQM/GR3/GRJ/GRM

GR3/GRJ/GRM

LLL

LLL

1.6g0.8

2.0g1.25

3.2g1.6

1.25g2.0

1.6g3.2

0.6 to 1.0

1.0 to 1.2

2.2 to 2.6

0.4 to 0.7

0.6 to 1.0

0.8 to 0.9

0.9 to 1.0

1.0 to 1.1

0.5 to 0.7

0.8 to 0.9

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

1.4 to 1.8

2.6 to 2.8

(in mm)

Chip (LgW) a b c

Table 1 Flow Soldering Method

Series

18

21

31

21

31

Chip Dimension Code

(L/W)

Flow soldering can only be used for products with a chip size from 1.6x0.8mm to 3.2x1.6mm.

Solder Resist

ab

c

Chip Capacitor

Land

Continued from the preceding page.

Continued on the following page.

Chassis

Solder (ground)

Electrode Pattern

Solder Resist

Solder Resist

Solder Resist

Lead Wire

Soldering Iron

Lead Wire

Solder Resist

Pattern Forms

Placing Close to Chassis

Placing

of Chip Components

and Leaded Components

Placing

of Leaded Components

aer Chip Component

Lateral Mounting

Prohibited Correct

in section in section

in section in section

in section in section

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

LLA

LLA

1.6g0.8

2.0g1.25

(in mm)

Chip (LgW)Series

0.3 to 0.4

0.5 to 0.7

a

0.25 to 0.35

0.35 to 0.6

b

0.15 to 0.25

0.2 to 0.3

c

0.4

0.5

p

Table 4 LLA Series Reflow Soldering Method

18

21

[Land for ZRB Series]

Chip Dimension Code

(L/W)

ZRB

ZRB

1.0g0.5

1.6g0.8

(in mm)

Chip (LgW)

Series

0.4 to 0.6

0.7 to 0.9

a

0.4 to 0.5

0.7 to 0.8

b

0.5 to 0.7

0.8 to 1.0

c

Table 3 ZRB Series Reflow Soldering Method

15

18*

Chip Dimension

Code (L/W)

Solder Resist

ab

c

ZRB

Land

*If distance between parts is too short, there is risk to cause

electrical short. Please confirm the mounting pitch

(distance between centers of parts) has 1.275mm or more.

(ZRB18 only)

Continued from the preceding page.

Continued on the following page.

GJM/GRM

GJM/GRM

GJM/GRM

GQM/GR3/GRJ/GRM

GQM

GR3/GRJ/GRM/GR7

GQM

GR3/GRJ/GRM/GR7

GR3/GRJ/GRM

GA2/GA3/GR4

GR3/GRJ/GRM/GA2/
GA3/GR4

GA2/GA3

GR3/GRJ/GRM/GA2/
GA3/GR4

LLL

LLL

LLL/LLR

LLL

LLL

0.4g0.2

0.6g0.3 (±0.03)

0.6g0.3 (±0.05)

0.6g0.3 (±0.09)

1.0g0.5 (within ±0.10)

1.0g0.5 (±0.15/±0.20)

1.6g0.8 (within ±0.10)

1.6g0.8 (±0.15/±0.20)

2.0g1.25

2.0×g1.25 (within ±0.10)

2.0g1.25 (±0.15)

2.0g1.25 (±0.20)

2.8g2.8

3.2g1.6 (within ±0.20)

3.2g1.6 (±0.30)

3.2g2.5

4.5g2.0

4.5g3.2

5.7g2.8

5.7g5.0

0.5g1.0

0.6g1.0

0.8g1.6

1.25g2.0

1.6g3.2

0.16 to 0.2

0.2 to 0.25

0.2 to 0.25

0.23 to 0.3

0.3 to 0.5

0.4 to 0.6

0.6 to 0.8

0.7 to 0.9

1.0 to 1.2

1.2

1.2

1.0 to 1.4

2.2 to 2.5

1.8 to 2.0

1.9 to 2.1

2.0 to 2.4

2.8 to 3.4

3.0 to 3.5

4.0 to 4.6

4.0 to 4.6

0.15 to 0.2

0.20 to 0.25

0.2 to 0.3

0.4 to 0.5

0.6 to 0.8

0.12 to 0.18

0.2 to 0.3

0.25 to 0.35

0.25 to 0.35

0.35 to 0.45

0.4 to 0.5

0.6 to 0.7

0.7 to 0.8

0.6 to 0.7

0.6

0.6 to 0.8

0.6 to 0.8

0.8 to 1.0

0.9 to 1.2

1.0 to 1.3

1.0 to 1.2

1.2 to 1.4

1.2 to 1.4

1.4 to 1.6

1.4 to 1.6

0.2 to 0.25

0.25 to 0.35

0.3 to 0.4

0.4 to 0.5

0.6 to 0.7

0.2 to 0.23

0.25 to 0.35

0.3 to 0.4

0.3 to 0.4

0.4 to 0.6

0.5 to 0.7

0.6 to 0.8

0.8 to 1.0

0.8 to 1.1

1.25

1.2 to 1.4

1.2 to 1.4

1.9 to 2.3

1.5 to 1.7

1.7 to 1.9

1.8 to 2.3

1.4 to 1.8

2.3 to 3.0

2.1 to 2.6

3.5 to 4.8

0.7 to 1.0

0.7 to 1.0

1.4 to 1.6

1.4 to 1.8

2.6 to 2.8

KRM

KRM

KR3/KRM

2.0g1.25

3.2g1.6

5.7g5.0

1.0 to 1.2

2.2 to 2.4

2.6

0.6 to 0.7

0.8 to 0.9

2.7

0.8 to 1.1

1.0 to 1.4

5.6

(in mm)

Chip (LgW) a b c

<Applicable to Part Number KR3/KRM>

(in mm)

Chip (LgW)

Series

Series

02

03

15

18

21

21

22

31

32

42

43

52

55

15

1U

18

21

31

21

31

55

Chip Dimension Code

(L/W)

Chip Dimension Code

(L/W)

abc

Table 2 Reflow Soldering Method

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

LLM 21 2.0g1.25

(in mm)

Chip

(LgW)

0.6 to 0.8a(0.3 to 0.5)

b, b'

0.3

c, c'

2.0 to 2.6d1.3 to 1.8e1.4 to 1.6

f

0.5

p

Table 5 LLM Series Reflow Soldering Method

b=(c-e)/2, b'=(d-f)/2

[Land for LLA Series] [Land for LLM Series]

c'

a

e

b

c p

f

b'

d

Solder Resist Solder Resist

pc

ab

Chip Capacitor

Chip Capacitor

Land

Land

2-2. Dimensions of Slit (Example)

Preparing the slit helps flux cleaning and resin
coating on the back of the capacitor.
However, the length of the slit design should be as
short as possible to prevent mechanical damage in
the capacitor.
A longer slit design might receive more severe
mechanical stress from the PCB.
Recommended slit design is shown in the Table.

1.6g0.8

2.0g1.25

3.2g1.6

3.2g2.5

4.5g2.0

4.5g3.2

5.7g2.8

5.7g5.0

–

–

1.0 to 2.0

1.0 to 2.0

1.0 to 2.8

1.0 to 2.8

1.0 to 4.0

1.0 to 4.0

–

–

3.2 to 3.7

4.1 to 4.6

3.6 to 4.1

4.8 to 5.3

4.4 to 4.9

6.6 to 7.1

LgWd e

(in mm)

<Applicable to beyond Rated Voltage of 200VDC>

Land

Solder Resist

L

W

Chip Capacitor

Slit

d

e

Series

Chip Dimension Code

(L/W)

Continued from the preceding page.

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

Continued from the preceding page.

Continued on the following page.

Land PatternLand Pattern

+ Solder Resist

Solder Resist

(in mm)

NFM15CC
NFM15PC
NFM18CC
NFM18PC
NFM18PS
NFM21CC
NFM21PC
NFM21PS

o Reflow Soldering

o Reflow Soldering

o Flow Soldering

Chip mounting side

Chip mounting side

NFM3DCC
NFM3DPC

NFM31PC

NFM41CC
NFM41PC

4.4

4.4

6.0

1.4

1.4

2.0

Part

Number

Size (mm)

d

1.0

1.2

1.2

e

2.0

2.6

2.6

f

2.4

3.0

3.0

g

1.0

1.0

1.5

ab

2.5

2.5

3.5

c

NFM3DCC
NFM3DPC
NFM31PC
NFM31KC
NFM41CC
NFM41PC

NFM3DCC
NFM3DPC

NFM31PC

NFM41CC
NFM41PC

4.4

4.4

6.0

1.4

1.4

2.0

Part

Number

Size (mm)

d

1.0

1.2

1.2

e

2.0

2.6

2.6

f

2.4

3.0

3.0

g

1.0

1.0

1.5

ab

2.5

2.5

3.5

c

a

e

0.6

f

g

b
c
d

Small diameter thru hole ø0.4

Small diameter thru hole ø0.4

b

a

e

0.6

f

g

c
d

NFM3DCC/NFM3DPC/NFM31PC/NFM41CC/NFM41PC

Small diameter thru hole ø0.4

10mm or
more
(in case of
10A)

1.4

1.0

1.2

0.6

2.6

3.0

2.5

4.4

NFM31KC*

1

*

1 For large current

design, width of
signal land pattern
should be wider not
less than 1mm per
1A (1mm/A).
For example,
in case of 10A, signal
land pattern width
should be 10mm or
more.
(1mm/A*10A=10mm)

*

1 For large current

design, width of
signal land pattern
should be wider not
less than 1mm per
1A (1mm/A).
For example,
in case of 10A, signal
land pattern width
should be 10mm or
more.
(1mm/A*10A=10mm)

Small diameter thru hole ø0.4

1.4

1.0

1.2

0.6

2.6

3.0

2.5

4.4

NFM31KC*

1

10mm or
more
(in case of
10A)

NFM18PS

NFM21PS

0.4

0.6

1.0

1.5

2.2

0.4

0.6

1.2

Small diameter thru hole ø0.2-ø0.3

1.2

1.5

0.4

0.1

1.2

0.8

2.0

0.05

Small diameter thru hole ø0.2

NFM18CC/NFM18PC

0.85

1.25

1.85

2.35

0.6

0.4

1.6

1.8

1.2

0.8

2.6

Small diameter thru hole ø0.2-ø0.3

0.25

0.7

1.3

0.25

0.3

0.6

0.75

Filled via
ø0.15

NFM15CC/NFM15PC

NFM21CC/NFM21PC

0.6

0.8

0.6

1.9

2.3

1.4

2.6

Small diameter thru hole ø0.4

<Applicable to NFM Series>

Series Land Dimensions

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

2. Adhesive Application

If you want to temporarily attach the capacitor to the board
using an adhesive agent before soldering the capacitor, first
be sure that the conditions are appropriate for axing the
capacitor. If the dimensions of the land, the type of
adhesive, the amount of coating, the contact surface area,
the curing temperature, or other conditions are
inappropriate, the characteristics of the capacitor may
deteriorate.

1. Selection of Adhesive
1-1. Depending on the type of adhesive, there may be a

decrease in insulation resistance. In addition, there is a
chance that the capacitor might crack from contractile
stress due to the dierence in the contraction rate of
the capacitor and the adhesive.

1-2. If there is not enough adhesive, the contact surface

area is too small, or the curing temperature or curing
time are inadequate, the adhesive strength will be
insucient and the capacitor may loosen or become
disconnected during transportation or soldering.
If there is too much adhesive, for example if it overflows
onto the land, the result could be soldering defects, loss
of electrical connection, insucient curing, or slippage
aer the capacitor is mounted.
Furthermore, if the curing temperature is too high or the
curing time is too long, not only will the adhesive

strength be reduced, but solderability may also suer
due to the eects of oxidation on the terminations
(outer electrodes) of the capacitor and the land surface
on the board.
(1) Selection of Adhesive

Epoxy resins are a typical class of adhesive.
To select the proper adhesive, consider the following
points.

1) There must be enough adhesive strength to
prevent the component from loosening or slipping
during the mounting process.

2) The adhesive strength must not decrease when
exposed to moisture during soldering.

3) The adhesive must have good coatability and
shape retention properties.

4) The adhesive must have a long pot life.

5) The curing time must be short.

6) The adhesive must not be corrosive to the exterior
of the capacitor or the board.

7) The adhesive must have good insulation properties.

8) The adhesive must not emit toxic gases or
otherwise be harmful to health.

9) The adhesive must be free of halogenated
compounds.

3. Board Design
When designing the board, keep in mind that the amount
of strain which occurs will increase depending on the size
and material of the board.

[Relationship with amount of strain to the board
thickness, length, width, etc.]

=

3PL

2Ewh

2

Relationship between load and strain

3

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,
the amount of strain also increases.
→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.

· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.

· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the eect on the amount of strain
becomes even greater.

Continued from the preceding page.

: Strain on center of board (μst)
L: Distance between supporting points (mm)

w: Board width (mm)
h: Board thickness (mm)
E: Elastic modulus of board (N/m2=Pa)
Y: Deflection (mm)

P: Load (N)

3

L

w

Y

h

P

Continued on the following page.

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

Continued from the preceding page.

[Sizes: 1205(3212M) / 1206(3216M) / 1806(4516M)]

Bonding agent

Coating position of
bonding agent

The flux in the solder paste contains halogen-based
substances and organic acids as activators.
Strong acidic flux can corrode the capacitor and degrade
its performance.

Please check the quality aer mounting, please use.

6. Reflow Soldering

o Set temperature and time to ensure that leaching of the

terminations does not exceed 25% of the chip end area
as a single chip (full length of the edge A-B-C-D shown at
right) and 25% of the length A-B shown as mounted on
substrate.

[As a Single Chip]

[As Mounted on Substrate]

5. Flow Soldering

A

B

C

D

Termination (Outer Electrode)

A

B

4. Flux for Flow Soldering

1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of solderability,
so apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering.)

2. Flux containing too high a percentage of halide may cause
corrosion of the terminations unless there is sucient
cleaning. Use flux with a halide content of 0.1% max.

3. Strong acidic flux can corrode the capacitor and degrade
its performance.
Please check the quality of capacitor aer mounting.

3. Adhesive Curing

1. Insucient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the terminations due
to moisture absorption.

Control curing temperature and time in order to prevent
insucient hardening.

Continued on the following page.

(2) Use the following illustration as a guide to the

amount of adhesive to apply.

Cross Sectional View

Side View

Resist

Adhesive

Land

Board

<Applicable to NFM Series>

[Sizes: 0603(1608M) / 0805(2012M) / 1206(3216M)]

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

1. Transportation

1. The performance of a capacitor may be aected by the
conditions during transportation.

1-1. The capacitors shall be protected against excessive

temperature, humidity, and mechanical force during
transportation.
(1) Climatic condition

F*-5'02#+.#0230#BQ~z
F!&,%#-$2#+.#0230#'0G'0BQ|G|
F*-5'0.0#1130#B}z)
F!&,%#-$'0.0#1130#B)G+',@

H|J#!&,'!*!-,"'2'-,

0,1.-022'-,1&** #"-,#',13!&572&2

the boxes are not deformed and forces are not

"'0#!2*7.11#"-,2-2&#',,#0.!)%',%@

{Q|@-,-2..*7#6!#11'4#4' 02'-,A1&-!)A-0.0#1130#

to the capacitor.

H{J&#,#6!#11'4#+#!&,'!*1&-!)-0.0#1130#'1

..*'#"2-!.!'2-0A!&'..',%-0!0!)',%+7

occur in the ceramic body of the capacitor.

H|J&#,2&#1&0.#"%#-$,'0"0'4#0A1-*"#0',%

'0-,A25##8#01A!&11'1A#2!@'+.!21120-,%*7-,

the surface of the capacitor, the capacitor may

!0!),"1&-02Q!'0!3'2@

{Q}@-,-231#!.!'2-02-5&'!&#6!#11'4#1&-!)51

applied by dropping, etc.
A capacitor dropped accidentally during processing
may be damaged.

2. Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system, to confirm

2&22�#'1,-.0- *#+5'2&2&#.#0$-0+,!#,"

specification values in a finished product before using.

|@',!#4-*2%#"#.#,"#,!7,"2#+.#0230#

dependency exists in the capacitance of high dielectric
type ceramic capacitors, the capacitance may change
depending on the operating conditions in the actual
system. Therefore, be sure to evaluate the various

!&0!2#0'12'!1A13!&12&#*#)%#!300#,2,",-'1#
 1-0.2'4'27A5&'!&5'**s#!22&#!.!'2,!#4*3#-$

the capacitor.

}@,""'2'-,A4-*2%#1#6!##"',%2&#.0#"#2#0+',#"130%#

may be applied to the capacitor by the inductance in the
actual system. Evaluate the surge resistance in the actual
system as required.

<Applicable to NFM Series>

~@&##s#!21-$,-'1#13..0#11'-,!,407"#.#,"',%-,

the usage conditions, including dierences in the circuit

-02- #31#"A2&#27.#-$,-'1#A2&#1&.#-$2&#

pattern to be mounted, and the mounting location. Be
sure to verify the eect on the actual device in advance.

Other

Continued from the preceding page.

{@!0!)+7 #!31#"',2&#!.!'2-0"3#2-2&#120#11

of the thermal contraction of the resin during curing
process.
The stress is aected by the amount of resin and curing
contraction.

#*#!20#1',5'2&*-5!30',%!-,20!2'-,@

The dierence in the thermal expansion coecient

#25##,!-2',%0#1',-0+-*"',%0#1',,"2&#

capacitor may cause the destruction and deterioration of

2&#!.!'2-013!&1!0!)-0.##*',%A,"*#"2-2&#

deterioration of insulation resistance or dielectric

0#)"-5,@
#*#!20#1',$-05&'!&2&#2�+*#6.,1'-,!-#t!'#,2

is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buer
against the stress.

|@#*#!20#1',2&2'1*#11&7%0-1!-.'!@

Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance
of a capacitor.
An epoxy resin can be used as a less hygroscopic resin.

}@&#&*-%#,1712#+13 12,!#,"-0%,'!!'"0#

included in coating material, and a chip corrodes by the

)',"-$-2',%+2#0'*@
-,-231#120-,%!'"27.#@

<Applicable to ZRB Series>

~@-1113..0#11!-312'!,-'1#+7 #!31#"',1#0'#1

"3#2-2&#0#1',"30',%!30',%.0-!#11@*#1#!-,2!2-30

sales representative or product engineers on the apply to
resin during curing process.

8. Coating

{@*#1##4*32#2&#!.!'2-031',%!23*!*#,',%

equipment and conditions to confirm the quality, and
select the solvent for cleaning.

|@,13'2 *#!*#,',%+7*#4#0#1'"3*r36-0-2�

foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.

7. Washing

!

Note

• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.