Page 1
Total page 2/16
Spec. No. JENF243A-0005T-01 P.1/10
Reference Only
Chip Ferrite Bead BLM21□□□□□□N1□ Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM21_□N Series.
2. Part Numbering
(ex.) BL M 21 AG 121 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (7)Category
(2)Type (8)Numbers of Circuit
(9)Packaging
D:Taping(φ180mm Reel, Paper Tape)
L:Taping(φ180mm Reel, Plastic Tape)
B:Bulk
Impedance (
120±25% 120 200 0.15 0.25
220±25% 220 200 0.20 0.30
470±25% 470 200 0.25 0.35
600±25% 600 200 0.30 0.40
1000±25% 1000 200 0.50 0.60
22±25％
20 min. 30 4000 0.014 0.028
60±25％
120±25％
220±25％
330±25％
5±25％
60±25％
75±25％
120±25％
120±25％
150±25％
150±25％
)
Rated Current
(mA)(
＊
Typical
22 6000 0.009 0.018
60 3500 0.02 0.04
120 3000 0.03 0.06
220 2000 0.045 0.09
330 1500 0.07 0.14
5 1000 0.02 0.04
60 800 0.13 0.23
75 700 0.16 0.26
120 600 0.19 0.29
120 200 0.25 0.35
150 600 0.21 0.31
150 200 0.25 0.35
1)
Initial
Values
DC Resistance
() max.
Values
After
Testing
Remark
For
Digital
Interface
For DC
power line
For
high speed
signal line
3. Rating
Customer
Part Number
(3)Dimension (L×Ｗ)
(4)Characteristics
(5)Typical Impedance at 100MHz
(6)Performance
MURATA
Part Number
BLM21RK121SN1B
BLM21RK221SN1B
BLM21RK471SN1B
BLM21RK601SN1B
BLM21RK102SN1B
BLM21PG220SN1D
BLM21PG220SN1B
BLM21PG300SN1D
BLM21PG300SN1B
BLM21PG600SN1D
BLM21PG600SN1B
BLM21PG121SN1D
BLM21PG121SN1B
BLM21PG221SN1D
BLM21PG221SN1B
BLM21PG331SN1D
BLM21PG331SN1B
BLM21BB050SN1D
BLM21BB050SN1B
BLM21BB600SN1D
BLM21BB600SN1B
BLM21BB750SN1D
BLM21BB750SN1B
BLM21BB121SN1D
BLM21BB121SN1B
BLM21BD121SN1D
BLM21BD121SN1B
BLM21BB151SN1D
BLM21BB151SN1B
BLM21BD151SN1D
BLM21BD151SN1B
BLM21RK121SN1D
BLM21RK221SN1D
BLM21RK471SN1D
BLM21RK601SN1D
BLM21RK102SN1D
(at 100MHz,Under Standard
Testing Condition)
MURATA MFG.CO., LTD.
Page 2
Total page 3/16
Spec. No. JENF243A-0005T-01 P.2/10
Reference Only
Impedance (
Customer
Part Number
BLM21BB201SN1D
BLM21BB201SN1B
BLM21BB221SN1D
BLM21BB221SN1B
BLM21BD221SN1D
BLM21BD221SN1B
BLM21BB331SN1D
BLM21BB331SN1B
BLM21BD331SN1D
BLM21BD331SN1B
BLM21BD421SN1D
BLM21BD421SN1B
BLM21BB471SN1D
BLM21BB471SN1B
BLM21BD471SN1D
BLM21BD471SN1B
BLM21BD601SN1D
BLM21BD601SN1B
BLM21BD751SN1D
BLM21BD751SN1B
BLM21BD102SN1D
BLM21BD102SN1B
BLM21BD152SN1D
BLM21BD152SN1B
BLM21BD182SN1D
BLM21BD182SN1B
BLM21BD222SN1L
BLM21BD222SN1B
BLM21BD222TN1D
BLM21BD222TN1B
BLM21BD272SN1L
BLM21BD272SN1B
BLM21AG121SN1D
BLM21AG121SN1B
BLM21AG151SN1D
BLM21AG151SN1B
BLM21AG221SN1D
BLM21AG221SN1B
BLM21AG331SN1D
BLM21AG331SN1B
BLM21AG471SN1D
BLM21AG471SN1B
BLM21AG601SN1D
BLM21AG601SN1B
BLM21AG102SN1D
BLM21AG102SN1B
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
MURATA
Part Number
(at 100MHz,Under Standard
Testing Condition)
200±25％
220±25％
220±25% 220 200 0.25 0.35
330±25％
330±25% 330 200 0.3 0.4
420±25% 420 200 0.3 0.4
470±25％
470±25% 470 200 0.35 0.45
600±25% 600 200 0.35 0.45
750±25% 750 200 0.4 0.5
1000±25% 1000 200 0.4 0.5
1500±25% 1500 200 0.45 0.55
1800±25% 1800 200 0.5 0.6
1600 min. 2250 200 0.6 0.7
2200±25% 2200 200 0.6 0.7
2700±25% 2700 200 0.8 0.9
120±25％
150±25％
220±25％
330±25％
470±25％
600±25％
1000±25％
)
Rated Current
(mA)
Typical
200 500 0.26 0.36
220 500 0.26 0.36
330 400 0.33 0.43
470 400 0.40 0.50
120 800 0.10 0.20
150 800 0.10 0.20
220 800 0.13 0.23
330 700 0.16 0.26
470 700 0.19 0.29
600 600 0.21 0.31
1000 500 0.28 0.38
DC Resistance
() max.
Initial
Values
Values
After
Testing
Remark
For
high speed
signal line
For
general
use
(*1) In case of Rated current is more than 1A,
Rated Current is derated as right figure
depending on the operating temperature.
x
1
Rated Current (A )
0
Operating Temperature (°C)
MURATA MFG.CO., LTD.
Describe the Rated current as x[A]
in case of more than 1A.
85 125
Page 3
Spec. No. JENF243A-0005T-01 P.3/10
Reference Only
4. Style and Dimensions
E
L
W
:Electrode
■ Equivalent Circuit
T
Resistance element becomes
()
dominant at high frequencies.
■ Unit Mass (Typical value)
0.010g
L W T E
2.0±0.2 1.25±0.2
0.85±0.2
for 21BD222SN1□
21BD272SN1
1.25±0.2
□
0.5±0.2
for 21BD272SN1
0.3±0.2
(in mm)
□
5. Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Atmospheric pressure : 86kPa to 106kPa
Humidity : 60%(RH) to 70%(RH)
7. Specifications
7-1.Electrical Performance
No. Item Specification Test Method
Impedance Meet item 3.
7-1-1
7-1-2 DC Resistance Meet item 3.
7-2. Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions
7-2-2 Bonding
Strength
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : Agilent4291A or the equivalent
Test Fixture : Agilent16192A or the equivalent
Measuring Equipment : Digital multi meter
Meet item 4. Visual Inspection and measured with Slide Calipers.
Meet Table 1.
Table 1
Appearance No damage
Impedance
Change
(at 100MHz)
DC
Resistance
Within ±30%
Meet item 3.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5s±1s
Applied direction:Parallel to substrate
Ｆ
R0.5
Side view
Ｆ
Substrate
MURATA MFG.CO., LTD.
Page 4
Total page 5/16
Spec. No. JENF243A-0005T-01 P.4/10
Reference Only
No. Item Specification Test Method
7-2-3 Bending
Strength
Meet Table 1. It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm1.6mm
Deflection: 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
R340
Pressure jig
F
Deflection
45mm
7-2-4 Vibration
7-2-5 Resistance
to Soldering
Heat
7-2-6 Drop Products shall be no failure
after tested.
7-2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 4s±1s
Immersion and emersion rates : 25mm/s
7-3. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
7-3-2 Humidity Temperature : 40°C±2°C
7-3-3 Heat Life Temperature : 125°C±3°C
7-3-4 Cold
Resistance
Meet Table 1. 1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
(in case of Rated current is more than 1A,
do the test at : +85 °C±3°C)
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55°C±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
45mm
Product
MURATA MFG.CO., LTD.
Page 5
Total page 6/16
Spec. No. JENF243A-0005T-01 P.5/10
Reference Only
8. Specification of Packaging
8-1. Appearance and Dimensions
Part Number Type
8mmwide
Paper
tape
BLM21
except
21BD222SN1L
21BD272SN1L
8mmBLM21BD222SN1L
BLM21BD272SN1L
wide
Plastic
tape
Taping Products shall be packaged in the cavity of the base
tape of 8mm-wide, 4mm-pitch continuously and
sealed by top tape and bottom tape.
Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user.
Spliced point The base tape and top tape have no spliced point. The cover tape has no spliced point.
Cavity There shall not be burr in the cavity.
Missing
components
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
number
a
1.1
max.
1.3
±0.1
Appearance and Dimensions
1.75±0.1
Plastic Tape
0.2±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
1.5
-0
2.25±0.1
3.5±0.05
8.0±0.3
1.45±0.1
There are holes in the cavity
of the Plastic tape
+0.3
1.0
-0
Direction of feed
*
Dimension of the Cavity is measured at the bottom side.
Paper tape Plastic tape
Products shall be packaged in the each embossed
cavity of 8mm-wide, 4mm-pitch plastic tape
continuously and sealed by cover tape.
－
a
Paper Tape
a
(in mm)
8-2. Tape Strength
(1)Pull Strength
Paper tape
Plastic tape
(2)
Peeling off force of Top tape･Cover tape
Top tape
Bottom tape
Plastic tape 5N min.
Cover tape 10N min.
5N min.
Speed of Peeling off 300mm/min
Peeling off force *
Paper tape 0.1N to 0.6N
Plastic tape 0.2N to 0.7 N
* Minimum value is typical.
Case of Paper tape Case of Plastic tape
165 to 180 degree
Top tape
F
165 to 180 degree
F
Cover tape
Bottom tape
Base tape
Plastic tape
MURATA MFG.CO., LTD.
Page 6
Spec. No. JENF243A-0005T-01 P.6/10
Reference Only
8-3. Taping Condition
(1) Standard quantity per reel
Type Quantity per 180mm reel
BLM21(except 21BD222SN1L/21BD272SN1L) 4000 pcs. / reel
BLM21BD222SN1L/BLM21BD272SN1L 3000 pcs. / reel
(2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. » □□
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
OOOO
(1) (2) (3)
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
(△)
(1) (2)
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc)
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
2.0±0.5
+1
60
-
0
+1
9.0
-0
13.0±1.4
180
Trailer
160 min.
+0
-3
Label
13.0±0.2
21.0 ±0.8
Direction of feed
190 min.
Empty tape
Leader
210 m in.
Top tape
Cover tape
Paper tape
･･･
Plastic tape
･･･
(in mm)
8-4. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
(mm)
W D H
Standard Reel Quantity in Outer Case
(Reel)
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an
order.
MURATA MFG.CO., LTD.
Page 7
Spec. No. JENF243A-0005T-01 P.7/10
Reference Only
9. ！ Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (vehicles,trains,ships,etc.)
(4)Power plant control equipment (9)Applications of similar complexity and /or reliability requirements
(5)Medical equipment to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions
< BLM21 series(except BLM21PG type) >
1.0
< For BLM21PG type >
1.0
3.0to4.0
Chip Ferrite Bead
1.2
3.0to4.0
Chip Ferrite Bead
1.2
a
Solder Resist
Pattern
Total page 8/16
Solder Resist
Pattern
(in mm)
Rated
Type
BLM21PG
*The excessive heat by land pads may cause deterioration
at joint of products with substrate.
Current
(A)
1.5 1.0 1.0 1.0
2 1.2 1.0 1.0
3～4
6 6.4 3.3 1.65
Land pad thickness
and dimension a
18µm 35µm 70µm
2.4 1.2 1.0
(in mm)
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Solder Use Sn-3.0Ag-0.5Cu solder
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Do not use water-soluble flux.
Standard thickness of solder paste : 100 µm to 200 m
MURATA MFG.CO., LTD.
Page 8
Spec. No. JENF243A-0005T-01 P.8/10
Reference Only
(3) soldering profile
□Flow soldering profile
Temp.
(℃)
150
265℃±3℃
250℃
Heating Time
Limit Profile
Standard Profile
60s min.
(s)Time.
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、4～6s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
□Reflow soldering profile
Temp.
(℃)
180
150
245℃± 3℃
220℃
260℃
230℃
Limit Profile
30s～60s
Standard Profile
90s±30s
60s max.
Time.
(s)
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
t
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
(T:Chip thickness)
MURATA MFG.CO., LTD.
Page 9
Total page
Spec. No. JENF243A-0005T-01 P.9/10
Reference Only
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage.
<Products direction>
a
b
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
〈
〉
Good example
〈
〉
Poor example
(2) Products location on P.C.B. separation.
Products (A, B, C, D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
CB D.
b
Seam
A
a
Slit
B
C
D
Length:a
b
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD.
Page 10
Spec. No. JENF243A-0005T-01 P.10/10
Reference Only
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
10-11 Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
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