Multi-Tech MultiConnect xDot, MultiConnect xDot MTXDOT-868, MultiConnect xDot MTXDOT-915 Developer's Manual

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MultiConnect

MTXDOT Developer Guide

xDot

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MULTICONNECT XDOT DEVELOPER GUIDE

MultiConnect xDot Developer Guide

Models: MTXDOT-915-xxx, MTXDOT-868-xxx

Part Number: S000645, Version 1.0

This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2016 by Multi-Tech Systems, Inc.

Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.

Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.

Trademarks and Registered Trademarks

MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All other products and technologies are the trademarks or registered trademarks of their respective holders.

Legal Notices

The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted Applications is at the user’s sole risk and liability.

MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS.

The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever.

Contacting MultiTech

Knowledge Base

The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.

Support Portal

To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.

Support

Business Hours: M-F, 8am to 5pm CT

Country By Email By Phone

Europe, Middle East, Africa: support@multitech.co.uk +(44) 118 959 7774

U.S., Canada, all others: support@multitech.com (800) 972-2439 or (763) 717-5863

Warranty

To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.

World Headquarters

Multi-Tech Systems, Inc.

2205 Woodale Drive, Mounds View, MN 55112

Phone: (800) 328-9717 or (763) 785-3500

Fax (763) 785-9874

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CONTENTS

Contents

Chapter 1 Product Overview .................................................................................................................................... 6

Overview ....................................................................................................................................................................... 6

Documentation Overview ............................................................................................................................................. 6

Related Documentation .............................................................................................................................................. 6

mbed Documentation ................................................................................................................................................... 6

Programming the xDot Microcontroller ..................................................................................................................... 7

General mBed Links .................................................................................................................................................... 7

xDot Platform ............................................................................................................................................................. 7

EUI and Networking ...................................................................................................................................................... 7

Product Build Options ................................................................................................................................................... 8

Chapter 2 Getting Started ........................................................................................................................................ 9

Getting Started with the xDot Developer Kit ................................................................................................................ 9

COM Port Enumeration by Operating System .............................................................................................................. 9

Linux............................................................................................................................................................................ 9

Windows ..................................................................................................................................................................... 9

Mac ........................................................................................................................................................................... 10

Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11

xDot............................................................................................................................................................................. 11

Chapter 4 Specifications and Pin Information ........................................................................................................ 12

MTXDOT Specifications ............................................................................................................................................... 12

Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14

Power Draw................................................................................................................................................................. 15

Measuring the Power Draw ...................................................................................................................................... 15

Electrical Characteristics ............................................................................................................................................. 16

xDot and Processor Pin Information .......................................................................................................................... 16

Pin Information ......................................................................................................................................................... 16

Pull-Up/Down............................................................................................................................................................ 19

xDot Pinout Design Notes ........................................................................................................................................... 20

Serial Pinout Notes.................................................................................................................................................... 20

Serial Settings.............................................................................................................................................................. 20

LoRa ............................................................................................................................................................................ 20

Throughput Rates...................................................................................................................................................... 20

Range ........................................................................................................................................................................ 20

Chapter 5 Antennas ............................................................................................................................................... 22

Antenna System ......................................................................................................................................................... 22

U.FL and Trace Antenna Options ............................................................................................................................... 22

Ethertronics Chip Antenna.......................................................................................................................................... 24

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CONTENTS

Antenna Specifications ............................................................................................................................................. 24

Pulse Electronics Antenna........................................................................................................................................... 24

Antenna Specifications ............................................................................................................................................. 24

RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 25

Coaxial Cable Specifications ..................................................................................................................................... 25

OEM Integration ......................................................................................................................................................... 25

FCC & IC Information to Consumers ......................................................................................................................... 25

FCC Grant Notes........................................................................................................................................................ 25

Host Labeling............................................................................................................................................................. 26

Chapter 6 Safety Information................................................................................................................................. 27

Handling Precautions .................................................................................................................................................. 27

Radio Frequency (RF) Safety ....................................................................................................................................... 27

Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 27

Interference with Pacemakers and Other Medical Devices ...................................................................................... 28

Potential interference............................................................................................................................................... 28

Precautions for pacemaker wearers ........................................................................................................................ 28

Device Maintenance ................................................................................................................................................... 28

User Responsibility...................................................................................................................................................... 28

Chapter 7 Regulatory Information ......................................................................................................................... 29

EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 29

47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 29

FCC Interference Notice ............................................................................................................................................. 29

FCC Notice................................................................................................................................................................... 29

Industry Canada Class B Notice................................................................................................................................... 30

Chapter 8 Environmental Notices........................................................................................................................... 31

Waste Electrical and Electronic Equipment Statement .............................................................................................. 31

WEEE Directive.......................................................................................................................................................... 31

Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 31

REACH Statement ....................................................................................................................................................... 32

Registration of Substances........................................................................................................................................ 32

Substances of Very High Concern (SVHC) ................................................................................................................ 32

Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 33

Information on HS/TS Substances According to Chinese Standards ......................................................................... 34

Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 35

Chapter 9 Labels .................................................................................................................................................... 36

Label Examples............................................................................................................................................................ 36

Chapter 10 Developer Kit Overview ....................................................................................................................... 37

xDot Developer Kit ..................................................................................................................................................... 37

Developer Kit Package Contents ............................................................................................................................... 37

Firmware Updates..................................................................................................................................................... 37

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CONTENTS

Programming Devices in Production ........................................................................................................................ 37

xDot Developer Kit Mechanical Drawings................................................................................................................... 38

Micro Developer Board LEDs ...................................................................................................................................... 39

Chapter 11 Developer Board Schematics................................................................................................................ 40

Assembly Diagrams and Schematics ........................................................................................................................... 40

Assembly Diagrams ................................................................................................................................................... 40

Schematics ................................................................................................................................................................ 42

Chapter 12 Design Considerations.......................................................................................................................... 46

Noise Suppression Design ........................................................................................................................................... 46

PC Board Layout Guideline ......................................................................................................................................... 46

Electromagnetic Interference .................................................................................................................................... 46

Electrostatic Discharge Control................................................................................................................................... 47

Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 48

Mounting the Device on Your Board .......................................................................................................................... 48

Solder Profile............................................................................................................................................................... 48

Setpoints (Celsius)..................................................................................................................................................... 49

xDot Packing ............................................................................................................................................................... 49

Programming External Targets ................................................................................................................................... 49

JTAG/SWD Connector .............................................................................................................................................. 50

Index...................................................................................................................................................................... 52

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CHAPTER 1 PRODUCT OVERVIEW

Chapter 1 Product Overview

Overview

The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments*using the unlicensed ISM bands in North America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor and enhanced security. The xDot features an integrated ARM®Cortex®-M3 processor and mbedTMcompatible software library for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.

Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In

dense urban environments, a typical range is 1-2 miles.

Documentation Overview

This manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections for additional information needed to program your xDot and integrate your application with the MultiConnect Conduit gateway.

This document includes:

■ xDot device information: including mechanical drawings, specifications, safety and regulatory information,

and other device specific content.

■ Developer Kit information: including design considerations, schematics, and installation and operation

information.

This current version of this manual is available at www.multitech.com/support.

mbed Documentation

ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, and supported development boards, an online compiler and online developer collaboration tools.

Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit

(MTCDT) with an MTAC-LORA accessory card installed.

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CHAPTER 1 PRODUCT OVERVIEW

Programming the xDot Microcontroller

Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a

developer board.

Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset the xDot.

On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries.

MultiTech offers both development and stable release versions of the library.

■ Development version: libmxDot-dev-mbed5

■ Stable release version: libmxDot-mbed5

You can use either the mbed online compiler or offline tools.

■ Online: Use the mbed-os library in your mbed application

■ Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application.

General mBed Links

■ Explore mbed: http://developer.mbed.org/explore

■ Getting Started with mbed: http://developer.mbed.org/getting-started

■ mbed Handbook: http://developer.mbed.org/handbook/Homepage

■ mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler

■ mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md

■ mbed workspace tools documentation: https://github.com/ARMmbed/mbed-

os/blob/master/docs/BUILDING.md#workspace-tools

xDot Platform

The xDot mbed page includes the xDot library, firmware, and test cases https://developer.mbed.org/platforms/MTS-xDot-L151CC/

EUI and Networking

xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI:

AT+DI=<8-BYTE-HEX-MSB>

AT+DI=001122AABBCCDDEE

For information on setting up xDots as part of a LoRa network, go to www.multitech.net.

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CHAPTER 1 PRODUCT OVERVIEW

Product Build Options

Product Description Package Quantity

North America

MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100

MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 100

EMEA

MTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100

MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) 100

Developer Kits

MTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot

MTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot

Note:

■ The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revision

and x is the revision number.

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CHAPTER 2 GETTING STARTED

Chapter 2 Getting Started

Getting Started with the xDot Developer Kit

Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide.

Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and the other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which pins are available out of the box.

Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/

To send commands to the xDot:

1. Plug the developer board into a USB port.

2. Open communications software, such as TeraTerm, Putty, or Minicom.

3. Set the following:

■ Baud rate = 115,200

■ Data bits = 8

■ Parity = N

■ Stop bits = 1

■ Flow control = Off

To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for details and links.

For help setting up a MultiConnect®Conduit™to send data to and from an xDot, refer to Related Documentation .

COM Port Enumeration by Operating System

xDots create an AT Commands port and a debug port.

Linux

The following COM ports are created on Linux systems:

■ /dev/ttyACMx

■ /dev/ttyACMy

Where x and y may be 0 and 1, 3 and 4, etc.

The COM port with lower number is the AT command port and COM port with the higher number is the debug port.

Windows

On Windows systems, COM ports appear in the Device Manager:

■ Debug Port: mbed Serial Port

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CHAPTER 2 GETTING STARTED

■ AT Command Port: XR21V1410 USB UART

You may need to install a driver for the debug port to function properly. Go to: https://developer.mbed.org/handbook/Windows-serial-configuration

Mac

On Mac systems, COM ports appear in the Device Manager as:

■ /dev/cu.usbmodemx

Where x is a string of numbers and possibly letters, ending in a number.

The COM port with lower number is the AT command port and COM port with the higher number is the debug port.

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CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS

Chapter 3 Mechanical Drawings with Pinouts

xDot

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Chapter 4 Specifications and Pin Information

MTXDOT Specifications

Category Description

General

Compatibility LoRaWAN 1.0 specifications

Interfaces Note that pin functions are multiplexed.

Up to 19 digital I/O

Up to 10 analog inputs

2 DAC outputs

I2C

SPI

Wake pin

Reset pin

Full UART

mbed/simple UART (RX & TX only)

mbed programming interface

CPU Performance

CPU 32 MHz

Max Clock 32 MHz

Flash Memory 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available

EEPROM 8 KB, available 6 KB

SRAM 32 KB

Backup Register 128 byte, available 88

Radio Frequency

ISM Bands 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz

Physical Description

Weight 0.0001 oz. (0.003g)

Dimensions Refer to Mechanical Drawings for Dimensions.

RF Connectors

-UFL Models U.FL

-Trace Models Trace Connection

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Category Description

Environment

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Operating

-40° C to +85° C

Temperature

Storage

-40° C to +85° C

Temperature

Humidity 20%-90% RH, non-condensing

Power Requirements

Operating Voltage 2.4 to 3.57 V

Certifications and Compliance

EMC and Radio Compliance

EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012

EN 301 489-03 V1.6.1:2013 ICES-003:2012

FCC 15.247:2015 CISPR 22:2008

FCC 15.109:2015 AS/NZS CISPR 22

FCC 15.107:2015 AS/NZS 4268:2012 + a1:2013

RSS 247:2015 Standard 2014 MPE

Safety Compliance UL 60950-1 2nd ED

cUL 60950-1 2nd ED

IEC 60950-1 2nd ED AM1 + AM2

AS/NZS 60950.1:2015

Category Description

Transmission

North America EMEA

Max Transmitter

19 dBm 14 dBm

Power Output (TPO)

Maximum Receive

-137 dBm -137 dBm

Sensitivity

Link Budget

Max Effective

147 dB Point-to-Point 147 dB Point-to-Point

22 dBm 10 dBm Isotropic Radiated Power (EiRP)

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Category Description

Receive Sensitivity

Spreading Factor North America Typical Sensitivity

EMEA Typical Sensitivity

6 -111 dBm -121 dBm

7 -116 dBm -124 dBm

8 -119 dBm -127 dBm

9 -122 dBm -130 dBm

10 -125 dBm -133 dBm

11 -127 dBm -135 dBm

12 -129 dBm -137 dBm

Greater link budget is possible with higher gain antenna.

RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx

path.

RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx

path.

Mapping Data Rate to Spreading Factor/Bandwidth

Uplink Downlink

US/AU DR0: SF10BW125 DR8: SF12BW500

DR1: SF9BW125 DR9: SF11BW500

DR2: SF8BW125 ...

DR3: SF7BW125 DR13: SF7BW500

DR4: SF8BW500

DR5-DR7: RFU

EU DR0: SF12BW125

...

DR5: SF7BW15

DR6: SF7BW250

DR7: FSK

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Power Draw

Note:

■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source

when determining product load.

■ Power measurements are similar for 868 MHz models. Some 868 MHz sub-band frequencies do not

support maximum TXP power of 20.

■ Transmit power measured with MTXDOT-915-xx transmitting to a MultiConnect Conduit with an

MTAC-LORA-915 accessory card installed.

■ Idle current measured with the xDot joined with Conduit, but idle without data transferring.

■ Transmit power measured while transferring data packets using spread factor 9. Packet size limited

to 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was run to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement taken during that time.

■ For Inrush charge, recorded the highest observed value from five separate measurements.

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Voltage USB = 5v Standby Mode

Current, (Sleep = 0 Deep Sleep)

LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 10

LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 53

Voltage USB =5vAverage Current

(Amps) at Low Transmit Power Setting (TXP 2)

LDO = 3.3 0.013 0.017 0.018 0.132mC 153uS

LDO = 3.3 0.017 0.024 0.025 0.132mC 147uS

Average Current (Amps) at Default Transmit Power Setting (TXP 11)

Stop Mode Current, (Sleep = 1)

Idle current Average

Average Current (Amps) at Maximum Transmit Power Setting (TXP 20)

Spreading Factor Setting Packet Size (#

Total Inrush Charge measured in MilliCoulombs

Total Inrush Charge DURATION during Powerup (INRUSH Duration)

Measuring the Power Draw

To measure the power draw on an xDot developer board:

1. Flash the latest AT command firmware on the xDot.

2. Unplug the xDot from the computer and then reconnect it.

3. Connect current meter across JP30 on the developer board.

4. Set wake pin to wake, AT+WP=6.

5. Set wake mode to interrupt, AT+WM=1.

6. Put the xDot to sleep, AT+SLEEP=0|1.

7. Put jumper across JP5.

Bytes)

Note: After this step, AT command and debug ports no longer work.

8. Measure current draw.

9. Press the S2 button on the developer board to wake the xDot

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Electrical Characteristics

Signal Description Min Max

Vin Low Input low level -- 0.3 * VDD

Vin High Input high level 0.45 * VDD +0.6 --

Vout Low Output low level -- .4

Vout High Output high level 0.4 --

VCC Standard operating voltage 2.4 3.6

ICC Operating current (mA)

@5V

Operating current (mA) @3.3V

xDot and Processor Pin Information

-- 135

-- 200

Pin Information

Note:

■ Using the mbed platform expands your pin functionality options.

■ Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left)

■ The xDot is 0.045 x 0.045, board is 0.93 x 0.93

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

48QFN xDot Pin Pin Name SW Name Function

Description

Processor Pin Alt1

25 9 PB12 SPI2_NSS GPIO / SPI TIM10_CH1/

I2C2_SMBA/ SPI2_NSS/ I2S2_WS/ USART3_CK/ LCD_SEG12

26 10 PB13 SPI2_SCK GPIO / SPI TIM9_CH1/

SPI2_SCK/ I2S2_CK/ USART3_CTS/ LCD_SEG13

28 11 PB15 SPI2_MOSI GPIO / SPI TIM11_CH1/

SPI2_MOSI/ I2S2_SD/ LCD_SEG15

27 12 PB14 SPI2_MISO GPIO / SPI TIM9_CH2/

SPI2_MISO/ USART3_RTS/ LCD_SEG14

Processor Pin Alt2

ADC_IN18/ COMP1_INP/ VLCDRAIL2

ADC_IN19/ COMP1_INP

ADC_IN21/ COMP1_INP/ RTC_REFIN

ADC_IN20/ COMP1_INP

30 13 PA9 UART1_TX GPIO / UART USART1_TX/

LCD_COM1

31 14 PA10 UART1_RX GPIO / UART USART1_RX/

LCD_COM2

12 15 PA2 UART2_TX Debug UART

13 16 PA3 UART2_RX Debug UART

20 23 PB2 GPIO3 GPIO BOOT1 VLCDRAIL1/ ADCIN0b

18 24 PB0 GPIO2 GPIO TIM3_CH3/

LCD_SEG5

ADC_IN8/ COMP1_INP/ OPAMP2_VOUT/ VLCDRAIL3/ VREF_OUT

15 25 PA5 GPIO1 GPIO TIM2_CH1_ETR/

SPI1_SCK

ADC_IN5/ DAC_OUT2/ COMP1_INP

14 26 PA4 GPIO0 GPIO SPI1_NSS/

SPI3_NSS/ I2S3_WS/

ADC_IN4/ DAC_OUT1/ COMP1_INP

USART2_CK

45 27 PB8 I2C1_SCL GPIO / I2C TIM4_CH3/

TIM10_CH1/ I2C1_SCL/ LCD_SEG16

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

48QFN xDot Pin Pin Name SW Name Function

Description

Processor Pin Alt1

46 28 PB9 I2C1_SDA GPIO / I2C TIM4_CH4/

TIM11_CH1/ I2C1_SDA/ LCD_COM3

37 29 PA14 MBED SWCLK JTCK-SWCLK -

34 30 PA13 MBED SWDIO JTMS-SWDIO -

33 31 PA12 UART1_RTS GPIO / UART USART1_RTS/

SPI1_MOSI

32 32 PA11 UART1_CTS GPIO / UART USART1_CTS/

SPI1_MISO

7 33 NRST NRESET - -

10 34 PA0-WKUP1 WAKE GPIO / WAKE TIM2_CH1_ETR/

TIM5_CH1/ USART2_CTS

37 ANT1

47 RFU (ANT2)

Processor Pin Alt2

USB_DP

USB_DM

WKUP1/ RTC_TAMP2/ ADC_IN0/ COMP1_INP

8,23,35 ,47,49

1, 5, 17, 20,35, 36,

VSS GND

38, 39, 40, 41, 42, 43, 44, 45, 46, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58

2, 6, 7, 8,

Reserved 18, 19, 21, 22

16 PA6 LORA_DIO0 LORA Radio

17 PA7 LORA_DIO1 LORA Radio

29 PA8 LORA_DIO2 LORA Radio

42 PB6 LORA_DIO3 LORA Radio

43 PB7 LORA_DIO4 LORA Radio

40 PB4 LORA_MISO LORA Radio

41 PB5 LORA_MOSI LORA Radio

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

48QFN xDot Pin Pin Name SW Name Function

Description

38 PA15 LORA_NSS LORA Radio

11 PA1 LORA_RESET LORA Radio

39 PB3 LORA_SCK LORA Radio

22 PB11 SE_CLK Secure Element

19 PB1 SE_CTRL Secure Element

21 PB10 SE_IO Secure Element

2 PC13-WKUP2 SE_RESET Secure Element

44 BOOT0 Boot0 - -

3 PC14-

OSC32_IN(4)

4 PC15-

OSC32_OUT

5 PH0-

OSC_IN(5)

6 PH1-

OSC_OUT(5)

RTC_CLK - OSC32_IN

RTC_CLK - OSC32_OUT

Main 24M - OSC_IN

Main 24M - OSC_OUT

Processor Pin Alt1

Processor Pin Alt2

Pull-Up/Down

48QFN xDot Pin Pin Name SW Name PU/PD

7 33 NRST 10k PU

38 PA15 LORA_NSS 100k PU

19 PB1 SE_CTRL 10k PU

44 BOOT0 10k PD

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

xDot Pinout Design Notes

Refer to the mechanical drawing for your model for pin locations.

■ All pins that go to connectors are directly connected to the processor.

■ Refer to Pin Information table for pull up and pull down information.

xDots allow you to program pins depending on your application:

■ Serial: Available out of the box. See Serial Pinout Notes for details.

■ mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. For

more information about processor capabilities, see the processor datasheet.

Serial Pinout Notes

Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model for pin locations.

■ 18 PTA1 UART1_CTS

■ 19 PTA2 UART1_RTS

■ 36 PTC3 UART1_RX

■ 37 PTC4 UART1_TX

Serial Settings

When creating a serial connection with the device on the developer board, open communications software (such as TeraTerm, Putty, or Minicom ), and use the following settings:

■ Baud rate = 115,200

■ Data bits = 8

■ Parity = N

■ Stop bits = 1

■ Flow control = Off

LoRa

Throughput Rates

Theoretical maximum speeds for LoRa mode with ACKs off are:

■ Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps).

■ Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps).

Note: Data rates in the LoRaWAN specification vary by geographic region.

Range

Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use the following formula to calculate the maximum range:

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

The following table provides example settings and the theoretical maximum range based on these settings.

Example 18dB Transmit Power for

915 MHz Models

Units Example 14dB Transmit Power for

868MHz Models

Frequency 915 MHz 868

TX Power 19 dBm 14

TX Antenna Gain 3 dB 3

RX Sensitivity

-120 dBm -120

RX Antenna Gain 3 dB 3

Fade Margin

30 dB 30

Distance 8.14 Miles 5.41

Distance 13.08 Km 8.70

RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm.

Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to account for unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The amount of fade margin to include in a calculation depends on the environment in which you will deploy the system. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm.

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CHAPTER 5 ANTENNAS

Chapter 5 Antennas

Antenna System

The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device's certified antenna system, then recertification will be required.

This radio transmitter has been approved with the antenna types listed below. The antenna used must maintain the same specifications. The antenna must be of the same type, with similar in-band and out-of-band radiation patterns. Antenna types not included on this list, or having a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with this device.

U.FL and Trace Antenna Options

If using U.FL or trace antennas, note the following:

■ For a simple trace to RF antennas: Routing must follow standard RF design rules and practices for

stripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a reference circuit for the a trace antenna.

■ For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of

the SMA antenna as listed in the next topic.

■ The xDot Developer Board includes an Ethertronics M6200710-1K chip antenna, which by default connects

the xDot to the chip antenna. Only one antenna, either U.FL or chip, may be used at a time. To use the xDot’s U.FL connector, remove resistor C23 and L1, marked on the following image, to disconnect the chip antenna.

■ If using a chip antenna in your design, consult your antenna's documentation for placement and design

guidelines.

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CHAPTER 5 ANTENNAS

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CHAPTER 5 ANTENNAS

Ethertronics Chip Antenna

This is the developer board's default antenna.

Manufacturer: Ethertronics

Description: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount

Model Number: M620710-1K

Antenna Specifications

Category Description

Electrical Specifications

Frequency Range 902—928 MHz

Peak Gain 2.56 dBi

VSWR 2:6:1 max

Impedance 50 ohms unbalanced

Average Efficiency 58%

Power Handling 0.5 Watt cw

Polarization Linear

Mechanical Specifications

Mounting Surface Mount

Size 6.00 x 2.00 x 1.1mm

Pulse Electronics Antenna

Manufacturer: Pulse Electronics

Description: 868-915 MHz RP-SMA Antenna, 8"

Model Number: W1063

MultiTech Part Number: 45009830L

MultiTech ordering information:

Ordering Part Number Quantity

AN868-915A-1HRA 1

AN868-915A-10HRA 10

AN868-915A-50HRA 50

Antenna Specifications

Category Description

Frequency Range 868-928 MHz

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Category Description

Impedance 50 Ohms

VSWR < 2.0

Gain 3.0 dBi

Radiation Omni

Polarization Vertical

RSMA-to-U.FL Coaxial Cables

Coaxial Cable Specifications

Optional antenna cables can be ordered from MultiTech

Cable Type Coaxial Cable

Attenuation <1.0db

Connector Impedance 50 ohm

CHAPTER 5 ANTENNAS

Maximum Cable Length 16" (40 cm)

Ordering Information

Part Number Description

CARSMA-UFL-1 RSMA-to-UFL Coax Cable (Single Pack)

CARSMA-UFL-10 RSMA-to-UFL Coax Cable (Ten Pack)

CARSMA-UFL-100 RSMA-to-UFL Coax Cable (One Hundred Pack)

OEM Integration

FCC & IC Information to Consumers

The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4.

FCC Grant Notes

The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary.

FCC Definitions

Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that the

radiating structure(s) of the device is/are within 20 centimeters of the body of the user.

Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons.

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CHAPTER 5 ANTENNAS

Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices. (See note under Grant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee.

Note: Host design configurations constituting a device for portable use (<20 cm from human body) require

separate FCC/IC approval.

Host Labeling

The following statements are required to be on the host label:

This device contains FCC ID: {Add the FCC ID of the specific device} This device contains equipment certified under IC ID: {Add the IC ID of the specific device}

For additional labeling requirements, see the product's Labeling Requirements. For the FCC and IC IDs, see specific certificate information in the Regulatory Statement chapter.

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CHAPTER 6 SAFETY INFORMATION

Chapter 6 Safety Information

Handling Precautions

To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device.

Radio Frequency (RF) Safety

Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. Follow the safety advice given below.

■ Operating your device close to other electronic equipment may cause interference if the equipment is

inadequately protected. Observe any warning signs and manufacturers’ recommendations.

■ Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use of

radio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow restrictions for any environment where you operate the device.

■ Do not place the antenna outdoors.

■ Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may

endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction may lead to suspension or denial of cellular services to the offender, legal action, or both.

■ Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle

with fuel.

■ Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use.

Sécurité relative aux appareils à radiofréquence (RF)

À cause du risque d'interférences de radiofréquence (RF), il est important de respecter toutes les réglementations spéciales relatives aux équipements radio. Suivez les conseils de sécurit é ci-dessous.

■ Utiliser l'appareil à proximité d'autres équipements électroniques peut causer des interférences si les

équipements ne sont pas bien protégés. Respectez tous les panneaux d'avertissement et les recommandations du fabricant.

■ Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectez

ces restrictions relatives aux équipements radio dans les dépôts de carburant, dans les usines de produits chimiques, ou dans les zones où des dynamitages sont en cours. Suivez les restrictions relatives à chaque type d'environnement où vous utiliserez l'appareil.

■ Ne placez pas l'antenne en extérieur.

■ Éteignez votre appareil sans fil dans les avions. L'utilisation d'appareils électroniques portables en avion est

illégale: elle peut fortement perturber le fonctionnement de l'appareil et désactiver le réseau cellulaire. S'il ne respecte pas cette consigne, le responsable peut voir son accès aux services cellulaires suspendu ou interdit, peut être poursuivi en justice, ou les deux.

■ Éteignez votre appareil sans fil à proximité des pompes à essence ou de diesel avant de remplir le réservoir

de votre véhicule de carburant.

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CHAPTER 6 SAFETY INFORMATION

■ Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sont

susceptibles d'être utilisés.

Interference with Pacemakers and Other Medical Devices

Potential interference

Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure that cardiac pacemakers and defibrillators are safe from cellular device EMI.

The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference occurs, the FDA will assess the interference and work to resolve the problem.

Precautions for pacemaker wearers

If EMI occurs, it could affect a pacemaker in one of three ways:

■ Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm.

■ Cause the pacemaker to deliver the pulses irregularly.

■ Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate.

Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers. However, people with pacemakers may want to take simple precautions to be sure that their device doesn't cause a problem.

■ Keep the device on the opposite side of the body from the pacemaker to add extra distance between

the pacemaker and the device.

■ Avoid placing a turned-on device next to the pacemaker (for example, don’t carry the device in a shirt

or jacket pocket directly over the pacemaker).

Device Maintenance

When maintaining your device:

■ Do not attempt to disassemble the device. There are no user serviceable parts inside.

■ Do not expose your device to any extreme environment where the temperature or humidity is high.

■ Do not expose the device to water, rain, or spilled beverages. It is not waterproof.

■ Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The

information contained on discs or cards may be affected by the device.

■ Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with

MultiTech's accessory specifications may invalidate the warranty.

If the device is not working properly, contact MultiTech Technical Support.

User Responsibility

Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft.

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CHAPTER 7 REGULATORY INFORMATION

Chapter 7 Regulatory Information

EMC, Safety, and R&TTE Directive Compliance

The CE mark is affixed to this product to confirm compliance with the following European Community Directives:

Council Directive 2014/30/EU on the approximation of the laws of Member States relating to electromagnetic compatibility; and Council Directive 2014/35/EU on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits; and Council Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment; and Council Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity.

47 CFR Part 15 Regulation Class B Devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

■ Reorient or relocate the receiving antenna.

■ Increase the separation between the equipment and receiver.

■ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

■ Consult the dealer or an experienced radio/TV technician for help.

Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

FCC Interference Notice

Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC Notice

xDot products are open development based products that contain a sub ghz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC

15.247:2015 & IC RSS 247:2015)

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CHAPTER 7 REGULATORY INFORMATION

MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance. Accessing or controlling the radio through any means other than the provided binary software will require the user to obtain their own intentional radiator license from the certification body governing their locality, as all pre-certification provided with xDot will have been made invalid.

Industry Canada Class B Notice

This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.

Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matériel brouilleur.

This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions:

1. the device may not cause harmful interference, and

2. the user of the device must accept any interference suffered, even if the interference is likely to

jeopardize the operation.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

1. l'appareil ne doit pas produire de brouillage, et

2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, m ême si le brouillage est

susceptible d'en compromettre le fonctionnement.

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CHAPTER 8 ENVIRONMENTAL NOTICES

Chapter 8 Environmental Notices

Waste Electrical and Electronic Equipment Statement

Note: This statement may be used in documentation for your final product applications.

WEEE Directive

The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.

Instructions for Disposal of WEEE by Users in the European Union

The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or where you purchased the product.

July, 2005

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CHAPTER 8 ENVIRONMENTAL NOTICES

REACH Statement

Registration of Substances

After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation 1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would be considered as “articles”. In light of the definition in § 7.1(b) which requires registration of an article only if it contains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditions of use,” Our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended and anticipated use.

Substances of Very High Concern (SVHC)

Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU “REACH” requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European Chemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), MultiTech Systems, Inc. will provide updated compliance status.

Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant through a formalized process which includes collection and validation of materials declarations and selective materials analysis where appropriate. This data is controlled as part of a formal quality system and will be made available upon request.

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CHAPTER 8 ENVIRONMENTAL NOTICES

Restriction of the Use of Hazardous Substances (RoHS)

Multi-Tech Systems, Inc.

Certificate of Compliance

2011/65/EU

Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS).

These MultiTech products do not contain the following banned chemicals1:

■ Lead, [Pb] < 1000 PPM

■ Mercury, [Hg] < 1000 PPM

■ Hexavalent Chromium, [Cr+6] < 1000 PPM

■ Cadmium, [Cd] < 100 PPM

■ Polybrominated Biphenyl, [PBB] < 1000 PPM

■ Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM

Environmental considerations:

■ Moisture Sensitivity Level (MSL) =1

■ Maximum Soldering temperature = 260C (in SMT reflow oven)

Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration

would be found in some modules (>1000 PPM);

- Resistors containing lead in a glass or ceramic matrix compound.

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CHAPTER 8 ENVIRONMENTAL NOTICES

Information on HS/TS Substances According to Chinese Standards

In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII).

Hazardous/Toxic Substance/Elements

Name of the Component Lead

(PB)

Printed Circuit Boards O O O O O O

Resistors X O O O O O

Capacitors X O O O O O

Ferrite Beads O O O O O O

Relays/Opticals O O O O O O

ICs O O O O O O

Diodes/ Transistors O O O O O O

Oscillators and Crystals X O O O O O

Regulator O O O O O O

Voltage Sensor O O O O O O

Transformer O O O O O O

Speaker O O O O O O

Connectors O O O O O O

Mercury

(Hg)

Cadmium (CD)

Hexavalent Chromium (CR6+)

Polybromi nated Biphenyl (PBB)

Polybrominat ed Diphenyl Ether (PBDE)

LEDs O O O O O O

Screws, Nuts, and other Hardware

AC-DC Power Supplies O O O O O O

Software /Documentation CDs O O O O O O

Booklets and Paperwork O O O O O O

Chassis O O O O O O

X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits. O Represents that no such substances are used or that the concentration is within the aforementioned limits.

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X O O O O O

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CHAPTER 8 ENVIRONMENTAL NOTICES

Information on HS/TS Substances According to Chinese Standards (in Chinese)

依依照照中中国国标标准准的的有有毒毒有有害害物物质质信信息息

根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。

有有害害//有有毒毒物物质质//元元素素

成成分分名名称称

印刷电路板

电阻器

电容器

铁氧体磁环

继电器/光学部件

ICs O O O O O O

二极管/晶体管

振荡器和晶振

调节器

电压传感器

变压器

扬声器

连接器

LEDs O O O O O O

铅铅 (PB) 汞汞 (Hg) 镉镉 (CD) 六六价价铬铬 (CR6+)

O O O O O O

X O O O O O

O O O O O O

X O O O O O

O O O O O O

多多溴溴联联苯苯

(PBB)

多多溴溴二二苯苯醚醚

(PBDE)

螺丝、螺母以及其它五金件

交流-直流电源

软件/文档 CD

手册和纸页

底盘

X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。 O 表示不含该物质或者该物质的含量水平在上述限量要求之内。

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X O O O O O

O O O O O O

Page 36

CHAPTER 9 LABELS

Chapter 9 Labels

Label Examples

Note: Actual labels vary depending on the regulatory approval markings and content.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

The label shown is not the actual size.

1 - MultiTech Model Identification. 2 - MultiTech Ordering Part Number. 3 - Device Node Number.

Example xDot Device Label Example Developer Board Device Label

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CHAPTER 10 DEVELOPER KIT OVERVIEW

Chapter 10 Developer Kit Overview

xDot Developer Kit

The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application.

Developer Kit Package Contents

Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following:

Developer Board 1 - xDot Developer Board with xDot

Customer Notices Quick Start

Firmware Updates

Programming Devices in Production

Consult developer kit schematics for programming options.

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CHAPTER 10 DEVELOPER KIT OVERVIEW

xDot Developer Kit Mechanical Drawings

Note: The Reset and Wake buttons reset and wake the xDot processor.

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CHAPTER 10 DEVELOPER KIT OVERVIEW

Micro Developer Board LEDs

LED Description

LED1 User-definable LED.

LED3/SDA Programming Status.

LED2/PWR Power, blue light when the board has power.

LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assembly

diagram).

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CHAPTER 11 DEVELOPER BOARD SCHEMATICS

Chapter 11 Developer Board Schematics

Assembly Diagrams and Schematics

Assembly Diagrams

Top

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Bottom

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

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CHAPTER 11 DEVELOPER BOARD SCHEMATICS

Schematics

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CHAPTER 11 DEVELOPER BOARD SCHEMATICS

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CHAPTER 11 DEVELOPER BOARD SCHEMATICS

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CHAPTER 11 DEVELOPER BOARD SCHEMATICS

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CHAPTER 12 DESIGN CONSIDERATIONS

Chapter 12 Design Considerations

Noise Suppression Design

Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment.

Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern.

On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments.

Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification.

Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes.

PC Board Layout Guideline

In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.

The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device vertically in place during the wave solder process.

Electromagnetic Interference

The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels.

■ Keep traces carrying high frequency signals as short as possible.

■ Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for

ground and power distribution.

■ Decouple power from ground with decoupling capacitors as close to the device's power pins as possible.

■ Eliminate ground loops, which are unexpected current return paths to the power source and ground.

■ Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series

inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines; however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification.

■ Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple

power lines are similar to decoupling telephone lines.

46 MultiConnect®xDotTMMTXDOT Developer Guide

Page 47

CHAPTER 12 DESIGN CONSIDERATIONS

■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits.

■ Locate cables and connectors to avoid coupling from high frequency circuits.

■ Lay out the highest frequency signal traces next to the ground grid.

■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground

plane covers all traces.

■ Minimize the number of through-hole connections on traces carrying high frequency signals.

■ Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns

are better.

■ On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to

traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces.

■ Distribute high frequency signals continuously on a single trace rather than several traces radiating from

one point.

Electrostatic Discharge Control

Handle all electronic devices with precautions to avoid damage due to the static charge accumulation.

See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing.

MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling.

MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers.

MultiConnect®xDotTMMTXDOT Developer Guide 47

Page 48

CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Chapter 13 Mounting xDots and Programming External Targets

Mounting the Device on Your Board

A footprint diagram is included on the xDot Mechanical Diagram.

Solder Profile

Solder Paste: SAC NC 254

Note: Calculate slope over 120 seconds

Name Low Limit High Limit Units

Max Rising Slope (Target=1.0) 0 2 Degrees/Second

Max Falling Slope -2 -0.1 Degrees/Second

Soak Time 150-170C 15 45 Seconds

Peak Temperature 235 250 Degrees Celsius

Total Time Above 218C 30 90 Seconds

48 MultiConnect®xDotTMMTXDOT Developer Guide

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CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Setpoints (Celsius)

Zone 1 2 3 4 5 6 7

Top 130 160 170 190 230 245 255

Bottom 130 160 170 190 230 245 255

Conveyer Speed 32.0 inch/minute

Max Rising Slope Max Falling Slope Soak Time 150-

170C

TC Position Slope PWI Slope PWI Time PWI Temp PWI Time PWI

1 <TC2> 1.38 38% -0.63 45% 28.82 -8% 240.22 -30% 43.61 -55%

2 <TC3> 1.38 38% -0.75 32% 26.75 -22% 241.21 -17% 43.66 -54%

3 <TC4> 1.38 38% -0.70 36% 29.47 -4% 239.56 -39% 43.29 -56%

Delta 0.00 0.12 2.72 1.65 0.37

Peak Temp Total Time /218C

xDot Packing

xDots ship on 20 piece trays, which you can use for pick and place handling.

Warning: Maximum temperature for these trays is 65° C.

Programming External Targets

You can use the xDot developer board to program external targets. To do this:

1. Connect header JP1 to your target board with a 9-position ribbon cable.

2. Apply power to your target board.

MultiConnect®xDotTMMTXDOT Developer Guide 49

Page 50

CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

3. When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed

programming interface to the external target. You can use the mbed programming environment as normal to program and debug the external target.

MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable.

JTAG/SWD Connector

The developer board uses an unshrouded 10-pin header.

Cortex 10-pin 0.04" JTAG/SWD Connector Pinout

Suitable connector headers include:

50 MultiConnect®xDotTMMTXDOT Developer Guide

Page 51

CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

■ Harwin: M50-3500542

■ Mouser: 855-M50-3500542

■ Samtec shrouded header: FTSH-105-01-F-D-K

The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm).

Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red stripe.

MultiConnect®xDotTMMTXDOT Developer Guide 51

Page 52

INDEX

Index

schematics

Developer Board ...................................................40

antenna ....................................................................22 24

developer board ......................................................24

assembly diagrams

Developer Board ......................................................40

AT command

port ............................................................................9

baud rate.......................................................................20

board components

Micro Developer Board............................................39

build options ...................................................................8

cable

coaxial ......................................................................25

certifications .................................................................12

Chinese hazardous substances

Chinese version........................................................35

English version .........................................................34

Class B ..........................................................................29

Industry Canada .......................................................30

COM ports.......................................................................9

Conduit............................................................................6

EMI ................................................................................46

ESD ................................................................................47

EUI...................................................................................7

external targets.............................................................49

FCC

grant notes...............................................................25

FCC Notice

Class B .....................................................................29

flow control...................................................................20

ground plane.................................................................46

handling precautions due to ESD..................................47

hazardous substances ...................................................33

host labeling..................................................................25

Industry Canada

Class B .....................................................................30

interférence des radiofréquences................................. 27

JTAG connector .............................................................50

data bits ........................................................................20

debug port ......................................................................9

device

maintenance ............................................................28

dimensions ....................................................................11

documentation................................................................6

electrical characteristics................................................16

electromagnetic interference .......................................46

electrostatic discharge ..................................................47

52 MultiConnect®xDotTMMTXDOT Developer Guide

KDB 447498 Section 8 .................................................. 25

labeling

host ..........................................................................25

labels .............................................................................36

Linux................................................................................9

LoRa

range ........................................................................20

Page 53

INDEX

Mac .................................................................................9

maintenance .................................................................28

mbed ..............................................................................6

mechanical drawings.....................................................11

Micro Developer Board............................................38

MTAC-LORA.....................................................................6

MTCDT.............................................................................6

MultiConnect ..................................................................6

network, connecting .......................................................7

noise suppression..........................................................46

packing list ....................................................................37

parity .............................................................................20

PC board layout.............................................................46

pin information .............................................................16

pinout notes..................................................................20

ports ................................................................................9

power draw...................................................................15

measuring ................................................................15

processor.........................................................................6

programming external targets ......................................49

ribbon cable ..................................................................49

RoHS..............................................................................33

RSMA-to-UFL cable .......................................................25

safety

RF interference ........................................................27

safety standards............................................................46

serial settings ................................................................20

solder profile.................................................................48

specifications.................................................................12

static..............................................................................27

stop bits.........................................................................20

sécurité

interférences RF.......................................................27

trace antenna................................................................22

transmission..................................................................12

U.FL antenna .................................................................22

user responsibility.........................................................28

radio frequency interference ........................................27

range .............................................................................20

receive sensitivity..........................................................12

related products..............................................................6

Windows .........................................................................9

xDot packing..................................................................49

MultiConnect®xDotTMMTXDOT Developer Guide 53

Multi-Tech MultiConnect xDot, MultiConnect xDot MTXDOT-868, MultiConnect xDot MTXDOT-915 Developer's Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

CHAPTER 1 PRODUCT OVERVIEW

Overview

Documentation Overview

Related Documentation

mbed Documentation

Programming the xDot Microcontroller

General mBed Links

xDot Platform

EUI and Networking

Product Build Options

CHAPTER 2 GETTING STARTED

Getting Started with the xDot Developer Kit

COM Port Enumeration by Operating System

Linux

Windows

CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS

xDot

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

MTXDOT Specifications

Mapping Data Rate to Spreading Factor/Bandwidth

Power Draw

Measuring the Power Draw

Electrical Characteristics

xDot and Processor Pin Information

Pin Information

Pull-Up/Down

xDot Pinout Design Notes

Serial Pinout Notes

Serial Settings

LoRa

Throughput Rates

Range

CHAPTER 5 ANTENNAS

Antenna System

U.FL and Trace Antenna Options

Ethertronics Chip Antenna

Antenna Specifications

Pulse Electronics Antenna

Antenna Specifications

RSMA-to-U.FL Coaxial Cables

Coaxial Cable Specifications

OEM Integration

FCC & IC Information to Consumers

FCC Grant Notes

Host Labeling

CHAPTER 6 SAFETY INFORMATION

Handling Precautions

Radio Frequency (RF) Safety

Sécurité relative aux appareils à radiofréquence (RF)

Interference with Pacemakers and Other Medical Devices

Potential interference

Precautions for pacemaker wearers

Device Maintenance

User Responsibility

CHAPTER 7 REGULATORY INFORMATION

EMC, Safety, and R&TTE Directive Compliance

47 CFR Part 15 Regulation Class B Devices

FCC Interference Notice

FCC Notice

Industry Canada Class B Notice

CHAPTER 8 ENVIRONMENTAL NOTICES

Waste Electrical and Electronic Equipment Statement

WEEE Directive

Instructions for Disposal of WEEE by Users in the European Union

REACH Statement

Registration of Substances

Substances of Very High Concern (SVHC)

Restriction of the Use of Hazardous Substances (RoHS)

Information on HS/TS Substances According to Chinese Standards

Information on HS/TS Substances According to Chinese Standards (in Chinese)

CHAPTER 9 LABELS

Label Examples

CHAPTER 10 DEVELOPER KIT OVERVIEW

xDot Developer Kit

Developer Kit Package Contents

Firmware Updates