Multi-Tech MultiConnect xDot, MultiConnect xDot MTXDOT-868, MultiConnect xDot MTXDOT-915 Developer's Manual
®
MultiConnect
MTXDOT Developer Guide
xDot
TM
MULTICONNECT XDOT DEVELOPER GUIDE
MultiConnect xDot Developer Guide
Models: MTXDOT-915-xxx, MTXDOT-868-xxx
Part Number: S000645, Version 1.0
Copyright
This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of
Multi-Tech Systems, Inc. All rights reserved. Copyright © 2016 by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information,
material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.
Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of
Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.
Trademarks and Registered Trademarks
MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All other
products and technologies are the trademarks or registered trademarks of their respective holders.
Legal Notices
The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with
applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or
death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life
preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or
missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted
Applications is at the user’s sole risk and liability.
MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE
UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR
COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES,
COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR
COMMUNICATIONS NETWORK USING THE PRODUCTS.
The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech
products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into
which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers.
MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance
of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written
document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested
changes is performed only as a courtesy and without any representation or warranty whatsoever.
Contacting MultiTech
Knowledge Base
The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.
Support Portal
To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.
Support
Business Hours: M-F, 8am to 5pm CT
Country By Email By Phone
Europe, Middle East, Africa: support@multitech.co.uk +(44) 118 959 7774
U.S., Canada, all others: support@multitech.com (800) 972-2439 or (763) 717-5863
Warranty
To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.
World Headquarters
Multi-Tech Systems, Inc.
2205 Woodale Drive, Mounds View, MN 55112
Phone: (800) 328-9717 or (763) 785-3500
Fax (763) 785-9874
2 MultiConnect®xDotTMMTXDOT Developer Guide
CONTENTS
Contents
Chapter 1 Product Overview .................................................................................................................................... 6
Overview ....................................................................................................................................................................... 6
Documentation Overview ............................................................................................................................................. 6
Related Documentation .............................................................................................................................................. 6
mbed Documentation ................................................................................................................................................... 6
Programming the xDot Microcontroller ..................................................................................................................... 7
General mBed Links .................................................................................................................................................... 7
xDot Platform ............................................................................................................................................................. 7
EUI and Networking ...................................................................................................................................................... 7
Product Build Options ................................................................................................................................................... 8
Chapter 2 Getting Started ........................................................................................................................................ 9
Getting Started with the xDot Developer Kit ................................................................................................................ 9
COM Port Enumeration by Operating System .............................................................................................................. 9
Linux............................................................................................................................................................................ 9
Windows ..................................................................................................................................................................... 9
Mac ........................................................................................................................................................................... 10
Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11
xDot............................................................................................................................................................................. 11
Chapter 4 Specifications and Pin Information ........................................................................................................ 12
MTXDOT Specifications ............................................................................................................................................... 12
Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14
Power Draw................................................................................................................................................................. 15
Measuring the Power Draw ...................................................................................................................................... 15
Electrical Characteristics ............................................................................................................................................. 16
xDot and Processor Pin Information .......................................................................................................................... 16
Pin Information ......................................................................................................................................................... 16
Pull-Up/Down............................................................................................................................................................ 19
xDot Pinout Design Notes ........................................................................................................................................... 20
Serial Pinout Notes.................................................................................................................................................... 20
Serial Settings.............................................................................................................................................................. 20
LoRa ............................................................................................................................................................................ 20
Throughput Rates...................................................................................................................................................... 20
Range ........................................................................................................................................................................ 20
Chapter 5 Antennas ............................................................................................................................................... 22
Antenna System ......................................................................................................................................................... 22
U.FL and Trace Antenna Options ............................................................................................................................... 22
Ethertronics Chip Antenna.......................................................................................................................................... 24
MultiConnect®xDotTMMTXDOT Developer Guide 3
CONTENTS
Antenna Specifications ............................................................................................................................................. 24
Pulse Electronics Antenna........................................................................................................................................... 24
Antenna Specifications ............................................................................................................................................. 24
RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 25
Coaxial Cable Specifications ..................................................................................................................................... 25
OEM Integration ......................................................................................................................................................... 25
FCC & IC Information to Consumers ......................................................................................................................... 25
FCC Grant Notes........................................................................................................................................................ 25
Host Labeling............................................................................................................................................................. 26
Chapter 6 Safety Information................................................................................................................................. 27
Handling Precautions .................................................................................................................................................. 27
Radio Frequency (RF) Safety ....................................................................................................................................... 27
Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 27
Interference with Pacemakers and Other Medical Devices ...................................................................................... 28
Potential interference............................................................................................................................................... 28
Precautions for pacemaker wearers ........................................................................................................................ 28
Device Maintenance ................................................................................................................................................... 28
User Responsibility...................................................................................................................................................... 28
Chapter 7 Regulatory Information ......................................................................................................................... 29
EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 29
47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 29
FCC Interference Notice ............................................................................................................................................. 29
FCC Notice................................................................................................................................................................... 29
Industry Canada Class B Notice................................................................................................................................... 30
Chapter 8 Environmental Notices........................................................................................................................... 31
Waste Electrical and Electronic Equipment Statement .............................................................................................. 31
WEEE Directive.......................................................................................................................................................... 31
Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 31
REACH Statement ....................................................................................................................................................... 32
Registration of Substances........................................................................................................................................ 32
Substances of Very High Concern (SVHC) ................................................................................................................ 32
Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 33
Information on HS/TS Substances According to Chinese Standards ......................................................................... 34
Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 35
Chapter 9 Labels .................................................................................................................................................... 36
Label Examples............................................................................................................................................................ 36
Chapter 10 Developer Kit Overview ....................................................................................................................... 37
xDot Developer Kit ..................................................................................................................................................... 37
Developer Kit Package Contents ............................................................................................................................... 37
Firmware Updates..................................................................................................................................................... 37
4 MultiConnect®xDotTMMTXDOT Developer Guide
CONTENTS
Programming Devices in Production ........................................................................................................................ 37
xDot Developer Kit Mechanical Drawings................................................................................................................... 38
Micro Developer Board LEDs ...................................................................................................................................... 39
Chapter 11 Developer Board Schematics................................................................................................................ 40
Assembly Diagrams and Schematics ........................................................................................................................... 40
Assembly Diagrams ................................................................................................................................................... 40
Schematics ................................................................................................................................................................ 42
Chapter 12 Design Considerations.......................................................................................................................... 46
Noise Suppression Design ........................................................................................................................................... 46
PC Board Layout Guideline ......................................................................................................................................... 46
Electromagnetic Interference .................................................................................................................................... 46
Electrostatic Discharge Control................................................................................................................................... 47
Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 48
Mounting the Device on Your Board .......................................................................................................................... 48
Solder Profile............................................................................................................................................................... 48
Setpoints (Celsius)..................................................................................................................................................... 49
xDot Packing ............................................................................................................................................................... 49
Programming External Targets ................................................................................................................................... 49
JTAG/SWD Connector .............................................................................................................................................. 50
Index...................................................................................................................................................................... 52
MultiConnect®xDotTMMTXDOT Developer Guide 5
CHAPTER 1 PRODUCT OVERVIEW
Chapter 1 Product Overview
Overview
The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication over
long distances, deep into buildings, or within noisy environments*using the unlicensed ISM bands in North
America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor and
enhanced security. The xDot features an integrated ARM®Cortex®-M3 processor and mbedTMcompatible software
library for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.
*
Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In
dense urban environments, a typical range is 1-2 miles.
Documentation Overview
This manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections for
additional information needed to program your xDot and integrate your application with the MultiConnect Conduit
gateway.
This document includes:
■ xDot device information: including mechanical drawings, specifications, safety and regulatory information,
and other device specific content.
■ Developer Kit information: including design considerations, schematics, and installation and operation
information.
This current version of this manual is available at www.multitech.com/support.
Related Documentation
■ DOT Series AT Command Reference: Includes details on the AT commands available for xDots.
■ MultiTech Developer Site: Application notes, LoRa information, and documentation for related products
such as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are available
on the MultiTech developer site. This site includes information on using the Conduit with xDots. Go to:
www.multitech.net
■ Processor Datasheet: ST ARM®Cortex®-M3 processor (STM32L151CCU6) datasheet is available on the ST
website: http://www.st.com/resource/en/datasheet/stm32l151cc.pdf
mbed Documentation
ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M
microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid
prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, and
supported development boards, an online compiler and online developer collaboration tools.
Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit
(MTCDT) with an MTAC-LORA accessory card installed.
6 MultiConnect®xDotTMMTXDOT Developer Guide
CHAPTER 1 PRODUCT OVERVIEW
Programming the xDot Microcontroller
Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a
developer board.
Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting
binary file to the mbed USB drive, and reset the xDot.
On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and
ETSI certification, some portions of the software is available only as binary libraries.
MultiTech offers both development and stable release versions of the library.
■ Development version: libmxDot-dev-mbed5
■ Stable release version: libmxDot-mbed5
You can use either the mbed online compiler or offline tools.
■ Online: Use the mbed-os library in your mbed application
■ Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application.
General mBed Links
■ Explore mbed: http://developer.mbed.org/explore
■ Getting Started with mbed: http://developer.mbed.org/getting-started
■ mbed Handbook: http://developer.mbed.org/handbook/Homepage
■ mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler
■ mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md
■ mbed workspace tools documentation: https://github.com/ARMmbed/mbed-
os/blob/master/docs/BUILDING.md#workspace-tools
xDot Platform
The xDot mbed page includes the xDot library, firmware, and test cases
https://developer.mbed.org/platforms/MTS-xDot-L151CC/
EUI and Networking
xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI:
AT+DI=<8-BYTE-HEX-MSB>
AT+DI=001122AABBCCDDEE
For information on setting up xDots as part of a LoRa network, go to www.multitech.net.
MultiConnect®xDotTMMTXDOT Developer Guide 7
CHAPTER 1 PRODUCT OVERVIEW
Product Build Options
Product Description Package Quantity
North America
MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100
MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 100
EMEA
MTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100
MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) 100
Developer Kits
MTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot
MTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot
Note:
■ The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revision
and x is the revision number.
8 MultiConnect®xDotTMMTXDOT Developer Guide
CHAPTER 2 GETTING STARTED
Chapter 2 Getting Started
Getting Started with the xDot Developer Kit
Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT
Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command
Reference Guide.
Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and
the other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which
pins are available out of the box.
Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot.
Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/
To send commands to the xDot:
1. Plug the developer board into a USB port.
2. Open communications software, such as TeraTerm, Putty, or Minicom.
3. Set the following:
■ Baud rate = 115,200
■ Data bits = 8
■ Parity = N
■ Stop bits = 1
■ Flow control = Off
To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for
details and links.
For help setting up a MultiConnect®Conduit™to send data to and from an xDot, refer to Related Documentation .
COM Port Enumeration by Operating System
xDots create an AT Commands port and a debug port.
Linux
The following COM ports are created on Linux systems:
■ /dev/ttyACMx
■ /dev/ttyACMy
Where x and y may be 0 and 1, 3 and 4, etc.
The COM port with lower number is the AT command port and COM port with the higher number is the debug
port.
Windows
On Windows systems, COM ports appear in the Device Manager:
■ Debug Port: mbed Serial Port
MultiConnect®xDotTMMTXDOT Developer Guide 9
CHAPTER 2 GETTING STARTED
■ AT Command Port: XR21V1410 USB UART
You may need to install a driver for the debug port to function properly. Go to:
https://developer.mbed.org/handbook/Windows-serial-configuration
Mac
On Mac systems, COM ports appear in the Device Manager as:
■ /dev/cu.usbmodemx
Where x is a string of numbers and possibly letters, ending in a number.
The COM port with lower number is the AT command port and COM port with the higher number is the debug
port.
10 MultiConnect®xDotTMMTXDOT Developer Guide
CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS
Chapter 3 Mechanical Drawings with Pinouts
xDot
MultiConnect®xDotTMMTXDOT Developer Guide 11
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION
Chapter 4 Specifications and Pin Information
MTXDOT Specifications
Category Description
General
Compatibility LoRaWAN 1.0 specifications
Interfaces Note that pin functions are multiplexed.
Up to 19 digital I/O
Up to 10 analog inputs
2 DAC outputs
I2C
SPI
Wake pin
Reset pin
Full UART
mbed/simple UART (RX & TX only)
mbed programming interface
CPU Performance
CPU 32 MHz
Max Clock 32 MHz
Flash Memory 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available
EEPROM 8 KB, available 6 KB
SRAM 32 KB
Backup Register 128 byte, available 88
Radio Frequency
ISM Bands 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz
Physical Description
Weight 0.0001 oz. (0.003g)
Dimensions Refer to Mechanical Drawings for Dimensions.
RF Connectors
-UFL Models U.FL
-Trace Models Trace Connection
12 MultiConnect®xDotTMMTXDOT Developer Guide
Category Description
Environment
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION
Operating
-40° C to +85° C
Temperature
Storage
-40° C to +85° C
Temperature
Humidity 20%-90% RH, non-condensing
Power Requirements
Operating Voltage 2.4 to 3.57 V
Certifications and Compliance
EMC and Radio
Compliance
EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012
EN 301 489-03 V1.6.1:2013 ICES-003:2012
FCC 15.247:2015 CISPR 22:2008
FCC 15.109:2015 AS/NZS CISPR 22
FCC 15.107:2015 AS/NZS 4268:2012 + a1:2013
RSS 247:2015 Standard 2014 MPE
Safety Compliance UL 60950-1 2nd ED
cUL 60950-1 2nd ED
IEC 60950-1 2nd ED AM1 + AM2
AS/NZS 60950.1:2015
Category Description
Transmission
North America EMEA
Max Transmitter
19 dBm 14 dBm
Power Output (TPO)
Maximum Receive
-137 dBm -137 dBm
Sensitivity
Link Budget
Max Effective
1
147 dB Point-to-Point 147 dB Point-to-Point
22 dBm 10 dBm
Isotropic Radiated
Power (EiRP)
MultiConnect®xDotTMMTXDOT Developer Guide 13
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION
Category Description
Receive Sensitivity
Spreading Factor North America Typical Sensitivity
2
EMEA Typical Sensitivity
3
6 -111 dBm -121 dBm
7 -116 dBm -124 dBm
8 -119 dBm -127 dBm
9 -122 dBm -130 dBm
10 -125 dBm -133 dBm
11 -127 dBm -135 dBm
12 -129 dBm -137 dBm
1
Greater link budget is possible with higher gain antenna.
2
RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx
path.
3
RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx
path.
Mapping Data Rate to Spreading Factor/Bandwidth
Uplink Downlink
US/AU DR0: SF10BW125 DR8: SF12BW500
DR1: SF9BW125 DR9: SF11BW500
DR2: SF8BW125 ...
DR3: SF7BW125 DR13: SF7BW500
DR4: SF8BW500
DR5-DR7: RFU
EU DR0: SF12BW125
...
DR5: SF7BW15
DR6: SF7BW250
DR7: FSK
14 MultiConnect®xDotTMMTXDOT Developer Guide
Power Draw
Note:
■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source
when determining product load.
■ Power measurements are similar for 868 MHz models. Some 868 MHz sub-band frequencies do not
support maximum TXP power of 20.
■ Transmit power measured with MTXDOT-915-xx transmitting to a MultiConnect Conduit with an
MTAC-LORA-915 accessory card installed.
■ Idle current measured with the xDot joined with Conduit, but idle without data transferring.
■ Transmit power measured while transferring data packets using spread factor 9. Packet size limited
to 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was run
to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement taken
during that time.
■ For Inrush charge, recorded the highest observed value from five separate measurements.
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION
Voltage USB = 5v Standby Mode
Current, (Sleep = 0
Deep Sleep)
LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 10
LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 53
Voltage USB =5vAverage Current
(Amps) at Low
Transmit Power
Setting (TXP 2)
LDO = 3.3 0.013 0.017 0.018 0.132mC 153uS
LDO = 3.3 0.017 0.024 0.025 0.132mC 147uS
Average Current
(Amps) at Default
Transmit Power
Setting (TXP 11)
Stop Mode
Current,
(Sleep = 1)
Idle current
Average
Average Current
(Amps) at
Maximum
Transmit Power
Setting (TXP 20)
Spreading Factor Setting Packet Size (#
Total Inrush
Charge
measured in
MilliCoulombs
Total Inrush Charge
DURATION during
Powerup (INRUSH
Duration)
Measuring the Power Draw
To measure the power draw on an xDot developer board:
1. Flash the latest AT command firmware on the xDot.
2. Unplug the xDot from the computer and then reconnect it.
3. Connect current meter across JP30 on the developer board.
4. Set wake pin to wake, AT+WP=6.
5. Set wake mode to interrupt, AT+WM=1.
6. Put the xDot to sleep, AT+SLEEP=0|1.
7. Put jumper across JP5.
Bytes)
Note: After this step, AT command and debug ports no longer work.
8. Measure current draw.
9. Press the S2 button on the developer board to wake the xDot
MultiConnect®xDotTMMTXDOT Developer Guide 15
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION
Electrical Characteristics
Signal Description Min Max
Vin Low Input low level -- 0.3 * VDD
Vin High Input high level 0.45 * VDD +0.6 --
Vout Low Output low level -- .4
Vout High Output high level 0.4 --
VCC Standard operating voltage 2.4 3.6
ICC Operating current (mA)
@5V
Operating current (mA)
@3.3V
xDot and Processor Pin Information
-- 135
-- 200
Pin Information
Note:
■ Using the mbed platform expands your pin functionality options.
■ Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left)
■ The xDot is 0.045 x 0.045, board is 0.93 x 0.93
16 MultiConnect®xDotTMMTXDOT Developer Guide
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