Multitech MultiConnect MTPCIE-H5, MultiConnect MTPCIE-BW Developer's Manual

MultiConnect

MTPCIE-H5/MTPCIE-BW Developer Guide

PCIe

MULTICONNECT PCIE DEVELOPER GUIDE

MultiConnect PCIe Developer Guide

Models: MTPCIE-H5-xx, MTPCIE-BW

Part Number: S000538, Version 1.2 USA and Canada Edition

This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2013 by Multi-Tech Systems, Inc.

Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.

Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.

Trademarks

Multi-Tech, SocketModem, and the Multi-Tech logo are registered trademarks of Multi-Tech Systems, Inc. MultiConnect is a trademark of Multi-Tech System. All other brand and product names are trademarks or registered trademarks of their respective companies.

Legal Notices

The Multi-Tech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted Applications is at the user’s sole risk and liability.

MULTI-TECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTI-TECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTI-TECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS.

The Multi-Tech products and the final application of the Multi-Tech products should be thoroughly tested to ensure the functionality of the Multi-Tech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the Multi-Tech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent Multi-Tech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever.

Contacting Multi-Tech

Knowledge Base

The Knowledge Base provides immediate access to support information and resolutions for all Multi-Tech products. Visit http://www.multitech.com/kb.go.

Support Portal

To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.

Support

Business Hours: M-F, 9am to 5pm CT

Country By Email By Phone

Europe, Middle East, Africa: support@multitech.co.uk +(44) 118 959 7774

U.S., Canada, all others: support@multitech.com (800) 972-2439 or (763) 717-5863

Warranty

To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.

World Headquarters

Multi-Tech Systems, Inc.

2205 Woodale Drive, Mounds View, MN 55112

Phone: (800) 328-9717 or (763) 785-3500

Fax (763) 785-9874

2 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

CONTENTS

Contents

Product Overview .................................................................................................................................................... 6

About MultiConnect PCIe.............................................................................................................................................. 6

Documentation ........................................................................................................................................................... 6

Developer Kit Contents ................................................................................................................................................ 6

Attaching Power Supply Blades .................................................................................................................................... 6

Power Supply and Blades............................................................................................................................................ 6

Attaching the Blades ................................................................................................................................................... 7

Pinout...................................................................................................................................................................... 8

Multi-Tech Mini PCIe Pinout ......................................................................................................................................... 8

Standard Mini-PCI Express Pinout ............................................................................................................................ 11

Pinout for Cellular USB Only ....................................................................................................................................... 13

Design Considerations............................................................................................................................................ 14

Design Consideration .................................................................................................................................................. 14

Noise Suppression Design ........................................................................................................................................... 14

PC Board Layout Guideline ......................................................................................................................................... 14

Electromagnetic Interference .................................................................................................................................... 14

Electrostatic Discharge Control................................................................................................................................... 15

USB Design ................................................................................................................................................................. 15

Developer Board and Schematics ........................................................................................................................... 16

Developer Board ......................................................................................................................................................... 16

Assembly Diagram....................................................................................................................................................... 18

Top ............................................................................................................................................................................ 18

Bottom ...................................................................................................................................................................... 19

Developer Board Block Diagram ................................................................................................................................. 20

Developer Board Schematics ...................................................................................................................................... 21

Board Components ..................................................................................................................................................... 30

Installing a Communications Device onto the Board.................................................................................................. 31

Installing a SIM Card .................................................................................................................................................. 31

Safety Notices and Warnings ................................................................................................................................. 32

Radio Frequency (RF) Safety ....................................................................................................................................... 32

Sécurité des fréquences radio ................................................................................................................................. 32

Vehicle Safety.............................................................................................................................................................. 32

User Responsibility...................................................................................................................................................... 33

Device Maintenance ................................................................................................................................................... 33

Notice regarding Compliance with FCC and Industry Canada Requirements for RF Exposure .................................. 33

Labeling Requirements .......................................................................................................................................... 34

Approvals and Certification......................................................................................................................................... 34

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 3

CONTENTS

Example HSPA+ H5 Labels......................................................................................................................................... 34

Host Labeling............................................................................................................................................................. 35

Regulatory Statements .......................................................................................................................................... 36

R&TTE Directive Compliance ...................................................................................................................................... 36

Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 37

International Modem Restrictions .............................................................................................................................. 37

Industry Canada and FCC ............................................................................................................................................ 37

Requirements for Cellular Antennas with regard to FCC/IC Compliance ................................................................. 38

Industry Canada and FCC Identification Numbers ................................................................................................... 38

Environmental Notices........................................................................................................................................... 39

Waste Electrical and Electronic Equipment Statement .............................................................................................. 39

WEEE Directive.......................................................................................................................................................... 39

Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 39

Information on HS/TS Substances According to Chinese Standards ......................................................................... 40

Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 41

Antennas, Cables, GPS ........................................................................................................................................... 42

Antenna System Cellular Devices................................................................................................................................ 42

FCC and IC Antenna Requirements Toward License Exempt Radio Transmitters (Bluetooth/Wlan)....................... 42

Notice regarding Compliance with FCC and Industry Canada Requirements for RF Exposure ................................ 42

Cellular Antenna Information ................................................................................................................................... 42

Antenna Cable Information ...................................................................................................................................... 43

GPS Antennas............................................................................................................................................................ 44

Bluetooth and Wi-Fi Antenna Specifications ............................................................................................................ 44

OEM Integration ....................................................................................................................................................... 45

Device Overview .................................................................................................................................................... 47

Description .................................................................................................................................................................. 47

Product Build Options ................................................................................................................................................. 47

Account Activation for Cellular Devices ..................................................................................................................... 47

Bluetooth/Wi-Fi .......................................................................................................................................................... 47

Mechanical Drawing .............................................................................................................................................. 49

MTPCIE-H5-xx.............................................................................................................................................................. 49

MTPCIE-BW ................................................................................................................................................................. 50

Specifications......................................................................................................................................................... 51

MTPCIE-H5 Specifications ........................................................................................................................................... 51

MTPCIE-H5 DC Electrical Characteristics..................................................................................................................... 53

Absolute Maximum Rating........................................................................................................................................ 53

PCIE Connector Leads ................................................................................................................................................. 53

Typical Power Flow .................................................................................................................................................... 59

Power Measurements................................................................................................................................................. 60

MTPCIE-H5 ................................................................................................................................................................ 60

4 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

CONTENTS

MTPCIE-H5-V-BW...................................................................................................................................................... 60

MTPCIE-BW ............................................................................................................................................................... 60

Application Notes .................................................................................................................................................. 61

RF Performances ......................................................................................................................................................... 61

Receiver Features for Cellular Devices ..................................................................................................................... 61

Frequency Bands......................................................................................................................................................... 62

Installing Drivers for Non-UIP HSPA+ Devices......................................................................................................... 63

HSPA+ Device Driver Installation ................................................................................................................................ 63

Installing on Linux ..................................................................................................................................................... 63

Windows Release Notes .......................................................................................................................................... 64

Downloading the Windows USB Driver ................................................................................................................... 64

Windows Notes ........................................................................................................................................................ 64

Installing on Windows 8, 7 or Vista ......................................................................................................................... 65

Installing on Windows XP ......................................................................................................................................... 66

Uninstalling Windows Drivers ................................................................................................................................... 67

Remove Microsoft Installed Drivers.......................................................................................................................... 67

Developer Note......................................................................................................................................................... 68

Using Linux with H5 Devices .................................................................................................................................. 69

Shell Commands.......................................................................................................................................................... 69

Testing Serial Ports.................................................................................................................................................... 69

Create a PPP Connection ............................................................................................................................................ 69

Example..................................................................................................................................................................... 69

C Programming............................................................................................................................................................ 70

open()........................................................................................................................................................................ 70

read()......................................................................................................................................................................... 71

write()........................................................................................................................................................................ 72

close()........................................................................................................................................................................ 72

Test Program() .......................................................................................................................................................... 73

Index...................................................................................................................................................................... 75

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 5

PRODUCT OVERVIEW

Product Overview

About MultiConnect PCIe

The MultiConnect™ PCIe embedded cellular modem is a complete, ready-to-integrate communications device that offers standard-based penta-band HSPA+ 21, dual-band EV-DO Rev A, or CDMA performance. This quick-to-market communications device allows developers to add wireless communication and GPS tracking to products with a minimum of development time and expense. The MultiConnect PCIe embedded cellular modem is based on industry-standard open interfaces and utilizes a PCI Express Mini Card form factor.

Documentation

The following documentation is available by email to oemsales@multitech.com or by using the Developer Guide Request Form at www.multitech.com.

■ MultiConnect PCIe Developer Guide – This document. Provides an overview, safety and regulatory

information, design considerations, schematics, and device information for developers.

■ AT Command Guide – Device specific AT command reference guide.

Developer Kit Contents

Your Developer Kit (MTPCIE-DK1) includes the following:

Developer Board 1 - MTPCIE-DK Developer Board

Power Supply 1 - 100-240V 9V-1.7A power supply with removable blades, 1 - US blade/plug, 1 - EURO

blade/plug, 1 - UK blade/plug

Cables 1 - RS-232 DB9F-DB9M serial cable, 1 - RJ-45 Ethernet cable, 2 -USB cable 2 - SMA-to-UFL

antenna cables (1 - for cellular, 1 - for GPS) 1 - RSMA-to-UFL antenna cable for Bluetooth/Wi-Fi

Antennas 1 - 3.3V magnetic GPS antenna , 1 - HEPTA band SMA antenna, 1 - 2.4GHz, dipole Wi-Fi

antenna

Customer Notices Modem activation notice

Additional One promotional screwdriver

Attaching Power Supply Blades

Power Supply and Blades

If your device shipped with a power cord, attach the blades for your region.

6 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

PRODUCT OVERVIEW

Power Supply No Power Supply with Power Supply with Power Supply with

Blades EU blad NAM blade UK blade

Attaching the Blades

To attach a power supply blade:

1. Remove the power supply cover (not shown). To do this, slide the lock down and hold it while you lift off

the cover.

2. Insert the latch on the blade into the notch on the power supply.

3. Slide the lock down and hold it while you press the blade in place. Then, release it.

1 - Latch

2 - Notch

3 - Sliding lock

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 7

PINOUT

Pinout

Multi-Tech Mini PCIe Pinout

Note:

Some modems do not include all the pins shown above. Refer to your model’s Device Guide for model specific pinout information.

SDIO can operate up to 25Mhz. Treat the SDIO traces to Host like a bus and keep the bus length as short as possible. Multi-Tech recommends adding series termination resistors on all the SDIO traces.

Pin # Name I/O Function MTPCIE-H5 MTPCIE-H5-V-BW MTPCIE-

1 SDIO_D0 I/O Wi-Fi SDIO_D0 X X

2 3.3Vaux I 3.3Vaux X X X

3 SDIO_D1 I/O Wi-Fi SDIO_D1 X X

4 GND Ground X X X

5 SDIO_D2 I/O Wi-Fi SDIO_D2 X X

6 BT_TXD I Bluetooth Transmit X X

data

7 SDIO_D3 I/O Wi-Fi SDIO_D3 X X

8 BT_RTS I Bluetooth RTS X X

9 GND Ground X X X

10 BT_CTS O Bluetooth CTS X X

11 SDIO_CMD I/O Wi-Fi SDIO_CMD X X

12 BT_RXD O Bluetooth Receive data X X

13 SDIO_CLK I Wi-Fi SDIO_CLK X X

14 BT_EN I Bluetooth enable (low X X

disable)

15 GND Ground X X X

16 GPIO_2 I/O 3G Cellular General X

purpose I/O

17 WLAN_EN I Wi-Fi enable (low X X

disable)

18 GND Ground X X X

19 WLAN_IRQ O Wi-Fi interrupt (low X X

active)

20 3G_ONOFF I 3G Cellular On/Off (low X X

active)

8 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

PINOUT

Pin # Name I/O Function MTPCIE-H5 MTPCIE-H5-V-BW MTPCIE-

21 GND Ground X X X

22 3G_RST I 3G Cellular Reset line X X

(low active)

23 1.8V O 1.8V output X X

24 3.3Vaux I 3.3Vaux X X X

25 GPIO_1 I/O Bluetooth General X X

purpose I/O

26 GND Ground X X X

27 GND Ground X X X

28 3G_DVI_WA0 I/O 3G Cellular digital voice X

control line

29 GND Ground X X X

30 3G_DVI_CLK I/O 3G Cellular digital voice X

clock

31 3G_DVI_RX I 3G Cellular digital voice X

receive

32 RI O 3G Cellular UART RI X

33 3G_DVI_TX O 3G Cellular digital voice X

transmit

34 GND Ground X X X

35 GND Ground X X X

36 USB_D- I/O 3G USB Negative Data X X

37 GND Ground X X X

38 USB_D+ I/O 3G USB Positive Data X X

39 3.3Vaux I 3.3Vaux X X X

40 GND Ground X X X

41 3.3Vaux I 3.3Vaux X X X

42 LED_WWAN# O 3G Cellular STAT LED X X

Output

43 GND Ground X X X

44 DCD O 3G Cellular UART DCD X

45 CTS O 3G Cellular UART CTS X

46 GPIO_3 I/O 3G Celllular General X

purpose I/O

47 RTS I 3G Cellular UART RTS X

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 9

PINOUT

Pin # Name I/O Function MTPCIE-H5 MTPCIE-H5-V-BW MTPCIE-

48 DTR I 3G Cellular UART DTR X

49 RXD O 3G Cellular UART X

Receive data

50 GND Ground X X X

51 TXD I 3G Cellular UART X

transmit data

52 3.3Vaux I 3.3Vaux X X X

10 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

Standard Mini-PCI Express Pinout

Pin # Function I/O Description

1 WAKE# O WAKE

2 3.3Vaux I 3.3Vaux

3 COEX1 I Co-existence pin, not defined

4 GND GND

5 COEX2 I Co-existence pin, not defined

6 1.5V I 1.5V

7 CLKREQ# O CLKREQ#

8 UIM_PWR I UIM_PWR

9 GND GND

10 UIM_DATA I/O UIM_DATA

11 REFCLK+ I PCI Express reference clock

PINOUT

12 UIM_CLK I UIM_CLK

13 REFCLK- I PCI Express reference clock

14 UIM_RESET I UIM_RESET

15 GND GND

16 UIM_VPP 0 UIM_VPP

17 Reserved Reserved

18 GND GND

19 Reserved Reserved

20 W_DISABLE# I W_DISABLE#

21 GND GND

22 PERST# I PERST#

23 PERn0 O PCI Express receiver differential pair signal

24 3.3Vaux I 3.3Vaux

25 PERp0 O PCI Express receiver differential pair signal

26 GND GND

27 GND GND

28 1.5V I 1.5V

29 GND GND

30 SMB_CLK I SMB_CLK

31 PETn0 I PCI Express transmitter differential pair signal

32 SMB_DATA I/O SMB_DATA

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 11

PINOUT

Pin # Function I/O Description

33 PETp0 I PCI Express transmitter differential pair signal

34 GND GND

35 GND GND

36 USB_D- I/O USB Negative Data

37 GND GND

38 USB_D+ I/O USB Positive Data

39 3.3Vaux I 3.3Vaux

40 GND GND

41 3.3Vaux I 3.3Vaux

42 LED_WWAN# O LED Output

43 GND GND

44 LED_WLAN# O LED Output

45 Reserved Reserved

46 LED_WPAN# O LED Output

47 Reserved Reserved

48 1.5V I 1.5V

49 Reserved Reserved

50 GND GND

51 Reserved Reserved

52 3.3Vaux I 3.3Vaux

12 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

Pinout for Cellular USB Only

Pin # Name I/O Description

2 3.3 Vaux I 3.3 Vaux

4 GND Ground

9 GND Ground

15 GND Ground

18 GND Ground

20 3G_ONOFF I 3G cellular on/off

21 GND Ground

22 3G_RST I 3G cellular reset line

24 3.3 Vaux I 3.3 Vaux

26 GND Ground

27 GND Ground

PINOUT

29 GND Ground

35 GND Ground

36 USB_D- I/O 3G USB Negative Data

37 GND Ground

38 USB_D+ I/O 3G USB Positive Data

39 3.3 Vaux I 3.3 Vaux

40 GND Ground

41 3.3 Vaux I 3.3 Vaux

42 LED_WWAN O 3G Cellular STAT LED Output

43 GND Ground

50 GND Ground

52 3.3 Vaux I 3.3 Vaux

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 13

DESIGN CONSIDERATIONS

Design Considerations

Design Consideration

When using the Multi-Tech MiniPCIe form factor:

■ Consult your modem’s device guide for device dimensions. With the modem, the Multi-Tech Mini PCIe form

factor exceeds the standard Mini PCIe maximum component height for top and bottom.

■ If you need to install components under the module, use taller connectors to avoid conflict. Multi-Tech

recommends not installing components under the module.

■ Check the Pinout table for pins that differ from the MiniPCIe spec.

Noise Suppression Design

Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB) containing the MultiConnect PCIe. Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment.

Any OEM board design that contains the MultiConnect PCIe must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled onboard can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern.

On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments.

Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification.

Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes.

PC Board Layout Guideline

In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.

Electromagnetic Interference

The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels.

■ Keep traces carrying high frequency signals as short as possible.

■ Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for

ground and power distribution.

■ Decouple power from ground with decoupling capacitors as close to the device's power pins as possible.

14 MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide

DESIGN CONSIDERATIONS

■ Eliminate ground loops, which are unexpected current return paths to the power source and ground.

■ Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple

power lines are similar to decoupling telephone lines.

■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits.

■ Locate cables and connectors to avoid coupling from high frequency circuits.

■ Lay out the highest frequency signal traces next to the ground grid.

■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground

plane covers all traces.

■ Minimize the number of through-hole connections on traces carrying high frequency signals.

■ Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns

are better.

■ On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to

traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces.

■ Distribute high frequency signals continuously on a single trace rather than several traces radiating from

one point.

Electrostatic Discharge Control

Handle all electronic devices with precautions to avoid damage due to the static charge accumulation.

See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing.

Multi-Tech strives to follow these recommendations. Input protection circuitry is incorporated in Multi-Tech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling.

Multi-Tech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). Multi-Tech recommends that you use our packaging when returning a product and when you ship your products to your customers.

USB Design

Multi-Tech recommends that you review Intel's High Speed USB Platform Design Guidelines for information about USB signal routing, impedance, and layer stacking. Also:

■ Shield USB cables with twisted pairs (especially those containing D+/D-).

■ Use a single 5V power supply for USB devices. See the Power Draw section in your model’s Device Guide for

current (ampere) requirements.

■ Route D+/D- together in parallel with the trace spacing needed to achieve 90 ohms differential impedance

for the USB pair and to maintain a 20 mil space from the USB pair and all other signals.

■ If power is provided externally, use a common ground between the carrier board and the device.

MultiConnectTMPCIe MTPCIE-H5/MTPCIE-BW Developer Guide 15