Multitech MultiConnect Conduit MTCDT-LAP3 Hardware Manual

®

MultiConnect

MTCDT-LAP3 Hardware Guide (AU)

Conduit

TM

MULTICONNECT® CONDUITTM HARDWARE GUIDE

MultiConnect®ConduitTMHardware Guide

Models: MTCDT-LAP3-246A-915-AU, MTCDT-LAP3-246A-AU

Part Number: S000718

Copyright

This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of
Multi-Tech Systems, Inc. All rights reserved. Copyright © 2019 by Multi-Tech Systems, Inc.

Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information,
material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and non­infringement.

Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of
Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.

Legal Notices

The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with
applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or
death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life
preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or
missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted
Applications is at the user’s sole risk and liability.

MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE
UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR
COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES,
COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR
COMMUNICATIONS NETWORK USING THE PRODUCTS.

The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech
products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into
which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers.
MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance
of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written
document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested
changes is performed only as a courtesy and without any representation or warranty whatsoever.

Contacting MultiTech

Knowledge Base

The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.

Support Portal

To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.

Support

Business Hours: M-F, 8am to 5pm CT

Country By Email By Phone

Europe, Middle East, Africa: [e-mail] +(44) 118 959 7774

U.S., Canada, all others: [e-mail] [phone] or [phone]

Warranty

To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.

World Headquarters

Multi-Tech Systems, Inc.

2205 Woodale Drive, Mounds View, MN 55112

Phone: [phone] or [phone]

Fax [phone]

2 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

CONTENTS

Contents

Chapter 1 – Product Overview ................................................................................................................................. 4

Introduction .................................................................................................................................................................. 4

Product Kit Contents ..................................................................................................................................................... 5

Build Options................................................................................................................................................................. 6

Chapter 2 – Specifications ........................................................................................................................................ 7

Conduit Specifications................................................................................................................................................... 7

Mechanical Drawing...................................................................................................................................................... 8

Backpanel Connectors .................................................................................................................................................. 9

LED Descriptions ......................................................................................................................................................... 10

Chapter 3 – Antenna Information .......................................................................................................................... 12

Wieson Antenna.......................................................................................................................................................... 12

Antenna Specifications ............................................................................................................................................. 12

Chapter 4 – Setting up and Configuring the Device ................................................................................................ 13

Install and Connect Conduit Hardware....................................................................................................................... 13

Installing a Mini SIM Card ........................................................................................................................................... 13

Accessory Port (mCard) Interfaces.............................................................................................................................. 14

Installing a Micro SD Card........................................................................................................................................... 15

Installing a Battery ...................................................................................................................................................... 16

Connecting to the Debug Interface............................................................................................................................. 17

Restoring User Defined Settings ................................................................................................................................. 18

Resetting the Device ................................................................................................................................................... 18

Powering Up the device .............................................................................................................................................. 19

Chapter 5 – Regulatory Information ....................................................................................................................... 20

Regulatory Compliance Mark (RCM)........................................................................................................................... 20

Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 20

REACH Statement ....................................................................................................................................................... 21

Registration of Substances........................................................................................................................................ 21

Substances of Very High Concern (SVHC) ................................................................................................................ 21

Waste Electrical and Electronic Equipment Statement .............................................................................................. 21

WEEE Directive.......................................................................................................................................................... 21

Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 21

Information on HS/TS Substances According to Chinese Standards ......................................................................... 23

Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 24

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 3

PRODUCT OVERVIEW

Chapter 1 – Product Overview

Introduction

MultiConnect®Conduit™ is a programmable gateway that uses an open Linux development environment to enable
machine-to-machine (M2M) connectivity using various wireless interfaces. It also provides an online application
store for industrial things as a platform for developers to provision and manage their gateway and associated
sensors and devices.

4 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

Product Kit Contents

Your product kit typically includes the following (varies with model):

PRODUCT OVERVIEW

Device 1 - MTCDT-Conduit

1

Power Supply 1 - 100-240V 9V-1.7A power supply with removable

blades

1 - AU blade/plug

Cables 1 - Micro USB Cable

1 - Ethernet Cable RJ45 6-ft.

Antennas 1 - Hepta Band SMA (for non-LTE devices) or 2 - LTE

SMA (for Conduit LTE only), 1 - GPS antenna, and 1 - Wi­Fi/Bluetooth antenna

2

Customer Notices Quick Start

Registration Card

Feet 4 - Clear Adhesive Feet

Additional 1 - Promotional screwdriver

Note 1: MTCDT-LAP3-246A-915-AU and MTCDT-LAP3-246L-915-AU include a LoRa Accessory Card.

Note 2: HEPTA or LTE antennas are not included with MTCDT-246 or 247A/L (No Radio versions).

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 5

PRODUCT OVERVIEW

Build Options

Product Description Region

MTCDT-LAP3-246A-915-AU Conduit 4G LTE Cat 1 w/ 3G Fallback Application

Enablement Programmable Gateway using GNSS w/AU
Accessory Kit and LoRa Accessory Card

MTCDT-LAP3-246A-AU Conduit 4G LTE Cat 1 w/ 3G Fallback Application

Enablement Programmable Gateway using GNSS w/AU
Accessory Kit

Australia

Australia

6 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

Chapter 2 – Specifications

Conduit Specifications

Category Description

General

Performance 4G LTE Cat 1 with 3G Fallback Release 9

Frequency Bands (MHz) 4G LTE Cat 1 FDD 2100 (B1), 850 (B5) , 900 (B8), 1800 (B3), and 700

(B28)

3G WCDMA 2100 (B1), GSM 850 (B5), and EGSM 900 (B8)

Physical Description

Dimensions See the Conduit Demensions Drawing

Weight 15.6 oz. (442.25 grams) with no accessory cards installed

Connectors

SPECIFICATIONS

Connectors 1 USB device micro Type B debug port (behind nameplate)

1 RJ-45 Ethernet port

1 USB micro port

2 cellular antenna connectors

1 Wi-Fi/Bluetooth connector

1 GPS antenna connector

Power Requirements

Input Voltage 9-32 Volts

Environment

Operating Environment -30° to +70° C

Storage Environment -40° to +85° C

Relative Humidity 20 to 90% non-condensing

Certifications

Country Approval RCM (Australia)

Radio & EMC Compliance EN 55022:2010

EN 301 489

1

FCC Part 15 Class B

IC Class B

Safety Compliance UL/cUL 60950-1 2nd Ed.

IEC 60950-1 2nd Ed. Am. 1 and Am. 2

Telecom Approvals Telstra

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 7

SPECIFICATIONS

1

UL Listed @ 40° C, limited by AC power supply. UL Recognized @ 65° C for Conduit LTE devices within IP67

enclosure or when used with the fused DC power cable, part number FPC-532-DC.

Installation in outdoor locations or ambient above 70° C has not been evaluated by UL. UL Certification does not
apply or extend to use in outdoor applications.

Optional power must be UL Listed ITE power supply marked LPS or Class 2 rated 12 VDC, 5A. Certification does not
apply or extend to Voltages outside certified range, and has not been evaluated by UL for operating voltages
beyond tested range.

Mechanical Drawing

8 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

SPECIFICATIONS

Backpanel Connectors

Label Description

CELL, AUX Cellular antenna inputs.

H5: CELL - Primary. AUX - Diversity.

AP1, AP2 Slots for MultiTech accessory cards. You can install an accessory card in either slot. Both slots

can be occupied at one time. An exception is an SDIO (Secure Digital Input/Output) card,
which can be used only in the AP1 slot.

USB DEVICE User-defined, high-speed 480 Mbps, standard USB 2.0 Micro B connector. Use this port to

connect the Conduit to a computer or another device. By default, this port is a serial port
terminal interface, but you can program it to act as another device such as a mass storage
device or an Ethernet port.

E-NET RJ-45 receptacle for standard Ethernet 10/100 Base-T.

Caution: Ethernet ports and command ports are not designed to be connected to a public
telecommunication network or used outside the building or campus.

USB HOST High-speed, standard USB 2.0 Type A connector. 500mA maximum current draw. You can

plug into the Host port a device such as a flash drive, camera, or printer if the Linux kernel
has the appropriate driver.

Power 9-32 Vdc power receptacle for provided power cord.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 9

SPECIFICATIONS

LED Descriptions

Conduit mLinux Model Front Panel

Conduit Application Model Front Panel

Label Name Description

PWR Power Solid (constant) green if unit is on indicating that DC power is present.

STATUS Power Status Default condition: LED blinks when mLinux is fully loaded.

LS Link Status Varies with radio model.

A-B-C-D -- These 4 LEDs are user-specified. Present on the Conduit mLinux model only.

CD Carrier Detect This LED is on when a cellular data connection is made. Present on the

Conduit Application model only.

Signal Signal Strength These 3 LEDs display the strength of the cellular signal. Present on the

Conduit Application model only.

If a cellular radio is installed, the typical LS (Link Status) LED behavior is the following:

OFF - No power to the cellular radio

Continuously Lit - Not registered

Slow Blink (-0.2Hz) - Registered or connected

10 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

SPECIFICATIONS

On the back of the Conduit, the RJ-45 Ethernet LEDs (located at the bottom of the connector) are defined as
follows:

Orange LED (lower-left) indicated activity/link. Blinks when there is transmit and receive on the
Ethernet link. It shows a steady light when there is a valid Ethernet connection.

Green LED (lower-right) indicates link speed. Lit when Ethernet is linked at 100Mbps. If not lit, Ethernet
is linked at 10 Mbps.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 11

ANTENNA INFORMATION

Chapter 3 – Antenna Information

Wieson Antenna

Devices were approved with the following antenna:

Manufacturer: Wieson

Description: LTE GY115HT467-017

Model Number: 11320Y11194A1

MultiTech ordering information:

Model Quantity

ANLTE2-1HRA 1

ANLTE2-10HRA 10

ANLTE2-50HRA 50

Antenna Specifications

Category Description

Frequency Range .069~0.96GHz, 1.71~2.17GHz, 2.3GHz~2.69GHz

Impedance 50 Ohms

VSWR VSWR should not exceed 3:1 at any point across the bands of operation

Peak Gain 3.8 dBi

Radiation Omni-directional

Polarization Linear Vertical

12 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

SETTING UP AND CONFIGURING THE DEVICE

Chapter 4 – Setting up and Configuring the Device

Install and Connect Conduit Hardware

To install and cable the device:

1. Install a Mini SIM card.

2. Install a Micro SD card (optional).

3. Install a battery (optional).

4. Connect the supplied antenna to the CELL connector on the back of the device.

5. Use the Ethernet connector to connect the Conduit to the device used to administer the Conduit.

6. Install any mCard accessory cards into a slot at the back of the device. Refer to Installing an mCard

Accessory Card for instructions.

7. Depending on the accessory card type, attach any antennas or cables for use with the card.

8. Connect the power cord to an outlet or power strip and to the power adapter.

9. Connect the power adapter to the barrel jack on the back panel of the device. The Power LED comes on

immediately after power is applied. Wait for the Status LED to begin blinking.

Installing a Mini SIM Card

You need:

Phillips screwdriver

Mini SIM card (2FF form factor)

To install or replace the SIM card:

1. Disconnect power to the Conduit, if it is connected.

2. At the front of the Conduit housing, remove the screw that secures the nameplate to the housing and

remove the nameplate.

3. Locate the SIM card holder in the upper right corner of the opening. If a SIM card is installed and needs to

be removed, slide it out of the SIM card holder.

4. Gently push the new SIM card into SIM card holder face up with the cut corner to the right and the SIM

contacts facing toward the Conduit’s interior.

5. If not installing a battery or micro SD card, reattach the MultiTech nameplate to the Conduit using the

screw removed in Step 2.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 13

SETTING UP AND CONFIGURING THE DEVICE

Accessory Port (mCard) Interfaces

The accessory card interface on the Conduit base board has the following interface options:

Interface Description

I2C Used by all accessory cards. I2C is required for

Electronic Identification (EID) support on the accessory
card but can be used for other I2C devices. It should
supports standard (100 kHz) and/or fast (400 kHz) clock
speeds.

The I2C interface reserves the full block of EEPROM
address space for Electronic ID support, so we
recommend that you not attach any other EEPROM
devices to the interface. We recommend that you use a
24C04 part, because both address bits of the 24C04 are
connected to the AP interface allowing you to identify
four separate accessory port (AP) cards in a system.

Serial UART Serial UART with HW flow control used by Serial

inteface based Accessory Cards

SDIO interface and/or SPI Interface AP1 has option for SDIO or SPI interface, based on what

Accessory Card is installed. AP2 supports only SPI based
Accessory Cards.

GPIO Additional control pins for certain Accessory Cards.

Interrupts Software defined interrupts. Can also be used as

additional control pins.

14 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

SETTING UP AND CONFIGURING THE DEVICE

Interface Description

PPS GPS generated Pulse-Per-Second signal used for

software timing. Default is 1 pulse/sec.

USB 2.0 A standard USB 2.0 High Speed interface for USB based

Accessory Cards.

5 VDC 1 Amp supply Used by all accessory cards.

3.3 VDC 1 Amp supply Used by all accessory cards.

For accessory card specifications, regulatory content, and installation information, see the Accessory Card
information.

Installing a Micro SD Card

You need:

Phillips screwdriver

MicroSD memory card

To install or replace the SD card:

1. Disconnect power to the Conduit, if it is connected.

2. At the front of the Conduit, remove the screw that secures the MultiTech nameplate.

3. Locate the SD card at the left side of the opening on the underside of the PC board.

4. If an SD card is already installed, gently push on the card to release it from its setting and remove it from

the housing with your fingers.

5. With the new SD card contacts facing up and toward the interior of the device, gently push the card into

the slot to secure it.

6. Reattach the MultiTech nameplate to the housing using the screw removed in step 2.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 15

SETTING UP AND CONFIGURING THE DEVICE

Installing a Battery

The battery is located in the Conduit housing.

You need:

Phillips screwdriver

If replacing a battery, non-metal tweezers or similar object

CR1632 standard coin lithium battery

To install or replace the battery:

1. If connected, disconnect power to the Conduit.

2. At the front of the Conduit housing, remove the screw that secures the MultiTech nameplate to the

housing.

3. The battery holder is located at the right side of the opening on the underside of the PC board. To

remove an existing battery, use non-metal tweezers as necessary.

4. Orient the new battery so that the positive (+) pole is facing down. Use your fingers or non-metal

tweezers to insert the battery into the holder.

5. Reattach the MultiTech nameplate to the housing using the screw removed in Step 2.

16 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

SETTING UP AND CONFIGURING THE DEVICE

CAUTION: Risk of explosion if this battery is replaced by an incorrect type. Dispose of batteries according to

instructions.

Note:

ATTENTION: Risque d’explosion si vous remplacez la batterie par un modèle incompatible. Jetez

les piles usagées selon les instructions.

Connecting to the Debug Interface

You need:

Phillips screwdriver

Standard USB Micro B cable

To connect the debug cable:

1. Disconnect power to the Conduit, if it is connected.

2. At the front of the Conduit housing, remove the screw that secures the MultiTech nameplate to the

housing.

3. Locate the USB debug cable connector in the center of the opening.

4. Connect the USB Micro B cable to the debug connector.

5. Connect the Type A end of the USB cable to the host.

6. From the host, use an application such as TeraTerm with a baud rate of 115,200. If the USB driver does

not automatically install, do the following:

a. Unplug the USB cable.
b. Go to the following web site to download and install the appropriate USB driver:

https://www.exar.com/connectivity/uart-and-bridging-solutions/usb-uarts/xr21b1411/

c. Plug the USB cable back into the housing.

7. From the host, access the Conduit's USB COM port.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 17

SETTING UP AND CONFIGURING THE DEVICE

Restoring User Defined Settings

You need:

A pin, paperclip, or similar thin object that can fit into the reset hole.

To restore user defined settings for an AEP device:

1. Locate the hole in the panel labeled RESET. The reset button is recessed into the housing.

2. Use the pin to press in the button for between 3 to 29 seconds, then release the reset button.

If you do not press in the button long enough, the device will reset, but the user defined settings will
not be restored.

If you hold it too long (30 seconds or longer), factory default settings will be restored.

Note: The RESET button is in the same location on all Conduit models.

Resetting the Device

You need:

A pin, paperclip, or similar thin object that can fit into the reset hole.

The following is the default condition for the RESET button on the Conduit. You can program a change to the
behavior of the button if needed.

To reset the device:

1. Find the hole in the front panel labeled RESET. The reset button is recessed into the case.

2. For AEP: Use the pin to press the RESET button for less than 3 seconds, then release. The device reboots.

For mLinux: Press and hold the RESET button for less than 5 seconds, then release. Holding it beyond 5

seconds resets an mLinux device to factory defaults.

3. The status LED will keep blinking normally for a couple of seconds until the unit resets. Then the status

light will stay solid while the device reboots. Once finished, the status will resume blinking normally.

18 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

SETTING UP AND CONFIGURING THE DEVICE

Powering Up the device

CAUTION: Use only the power cord provided with the device. Using any other power cord voids the warranty

and can damage the device.

To power up the device:

1. Install the desired MultiTech accessory card or cards into the slots at the back of the device. Refer to the

appropriate installation documentation for the accessory card.

2. Connect the power cord to an outlet or power strip and to the power adapter.

3. Connect the power adapter to the barrel jack on the back panel of the device.

4. Verify power.

The Power LED comes on immediately after power is applied.

The device takes a short time to boot up when you apply power.

5. Connect the device to the controlling device through the Ethernet connector or the USB connector on the

back panel.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 19

REGULATORY INFORMATION

Chapter 5 – Regulatory Information

Regulatory Compliance Mark (RCM)

This product complies with the requirements of the Regulatory Compliance Mark (RCM) for Electrical Regulatory
Authorities Council (ERAC), Electrical Equipment Safety System (EESS), and the Australian Communications and
Media Authority (ACMA) for Electromagnetic Compatibility (EMC).

Restriction of the Use of Hazardous Substances (RoHS)

Multi-Tech Systems, Inc.

Certificate of Compliance

2011/65/EU

Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations
set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment - RoHS).

These MultiTech products do not contain the following banned chemicals1:

Lead, [Pb] < 1000 PPM

Mercury, [Hg] < 1000 PPM

Hexavalent Chromium, [Cr+6] < 1000 PPM

Cadmium, [Cd] < 100 PPM

Polybrominated Biphenyl, [PBB] < 1000 PPM

Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM

Environmental considerations:

Moisture Sensitivity Level (MSL) =1

Maximum Soldering temperature = 260C (in SMT reflow oven)

1

Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration

would be found in some modules (>1000 PPM);

20 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

REGULATORY INFORMATION

- Resistors containing lead in a glass or ceramic matrix compound.

REACH Statement

Registration of Substances

After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation
1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view that Multi-Tech Systems, Inc. products would
be considered as “articles.” In light of the definition in § 7.1(b) which requires registration of an article only if it
contains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditions
of use,” our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended
and anticipated use.

Substances of Very High Concern (SVHC)

Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed
these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU “REACH”
requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European
Chemicals Agency, and relevant substances have been confirmed to be greater than 0.1% (w/w), Multi-Tech
Systems, Inc. will provide updated compliance status.

Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant
through a formalized process which includes collection and validation of materials declarations and selective
materials analysis where appropriate. This data is controlled as part of a formal quality system and will be made
available upon request.

Waste Electrical and Electronic Equipment Statement

Note: This statement may be used in documentation for your final product applications.

WEEE Directive

The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to take­back electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous
Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the
products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August
13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery
from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.

Instructions for Disposal of WEEE by Users in the European Union

The symbol shown below is on the product or on its packaging, which indicates that this product must not be
disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing
it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate
collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources
and ensure that it is recycled in a manner that protects human health and the environment. For more information
about where you can drop off your waste equipment for recycling, please contact your local city office, your
household waste disposal service or where you purchased the product.

July, 2005

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 21

REGULATORY INFORMATION

22 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

REGULATORY INFORMATION

Information on HS/TS Substances According to Chinese Standards

In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information
Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and
concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech
Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII).

Hazardous/Toxic Substance/Elements

Name of the Component Lead

(PB)

Printed Circuit Boards O O O O O O

Resistors X O O O O O

Capacitors X O O O O O

Ferrite Beads O O O O O O

Relays/Opticals O O O O O O

ICs O O O O O O

Diodes/ Transistors O O O O O O

Oscillators and Crystals X O O O O O

Regulator O O O O O O

Voltage Sensor O O O O O O

Transformer O O O O O O

Speaker O O O O O O

Connectors O O O O O O

Mercury

(Hg)

Cadmium
(CD)

Hexavalent
Chromium
(CR6+)

Polybromi
nated
Biphenyl
(PBB)

Polybrominat
ed Diphenyl
Ether (PBDE)

LEDs O O O O O O

Screws, Nuts, and other
Hardware

AC-DC Power Supplies O O O O O O

Software /Documentation CDs O O O O O O

Booklets and Paperwork O O O O O O

Chassis O O O O O O

X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous
material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits.
O Represents that no such substances are used or that the concentration is within the aforementioned limits.

MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU) 23

X O O O O O

REGULATORY INFORMATION

Information on HS/TS Substances According to Chinese Standards (in Chinese)

依依照照中中国国标标准准的的有有毒毒有有害害物物质质信信息息

根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染
控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒
物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。

有有害害//有有毒毒物物质质//元元素素

成成分分名名称称

印刷电路板

电阻器

电容器

铁氧体磁环

继电器/光学部件

ICs O O O O O O

二极管/晶体管

振荡器和晶振

调节器

电压传感器

变压器

扬声器

连接器

LEDs O O O O O O

铅铅 (PB) 汞汞 (Hg) 镉镉 (CD) 六六价价铬铬 (CR6+)

O O O O O O

X O O O O O

X O O O O O

O O O O O O

O O O O O O

O O O O O O

X O O O O O

O O O O O O

O O O O O O

O O O O O O

O O O O O O

O O O O O O

多多溴溴联联苯苯

(PBB)

多多溴溴二二苯苯醚醚

(PBDE)

螺丝、螺母以及其它五金件

交流-直流电源

软件/文档 CD

手册和纸页

底盘

X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。
O 表示不含该物质或者该物质的含量水平在上述限量要求之内。

24 MultiConnect®ConduitTMMTCDT-LAP3 Hardware Guide (AU)

X O O O O O

O O O O O O

O O O O O O

O O O O O O

O O O O O O