Multitech SocketModem GSM, MTSMC-G1 Hardware Manual

SocketModem® GSM

MTSMC-G1

Hardware Guide for Developers

Copyright and Technical Support

Hardware Guide for Developers

SocketModem® GSM – MTSMC-G1

Copyright

This publication may not be reproduced, in whole or in part, without prior expressed written permission from Multi­Tech Systems, Inc. All rights reserved.

Copyright © 2008 by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties with respect to the contents hereof and specifically

disclaim any implied warranties of merchantability or fitness for any particular purpos e. F urthermore, Multi-Tech
Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof
without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. See
the Multi-Tech Web site for current revisions of documentation.

Trademarks

Trademarks and Registered Trademarks of Multi-Tech Systems, Inc. are SocketModem and the Multi-Tech logo.

Record of Revisions
Revision Date Description

A 03/14/08 Initial release.
B 08/21/08 Updated the FCC statement on page 13.

World Headquarters

Multi-Tech Systems, Inc.
2205 Woodale Drive
Mounds View, Minnesota 55112
Phone: [phone] or 800-328-9717
Fax: [phone]
Internet Address: http://www.multitech.com

Technical Support
Country By Email By Phone

Europe, Middle East, Africa: [e-mail]

+(44) 118 959 7774

U.S., Canada, all others: [e-mail] 800-972-2439 or 763-717-5863

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 2

Table of Contents

Table of Contents

Chapter 1 – SocketModem GSM................................................................................................................4

Introduction........................................................................................................................................... 4

Product Features..................................................................................................................................4

Product Ordering Information............................................................................................................. 4

Technical Specifications......................................................................................................................5

Mechanical Dimensions.......................................................................................................................6

SocketModem Configuration...............................................................................................................7

Serial Configuration..........................................................................................................................7

Electrical Characteristics and Power Consumption......................................................................... 9

Electrical Characteristics..................................................................................................................9

Power Consumption......................................................................................................................... 9

LED Indicators ....................................................................................................................................10

RF Interface......................................................................................................................................... 10

Upgrading Firmware........................................................................................................................... 11

Chapter 2 – The Antenna System............................................................................................................12

Antenna System for Embedded GSM Modems...............................................................................12

RF Specifications................................................................................................................................12

Chapter 3 – Design Considerations........................................................................................................14

Noise Suppression Design Considerations.....................................................................................14

PC Board Layout Guidelines............................................................................................................. 14

Electromagnetic Interference (EMI) Considerations....................................................................... 15

Electrostatic Discharge Control........................................................................................................ 15

Chapter 4 – Safety and Regulatory Compliance....................................................................................16

Safety Notices and Warnings............................................................................................................16

Telecom Safety Warning................................................................................................................16

Wireless Safety..............................................................................................................................16

Certifications, Approvals, Compliance, and Requirements...........................................................18

Wireless Approvals ........................................................................................................................18

Regulatory Compliance Statements ..............................................................................................19

Waste Electrical and Electronic Equipment Statement..................................................................20

Restriction of the Use of Hazardous Substances (RoHS).............................................................21

Information on HS/TS Substances According to Chinese Standards............................................ 22

Information on HS/TS Substances According to Chinese Standards (in Chinese).......................23

Chapter 5 – The SocketModem Developer Board.................................................................................. 24

SocketModem Developer Board Block Diagram ...........................................................................24

The Developer Board Components ..................................................................................................25

Board Components........................................................................................................................26

Pins and Corresponding Signals....................................................................................................26

Table of Switch Blocks...................................................................................................................27

Developer Board Schematics ........................................................................................................28

Chapter 6 – Multi-Tech Warranty Statement ..........................................................................................32

The Multi-Tech Systems, Inc. Warranty Policy................................................................................32

Index...........................................................................................................................................................34

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 3

Chapter 1 – SocketModem GSM

Chapter 1 – SocketModem GSM

Introduction

The SocketModem® GSM wireless modem is a complete, ready-to-integrate communications device that
offers standards-based multi-band GSM/GPRS Class 10 performance. It is based on industry-standard
open interfaces and utilizes Multi-Tech’s universal socket design. This SocketModem includes an
embedded TCP/IP protocol stack to bring embedded Internet connectivity to any device.

Product Features

• Embedded TCP/IP stack with UDP and PING support

• Short Message Services (SMS) Features:

• Text and PDU, Point-to-Point, Cell broadcast

• AT command compatible

• Advanced management features include phone book management, fixed dialing number, real

time clock, and alarm management

• Large Memory SIM support to store/recall more than 127 text messages (SMS)

• Large Memory SIM support to store/recall more than 127 entries per phonebook

• Symstream multi-dimensional symbolic communication protocol

• Link Status (LS) LED and Signal Strength Indicator (SSI) LED on-board

Product Ordering Information

Product Description Region

MTSMC-G1 Quad-band GSM/GPRS SocketModem (850/1900 MHz Default) Global
MTSMC-G1-ED Quad-band GSM/GPRS SocketModem (900/1800 MHz Default) Global
MTSMC-G1-SS Quad-band GSM/GPRS SocketModem - Symstream Enabled

(850/1900 MHz Default)

MTSMC-G1-ED-SS Quad-band GSM/GPRS SocketModem - Symstream Enabled

(900/1800 MHz Default)

MTSMC-G1-XP-SS Quad-band GSM/GPRS SocketModem - Symstream Enabled -

External Power (850/1900 MHz Default)

MTSMC-G1-XP-ED-SS Quad-band GSM/GPRS SocketModem - Symstream Enabled -

External Power (900/1800 MHz Default)

How to Read the Table Above

Build Description

-G1 GSM/GPRS

-ED Euro Default, 900/1800 MHz

-SS Symstream Enabled

-XP External Power Source

Global

Global

Global

Global

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 4

Technical Specifications

The SocketModem GSM meets the following specifications:

Category

Standards
Bandwidth
Serial/Data Speed

Data Format
Data Error Correction
Data Compression
Fax Compatibility
Fax Class
Dimensions

Weight
Operating

Temperature
Storage Temperature
Humidity
Operating Voltage
Power Requirements

Connectors

IP Protocols
Supported

Approvals

Warranty

Description

GPRS Class 10
Quad-band 850/1900 or 900/1800 MHz GSM/GPRS
Serial interface supports DTE speeds to 921600 baud

Packet data up to 85.6K bps
Circuit-switched data (GPRS) up to 14.4K bps transparent and non-transparent

Asynchronous, transparent and non-transparent
MNP2
V.42bis
GSM
Class 1 and Class 2 Group 3

2.541” L × 1.045” W × 0.542” H (6.45cm x 2.65cm x 1.38cm) with SIM retracted

2.974” L × 1.045” W × 0.542” H (7.55cm x 2.65cm x 1.38cm) with SIM ejected
To be determined

-30° to +70° C (FCC certified operating temperature range is -30° to +50° C )

-40° to +85° C
20% to 90% (non-condensing)
5VDC

5V: Typical: To be determined (minimum 400mA)

Maximum Peak Current 2.0A
(Note: The VCC supply does not have to provide a constant high current

but must accommodate the short current spikes of about 1154µs every

4.651ms.)
Antenna: UFL button-type with maximum cable length of TBD” (TBD cm)
SIM: Standard 1.8V and 3V SIM receptacle
VCC/GND: Extra connector for retrofit situations in case VCC pin is not provided

with enough current (must be same 5V source as VCC pin) and cable length must
not cause more than TBD volts drop.

FTP client, ICMP, POP3 (receive mail), HTTP, SMTP (send mail), TCP/UDP
socket: To be determined at a later date.

Safety Certifications

UL 60950
cUL 60950
EN 60950
AS/NZS 60950:2000

EMC Approvals

FCC Part 22, 24
ETSI EN 301 489-7

Network

PTCRB

Two years

Chapter 1 – SocketModem GSM

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 5

Mechanical Dimensions

Chapter 1 – SocketModem GSM

SocketModem GSM Mechanical Drawing

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 6

SocketModem Configuration

Serial Configuration

Note: The bolded, shaded pins are the SocketModem GSM active pins.

Chapter 1 – SocketModem GSM

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 7

Top View

SocketModem Pinout

Chapter 1 – SocketModem GSM

Pinout Descriptions

Pin Signal In/Out Description

-Reset I Device Reset (with pull-up). The active low -RESET input resets the device logic

24

and returns the configuration of the device to the original factory default values or
"stored values" in the NVRAM. -RESET is tied to VCC through a time-constant
circuit for "Power-on-Reset" functionality. The module is ready to accept commands
after about 6 seconds after power-on or reset.
This signal is used to force a reset procedure by providing low level during reset of
at least 500µs. The signal is considered an emergency reset only. A reset
procedure is already driven by internal hardware during the power-up sequence. If
no external reset is necessary, this input can be left open. If used (emergency
reset), it has to be driven by an open collector or an open drain.

GND I

26

-RTS I Request to Sent (Active Low). -RTS signal is used for hardware flow control. -RTS

33

-RXD O Received Data. The module uses the RXD line to send data to the DTE and to

34

-TXD I Transmitted Data. The DTE uses the -TXD line to send data to the module for

35

-RI O RING (Active Low). Incoming ring signal from phone.

36

-DSR O Data Set Ready (Active Low). -DSR indicates module status to the DTE. -DSR

37

-CTS O Clear to Send (Active Low). -CTS is controlled by the module to indicate whether

38

-DCD O Data Carrier Detect (Active Low). -DCD output is ON (low) when a data

39

-DTR I Data Terminal Ready (Active Low). The -DTR input is turned ON (low) when the

40

GND I

41

VCC I DC Input Power. 5V DC power.

61

GND I Analog Ground. Analog ground is tied common with DGND on the SocketModem.

63

Logic Ground.

input ON (low) indicates that the DTE is ready to send data to the modem. In the
command state, the modem ignores -RTS.
Note: When the -RTS pin is not in use, it should be tied low.

send module responses to the DTE. In command mode, -RXD data presents the
module responses to the DTE. Module responses take priority over incoming data
when the two signals are in competition for -RXD. When no data is transmitted, the
signal is held in mark condition.

transmission or to transmit commands to the module. The DTE holds this circuit in
mark state when no data is being transmitted or during intervals between
characters.

Ring Indicate. -RI output ON (low) indicates the presence of an ON segment of a
ring signal on the telephone line. The modem will not go off-hook when -RI is active;
the modem waits for -RI to go inactive before going off-hook.

OFF (high) indicates that the DTE is to disregard all signals appearing on the
interchange circuits except Ring Indicator (-RI). It reflects the status of the local data
set and does not indicate an actual link with any remote data equipment.

or not the module is ready to transmit data. -CTS ON indicates to the DTE that
signals on TXD will be transmitted. -CTS OFF indicates to the DTE that it should not
transfer data on TXD.

connection is established and the module is ready to send/receive data.

DTE is ready to communicate. -DTR ON prepares the modem to be connected, and,
once connected, maintains the connection. -DTR OFF places the modem in the
disconnect state under control of the &Dn and &Qn commands.

Note: When the -DTR pin is not in use, it should be tied low.
Logic Ground.

To minimize potential ground noise issues, connect audio circuit return to AGND.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 8

Chapter 1 – SocketModem GSM

Electrical Characteristics and Power
Consumption

Note: These are preliminary measurements.

Electrical Characteristics

5V DC Characteristics (VDD = 5V ± 0.25V)

Digital Inputs
–DTR (40), –TXD (35), –RTS (33)
–RESET Input High

Digital Outputs
–DCD (39), –CTS (38), –DSR (37), –RI (36), –RXD (34)

VDDMAX

= 5.25V

Input High
Min 2.0V

Min 2.0V
Output High
Min 4V

Input Low
Max 0.8V
Input Low
Max 0.5V
Output Low
Max 0.4V

Current
Drive: 2mA

Digital Input Capacitance 5 pF

Power Consumption

Power Consumption in EGSM900 and GSM850 @ 25 degrees C

Conditions I

+5V
+5V
+5V
+5V

During TX bursts @ 2W 1.2 A 1.3 A
Average @ 2W 250mA 320mA
Average @ 0.5W 180mA 200mA
Average idle mode 15mA 25mA

Power Consumption in GSM1800 & 1900 MHz @ 25 degrees C

Conditions I

+5V During TX bursts @1W 1.1 A 1.2 A
+5V Average @1W 210mA 235mA
+5V Average @ 0.25W 165mA 185mA
+5V Average idle mode 15mA 25mA

Power Consumption in EGSM/GPRS 900 MHz and GSM/GRPS 850 MHz Mode Class 10

Conditions I

+5V
+5V
+5V
+5V

During TX bursts @ 2W 1.2 A 1.3 A
Average @ 2W 420mA 470mA
Average @ 0.5W 280mA 320mA
Average idle mode 15mA 25mA

I

NOM

I

NOM

I

NOM

MAX

MAX

MAX

Power Consumption in GSM/GRPS 1800 MHz and GSM/GRPS 1900 MHz Class 10

Conditions I

+5V
+5V
+5V
+5V

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 9

During TX bursts @ 1W 1.1 A peak 1.2 A peak
Average @ 1W 350mA 400mA
Average @ 0.25W 180mA 210mA
Average idle mode 15mA 25mA

I

NOM

MAX

Chapter 1 – SocketModem GSM

LED Indicators

The LEDs are used to indicate the working mode of the SocketModem. The LS LED indicates
Network Link Status and Network Strength

Network – defined by WMP100

Signal What Is Indicated

Off Processor Off
On Processor On – Not registered on the network
Slow Flash (on 200ms, off 2s) Registered on network
Quick flash (on 200ms, off 600ms) Registered on the network – Communication in

progress

Very quick flash (on 100ms, off 200ms) Bad software; software is bad or not compatible

Signal Strength

Signal What Is Indicated

Off Processor off or modem not registered on network
On Good GSM signal (RSSI >= 12)
Quick flash (on 200ms, off 600ms) Weak GSM signal (7 <= RSSI < 12)
Very quick flash (on 100ms, off 200ms) Very weak or no GSM signal (RSSI < 7)

RF Interface

Radio Characteristics

GSM 850 EGSM 900 GSM 1800 GSM 1900

Frequency RX 869 to 894 MHz 925 to 960 MHz 1805 to 1880 MHz 1930 to 1990 MHz
Frequency TX 824 to 849 MHz 880 to 915 MHz 1710 to 1785 MHz 1850 to 1910 MHz
RF Power
Stand

2W at 12.5% duty
cycle

2W at 12.5% duty
cycle

1W at 12.5% duty
cycle

1W at 12.5% duty

cycle
Impedance 50 ohms
VSWR <2
Typical Radiated Gain 0 dBi on azimuth plane

RF Performances

RF performances are compliant with the ETSI recommendation 05.05 and 11.10.
The main parameters are:

Receiver Features

• EGSM Sensitivity : < -104 dBm

• GSM 1800/GSM 1900 Sensitivity : < -102 dBm

• Selectivity @ 200 kHz : > +9 dBc

• Selectivity @ 400 kHz : > +41 dBc

• Dynamic range : 62 dB

• Intermodulation : > -43 dBm

• Co-channel rejection : + 9 dBc

Transmitter Features

• Maximum output power (EGSM) : 33 dBm ± 2 dB

• Maximum output power (DCS/PCS) : 30 dBm ± 2 dB

• Minimum output power (EGSM): 5 dBm ± 5 dB

• Minimum output power (DCS/PCS): 0 dBm ± 5 dB

• H2 level : < -30 dBm

• H3 level : < -30 dBm

• Noise in 925 - 935 MHz : < -67 dBm

• Noise in 935 - 960 MHz : < -79 dBm

• Noise in 1805 - 1880 MHz : < -71 dBm

• Phase error at peak power : < 5 ° RMS

• Frequency error : ± 0.1 ppm max

RF Connection

The RF connector on the SocketModem GSM is a UFL standard type. An antenna can be directly
connected through a mating UFL to SMA adapter.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 10

Upgrading Firmware

Upgrading the Firmware will be addressed in a later revision of thi s document.

Chapter 1 – SocketModem GSM

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 11

Chapter 2 – The Antenna System

Chapter 2 – The Antenna System

Antenna System for Embedded GSM Modems

The antenna system for use with the GSM modem includes a coax cable to interface between the UFL
connection on the modem and the antenna.

RF Specifications

GSM/EGSM RF Specifications

GSM 850 EGSM 900 GSM 1800 GSM 1900

Frequency RX 869 to 894 MHz 925 to 960 MHz 1805 to 1880 MHz 1930 to 1990 MHz
Frequency TX 824 to 849 MHz 880 to 915 MHz 1710 to 1785 MHz 1850 to 1910 MHz
RF Power
Stand

2W at 12.5% duty
cycle

2W at 12.5% duty
cycle

1W at 12.5% duty
cycle

1W at 12.5% duty
cycle

Coax Cable

An optional 6” antenna cable (SMA Jack to UFL Plug) can be ordered from Multi-Tech Systems,
Inc.

Part Number Description

CASMA-UFL-1 SMA to UFL COAX RF 6 inch cable (Single Pack)
CASMA-UFL-10 SMA to UFL COAX RF 6 inch cable (Ten Pack)

Cable Specifications

Cable Type: Dia. 1.13mm Coaxial Cable
Attenuation: <1.0db
Connector Impedance: 50 ohm

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 12

Antenna

GSM Antenna Requirements/Specifications

Frequency Range: 824 – 960 MHz / 1710 – 1990 MHz
Impedance: 50 ohm
VSWR: <2.0:1
Typical Radiated Gain: 0 dBi on azimuth plane
Radiation: Omni
Polarization: Vertical
Wave: Half Wave Dipole

Antennas Available from Multi-Tech:

Quad Band Description Qty Part Number

Hinged Right Angle 800/900/1800/1900 MHz Cellular Modem Antenna 1 ANQB-1HRA
Hinged Right Angle 800/900/1800/1900 MHz Cellular Modem Antenna 10 ANQB-10HRA
Hinged Right Angle 800/900/1800/1900 MHz Cellular Modem Antenna 50 ANQB-50HRA

PTCRB Requirements Note:

There cannot be any alteration to the authorized antenna system. The antenna system must be

the same type with similar in-band and out-of-band radiation patterns and maintain the same
specifications.

Chapter 2 – The Antenna System

FCC Requirements Note:

The antenna gain, including cable loss, must not exceed 3.1 dBi at 1900 MHz / 0.9 dBi at 850
MHz fo
mounted o
compliance.

r mobile operating configurations and 7.

perations, as defined in 2.1091 and 1.1307 of the rules for satisfying RF exposure

1 dBi at 1900 MHz / 0.9 dBi at 850 MHz for fixed

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 13

Chapter 3 – Design Considerations

Chapter 3 – Design Considerations

Noise Suppression Design Considerations

Engineering noise-suppression practices must be adhered to when designing a printed circuit board
(PCB) containing the SocketModem module. Suppression of noise is essential to the proper operation
and performance of the modem itself and for surrounding equipment.

Two aspects of noise in an OEM board design containing the SocketModem must be considered: on­board/off-board generated noise that can affect digital signal processing. Both on-board and off-board
generated noise that is coupled on-board can affect interface signal levels and quality. Of particular
concern is noise in frequency ranges affecting modem performance.

On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off­board is a separate, but equally important, concern. This type of noise can affect the operation of
surrounding equipment. Most local government agencies have stringent certification requireme nts
that must be met for use in specific environments.

Proper PC board layout (component placement, signal routing, trace thickness and geometry, etc.)
component selection (composition, value, and tolerance), interface connections, and shielding are
required for the board design to achieve desired modem performance and to attain EMI certification.

Other aspects of proper noise-suppression engineering practices are beyo nd the scope of this
designer guide. The designer should consult noise suppression techniques described in technical
publications and journals, electronics and electrical engineering text books, and component supplier
application notes.

PC Board Layout Guidelines

In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs,
power and ground are typically on the inner layers. All power and ground traces should be 0.05
inches wide.

The recommended hole size for the SocketModem pins is 0.036 in. +/-0.003 in. in diameter. Spacers
can be used to hold the SocketModem vertically in place during the wave solder process. A spacer
should be placed on pin 32 and pin 64 of the SocketModem. A suggested part number for the spacer
is BIVAR 938-0.130 for P1 (0.310in) option SocketModems. The spacers can be left on permanently
and will not effect operation.

All creepages and clearances for the SocketModem have been designed to meet requirements of
safety standards EN60950 or EN60601. The requirements are based on a working voltage of 125V or
250V. When the recommended DAA* circuit interface is implemented in a third party design, all
creepage and clearance requirements must be strictly followed in order to meet safety standards. The
third party safety design must be evaluated by the appropriate national agency per the required
specification.

User accessible areas: Based on where the third party design is to be marketed, sold, or used, it may
be necessary to provide an insulating cover over all TNV exposed areas. Consult with the recognized
safety agency to determine the requirements.

Note: Even if the recommended design considerations are followed, there are no guarantees that a

particular system will comply with all the necessary regulatory requirements. It is imperative that
specific designs be completely evaluated by a qualified/recognized agency.

*DAA stands for Data Access Arrangement. DAA is the telephone line interface of the module.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 14

Chapter 3 – Design Considerations

Electromagnetic Interference (EMI)
Considerations

The following guidelines are offered specifically to help minimize EMI generation. Some of these
guidelines are the same as, or similar to, the general guidelines but are mentioned again to reinforce
their importance. In order to minimize the contribution of the SocketModem-based design to EMI, the
designer must understand the major sources of EMI and how to reduce them to accepta ble levels.

1. Keep traces carrying high frequency signals as short as possible.

2. Provide a good ground plane or grid. In some cases, a multilayer board may be required with

full layers for ground and power distribution.

3. Decouple power from ground with decoupling capacitors as close to the SocketModem

module power pins as possible.

4. Eliminate ground loops, which are unexpected current return paths to the power source and

ground.

5. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination

of series inductors, common mode chokes, and shunt capacitors. Methods to decouple
telephone lines are similar to decoupling power lines; however, telephone line decoupling
may be more difficult and deserves additional attention. A commonly used design aid is to
place footprints for these components and populate as necessary during performance/EMI
testing and certification.

6. Decouple the power cord at the power cord interface with decoupling capacitors. Methods to

decouple power lines are similar to decoupling telephone lines.

7. Locate high frequency circuits in a separate area to minimize capacitive coupling to other

circuits.

8. Locate cables and connectors so as to avoid coupling from high frequency circuits.

9. Lay out the highest frequency signal traces next to the ground grid.

10. If a multilayer board design is used, make no cuts in the ground or power planes and be sure

the ground plane covers all traces.

11. Minimize the number of through-hole connections on traces carrying high frequency signals.

12. Avoid right angle turns on high frequency traces. Forty-five degree corners are good;

however, radius turns are better.

13. On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side

of the board to traces carrying high frequency signals. This will be effective as a high
frequency ground return if it is three times the width of the signal traces.

14. Distribute high frequency signals continuously on a single trace rather than several traces

radiating from one point.

Electrostatic Discharge Control

All electronic devices should be handled with certain precautions to avoid damage due to the
accumulation of static charge.

See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the
Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts,
Assemblies and Equipment.” This document covers ESD Control Program Administrative
Requirements, ESD Training, ESD Control Program Plan Technical Requirements
(grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment,
and handling), and Sensitivity Testing.

Multi-Tech Systems, Inc. strives to follow all of these recommendations. Input protection circuitry has
been incorporated into the Multi-Tech devices to minimize the effect of this static buildup, proper
precautions should be taken to avoid exposure to electrostatic discharge during handling.

Multi-Tech uses and recommends that others use anti-static boxes that create a faraday cage
(packaging designed to exclude electromagnetic fields). Multi-Tech recommends that you use our
packaging when returning a product and when you ship your products to your customers.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 15

Chapter 4 – Safety and Regulatory Compliance

Chapter 4 – Safety and Regulatory

Compliance

Safety Notices and Warnings

Note to OEMs: The following safety statements may be used in the documentation of
your final product applications.

Telecom Safety Warning

1. Never install telephone wiring during a lightning storm.

2. Never install a telephone jack in wet locations unless the jack is specifically designed for wet

locations.

3. This product is to be used with UL and cUL listed computers.

4. Never touch uninsulated telephone wires or terminals unless the telephone line has been

disconnected at the network interface.

5. Use caution when installing or modifying telephone lines.

6. Avoid using a telephone during an electrical storm. There may be a remote risk of electrical

shock from lightning.

7. Do not use a telephone in the vicinity of a gas leak.

8. To reduce the risk of fire, use only 26 AWG or larger telecommunication line cord.

9. This product must be disconnected from its power source and telephone network interface

when servicing.

Wireless Safety

General Safety

The modem is designed for and intended to be used in fixed and mobile applications.
“Fixed” means that the device is physically secured at one location and is not able to be
easily moved to another location. “Mobile” means that the device is designed to be used
in other than fixed locations.

Caution: Maintain a separation distance of at least 20 cm (8 inches) is

normally maintained between the transmitter’s antenna and the body of
the user or nearby persons. The Modem is not designed for or intended
to be used in portable applications within 20 cm. (8 inches) of the body of
the user.

RF Interference Issues

It is important to follow any special regulations regarding the use of radio equipment due
in particular to the possibility of radio frequency, RF, interference. Please follow the
safety advice given below carefully.

• Switch OFF your wireless modem when in an aircraft. The use of cellular telephones in

an aircraft may endanger the operation of the aircraft, disrupt the cellular network and
is illegal. Failure to observe this instruction may lead to suspension or denial of cellular
telephone services to the offender, or legal action or both.

• Switch OFF your wireless modem when around gasoline or diesel-fuel pumps and

before filling your vehicle with fuel.

• Switch OFF your wireless modem in hospitals and any other place where medical

equipment may be in use.

• Respect restrictions on the use of radio equipment in fuel depots, chemical plants or

where blasting operations are in progress.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 16

Chapter 4 – Safety and Regulatory Compliance

• There may be a hazard associated with the operation of your wireless modem close to

inadequately protected personal medical devices such as hearing aids and
pacemakers. Consult the manufacturers of the medical device to determine if it is
adequately protected.

• Operation of your wireless modem close to other electronic equipment may also cause

interference if the equipment is inadequately protected. Observe any warning signs and
manufacturers’ recommendations.

Vehicle Safety

• Do not use your wireless modem while driving.

• Respect national regulations on the use of cellular telephones in vehicles. Road safety

always comes first.

• If incorrectly installed in a vehicle, the operation of wireless modem telephone could

interfere with the correct functioning of vehicle electronics. To avoid such problems, be
sure that qualified personnel have performed the installation. Verification of the
protection of vehicle electronics should be part of the installation.

• The use of an alert device to operate a vehicle’s lights or horn on public roads is not

permitted.

Maintenance of Your Modem

Your wireless modem is the product of advanced engineering, design, and craftsmanship
and should be treated with care. The suggestions below will help you to enjoy this
product for many years.

• Do not expose the wireless modem to any extreme environment where the temperature

is above 50ºC or humidity is above 90% noncondensing.

• Do not attempt to disassemble the wireless modem. There are no user serviceable

parts inside.

• Do not expose the wireless modem to water, rain, or spilled beverages. It is not

waterproof.

• Do not place the wireless modem alongside computer discs, credit or travel cards, or

other magnetic media. The phone may affect the information contained on discs or
cards.

• The use of accessories not authorized by Multi-Tech or not compliant with Multi-Tech's

accessory specifications may invalidate the warranty of the wireless modem.

• In the unlikely event of a fault in the wireless modem, contact Multi-Tech Tech Support.

Your Responsibility

This wireless modem is your responsibility. Please treat it with care respecting all local
regulations. It is not a toy. Therefore, keep it in a safe place at all times and out of the
reach of children.

Try to remember your Unlock and PIN codes. Become familiar with and use the security
features to block unauthorized use and theft.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 17

Chapter 4 – Safety and Regulatory Compliance

Certifications, Approvals, Compliance, and
Requirements

Wireless Approvals

The Multi-Tech SocketModem is Industry and/or Carrier Approved as an End Product modem. When
integrated and used with an antenna system that was part of the Multi-Tech modem certification, no
additional approvals or certification are required (however, CDMA has a few exceptions) for the
device you develop as long as the following are met:

• PTCRB Requirements:

The antenna system cannot be altered.

• Model Identification:

IMPORTANT

When the wireless carrier asks you to provide the modem's model identification,
give the Multi-Tech wireless model identification, not the identification of the host
device.
See the label example below.

The Multi-Tech model identification allows the carrier to verify the modem as one of its
approved models.

This information is located on the modem's label.

Example:

The following is an example of Multi-Tech's wireless model identification:

MTSMC-G1 – Multi-Tech wireless GSM model identification.

The following is an example of what an end product label could look like. End
product includes an integrated GSM modem:

Host Device
Identification

Multi-Tech
Model
Identification

IMEI
(International
Mobile
Equipment
Identity)

• Other Information the Wireless Carrier Asks You to Provide:

The modem's 15-character IMEI (International Mobile Equipment Identity) number printed
on the modem's label.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 18

Chapter 4 – Safety and Regulatory Compliance

Regulatory Compliance Statements

EMC, Safety, and R&TTE Directive Compliance

The CE mark is affixed to this product to confirm compliance with the following European Community
Directives:

Council Directive 89/336/EEC of 3 May 1989 on the approximation of the laws of Member States
relating to electromagnetic compatibility;
and
Council Directive 73/23/EEC of 19 February 1973 on the harmonization of the laws of Member
States relating to electrical equipment designed for use within certain voltage limits;
and
Council Directive 1999/5/EC of 9 March on radio equipment and telec ommunications terminal
equipment and the mutual recognition of their conformity.

International Modem Restrictions

Some dialing and answering defaults and restrictions may vary for international modems. Changing
settings may cause a modem to become non-compliant with national telecom requiremen t s in specific
countries. Also note that some software packages may have features or lack restrictions that may cause
the modem to become non-compliant.

EMC Requirements for the United States

FCC Part 15 Regulation

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses, and can
radiate radio frequency energy, and if not installed an d used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Plug the equipment into an outlet on a circuit that is different from the one used by the receiver.

Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC rules. Operation of this device is subject to the following
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference that may cause undesired operation.

WARNING – Changes or modifications to this unit not expressly approved by the party responsible for

compliance could void the user’s authority to operate the equipment.

EMC Requirements for Industry Canada

This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le
matériel brouilleur.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 19

Chapter 4 – Safety and Regulatory Compliance

Waste Electrical and Electronic Equipment
Statement

Note to OEMs: The statement is included for your information and may be used in
the documentation of your final product applications.

WEEE Directive

The WEEE directive places an obligation on EU-based manufacturers, distributors, retailers, and importers
to take-back electronics products at the end of their useful life. A sister Directive, ROHS (Restriction of
Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous
substances in the products at the design phase. The WEEE Directive covers all Multi-Tech products
imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers
are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of
specified percentages per the WEEE requirements.

Instructions for Disposal of WEEE by Users in the European Union

The symbol shown below is on the product or on its packaging, which indicates that this product must not be
disposed of with other waste. Instead, it is the user’s responsibility to dispose of their waste equipment by
handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
The separate collection and recycling of your waste equipment at the time of disposal will help to conserve
natural resources and ensure that it is recycled in a manner that protects human health and the
environment. For more information about where you can drop off your waste equipment for recycling, please
contact your local city office, your household waste disposal service or where you purchased the product.

July, 2005

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 20

Chapter 4 – Safety and Regulatory Compliance

Restriction of the Use of Hazardous Substances
(RoHS)

Multi-Tech Systems, Inc.
Certificate of Compliance

2002/95/EC

Multi-Tech Systems Inc. confirms that its embedded products now comply with the chemical concentration
limitations set forth in the directive 2002/95/EC of the European Parliament (Restriction Of the use of certain
Hazardous Substances in electrical and electronic equipment - RoHS)

These Multi-Tech Systems, Inc. products do not contain the following banned chemicals:

Lead, [Pb] < 1000 PPM
Mercury, [Hg] < 1000 PPM
Hexavalent Chromium, [Cr+6]

Cadmium, [Cd] < 100 PPM
Polybrominated Biphenyl, [PBB] < 1000 PPM
Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM

Moisture Sensitivity Level (MSL) =1
Tin Whisker Growth = None detected
Maximum Soldering temperature = 260C (wave only)

Notes:

1. Lead usage in some components is exempted by the following RoHS annex; therefore, higher lead

concentration would be found in some modules (>1000ppm).

a. Lead in high melting temperature type solders (i.e., tin-lead solder alloys containing more

than 85% lead).

b. Lead in electronic ceramic parts (e.g., piezoelectronic devices).

2. Moisture Sensitivity Level (MSL) – Analysis is based on the components/material used on the

board.

3. Tin Whisker Study was done per NEMI guidelines (Elevated temperature cycle of 60°C and no n-

condensing relative humidity of 87% exposed to this environment for 1000 hours).

< 1000 PPM

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 21

Chapter 4 – Safety and Regulatory Compliance

Information on HS/TS Substances According to
Chinese Standards

In accordance with China’s Administrative Measures on the Control of Pollution Caused by Electronic Information
Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and
concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi­Tech Systems Inc. products relative to the EIP standards set by China’s Ministry of Information Industry (MII).

Name of the
Component

Printed Circuit Boards O O O O O O
Resistors X O O O O O
Capacitors X O O O O O
Ferrite Beads O O O O O O
Relays/Opticals O O O O+ O O
ICs O O O O O O
Diodes/ Transistors O O O O O O
Oscillators and Crystals X O O O O O
Regulator O O O O O O
Voltage Sensor O O O O O O
Transformer O O O O O O
Speaker O O O O O O
Connectors O O O O O O
LEDs O O O O O O
Screws, Nuts, and other

Hardware
AC-DC Power Supplies O O O O O O
Software /

Documentation CDs
Booklets and

Paperwork
Chassis O O O O O O

X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous

material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits.

O Represents that no such substances are used or that the concentration is within the aforementioned limits.

Hazardous/Toxic Substance/Elements
Lead

(PB)

Mercury

(Hg)

X O O O O O

O O O O O O

O O O O O O

Cadmium

(CD)

Hexavalent

Chromium

(CR6+)

Polybrominated

Biphenyl (PBB)

Polybrominated

Diphenyl Ether

(PBDE)

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 22

Chapter 4 – Safety and Regulatory Compliance

Information on HS/TS Substances According to
Chinese Standards (in Chinese)

依照中国标准的有毒有害物质信息

根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP)

标准－中华人民共和国《电子信息产品污染控制管理办法》（第 39 号），也称作中国

RoHS，下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒物质 (TS) 或有害物质
(HS) 的名称及含量水平方面的信息。

成分名称
印刷电路板
电阻器

电容器

铁氧体磁环
继电器/光学部件

IC O O O O O O

二极管/晶体管
振荡器和晶振
调节器
电压传感器
变压器
扬声器
连接器

LED O O O O O O

螺丝、螺母以及其
它五金件

交流-直流电源

软件/文档 CD

手册和纸页

底盘

X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。

有害/有毒物质/元素

铅

(PB)

O O O O O O
X O O O O O
X O O O O O
O O O O O O
O O O O O O

O O O O O O
X O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O

X O O O O O

O O O O O O
O O O O O O
O O O O O O
O O O O O O

汞

(Hg)

镉

(CD)

六价铬

(CR6+)

多溴联苯

(PBB)

多溴二苯醚

(PBDE)

O 表示不含该物质或者该物质的含量水平在上述限量要求之内。

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 23

Chapter 5 – The SocketModem Developer Board

Chapter 5 – The SocketModem

Developer Board

SocketModem Developer Board Block Diagram

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 24

Chapter 5 – The SocketModem Developer Board

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 25

The Developer Board Components

See the next page for a description of the Board Components.

Board Components

Jumper Description
JP1
JP2 & 4
JP3

JP6 & JP9

JP7 & JP13
JP8
JP10 & JP11
JP12

JP19
Switch 3
Switch Block

Mutes the speaker. Default positions are 1 and 2 (speaker is not muted).
Testing interface (debugging) for the RS-232 signals.
Changes the speed of the driver. For Multi-Tech use only. Default positions are 1
and 2 (transceiver operates normally).
JP6 & JP9 are the 5V / 3.3V regulators. The operating voltage factory default
setting is 3.3V.
JP1 jumper must be set to 3.3V.
Warning – Be sure to that 5V / 3.3V jumper is set to match the requirements of
your SocketModem. If this jumper is set incorrectly, damage to the
SocketModem and/or the Test/Demo card could result.
Caution – Use only the provided Multi-Tech Systems, Inc. transformer with the
Test/Demo board. Use of any other power source will void the warranty and will
likely damage the Test/Demo board and the SocketModem. The transformer
connector is keyed to prevent improper connection to the Test/Demo board.
Testing interface (debugging) for the serial TTL signals.
Enables/disables the Watchdog interface.
100 OHM terminator for ISDN. Default positions are 1 and 2 (off).
Ties the TX and RX clock lines together. Default positions are 1 and 2 (transmit
and receiver clock act independently.
Allows a stereo jack feed. Default is ON. If ON, then left and right stereo
channels are combined and form a mono channel.
Sets the alternate ISDN clock. Default position is OFF (the alternate ISDN clock
is off).
Set the switch to the product being used.

Chapter 5 – The SocketModem Developer Board

Pins and Corresponding Signals

J4 and J7

10 PWR
8 CTS
6 DSR
4 DTR
2 RXD

J2 and J13

2 RXC 1 TXC

9 RI
7 RTS
5 GND
3 TXD
1 DCD

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 26

Chapter 5 – The SocketModem Developer Board

Table of Switch Blocks

Switch Blocks and Board

Module Style Board Labels & Block

Orientation

Non-ISDN

SocketModems
and
SocketEthernet IP

Standard ISDN

Alternate ISDN

Note: ALT stands for alternate ISDN

“MODEM

ETHERNET”

“ALT ISDN

MT ISDN”

“ALT ISDN

MT ISDN”

Settings – S4

Board Labels & Block

Settings – S3

“MT ISDN /

ETHERNET

MODEM”

“MT ISDN /

ETHERNET

MODEM”

“ALT ISDN”

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 27

Chapter 5 – The SocketModem Developer Board

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 28

Developer Board Schematics

SHUNT ON:
1&2=TDCLK
2&3=SYNC

VIN

VIN4,5

DSR3

TXD3

DTR3

RXD3

RI3

RTS3
CTS3

DCD3

RXCLK3

MBAUD3

SLP3

TIP3,4

RING3,4

TXCLK3

GND

GND

GND

GND

GND

GND

GND

CGND

CGND

CGND

CGND

CGND
CGND

GND

GND

GND GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

VCC5

GND

GND GND

GND

GND

GND

GND

GND

VDD3_3

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

U14

Si4840DY

6

8
2
3

7
4

1

5

D2

D4

S2S3D3
G1S1D1

R247 1

CR1 MMBD301LT1

R32 24.3K

U9

LTC1778

8

5

7

6

1
2

4

3
9

10

11

12

13
14
15

16

VFB

ITH

ION

SGND

RUN/SS
PGOOD

FCB

VRNG
EXTVCC

VIN

INTVCC

BG

PGND

SW

TG

BOOST

JP4

HEADER-5x2

12
34
56
78
910

U22 TC1262

1

3

VIN VOUT

C178
1uF
16 V

R246 0

R85 0

C177 .1uF 16 V

JP12

HEADER-3

1
2
3

P9

SHUNT

R69 22K

P12

SHUNT

C45 470pF

L1 15uH

R1 100K

R31 15.8K

+

R86 0

CR2 40V/3A

+

J7

ZDX-POWER-CON

1

2

3

R70 49.9K

C176 .01uF

C175
1uF
16 V

S1

SW-SPDT

2

3154

JP9

HEADER-3

1
2
3

VR1 LD29300

1 3

VIN VOUT

+

C43 10uF

10 V

J1

25-POS/D-SUB

13

25

12

24

11

23

10

22

9

21

8

20

7

19

6

18

5

17

4

16

3

15

2

14

1

26

27

R87 0

C48 100uF 6.3 V

L2

ZJYS-2

1
2 3

4

C46 .1uF

16 V

+

C49 100uF 6.3 V

U15

Si4840DY

6

8
2
3

7
4

1

5

D2

D4

S2S3D3
G1S1D1

JP2

HEADER-2

1
2

D1
MB4S

1 2

+

R71 2.2M

C44 .22uF 16 V

R16 330

R245 0

JP6

HEADER-3

1
2
3

U26

ICL3237E

21

8
20
18

24
23
22
19
17

27

4

26

2

9

11

5

6

7

10

12

28

25

1

3

13

14

15

16

R10UT R1IN
R2OUT
R3OUT

T1IN

T2IN

T3IN

T4IN

T5IN
V+

V-

VCC
GND

R2IN
R3IN

T1OUT
T2OUT
T3OUT
T4OUT
T5OUT

C1+

C1-

C2+

C2-

EN

SHDN

MBAUD

R1OUTB

R84 0

P6

SHUNT

Chapter 5 – The SocketModem Developer Board

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 29

Developer Board Schematics

Place close to
the Module.

RESET

TXIND

DTRTTL
RTSTTL

RXIND

DCIND

DTRIND

TXDTTL

ACT

SPD
COL
LINK

FDX

RING

TIP

RXDTTL
DSRTTL

CTSTTL

RITTL

DSRTTL
RITTL

CTSTTL

RXDTTL

DTR2
TXD2
RTS2

RXD2
CTS2
DSR2
DCD2
RI2

DTRTTL5

RTSTTL5

TXDTTL5

CTSTTL5

RXDTTL

5

DSRTTL5

RITTL5

ACT 4

RX+4

TX-4

RX-

4

SPKR 4,5TIP2,4

TX+

4

RING2,4

LINK 4

DCDTTL 5

MIC 5

SPK_P 4

SPK_N 4

MIC_N 4

MIC_P 4

RXCLK

2

MBAUD2

SLP2

TXCLK2

GND

GND

GND

GND

GND

GND

GND

VCC5

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

+

C6 10uF

16 V

J3

12-PIN-SOC

1
2
3
4
5
6
7
8
9
10
11
12

S3-1

SW-4PDT

2

3
1

R44 150

JP7

HEADER-5x2

1 2
3 4
5 6
7 8

R41 200
R39 200

+

U25

ADM6318

1

4

3

5

2

RESET

WDIRESET

VCC

GND

S3-2

SW-4PDT

11

10
12

R57 10K

S5

SW-SPST

1

3

2 4

R45 150

SW3

SW-DPDT

2

1

3

5

4

6

R194 47K

C24 .01uF

R7 0

LED5 RED

U3

ICL3237E

21

8

20
18

24
23
22
19
17

27
4

26
2

9

11

5
6

7
10
12

28
25

1

3

13

14

15

16

R10UTR1IN
R2OUT
R3OUT

T1IN
T2IN
T3IN
T4IN
T5IN

V+

V-

VCC
GND

R2IN
R3IN

T1OUT
T2OUT
T3OUT
T4OUT
T5OUT

C1+
C1-

C2+
C2-

EN

SHDN

MBAUD

R1OUTB

LED3 RED

C5 .01uF

LED1 RED

U12F

74LCX04

12

13

LED9 RED

R236 0

S3-3

SW-4PDT

8

7
9

J4

12-PIN-SOC

1
2
3
4
5
6
7
8

9
10
11
12

LED6 RED

R46 150

R195 0

U5B

74VHC00

4
5

6

R8 0

J6

10-PIN-SOC

1
2
3
4
5
6
7
8
9

10

JP3

HEADER-3

1
2
3

C9 .01uF

R40 200

U5A

74VHC00

1
2

3

14

7

JP13

HEADER-2

1

2

U8

7S32

1
2

4

5

3

R38 200

J5

14-PIN-SOC

1

2

3

4

5

6

7

8

9

10

11

12

13

14

R196 0

R43 150

S3-4

SW-4PDT

5

6
4

LED8 RED

R9 0

JP8

HEADER-2

1
2

P3

SHUNT

R235 4.7K

LED2 RED

LED7 RED

LED4 RED

R42 200

9 10

Chapter 5 – The SocketModem Developer Board

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 30

Developer Board Schematics

TX TERM.

SHUNT ON:
1&2=OPEN

2&3=100
OHM

SHUNT ON:
1&2=OPEN
2&3=100
OHM

HANDSET

RX TERM.

I_RX-

I_RX+

E_TX-

E_TX+

E_RX-

E_RX+

I_TX+

I_TX-

RING2,3

TIP2,3

SPKR3,5

ACT

3

LINK

3

VIN2,5

VIN2,5

SPK_N3

SPK_P3

MIC_N3

MIC_P3

TX+3

RX-3

RX+3

TX-3

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

CGND

CGND

CGND

CGND
CGND

CGND
CGND

VCC

VCC

VCC

GND

GND

GND

GND

R75 47K

C192 .01uF

JP10

HEADER-3

1
2
3

R55 0

S4-3

SW-4PDT

8

7
9

C26 10uF

16 V

C54 15pF

R241 9.09

U4
LM386

2

3

5

FB27

C53 220pF

5KV

R73 47K

J2

6X4-MODJACK

5
4
3
2

R22 4.7K

R23
10K

2

R13 75

J21

8X8-MODJACK

5

4

3

2

6

1

7
8

C55 15pF

C194 .01uF

S4-4

SW-4PDT

5

6
4

R239 0

Q21
2N3904

JP1

HEADER-3

1
2
3

CR3

DALC208SC6

5

3

1

6

2

4

FB28

BLM18AG102SN1

R56 1K

R74 2.7K

U13B

74LCX04

3 4

R58 4.7K

J22

4X4-MODJACK

1
2
3
4

R14 75

C56 15pF

DS1

SPEAKER

1
2

R237 100

S4-1

SW-4PDT

2

3
1

FB29

C3 10uF

16 V

C195 .01uF

FB23 600-OHM

P1

SHUNT

C57 15pF

R238 100

C193 .01uF

C27 .1uF

16 V

P11

SHUNT

JP11

HEADER-3

1
2
3

C42 .001uF

2KV

S4-2

SW-4PDT

11

10
12

Q19
2N3904

F1 145mA

FB24 600-OHM

C52 220pF

5KV

R240 9.09

U13A

74LCX04

14

7

1 2

FB26

C12 .01uF

R72 2.7K

+

C28 100uF

16 V

J10

8X8-MODJACK-2LEDS

5
4
3
2

6

1

7

8

9
10
11
12
13
14

F2 145mA

P10

SHUNT

R6 0
R3 0

R2 0

R10 0

Safety Isolation Barrier

NOTE:
C192, C193, C194, C195
are not instal le d on
the board by default.

Chapter 5 – The SocketModem Developer Board

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 31

Developer Board Schematics

DCDTTL 3

DTRTTL

3

RXDTTL 3

DSRTTL

3

CTSTTL

3

TXDTTL 3

RTSTTL

3

RITTL 3

VIN

2,4

MIC

3

SPKR

3,4

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

VCC

VCC

VCC

VCC

VCC

VCC

VCC

VCC

R78 47K

U13C

74LCX04

5

6

C187 4.7pF

Q14
2N3904

C191 .01uF

R80 47K

R214 2.7K

FB25

MLB20

R205 10K

C13 .01uF

R77 47K

R207 47K

C186 .001uF

100 V

R82 47K

R209 47K

+

C179 10uF

16V

C180 .01uF

Q18

2N3904

R211 10K

C183 .001uF

C14 .01uF

R210 0

R18 2.7K

C181 1uF

U12C

74LCX04

5 6

R212 47K

U12A

74LCX04

14

7

1 2

C182 .001uF

100 V

R81 47K

+

-

U17A
V+

V­TL082

1

3
2

Q17

2N3904

U12E

74LCX04

10

11

R213 10K

U23

LM4861

1

2

4
3

5

8

6
7

SHUTDOWN

BYPASS

IN­IN+

VO1

VO2

VDD
GND

Q20

2N3904

U12B

74LCX04

3 4

U13D

74LCX04

8 9

R216 0

Q15
2N3904

Q13
2N3904

P19

SHUNT

U12D

74LCX04

89

R76 47K

C1 .01uF

C185 .01uF

U13E

74LCX04

10

11

J19

HEADER-2

R79 47K

LED13 RED

J20

5-PIN-STEREO-JACK

4
3
5
2
1

Q12
2N3904

C184 .47uF

25 V

R208 301K

J18

5-PIN-STEREO-JACK

4
3
5
2
1

Q16

2N3904

16 V

C190
.1uF

R5 2.7K LED12 RED

R17 2.7K LED11 RED

R4 2.7K

LED10 RED

R215 0

LED17 RED

R59 2.7K

LED16 RED R60 2.7K

LED15 RED

R20 2.7K

LED14 RED R19 2.7K

R83 47K

Chapter 6 – The Multi-Tech Warranty Statement

Chapter 6 – Multi-Tech Warranty

Statement

The Multi-Tech Systems, Inc. Warranty Policy

Multi-Tech Systems, Inc., (hereafter “MTS”) warrants that its products will be free from defects in material or
workmanship for a period of two, five, or ten years (depending on model) from date of purchase, or if proof of
purchase is not provided, two, five, or ten years (depending on model) from date of shipment.

MTS MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND ALL IMPLIED WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED.

This warranty does not apply to any products which have been damaged by lightning storms, water, or power surges
or which have been neglected, altered, abused, used for a purpose other than the one for which they were
manufactured, repaired by Customer or any party without MTS’s written authorization, or used in any manner
inconsistent with MTS’s instructions.

MTS’s entire obligation under this warranty shall be limited (at MTS’s option) to repair or replacement of any products
which prove to be defective within the warranty period or, at MTS’s option, issuance of a refund of the purchase price.
Defective products must be returned by Customer to MTS’s factory — transportation prepaid.

MTS WILL NOT BE LIABLE FOR CONSEQUENTIAL DAMAGES, AND UNDER NO CIRCUMSTANCES WILL ITS
LIABILITY EXCEED THE PRICE FOR DEFECTIVE PRODUCTS.

Repair Procedures for U.S. and Canadian Customers

In the event that service is required, products may be shipped, freight prepaid, to our Mounds View,
Minnesota factory:

Multi-Tech Systems, Inc.
2205 Woodale Drive
Mounds View, MN 55112 U.S.A.
Attn: Repairs, Serial # ____________

A Returned Materials Authorization (RMA) is not required. Return shipping charges (surface) will be paid by
MTS to destinations in U.S. and Canada.

Please include, inside the shipping box, a description of the problem, a return shipping address (must have
street address, not P.O. Box), your telephone number, and if the product is out of warranty, a payment in
advance is required. Acceptable means of payment include credit card, wire transfer or a check in U.S.
dollars drawn on a U.S. Bank.

For out of warranty repair charges, go to COMPANY/Policies/warranty/
Extended two-year overnight replacement service agreements are availa ble for selected products. Please

call MTS customer service at [phone] or visit our web site at

/PARTNERS/Programs/overnight_replacement/

Please direct your questions regarding technical matters, product configuration, verification that the product
is defective, etc., to our Technical Support department at [phone] or email [e-mail]
Please direct your questions regarding repair expediting, receiving, shipping, billing, etc., to our Repair
Accounting department at [phone] or [phone], or email [e-mail]

Repairs for damages caused by lightning storms, water, power surges, incorrect installation, physical abuse,
or user-caused damages are billed on a time-plus-materials basis.

for details on rates and coverages.

.

Repair Procedures for International Customers
(Outside U.S.A. and Canada)

Your original point-of-purchase Reseller may offer the quickest and most economical repair option for your
Multi-Tech product. You may also contact any Multi-Tech sales office for information about the nearest
distributor or other repair service for your Multi-Tech product. The Multi-Tech sales office directory is
available at www.multitech.com/PARTNERS/Channels/offices/

In the event that factory service is required, products may be shipped, freight prepaid to our Mounds View,
Minnesota factory. Recommended international shipment methods are via Federal Expres s, UPS or DHL
courier services, or by airmail parcel post; shipments made by any other method will be refused. Please
include, inside the shipping box, a description of the problem, a return shipping address (must have street
address, not P.O. Box), your telephone number, and if the product is out of warranty, a payment in advance
is required. Acceptable means of payment include credit card, wire transfer or a check in U.S. dollars drawn

.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 32

Chapter 6 – The Multi-Tech Warranty Statement

on a U.S. Bank. Repaired units shall be shipped freight collect, unless other arrangement s are made in
advance.

Please direct your questions regarding technical matters, product configuration, verification that the product
is defective, etc., to our Technical Support department nearest you or email [e-mail]
calling the U.S., please direct your questions regarding repair expediting, receiving, shipping, billing, etc., to
our Repair Accounting department at +[phone] in the U.S.A., or email [e-mail]

Repairs for damages caused by lightning storms, water, power surges, incorrect installation, physical abuse,
or user-caused damages are billed on a time-plus-materials basis.

Repair Procedures for International Distributors

International distributors should contact their MTS International sales representative for information about
the repair of Multi-Tech product(s).

Please direct your questions regarding technical matters, product configuration, verification that the product
is defective, etc., to our International Technical Support department at +[phone]. When calling the
U.S., please direct your questions regarding repair expediting, receiving, shipping, billing, etc., to our Repair
Accounting department at +[phone] in the U.S.A. or email [e-mail].

Repairs for damages caused by lightning storms, water, power surges, incorrect installation, physical abuse,
or user-caused damages are billed on a time-plus-materials basis.

Multi-Tech Systems, Inc., (hereafter “MTS”) warrants that its products documented in the Developer Guide
will be free from defects in material or workmanship for a period of two years from date of purchase; or, if
proof of purchase is not provided, two years from date of shipment.

MTS MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND ALL IMPLIED WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED.

This warranty does not apply to any products which have been damaged by lightning storms, water, or
power surges or which have been neglected, altered, abused, used for a purpose other than the one fo r
which they were manufactured, repaired by Customer or any party without MTS’s written authorization, or
used in any manner inconsistent with MTS’s instructions.

MTS’s entire obligation under this warranty shall be limited (at MTS’s option) to repair or replacement of any
products which prove to be defective within the warranty period or, at MTS’s option, issuance of a refund of
the purchase price. Defective products must be returned by Customer to MTS’s factory — transportation
prepaid.

MTS WILL NOT BE LIABLE FOR CONSEQUENTIAL DAMAGES, AND UNDER NO CIRCUMSTANCES
WILL ITS LIABILITY EXCEED THE PRICE FOR DEFECTIVE PRODUCTS.

. When

.

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 33

Index

Index

A

Antenna system for wireless products.............12

B

Block Diagram..................................................24

Board Components..........................................26

C

China’s Administrative Measures on the Control

of Pollution..............................................22, 23

D

Design Considerations.....................................14

Developer Board..............................................25

Developer Board Schematics ..............28, 29, 31

E

Electrical Characteristics

SocketModem GPRS......................................9

Electromagnetic Interference Considerations..15

Electrostatic Discharge Control........................15

EMC Requirements for Industry Canada.........19

EMC, Safety, and R&TTE Directive Compliance

......................................................................19

F

J

Jumper – 5V / 3.3V..........................................26

M

Maintenance of Your Modem...........................17

Mechanical Dimensions

SocketModem GPRS .....................................6

P

PC Board Layout Guidelines ...........................14

Pin Configurations..............................................7

R

RF Interface

SocketModem GPRS ...................................10

RoHS Compliance ...........................................21

S

Safety Warning Telecom .................................16

Stereo jack feed jumper...................................26

Switch Block.....................................................26

T

Technical Specifications ....................................5

Testing RS-232 jumper....................................26

FCC Regulations..............................................19

H

Handling Precautions related to electrostatic

discharge control...........................................15

W

Warranty ..........................................................33

WEEE Directive ...............................................20

Wireless Approvals..........................................18

Wireless Safety................................................16

I

International Modem Restrictions ....................19

Multi-Tech Systems, Inc. SocketModem GSM Hardware Guide for Developers 34