MTX MTX-GTW II User Manual

USERGUIDE

HARDWARE

MTX-GTW II

SMART SOLUTIONS FOR A CHANGING WORLD

#WeAreConnectivity

www.mtxm2m.com

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Index

GENERAL NOTES ....................................................................................................................5

IMPORTANT INFORMATION ................................................................................................... 5

SERVICE AND SUPPORT ........................................................................................................ 5

REVISION INFORMATION ....................................................................................................... 6

DESCRIPTION .......................................................................................................................... 7

1. Product Label ............................................................................................................................................7

WARRANTY..............................................................................................................................8

REFERENCES ...........................................................................................................................9

TECHNICAL DATA .................................................................................................................... 10

1. System Architecture and System Functionality .......................................................................................10

1.1 Block Diagram ..............................................................................................................................10

1.2 Technical Data Electronics ..........................................................................................................10

1.2.1 External Interfaces .........................................................................................................10

1.2.2 Internal Interfaces ..........................................................................................................11

1.2.3 User’s Interfaces ............................................................................................................11

ELECTRONIC SPECIFICATIONS .............................................................................................. 12

1. External Interfaces ....................................................................................................................................12

1.1 Function Specication ..................................................................................................................12

1.1.1 USB OTG ..........................................................................................................................12

1.1.2 Ethernet ...........................................................................................................................13

1.1.3 COM1 ...............................................................................................................................14

1.1.4 COM2 ...............................................................................................................................15

1.1.5 Terminal block connector muxing ..................................................................................18

1.1.5.1 RS485/422 .................................................................................................................19

1.1.5.2 Outputs ........................................................................................................................20

1.1.5.2.1 Output characteristics .............................................................................................20

1.1.5.2.2 Input characteristics ................................................................................................21

1.1.6 Power Supply ...................................................................................................................21

1.1.7 Antenna Connectors .......................................................................................................22

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2. Internal Interfaces ....................................................................................................................................23

2.1 iMX6UL-IND .........................................................................................................................23

2.2 Micro SIM ......................................................................................................................................23

2.3 Micro SD .......................................................................................................................................23

2.4 WiFi ..............................................................................................................................................24

2.5 RF Card .........................................................................................................................................25

2.5.1 Wavenis Card ..................................................................................................................26

2.5.2 MOD-RF ...........................................................................................................................27

2.5.3 Other modules ................................................................................................................27

3. User Interfaces ..........................................................................................................................................28

3.1 Status LED ....................................................................................................................................28

3.2 Jumper ..........................................................................................................................................28

4. System Components .................................................................................................................................30

4.1 Cinterion Radio Module ...............................................................................................................30

4.2 EEPROM ........................................................................................................................................30

4.3 GPIO Expander .............................................................................................................................30

4.4 RTC ................................................................................................................................................31

MECHANIC SPECIFICATIONS ................................................................................................. 32

1. Construction ..............................................................................................................................................32

1.1 MTX-GTW II Top View ....................................................................................................................32

1.2 MTX-GTW II Enclosure Drawings .................................................................................................33

1.3 MTX-GTW II DIN Rail .....................................................................................................................35

2. Requirements for the Superior System ...................................................................................................37

2.1 Protection Against External Effects .............................................................................................37

2.2 Thermal Management .................................................................................................................37

SAFETY REQUIREMENTS AND PROTECTION REGULATIONS ............................................ 38

1. Safety Instructions ....................................................................................................................................38

2. General Precautions .................................................................................................................................39

3. SIM Card Precautions ...............................................................................................................................40

4. Antenna Precautions ................................................................................................................................41

5. Radio Frequency (RF) Exposure and SAR ...............................................................................................42

6. Personal Medical Devices ........................................................................................................................43

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CONFORMITY ASSESSMENT ................................................................................................. 44

1. PTCRB Approval ........................................................................................................................................45

2. FCC Compliant .........................................................................................................................................46

2.1 SAR information ...........................................................................................................................46

3. AT&T Certication .....................................................................................................................................48

DECLARACIÓN DE CONFORMIDAD (SPANISH) ...................................................................49

1. Estándares de homologación europea ...................................................................................................49

2. Aprobación PTCRB ....................................................................................................................................50

3. Conformidad FCC ......................................................................................................................................51

3.1 Tasa de absorción especíca (SAR) ............................................................................................51

4. Certicación AT&T .....................................................................................................................................53

REGULATORY AND TYPE APPROVAL INFORMATION ......................................................... 54

1. Directives and Standards .........................................................................................................................54

2. SAR Requirements Specic to Portable Mobiles ....................................................................................57

3. SELV Requirements ..................................................................................................................................58

ROHS STATEMENT ..................................................................................................................59

DISPOSAL OF OLD ELECTRICAL AND ELECTRONIC EQUIPMENT ESCRIPTION ..............60

SALES CONTACT ......................................................................................................................61

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GENERAL NOTES

Product is deemed accepted by recipient and provided without interface to recipient’s products. The
documentation and/or product are provided for testing, evaluation, integration and information purposes.

The documentation and/or product are provided on an “as is” basis only and may contain deciencies or

inadequacies. The documentation and/or product are provided without warranty of any kind, express or
implied. To the maximum extent permitted by applicable law, Matrix Electronica S.L.U. further disclaims all

warranties; including without limitation any implied warranties of merchantability, completeness, tness

for a particular purpose and non-infringement of third-party rights. The entire risk arising out of the use or
performance of the product and documentation remains with recipient. This product is not intended for
use in life support appliances, devices or systems where a malfunction of the product can reasonably be
expected to result in personal injury. Applications incorporating the described product must be designed

to be in accordance with the technical specications provided in these guidelines. Failure to comply with

any of the required procedures can result in malfunctions or serious discrepancies in results.

All safety instructions regarding the use of mobile technical systems, including GSM products, which also
apply to cellular phones, must be followed. Matrix Electronica S.L.U. or its suppliers shall, regardless of
any legal theory upon which the claim is based, not be liable for any consequential, incidental, direct,
indirect, punitive or other damages whatever (including, without limitation, damages for loss of business

prots, business interruption, loss of business information or data, or other pecuniary loss) arising out

the use of or inability to use the documentation and/or product, even if Matrix Electronica S.L.U. has been
advised of the possibility of such damages. The foregoing limitations of liability shall not apply in case of
mandatory liability, e.g. under the Spanish Product Liability Act, in case of intent, gross negligence, injury
of life, body or health, or breach of a condition which goes to the root of the contract. However, claims
for damages arising from a breach of a condition, which goes to the root of the contract, shall be limited
to the foreseeable damage, which is intrinsic to the contract, unless caused by intent or gross negligence
or based on liability for injury of life, body or health. The above provision does not imply a change on
the burden of proof to the detriment of the recipient. Subject to change without notice at any time. The
interpretation of this general note shall be governed and construed according to Spanish law without
reference to any other substantive law.

IMPORTANT INFORMATION

This guide contains important information for the start up and use of the MTX-GTW II. Read it carefully
before you start working with the MTX-GTW II. The warranty will be void should damage occur due to non­compliance with these instructions for use. We cannot accept any responsibility for consequential loss.

SERVICE AND SUPPORT

To contact customer support please contact your local distributor/sales agent or use the contact details
below:

Address: Alejandro Sánchez 109, 28019 Madrid (Spain)
Email: [e-mail]
Website: mtxm2m.com

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REVISION INFORMATION

REVISION DATE AUTHOR CHANGES

1.0 2018/01 JAM First draft

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DESCRIPTION

The MTX-GTW II is designed to be driven by the iMX6UL-IND or iMX6UL-IOT module and offers PC core
functionalities and standard interfaces. This user guide provides information about the components,
features, connectors and signals available on the MTX-GTW II.

1. Product Label

The label xed to the bottom of a MTX device comprises the following information:

MODEL: MTX-Router-Titan II
P/N 199802164
HR: 1.01 FW: 3.00.3.21
1744 IMEI: 357042060418895
MAC: 00D0934046F2

Pb

1
2
3
4
5
6
7

8910 11 12 13 14

1. MTX logo

2. Product name (model)

3. Part number/ordering code

4. Hardware and rmware versions

5. Year/week of fabrication

6. IMEI number

7. MAC address

8. Data matrix code (IMEI)

9. Data matrix code (MAC)

10. RoHS symbol

11. CE logo

12. Pb-free symbol

13. WEEE symbol

14. PTCRB certication logo

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WARRANTY

The information contained within this user guide, including but not limited to any product specication, is

subject to change without notice. Matrix Electronica provides no warranty with regard to this user guide
or any other information contained herein, and hereby expressly disclaims any implied warranties of

merchantability or tness for any particular purpose with regard to any of the foregoing. Matrix Electronica

assumes no liability for any damages incurred directly or indirectly from any technical or typographical
errors or omissions contained herein or for discrepancies between the product and the user guide. In no
event shall Matrix Electronica be liable for any incidental, consequential, special, or exemplary damages,
whether based on tort, contract or otherwise, arising out of or in connection with this user guide or any
other information contained herein or the use thereof.

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REFERENCES

• iMX6UL Freescale Reference Manual

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TECHNICAL DATA

1. System Architecture and System Functionality

1.1 Block Diagram

TERMINALS

JUMPERS

DB9 F (RS232)

GPIO EXT

GPIO

DB9 M (RS232)

RS485/422 Driver

RS232 Driver

RS232 Driver

RTC EEPROM

iMX6UL

ETH

USB

SDCARD

WIFI

LEDS

POWER

CINTERION

SIM

RF

COM 2

COM 1

I2C

GPIO

GPIO

COM 3

COM 4

GPIO

3V3

5V

GPIO

8 -> 30V

GPIO

USB

Illustration 1: MTX-GTW-II block diagram

1.2 Technical Data Electronics

The interfaces and system components listed in the following are implemented on the MTX-GTW II. Due
to the fact that the board can be installed in a casing, the interfaces are divided into external and internal
interfaces.

1.2.1 External Interfaces

• 1x USB OTG 2.0

• 1x ethernet

• 1x RS485/422

• 2x RS232 DB9F/M

• Up to 4x digital inputs/outputs

• 1x power supply

• Up to 3x antenna connectors

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1.2.2 Internal Interfaces

• 1x iMX6UL board

• 1x micro SIM Card

• 1x micro SD Card

• 1x WiFi b/g/n (depending on models)

• 1x RF card

1.2.3 User’s Interfaces

• 4x status LEDs

• 6x jumpers

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ELECTRONIC SPECIFICATIONS

1. External Interfaces

Illustration 2: MTX-GTW II front view

1.1 Function Specication

1.1.1 USB OTG

The USB OTG interface of the iMX6UL-IND/IOT (USB0) is offered as Micro USB AB-type.

iMX6UL

TPS2041

MICRO

USB

Type of media: USB OTG 2.0 Hi-Speed, 5V bus voltage (limited to 500mA)

Interface on module: USB OTG

Signal characteristic: Compatible with the Universal Serial Bus Specication REV. 2.0

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ESD protection: ±15kV human body model

Description: Right angle Micro USB AB

1.1.2 Ethernet

The IMX6UL-IND/IOT directly drives the Ethernet interface. The SMSC LAN8720Ai is used as a PHY.

iMX6UL

RJ45

LED (Ethernet)

LED (Ethernet)

LAN8 720Ai

Type of media: 10/100 Mbit

Signal characteristic: Compatible with the IEEE-802.3 standard

Status LEDs: 2

Modes: MDI, Auto-MDIX

Interface on module: RMII/ENET0

Description: Right angle RJ45 jack

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1.1.3 COM1

The UART3 interface of the iMX6UL-IND/IOT drives the RS232 interface of the MTX-GTW II by default. The
ST ST3232EBDR is used as a driver.

iMX6UL

DB9 F
COM1

ST3232

Transfer rate: Up to 250Kbit/s

Interface on module: AUART3

Handshake: RTS/CTS or XON/XONFF

ESD protection: ±15kV human body model

The pin 6 of DB9 connector is used like a extra digital input signal active low. This signal is routed to GPIO

expander chip in order to read its state from iMX6UL-IND/IOT using I2C bus. The following gure shows

simple input schematic.

GPIO IN RS 1

DB9 PIN6

Ri113

+3V3

100K

Di13

Ri112

1K

BAT54C

COM1 f

emale

5
9
4
8
3
7
2
6
1

IRS 2

DB TXD2

DB CTS2

DB RXD2

DB RTS2

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The following table show the conguration of the DB9 Female (DCE) connector of the COM1 interface.

PIN SIGNAL TYPE REMARK

2 TXD1 O Transmit Data

3 RXD1 I Receive Data

5 GND P GROUND

6 IN_RS I Not standard extra input

7 CTS1 I Clear to Send

8 RTS1 O Request to Send

PIN 1

1.1.4 COM2

The UART5 interface of the iMX6UL-IND/IOT drives the RS232 interface of the MTX-GTW II by default. The
ST ST3232EBDR is used as a driver.

iMX6UL

DB9 M

COM2

ST3232

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Transfer rate: Up to 250Kbit/s

Interface on module: UART5

Handshake: RTS/CTS or XON/XONFF

ESD protection: ±15kV human body model

In order to supply power for external sensor connection, the pin 4 of the DB9 male connector can be
grounded or connected to 5V throught a protection diode.

The signal that controls pin 4 state is routed to GPIO expander chip in order to set its state from iMX6UL-

IND/IOT using I2C bus. The following gure shows pin 4 output schematic.

GPIO IN RS 0

+5V

DB CTS0
DB TXD0

DB RTS0

DB RXD0

Rc111
2K2

2K2

Rc106

DMP3099L-7

Qc10
BSS138W

Qc9

Dc12

SS16

DB9 X2

5B
9B
4B
8B
3B
7B
2B
6B
1B

S

D

G

2

3

AK

D

I

G

S

When the pins of COM2 are joined using a shunt, pin 9 of this DB9 connector is joined to pin 4.

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The following table show the conguration of the DB9 Male (DTE) connector of the COM2 interface.

PIN SIGNAL TYPE REMARK

2 RXD1 I Receive Data

3 TXD1 O Transmit Data

4 DTR_PWR O 4.3 V or GND OUTPUT

5 GND P GROUND

7 RTS1 O Request to Send

8 CTS1 I Clear to Send

9 PWR_AUX O DTR_PWR or OPEN

PIN 1

COM1 (female) and COM2 (male) connectors are joined in a combo 2xDB9 connector.

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1.1.5 Terminal block connector muxing

The following table show the conguration of the 7 ways pluggable terminal block.

PIN SIGNAL TYPE FIRST FUNCTION SENCOND FUNCTION

1 V+ P Positive power input (8 TO 30 V)

2 GND P GND power input

3 D+ IO RS485 positive line Output common relay diode

4 D- IO RS485 negative line IO 4

5 1 IO IO 1 RS422 line Z

6 2 IO IO 2 RS422 line Y

7 3 IO IO 3 Output common relay diode

Phoenix 1843842: right angle, 7 ways, 3.5 mm terminal w. screws

The default assembly doesn’t include the secondary function of pins 3, 4, 5 and 6. Ask our sales team
about custom assemblies. Slide-switch SWIO1 select between primary and secondary functions of pin 7.
Place this switch in the nearest position to the terminal block to set pin 7 as IO3.

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1.1.5.1 RS485/422

The UART2 of the iMX6UL-IND/IOT drives the RS485/422 interface on the MTX-GTW II. The ST ST3485EBDR
is used as a transceiver for RS485. In case of RS422 interface, two ST3485EBDR transceivers are used.

iMX6UL

ST3485

ST3485

TERMINAL

(Jp4:3,4)

TERMINAL

(Jp4:5,6)

Transfer rate: Up to 1.5Mbit/s (RS485 half-duplex/RS422 full-duplex)

Interface on module: UART2

Handshake: CTS# used for clearing the transmission direction

ESD protection: ±15kV human body model

See conguration of the RS485/422, power and IO Pluggable Terminals in IO section.

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1.1.5.2 Outputs

There are up to four inouts that have the following structure:

GPIO OUT 1

COMMON

GND

Rpol

2K2

Rpdown
100K

Qlimit
NPN

Qout
NPN

Rlimit
IR5

Dprot

Drelay

+3V3

+3V3

GPIO IN 1

GPIO IN 1

Ri38

1K

D13

TCMD4000

Ui9A

Ri30
100K

1

2

16

15

IO1

1.1.5.2.1 Output characteristics

Max. voltage: 30 V

Current limiter: 350 mA

Others: diode for de-energize inductive loads

In order to control the chosen output, the following iMX6UL-IND/IOT GPIOs are available:

OUTPUT iMX6UL-IND/IOT INTERNAL GPIO REFERENCE

OUT1 gpio4_27

OUT2 gpio4_28

OUT3 gpio_9

OUT4 4th IO of I2C GPIO expander chip

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1.1.5.2.2 Input characteristics

Max. voltage: 30 V

Isolated: NO

Activation: IN_X grounded

In order to control the chosen output, the following iMX6UL-IND/IOT GPIOs are available:

OUTPUT iMX6UL-IND/IOT INTERNAL GPIO REFERENCE

IN1 gpio4_25

IN2 gpio4_26

IN3 gpio1_5

IN4 3th IO of I2C GPIO expander chip

1.1.6 Power Supply

For protective and EMC reasons the supply input of the MTX-GTW II is designed very robustly.

PLUG

CONNECTOR

REVERSE

POLARITY

LINE

FILTER

SWITCHING

REGULATOR 5V

SWITCHING

REGULATOR 4.1V

PARAMETER MIN. TYP. MAX. UNIT

DC Input Voltage 8 24 30 V

Power consumption 3 18 W

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1.1.7 Antenna Connectors

There are up to three antenna connector outputs, that can be used in function of the MTX-GTW II assembly
options:

MODEL ANTENNA 1 ANTENNA 2 ANTENNA 3

MTX-GTW II-3G 3G X X

MTX-GTW II-3G-GPS 3G GPS X

MTX-GTW II-V2 X X X

MTX-GTW II-4G 3G/4G 3G/4G X

The default assembly of MTX-GTW II has no RF internal interface. When we use an MTX-GTW II custom
assembly, additional antenna connectors may be appended in function of RF modules added.

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2. Internal Interfaces

2.1 iMX6UL-IND

The core of the MTX-GTW II is the iMX6UL-IND or iMX6UL-IOT SBC. The following table shows the key
features of these SBCs.

FEATURE iMX6UL-IND iMX6UL-IOT

Processor Freescale iMXUL @ 528MHz Freescale iMXULL @ 528MHz

RAM 256MB DDR3 256MB DDR3

FLASH 4GB eMMC 4GB eMMC

Temp. range -40ºC~85ºC 0ºC~70ºC

WiFi NO RTL8188ETV

2.2 Micro SIM

The Cinterion radio module has a SIM card interface that connect it to SIM holders placed in PCB. The
SIM holder named Jm11 is a internal interface, because is not possible to access it whithout open the
MTX-GTW II case.

The default MTX-GTW II assembly includes Jm7 instead of Jm11. This SIM holder can be accesed from
cutoff in MTX-GTW II case frontal panel.

Both SIM holders are push-push model.

2.3 Micro SD

The iMX6UL-IND/IOT SBC has a SIM card interface connected to a push-push micro SD holder placed
on its PCB. The micro SD holder named Jm5 is a internal interface, because is not possible to access it
whithout open the MTX-GTW II case.

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2.4 WiFi

The MTX-GTW II can be ordered with an iMX6UL-IOT SBC. This SBC includes RTL8188ETV WiFi module.
The following table shows the key features of this module.

FEATURE REMARK

IEEE 802.11 b/g/n Single 2.4GHz band. Symbol rate up to 150Mbps

Encryption WPA and WPA2

Operation mode Supports Client and Access Point

Module interface USB

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2.5 RF Card

An RF Card connector is available on the MTX-GTW II, although this interface is not included in default
assembly. Two complete UART interfaces (RX,TX,CTS,RTS), I2C, 3 GPIOs, and SPI are available on this
connector. The following table shows the connector pinout (CNrf1).

PIN SIGNAL TYPE REMARK

1 UART6_RX I UART6 Receive Data

2 UART6_TX O UART6 Transmit Data

3 ENABLE_THIS IO Gpio1_18

4 ENABLE_UP IO Gpio1_15

5 IRQ IO Gpio1_28

6 GND P Ground

7 +3V OUT O LED

8 VCC P 5VDC

9 SPICS - SPI Chip Select

10 SPIDI - SPI Data In

11 UART6_CTS# I UART6 Clear to Send

12 UART6_RTS# O UART6 Request to Send

13 I2C_SCL/SPICLK O I2C Clock signal/ SPI Clock

14 I2C_SDA/SPIDO I/O I2C Data signal/ SPI Data Out

15 UART5_RX I UART5 Receive Data

16 UART5_TX O UART5 Transmit Data

17 UART5_CTS# I UART5 Clear to Send

18 UART5_RTS# O UART5 Request to Send

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The second UART in the Rf Card connector is the same UART used in COM2. So, it is not possible to use
both interfaces simultaneously; the default assembly of MTX-GTW II routes UART 5 to COM2 interface.

The supply of this connector can be enable/disable using Gpio1_14 of iMX6UL-IND/IOT SBC.

The SPI interface of the Rf Card connector is not included in the MTX-GTW-ROUTER II default assembly,
because it is implemented using the same pins that UART 5, that is used in the default assembly as
COM2.

2.5.1 Wavenis Card

The CNrf1 connector has been designed in order to allow the connection of one Elster Honeywell Wavenis
card module. The following table shows the key features of this module.

FEATURE DESCRIPTION

Frequency 868/433/915MHz

Network Topology Point-to-Point, Star and Mesh

Typical Transfer rate

9,6 kbps @ 433 & 868 MHz
19,2 kbps @ 915MHz

Line-of-sight

25mW: Up to 1km
500mW: Up to 4km

Dimensions

25mW: 30x28x7 mm
500mW: 37x30x7 mm

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Detailed information about this module can be found on the following link:

http://www.coronis.com/en/wavecard.html

2.5.2 MOD-RF

The CNrf1 connector also supports the connection of the Matrix Electronica MOD-RF module. The
following table shows the key features of this module.

FEATURE DESCRIPTION

RF Technology

Bluetooth 2.1 (Bluegiga WT12)
Bluetooth 4.0 (Bluegiga BLE112)
RF 2,4GHz (Amber 8426: 868/WMBUS)

2.5.3 Other modules

There are some modules with que same mechanical format and interface that has been developed by
Matrix. Ask Matrix for new products and improvements.

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3. User Interfaces

3.1 Status LED

The MTX-GTW II has four LEDs to inform the user about different status conditions. The following table
shows the different LED indications.

LED STATUS REMARK

On when power good

1 General purpose indicator 1

2 General purpose indicator 2

3 General purpose indicator 3

3.2 Jumper

The MTX-GTW II has two shunt banks for conguration purposes. The following tables show information

about the signals connected to each one.

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The Pluggable Terminal pin muxing is implemented in the Jio14 jumper bank. The next table shows the
shunt placement needed to select every pin function.

PIN SIGNAL JUMPER FIRST FUNCTION JUMPER SENCOND FUNCTION

1 V+ - -

2 V- - -

3 D+ 1-2 2-3

4 D- 4-5 5-6

5 1 7-8 8-9

6 2 10-11 11-12

7 3 13-14 14-15

The pin muxing previously showed is related to the default assembly. The assembly of the MTX-GTW II
allows change:

• Pin 4 rst function OUPUT_4 instead RS485 negative line

• Pin 5 srt function RS422 Z pin instead OUTPUT_1

• Pin 5 srt function RS422 Y pin instead OUTPUT_2

Jc18 is used to join pins 4 and 9 of COM2 connector.

The iMX6UL-IND/IOT SBC has a boot conguration SW, named SW 1:

PIN SIGNAL REMARK

1 BT_CFG[7/5]

Booting Conguration Signals.

Check iMX6UL-IND User Guide for more information.

2 BT_CFG[6/3]

3 BOOT_MODE0

4 BOOT_MODE1

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4. System Components

4.1 Cinterion Radio Module

There is a Cinterion radio module on the carrier board. It is possible to assembly four different radio
modules over the same footprint:

• EHS6 3G Gemalto Cinterion module

• EHS8 3G + GPS Gemalto Cinterion module

• ELS61-E 2G/4G (Cat 1) Gemalto Cinterion module

• ELS81 2G/3G/4G (Cat 4) Gemalto Cinterion module

The signal Gpio5_07 is used to enable/disable the radio module power supply. This module is connected
to iMX6UL-IND/IOT using USB high speed interface.

4.2 EEPROM

A 2Kbit EEPROM (Atmel AT24MAC402-XHM-T) is on the MTX-GTW II carrier board. The EEPROM is
controlled via the processor’s I2C bus 1. Writing protection (WP) of the EEPROM is not available. The

base addresses can be taken from the following table. The rst one is for memory bank and the second

one is for MAC address read.

This memory provides the MAC address of the ethernet interface of MTX-GTW II.

I2C BUS POSITION DEVICE ADDRESS

1 MTX-GTW II EEPROM – 24MAC102 0x50 + 0x58

4.3 GPIO Expander

The iMX6UL-IND/IOT has not enough GPIOs to manage all the needed IOs and control external signals.
So, a PCA9570 is included in the design to provide the four additional GPIOs required.

I2C BUS POSITION DEVICE ADDRESS

1 MTX-GTW II PCA9570 0x24

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4.4 RTC

A DS1337 RTC module is on the MTX-GTW II board. The RTC is supplied by a super capacitor in order to
maintain the information when the main supply be removed.

I2C BUS POSITION DEVICE ADDRESS

1 MTX-GTW II RTC DS1337 0x68

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MECHANIC SPECIFICATIONS

1. Construction

PCB outlines

1.1 MTX-GTW II Top View

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1.2 MTX-GTW II Enclosure Drawings

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1.3 MTX-GTW II DIN Rail

DIN rail with four screws:

DIN rail with two screws:

DIN rail with plastic handles:

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DIN rail with plastic handles horizontal:

Wall mount:

MTX-T ACC wall mounting plate (Titan II/GTW II/BGS2T): 000427108

Packaging:

Individual box: 5.5cm high x 12cm wide x 16cm long, 0.37Kg

60 boxes: 55cm high x 35cm wide x 35cm long, 23Kg

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2. Requirements for the Superior System

The MTX-GTW II has an IP65 enclosure which protects itself again dust, external impact and contact.
However, as the MTX-GATEWAY PCB can be bought as a standalone product, the following points must
be considered:

2.1 Protection Against External Effects

The MTX-GTW II PCB is not protected against dust, external impact and contact (IP00). An adequate
protection has to be guaranteed by the surrounding system.

2.2 Thermal Management

The main heat sources are the iMX6UL-IND/IOT module and the Cinterion radio module. The iMX6UL­IND/IOT module power consumption is 1.25 W.

The Cinterion radio module power consumption during idle communication state is lower than 0.150 mW.
The Cinterion module can increase its power consumption up to 3W during data transmission sequences,
depending on radio bands and used protocol. During GSM data transmission burst, the Cinterion radio

module can achieve a peak power consumption of 7 W. Check specications for more information on the

thermal behavior of every Cinterion module model.

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SAFETY REQUIREMENTS AND PROTECTION
REGULATIONS

Please read the information in this section before starting your integration work!

1. Safety Instructions

PLEASE READ THESE SAFETY INSTRUCTIONS AND KEEP A COPY OF THEM.

• Always ensure that use of the modem is permitted. The modem may present a hazard if used
in proximity to personal electronic medical devices. As a rule, the modem must not be used in
hospitals, airports or planes.

• Never use the device at a gas station, refuelling point, blasting area or in any other environment
where explosives may be present.

• Operating the device close to other electronic devices, such as antennas, television sets, and
radios may cause electromagnetic interference.

• This product is intended to be used with the antenna or other radiating element at least 20cm
away from any part of the human body. In applications where this rule cannot be applied,
the application designer is responsible for providing the SAR measurement test report and
declaration.

• You are responsible for observing your country’s safety standards, and where applicable, the
relevant wiring rules.

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2. General Precautions

The MTXGTW II terminal as a standalone item is designed for indoor use only. For outdoor use it must
be integrated into a weatherproof enclosure. Do not exceed the environmental and electrical limits as

specied in “Technical Data”.

• Avoid exposing the device to lighted cigarettes, naked ames or to extreme hot or cold
temperatures.

• Never try to dismantle the device yourself. There are no components inside the modem that
can be serviced by the user. If you attempt to dismantle the device, you may invalidate the
warranty.

• The MTX-GTW II terminal must not be installed nor located in areas where the surface
temperature of the plastic case could exceed 85°C.

In order to provide strain relief and to avoid transmitting excessive vibration to the device during
installation, all cables connected to the MTX-GTW II terminal must be secured or clamped immediately
adjacent to the device’s connectors.

• To protect the power supply cables, and in order to comply with the re safety requirements,
when the unit is powered from a battery or a high current supply, a fast 1.25A fuse should be
connected in line with the positive supply.

• Any incompatible components or products must not be connected to the MTX-GTW II terminal.

Note! MTX-GTW II distributors and sales ofces may refuse warranty claims where evidence of product

misuse is found.

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3. SIM Card Precautions

Before handling the SIM card in your application, ensure that you are not charged with static electricity.
Use proper precautions to avoid electrostatic discharges.

• When the SIM card hatch is opened, the SIM card connectors lie exposed under the SIM card
holder.

Caution! Do not touch these connectors! If you do, you may release an electrical discharge that could
damage the modem or the SIM card.

• When designing your application, the SIM card’s accessibility should be taken into account. We
always recommend that you have the SIM card protected by a PIN code. This will ensure that
the SIM card cannot be used by an unauthorized person.

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4. Antenna Precautions

If the antenna is to be mounted outside, consider the risk of lightning. Follow the instructions provided
by the antenna manufacturer.

• Never connect more than one modem to a single antenna. The modem can be damaged by
radio frequency energy from the transmitter of another modem.

• Like any mobile station, the antenna of the modem emits radio frequency energy. To avoid
EMI (electromagnetic interference), you must determine whether the application itself, or
equipment in the application’s proximity, needs further protection against radio emission and
the disturbances it might cause. Protection is secured either by shielding the surrounding
electronics or by moving the antenna away from the electronics and the external signal cable.

• The modem and antenna may be damaged if either come into contact with ground potentials
other than the one in your application. Beware: ground potentials are not always what they
appear to be.

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5. Radio Frequency (RF) Exposure and SAR

Your wireless modem device is a low-power radio transmitter and receiver (transceiver). When it is turned

on, it emits low levels of radio frequency energy (also known as radio waves or radio frequency elds).

Governments around the world have adopted comprehensive international safety guidelines, developed by

scientic organizations such as ICNIRP (International Commission on Non-Ionizing Radiation Protection)

and IEEE (The Institute of Electrical and Electronics Engineers Inc.), through periodic and thorough

evaluation of scientic studies. These guidelines establish permitted levels of radio wave exposure for

the general population. The levels include a safety margin designed to assure the safety of all persons,
regardless of age and health, and to account for any variations in measurements.

Specic Absorption Rate (SAR) is the unit of measurement for the amount of radio frequency energy
absorbed by the body when using a transceiver. The SAR value is determined at the highest certied

power level in laboratory conditions, but the actual SAR level of the transceiver while operating can be
well below this value. This is because the transceiver is designed to use the minimum power required to
reach the network.

The MTX-GTW II wireless modem device has been approved for applications where the antenna is located

more than 20cm from the body. In all other congurations the user is responsible for meeting the local

SAR regulations.

Users of the MTX-GTW II wireless modem device are responsible for ensuring that they meet the SAR
regulatory requirements of the countries in which they intend to operate the device and that their

documentation contains the relevant SAR declaration, certication information and user guidance as

appropriate.

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6. Personal Medical Devices

Wireless modem devices may affect the operation of cardiac pacemakers, hearing aids and certain other
implanted equipment. If a minimum distance of 15 cm (6 inches) is maintained between the MTX-GTW II
modem radiating antenna and a pacemaker, the risk of interference is limited. If the user’s application is
likely to be situated in the vicinity of personnel, a suitable warning should be contained in the equipment
manual to this effect.

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CONFORMITY ASSESSMENT

RED Declaration of Conformity (DoC)

Unique identication of this DoC: MTX-GTW II RED DoC

We

MATRIX ELECTRÓNICA S.L., C/ Alejandro Sanchez 109, 28019 Madrid, Spain

declare under our sole responsibility that the products MTX-GTW II family

MTX-GTW II ?????????

object of the declaration described above is in conformity with the relevant Union harmonization
Legislation: RED Directive 2014/53/EU and R&TTE Directive 99/5/EC

The following harmonized standards and/or other normative documents were applied: are labeled with
the CE conformity mark.

• EMC (art 3.1.b): EN 301 489-1 V2.2.0 EN 301 489-52 V1.1.0, EN 301 489-3 V2.1.1

• RADIO SPECTRUM (art 3. 2): EN 301 511 V12.5.1, EN 301 908-1 V11.1.1, EN 301 908-2
V11.1.1, EN 300 440 V2.1.1

• SAFETY (art 3.1.a):EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013

• RF SAFETY: EN62311:2008

The technical documentation relevant to the above equipment will be held at

MATRIX ELECTRÓNICA S.L., C/ Alejandro Sanchez 109, 28019 Madrid, Spain

Madrid, 15/01/2018

Mr. J. Vicente

Managing Board

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1. PTCRB Approval

PTCRB is the regional approval needed in North American Market.

MTX-GTW II is now PTCRB Certied:

Request #: 68541

Manufacturer: Matrix Electrónica

Model #: MTX-GTW II

Technologies and Frequency Bands: GSM 850/900/1800/1900, UMTS FDD: Band I/Band II/Band V/
Band VIII

FCCID: QIPEHS6

Industry Canada #: 7830A-EHS6

IMEI TAC: 35888405

Hardware Version: B2

Software Version: 01.000

SVN: 08

NAPRD.03 Version: GSM Test: 5.15/OTA Performance Test: 5.15

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2. FCC Compliant

MTX-GTW II and any variants contain FCC ID: QIPEHS6. The FCC Equipment Authorization Certication
for the EHS6 Module is listed under the FCC identier QIPEHS6

Industry Canada Certication Number: ?

The Cinterion reference application of the EHS6 Module registered under the above identier is certied

to be in accordance with the following Rules and Regulations of the Federal Communications Commission
(FCC). Power listed is ERP for Part 22 and EIRP for Part 24. It is compliant with FCC regulations.

Equipment class: PCS Licensed Transmitter

Notes: Quad band GSM/GPRS Modem

2.1 SAR information

Cinterion Wireless Modules models: EHS6 is marketed without a dened antenna.

The Maximum Antenna Gain when using indoor antennas depends on the distance from the antenna to
any nearby persons when in normal operation. It should not exceed the values shown on the table below.

According to the limit in 47 CFR 1.1310, we get the value of the maximum antenna gain as follows:

The maximum measured power output in the 850 MHz band is 1866.38 mW (32.71 dBm, see 7layers
test report MDE_Siem_0714_FCCb).

The maximum permissible exposure is dened as 47 CFR 1.1310 with 0.55773 mW/cm².

The maximum measured power output in the 1900 MHz band is 974.99 mW (29.89 dBm, see 7layers
test report MDE_Siem_0714_FCCc).

The maximum permissible exposure is dened as 47 CFR 1.1310 with 1 mW/cm².

According to the limit in 47 CFR 1.1310, we get the value of the maximum antenna gain as follows:

S = P*G/4πR²

S = 0.55773 mW/cm² or 1 mW/cm²

P = 1866.38 mW or 974.99 mW

R = 20 cm or 100cm

π = 3.1416

G(dBi)=10*log10(G)

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Solving for G; the maximum antenna gain is:

BAND DISTANCE MAXIMUM GAIN IN dBi

850MHz 20cm 1.7669

850MHz 50cm 9.7257

1900MHz 20cm 7.1227

1900MHz 50cm 15.0815

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3. AT&T Certication

AT&T performed applicable testing on the MTX-GTW II. This includes testing for:

• Negative impacts on AT&T’s wireless network

• Baseline regulatory conrmation

• RF testing against components in the wireless AT&T network

• Network selection testing

The MTX-GTW II device was not observed to cause any adverse problems to the AT&T network when

activated and used in the lab. The MTX-GTW II is certied for both CS and PS services (as applicable). Any
change to the mode of operation invalidates the AT&T Certication.

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DECLARACIÓN DE CONFORMIDAD
(SPANISH)

MATRIX ELECTRÓNICA S.L., C/ Alejandro Sanchez 109, 28019 Madrid, Spain

1. Estándares de homologación europea

Declaramos bajo nuestra responsabilidad que los productos MTX-GTW II que contienen un modulo celular

Cinterion EHS6 (tipo L30960-N2950-A100), al cual se reere esta declaración, están están conformes

con la Directiva RED 2014/53/EU

• EMC (art 3.1.b): EN 301 489-1 V2.2.0, EN 301 489-52 V1.1.0, EN 301 489-3 V2.1.1

• RADIO SPECTRUM (art 3. 2): EN 301 511 V12.5.1, EN 301 908-1 V11.1.1, EN 301 908-2
V11.1.1, EN 300 440 V2.1.1

• SAFETY (art 3.1.a): EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013

• RF SAFETY: EN62311:2008

Estos estándares armonizados permiten etiquetar al producto con el marcado CE

La documentación técnica referente al equipo anterior está disponible en:

MATRIX ELECTRÓNICA S.L., C/ Alejandro Sanchez 109, 28019 Madrid, Spain

Madrid, 30/05/2017

Sr. J. Vicente

Managing Board

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2. Aprobación PTCRB

PTCRB es un aprobado regional necesario en el mercado norteamericano.

MTX-GTW II tiene la certicación PTCRB:

Solicitud #: 68541

Fabricante: Matrix Electrónica

Modelo#: MTX-GTW II

Tecnologías y bandas de frecuencias: GSM 850/900/1800/1900, UMTS FDD: Band I/Band II/Band V/
Band VIII

FCCID: QIPEHS6

Industry Canada #: 7830A-EHS6

IMEI TAC: 35888405

Version Hardware: B2

Version Software: 01.000

SVN: 08

NAPRD.03 Version: GSM Test: 5.15/OTA Performance Test: 5.1

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3. Conformidad FCC

MTX-GTW II y todas sus variantes contienen el FCC ID: QIPEHS6. El Certicado de Autorización de Equipo
de la FCC para el módulo EHS6 está listado con el identicador FCC QIPEHS6

Número de Certicación de Industria en Canadá: ?

El formulario de referencia del módulo EHS6 registrado bajo el anterior identicador está conforme con

las siguientes Reglas y Regulaciones de la Comisión Federal de Comunicaciones (FCC). La potencia
listada como ERP para la parte 22 y como EIRP para la parte 24 cumple con las regulaciones de la FCC.

Clase de equipo: Transmisor PCS Licenciado

Notas: Quad band GSM/GPRS Modem

3.1 Tasa de absorción especíca (SAR)

El módulo Cinterion EHS6 es comercializado sin una antena denida. La ganancia máxima de antena

usando antenas de interior depende de la distancia de esta a las personas cercanas y en condiciones
normales no debe sobrepasar los límites mostrados en la tabla siguiente.

La máxima potencia de salida medida en la banda de 850MHz es 1866.38 mW (32.71 dBm, ver el
reporte de test de 7layers MDE_Siem_0714_FCCb).

La máxima exposición permisible se dene en 47 CFR 1.1310 con un valor de 0.55773 mW/cm².

La máxima potencia de salida medida en la banda de 1900 MHz es 974.99 mW (29.89 dBm, ver el
reporte de test de 7layers MDE_Siem_0714_FCCc).

La máxima exposición permisible se dene en 47 CFR 1.1310 con un valor de 1 mW/cm².

De acuerdo al límite en 47 CFR 1.1310, obtenemos el valor de la máxima ganancia de antena como
sigue:

S = P*G/4πR²

S = 0.55773 mW/cm² o 1 mW/cm²

P = 1866.38 mW o 974.99 mW

R = 20 cm o 100cm

π = 3.1416

G(dBi)=10*log10(G)

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Despejando G; la máxima ganancia de antena es:

BANDA DISTANCIA GANANCIA MÁXIMA EN dBi

850MHz 20cm 1.7669

850MHz 50cm 9.7257

1900MHz 20cm 7.1227

1900MHz 50cm 15.0815

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4. Certicación AT&T

AT&T ha realizado los test aplicables al terminal MTX-GTW II. Esto incluye las siguientes comprobaciones:

• Impactos negatives en la red inalámbrica de AT&T

• Conrmación del cumplimiento de la normativa básica aplicable

• Prueba de RF contra los distintos components usados en la red de AT&T

• Prueba de selección de red

El dispositivo MTX-GTW II no ha evidenciado ni causado ningún tipo de problema en la red de AT&T

cuando ha sido activado y utilizado en el laboratorio. El MTX-3G-JAVA está certicado para servicios CS y
PS. Cualquier cambio en el modo de operación del equipo invalidará la certicación de AT&T.

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REGULATORY AND TYPE APPROVAL
INFORMATION

1. Directives and Standards

The MTX-GTW II modem has been designed to comply with the directives and standards listed below.

It is the responsibility of the application manufacturer to ensure compliance of the nal product with
all provisions of the applicable directives and standards, as well as with the technical specications

provided in this document.

DIRECTIVES

1999/05/EC

Directive of the European Parliament and of the council of 9 March
1999 on radio equipment and telecommunications terminal
equipment and the mutual recognition of their conformity (in short
referred to as R&TTE Directive 1999/5/EC). The product is labeled
with the CE conformity mark.

ECE-R 10

Economic Commission for Europe (ECE) Regulation No. 10: Uniform
provisions concerning the approval of vehicles with regard to
electromagnetic compatibility.

2002/95/EC (RoHS 1)
2011/65/EC (RoHS 2)

Directive of the European Parliament and of the Council of 27 January
2003 (and revised on 8 June 2011) on the restriction of the use of
certain hazardous substances in electrical and electronic equipment
(RoHS).

STANDARDS OF NORTH AMERICAN TYPE APPROVAL

CFR Title 47

Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
PCS); US Equipment Authorization FCC.

OET Bulletin 65
(Edition 97-01)

Evaluating Compliance with FCC Guidelines for Human Exposure to
Radiofrequency Electromagnetic Fields.

UL 60 950-1 Product Safety Certication (Safety requirements).

NAPRD.03 V5.15

Overview of PCS Type certication review board Mobile Equipment Type.
Certication and IMEI control. PCS Type Certication Review board

(PTCRB).

RSS132 (Issue2)
RSS133 (Issue5)

Canadian Standard.

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STANDARDS OF EUROPEAN TYPE APPROVAL

3GPP TS 51.010-1

Digital cellular telecommunications system (Release 7); Mobile

Station (MS) conformance specication.

ETSI EN 301 511 V9.0.2

Global System for Mobile communications (GSM); Harmonized
standard for mobile stations in the GSM 900 and DCS 1800
bands covering essential requirements under article 3.2 of the
R&TTE directive (1999/5/EC).

GCF-CC V3.49 Global Certication Forum - Certication Criteria.

ETSI EN 301 489-01 V1.9.2

Electromagnetic Compatibility and Radio spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for radio
equipment and services; Part 1: Common Tech. Requirements.

ETSI EN 301 489-07 V1.3.1

Electromagnetic Compatibility and Radio spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for radio

equipment and services; Part 7: Specic conditions for mobile

and portable radio and ancillary equipment of digital cellular
radio telecommunications systems (GSM and DCS).

ETSI EN 301 489-24 V1.5.1

Electromagnetic Compatibility and Radio spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for radio

equipment and services; Part 24: Specic conditions for IMT-

2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE)
radio and ancillary equipment.

EN 301 908-01 V5.2.1

Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000
Third Generation cellular networks; Part 1: Harmonized EN for
IMT-2000, introduction and common requirements of article 3.2
of the R&TTE Directive.

EN 301 908-02 V5.2.1

Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for IMT­2000 Third Generation cellular networks; Part 2: Harmonized
EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering
essential requirements of article 3.2 of the R&TTE Directive.

EN 62311:2008

Assessment of electronic and electrical equipment related to

human exposure restrictions for electromagnetic elds (0 Hz -

300 GHz).

IEC/EN 60950­1:2006+A11:2009+
A1:2010+A12:2011

Safety of information technology equipment.

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REQUIREMENTS OF QUALITY

IEC 60068 Environmental testing.

ECE-R 10 IP codes.

REQUIREMENTS OF QUALITY

SJ/T 11363-2006

“Requirements for Concentration Limits for Certain Hazardous
Substances in Electronic Information Products.” (2006-06)

SJ/T 11364-2006

“Marking for Control of Pollution Caused by Electronic Information
Products.” (2006-06)

According to the “Chinese Administration on the Control of Pollution
caused by Electronic Information Products” (ACPEIP) the EPUP, i.e.,
Environmental Protection Use Period, of this product is 20 years as
per the symbol shown here, unless otherwise marked. The EPUP is
valid only as long as the product is operated within the operating limits
described in the Gemalto M2M Hardware Interface Description?

Please see next table for an overview of toxic or hazardous substances
or elements that might be contained in product parts in concentrations

above the limits dened by SJ/T 11363-2006.

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2. SAR Requirements Specic to Portable Mobiles

Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must
be in accordance with the guidelines for human exposure to radio frequency energy. This requires the

Specic Absorption Rate (SAR) of portable EHS6 based applications to be evaluated and approved for

compliance with national and/or international regulations.

Since the SAR value varies signicantly with the individual product design, manufacturers are advised

to submit their product for approval if designed for portable use. For European markets the relevant

directives are mentioned below. It is the responsibility of the manufacturer of the nal product to verify

whether or not further standards, recommendations or directives are in force outside these areas.

Products intended for sale in US markets

EN 59005/ANSI C95.1: Considerations for evaluation of human exposure to Electromagnetic Fields
(EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz – 6GHz

Products intended for sale in European markets

EN 50360: Product standard to demonstrate the compliance of mobile phones with the basic restrictions

related to human exposure to electromagnetic elds (300MHz - 3GHz)

Please note that SAR requirements are specic only for portable devices and not for mobile devices as
dened below:

• Portable device: A portable device is dened as a transmitting device designed to be used so
that the radiating structure(s) of the device is/are within 20 centimeters of the user´s body.

• Mobile device: A mobile device is dened as a transmitting device designed to be used in other

than xed locations and to generally be used in such a way that a separation distance of at

least 20 centimeters is normally maintained between the transmitter’s radiating structure(s)

and the user’s body or that of nearby persons. In this context, the term “xed location” means

that the device is physically secured at one location and cannot be easily moved to another
location.

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3. SELV Requirements

The power supply connected to the MTX-GTW II shall be in compliance with the SELV requirements

dened in EN 60950-1.

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ROHS STATEMENT

The MTX-GTW II modem is compliant with the 2002/95/EC Directive of the European Parliament and of
the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS).

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DISPOSAL OF OLD ELECTRICAL AND
ELECTRONIC EQUIPMENT ESCRIPTION

This symbol, applied on our products and/or on its packaging, indicates that this product
should not be treated as household waste when you wish to dispose of it. Instead, it
should be handed over to an applicable collection point for the recycling of electrical and
electronic equipment. By ensuring this product is disposed of correctly, you will help
prevent potential negative consequences to the environment and human health, which
could otherwise be caused by inappropriate disposal of this product. The recycling of

materials will help to conserve natural resources. For more detailed information about the recycling of

this product, please contact your local city ofce, household waste disposal service or the retail store

where you purchased this product.

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SALES CONTACT

MATRIX MADRID

Matrix Electrónica S.L.
C/ Alejandro Sánchez 109
28019 Madrid, Spain

Phone 1: 902.19.81.46
Phone 2: +34-91.560.27.37
Fax 1: 902.99.54.14
Fax 2: +34-91.565.28.65

MATRIX BARCELONA

Matrix Electrónica S.L.
@SantCugat Business Park
Av. Via Augusta 15-25, B2- 8, ocinas 9-10
08174 Sant Cugat del Vallés, Barcelona, Spain

Phone: [phone]
Fax: [phone]

MATRIX DURANGO

Matrix Electrónica S.L.
Pol. Aliendalde 11, ocina 2G
48200 Durango, Vizcaya, Spain

Phone: [phone]
Fax: [phone]

MATRIX VALENCIA

Matrix Electrónica S.L.
Valencia, Spain

Phone: [phone]
Fax: [phone]

MATRIX SEVILLA

Matrix Electrónica S.L.
Sevilla, Spain

Phone: [phone]
Fax: [phone]

MATRIX LISBOA

LusoMatrix Lda.
Av. Coronel Eduardo Galhardo 7-1ºC
1170-105 Lisboa, Portugal

Phone: [phone]
Fax: [phone]

MATRIX CHICAGO

Matrix USA LLD
1112 W. Boughton Rd, Suite 346
Bolingbrook, IL 60440
USA

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