MtM Plus Technology M904S User Manual

Product Specification

Product Name: M904S

Version: 1.04

Doc No:

Date: Nov 25th, 2016

Bluetooth SiP Module

-BT 4.0 LE

MtM Technology Corporation

8F, 178 MinQuan East Road Section 3,

Taipei, Taiwan (R.O.C.) www.mtmtech.com.tw

MtM Technology Corporation

Date

Revise Contents

Revise by

Version

Jan. 23, 2014

Initial Version

Brian Juang

XA

Apr. 28, 2015

1.01

Dec. 29, 2015

1.02

Jun. 14, 2016

Add the antenna Design guide, and Modify Power consumption

PJ Chang

1.03

Nov. 25, 2016

1. Revise the reference scheme

2. Add FCC Related information

PJ Chang

1.04

Document History

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INDEX

1 Description ...................................................................................................................... 4

2 Feature ............................................................................................................................ 5

3 Block Diagram ................................................................................................................ 6

4 Technical Specification .................................................................................................. 7

4.1Recommendable Operation Condition ......................................................................... 7

4.1Temperature, humidity ................................................................................................. 7

4.2Voltage ......................................................................................................................... 7

4.3 Wireless Specifications ............................................................................................... 7

4.4 Radio Specifications Bluetooth 4.0 Low Energy........................................................ 8

4.5 External Antenna Design Guide ....................................................................... ..........9

4.5.1 PCB Antenna Design Guide .......................................................................... ..........9

4.5.2 Chip Antenna Design Guide .................................................................................. 11

4.6 Power Consumption .................................................................................................. 14

5 Dimensions ................................................................................................................... 17

6 Pin Assignments .......................................................................................................... 19

7 Recommend Footprint ............................................................................................... 20

8 Reference Design Circuit ........................................................................................... 21

9 Recommended Reflow Profile ................................................................................... 22

10 SiP Module Preparation .......................................................................................... 23

10.1 Handling ................................................................................................................ 23

10.2 SMT Preparation ................................................................................................... 23

11 Package Information ............................................................................................... 24

11.1 Product Marking ..................................................................................................... 24

11.2 Package Information ............................................................................................... 25

12 BQB / CE/ FCC Certification .................................................................................. 26

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1 Description

The SiP module M904S is a small size module with conformal shielding. The module provides full function of Bluetooth 4.0 Low Energy in a tiny module via 48 pins LGA Foot Print. The M904S module provides everything required to create Bluetooth 4.0 Low Energy product with RF, baseband, MCU, qualified Bluetooth v4.0 stack and customer application running on a single IC.

M904S enables ultra-low power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. The low power consumption and excellent radio performance make it the best solution for OEM /ODM customers who require embedded Bluetooth 4.0 Low Energy feature, such as, IP camera, car key, sport and fitness watch, mouse, led light bulb etc.

For the software and driver development, we provide extensive technical document and reference software code for the system integration.

Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers.

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Part Number

Description

M904S

CLASS 2 Bluetooth single mode Module according BT-4.0. Bluetooth SMART

2 Feature

 Bluetooth® v4.0 LE radio technology  -90 dBm sensitivity in Bluetooth® low energy mode  250 kbps, 1 Mbps, 2 Mbps supported data rates  TX Power -20 to +4 dBm in 4 dB steps  TX Power -30 dBm Whisper mode  12 mA peak RX, 10 mA peak TX (0 dBm)  256 kB embedded flash program memory  Supply voltage range 1.8 V to 3.6 V  SPI Master/Slave  Low power comparator  Temperature sensor  Two-wire Master (I2C compatible)  UART (CTS/RTS)  AES HW encryption  Real Timer Counter (RTC)  Demo SW Open source on nRF51SDK v8/SoftDevice version 1  Supports the nRF51SDK v11/SoftDevice v2  LGA-48 package, 6.5 x 6.5 mm

ORDRING INFORMATION

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3 Block Diagram

M904S supports UART command line interface to connect to the host processor. The simplified block diagram is depicted in the Fig. as below..

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No

Description

Value

Unit

Ratings Over Operating Free-Air Temperature Range

1 Supply voltage

All supply pins

–0.3 to 3.9

V

must have the

same voltage

2 Voltage on any digital pin

TBD

V

3 Operating ambient temperature

–25 to 75

°C

range

4 Storage temperature range

–35 to 75

°C

5 Bluetooth RF output

4 ± 1

dBm

Operating Condition

Min.

Typ.

Max.

DVDD_3V3

1.8

3.3 3.6

I/O supply voltage (VDD_PADS)

1.2

3.3 3.6

Features

Description

Bluetooth Standards

Bluetooth core v4.0 Low Energy

Antenna Port

Support Single Antenna for Bluetooth

Frequency Band

2.402 – 2.480 GHz

4 Technical Specification

4.1 Recommendable Operation Condition

Temperature, humidity

The M904S module has to withstand the operational requirements as listed in the table below

4..2Voltage

Power supply for the M904S module will be provided by the host via the power pins

4.3 Wireless Specifications

The M904S module compliance with the following features and standards

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Features

Description

Frequency Band

2.402– 2.480 GHz (2.4 GHz ISM Band)

Number of selectable Sub channels

40 channels

Modulation

GFSK

Supported rates

<2Mbps

Maximum receive level

-10dBm (with PER <30. 8%)

Parameter

Mode and Conditions

Min.

Typ.

Max.

Unit.

RX sensitivity

-

-90

-

dBm

Maximum input

- -10

dBm

Frequency range

2400

-

2483

MHz

Output power adjustment ranger

-20 - 4

dBm

Output power

- 2 -

dBm

Output power variation

- 4 -

dB

4.4 Radio Specifications Bluetooth 4.0 Low Energy

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4.5 External Antenna Design Guide

4.5.1 PCB Antenna Design Guide: Peak Gain: -2dBi Typ. / Avg. Gain: -3.5dBi Typ. (XZ-V)

Return Loss

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Radiation Patterns

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4.5.2 Chip Antenna Design Guide

Dimensions and Recommended PC Board Pattern

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Return Loss\With Matching Circuits

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4.5.2 Dipole Antenna Design Guide:

Return Loss

Radiation Patterns

xy-plane xz-plane

yz-plane

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4.5.4 PIFA Antenna Design Guide:

Return Loss

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Radiation Patterns

Vertical, Horizontal and Total Gain Patterns at 2400MHz

Vertical, Horizontal and Total Gain Patterns at 2440MHz

Vertical, Horizontal and Total Gain Patterns at 2480MHz

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Item

Condition

Typ.

Tx mode

3.3V

9.76mA

Rx mode

3.3V

12.15mA

System ON

Constant Latency

Sleep Mode

0.41uA

4.6 Power Consumption

Power Management

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Radio Current Consumption

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Transmitter Specifications

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Top-View:

Side-View:

Bottom-View:

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5 Dimensions

The size and thickness of the M904 module 6.5mm (W) x 6.5mm (L) x 1.3mm (H):

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Dimensions

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6 Pin Assignments

6.1Pin Description The foot print dimension and pin definition is defined as below

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7 Recommend Footprint

Suggest on PCB: SMD (1:1)

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P0_27

P0_26

ANTU11

ANT

1

NC

2

2.4GHz Antenna

RF

50 Ohm trace

C2

1.0uF_0402

L6 N.L_0402

C9 0R_0402

L7 N.L_0402

VDD

AVDD

U1

M904S_BLE_Module

GND

1

GND

2

GND

3

GND

4

GND

5

GND

6

GND

7

GND

8

GND

9

RF

10

ANT

11

GND

12

DEC213SWDCLK14SWDIO_nRESET15P0_1616P0_1517P0_1418P0_1319P0_0920P0_0821P0_06_AIN7_AREF1

22

ANT_TEST

34

GND

33

P0_26_AIN0_XL2

32

P0_27_AIN1_XL1

31

GND

30

VDD

29

P0_00_AREF0

28

P0_02_AIN3

27

P0_01_AIN2

26

P0_03_AIN4

25

P0_04_AIN5

24

P0_05_AIN6

23

GND48GND47GND46GND45GND44GND43GND42GND41GND40GND39GND38GND

37

AVDD

36

GND

35

RF

P0_09

P0_08

P0_15

P0_14

P0_13

P0_16

C17 12PF_0402

Y1 NM_32.768kHz

C16 12PF_0402

C3

1.0uF_0402

RTC (External)

P0_00

P0_01

P0_02

P0_03

P0_05

P0_04

P0_06

SWDIO

SWDCLK

DEC2

P0_27

P0_26

DC Power

R5 0R_0402

R4 0R_0402

DEC2

VDD

AVDD

R2 0R_0402

R3 0R_0402

PWR

RTC

RF

JTAG

DEC

8 Reference Design Circuit

8.1 Reference Schematic

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Re ference De s c rip t ion

1 Th e RF traces b e n d s must be g radu a l w ith an a p po x imate maxim u m bend of 4 5 degrees 2 RF trace s must have v ia on g ro u n d plan e besid e the RF tr a c e on b o th sid e s 3 RF trace s must have c o ns tant impedance (mic ro str ip t ransmissio n lin e ) 4 RF trace g o u n d lay er must be the s o lid g ro u n d la y e r im m e d iate ly b elow RF tra c e . 5 Th e re m u s t b e n o tr ace an d g round under a n tenna s e c tio n

8.2 Layout Guide The following points are observed for antenna.

RF Section Layout

CPW impedance Calculation

9 Recommended Reflow Profile

Profile Condition

a. Suitable for Lead-Free solder b. Between 155~160°C: 60~90 sec. c. Above 220°C: 60~90 sec. d. Peak Temperature: 240~245 (<10 sec.)

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10 SiP Module Preparations

10.1 Handling

Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti-static tray and packing. This protective package must be remained in suitable environment until the module is assembled and soldered onto the main board.

10.2 SMT Preparation

1. Calculated shelf life in sealed bag: 6 months at <40℃ and <90% relative humidity (RH).

2. Peak package body temperature: 250℃.

3. After bag was opened, devices that will be subjected to reflow solder or other high temperature

process must.

A. Mounted within: 72 hours of factory conditions <30℃/60% RH. B. Stored at ≦10% RH with N2 flow box.

4. Devices require baking, before mounting, if: A. Package bag does not keep in vacuumed while first time open.

B. Humidity Indicator Card is >10% when read at 23±5℃. C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours.

5. If baking is required, devices may be baked for 12 hours at 125±5℃.

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11 Package Information

11.1 Product Marking

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11.2 Package Information

----------------------------------------------------------------------------------------------------------------------------------------

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12 BQB/CE/FCC Certification

12.1 FCC (USA)

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

 Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.

IMPORTANT NOTE: FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

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IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product,

which integrates this module. Appropriate measurements (e.g. 15 B compliance) and if applicable additional equipment

authorizations (e.g. Verification , Doc) of the host device to be addressed by the integrator/manufacturer.

IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module.

20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied.

Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment.

USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following " Contains TX FCC ID: 2AJ9P-M904S". If the size of the end product is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

Professional installation Section 15.204(b) states that an approved "transmission system" must always be marketed as a

complete system including the antenna.

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