TSW1, R1 & R2 are located on the bottom side of the board close to PCIE connector.
Install R1, R2 & Don't Install TSW1
Install TSW1 & Don't Install R1 & R2
TSW1 Switch #1, 2, 3, 4, 5 and 6 closed (ON)
JTAG
#8 and 7 open
TSW1 Switch #1, 2, 3, 4, 5 and 6 open
NO JTAG
#8 & 7 closed (ON)
SYMBOL LEGEND
DO NOT
DNI
INSTALL
ACTIVE
#
LOW
DIGITAL
GROUND
AA
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
8
7
6
5
4
3
RH RV670 - PCI-E Edge Connector
2
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
121
of
ANALOG
GROUND
BUOBRING UP
ONLY
Doc No.
105-B340xx-00
1
RevDate:
2
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
5
DD
4
3
2
1
NOTE: some of the PCIE testpoints will
be available trought via on traces.
PETp0_GFXRp0(1)
PETn0_GFXRn0(1)
PETp1_GFXRp1(1)
PETn1_GFXRn1(1)
PETp2_GFXRp2(1)
PETn2_GFXRn2(1)
PETp3_GFXRp3(1)
PETn3_GFXRn3(1)
PETp4_GFXRp4(1)
PETn4_GFXRn4(1)
PETp5_GFXRp5(1)
PETn5_GFXRn5(1)
PETp6_GFXRp6(1)
CC
BB
PCIE_REFCLKP(1)
PCIE_REFCLKN(1)
PETn6_GFXRn6(1)
PETp7_GFXRp7(1)
PETn7_GFXRn7(1)
PETp8_GFXRp8(1)
PETp9_GFXRp9(1)
PETn9_GFXRn9(1)
PETp10_GFXRp10(1)
PETn10_GFXRn10(1)
PETp11_GFXRp11(1)
PETn11_GFXRn11(1)
PETp12_GFXRp12(1)
PETn12_GFXRn12(1)
PETp13_GFXRp13(1)
PETn13_GFXRn13(1)
PETp14_GFXRp14(1)
PETn14_GFXRn14(1)
PETp15_GFXRp15(1)
PETn15_GFXRn15(1)
DNI DNI
R13
R14
51R
51R
402 402
620NOPN008
TP11
620NOPN008
TP12
620NOPN008
TP13
620NOPN008
TP14
620NOPN008
TP19
620NOPN008
TP20
620NOPN008
TP21
620NOPN008
TP22
620NOPN008
TP27
620NOPN008
TP28
620NOPN008
TP7
620NOPN008
TP8
620NOPN008
TP9
620NOPN008
TP10
620NOPN008
TP15
620NOPN008
TP16
620NOPN008
TP17
620NOPN008
TP18
620NOPN008
TP23
620NOPN008
TP24
620NOPN008
TP25
620NOPN008
TP26
PERST#_buf(1)
AW48
AW46
AV51
AV49
AU48
AU46
AT51
AT49
AR48
AR46
AP51
AP49
AN48
AN46
AM51
AM49
AL48
AL46
AK51
AK49
AH51
AH49
AG48
AG46
AF51
AF49
AE48
AE46
AD51
AD49
AW43
AW42
AP36
AJ48
AJ46
U1A
PCIE_RX0P
PCIE_RX0N
PCIE_RX1P
PCIE_RX1N
PCIE_RX2P
PCIE_RX2N
PCIE_RX3P
PCIE_RX3N
PCIE_RX4P
PCIE_RX4N
PCIE_RX5P
PCIE_RX5N
PCIE_RX6P
PCIE_RX6N
PCIE_RX7P
PCIE_RX7N
PCIE_RX8P
PCIE_RX8N
PCIE_RX9P
PCIE_RX9N
PCIE_RX10P
PCIE_RX10N
PCIE_RX11P
PCIE_RX11N
PCIE_RX12P
PCIE_RX12N
PCIE_RX13P
PCIE_RX13N
PCIE_RX14P
PCIE_RX14N
PCIE_RX15P
PCIE_RX15N
Clock
PCIE_REFCLKP
PCIE_REFCLKN
PERSTB
PART 1 OF 10
P
C
I
E
X
P
R
E
S
S
I
N
T
E
R
F
A
C
E
PCIE_TX0P
PCIE_TX0N
PCIE_TX1P
PCIE_TX1N
PCIE_TX2P
PCIE_TX2N
PCIE_TX3P
PCIE_TX3N
PCIE_TX4P
PCIE_TX4N
PCIE_TX5P
PCIE_TX5N
PCIE_TX6P
PCIE_TX6N
PCIE_TX7P
PCIE_TX7N
PCIE_TX8P
PCIE_TX8N
PCIE_TX9P
PCIE_TX9N
PCIE_TX10P
PCIE_TX10N
PCIE_TX11P
PCIE_TX11N
PCIE_TX12P
PCIE_TX12N
PCIE_TX13P
PCIE_TX13N
PCIE_TX14P
PCIE_TX14N
PCIE_TX15P
PCIE_TX15N
Calibration
PCIE_CALRN
PCIE_CALRP
AU40
AU39
AU43
AU42
AT40
AT39
AT43
AT42
AP40
AP39
AP43
AP42
AN40
AN39
AN43
AN42
AL40
AL39
AL43
AL42
AK40
AK39
AK43
AK42
AH40
AH39
AH43
AH42
AG40
AG39
AG43
AG42
AN37
AP37
GFXTp0_PERp0 (1)
GFXTn0_PERn0 (1)
GFXTp1_PERp1 (1)
GFXTn1_PERn1 (1)
GFXTp2_PERp2 (1)
GFXTn2_PERn2 (1)
GFXTp3_PERp3 (1)
GFXTn3_PERn3 (1)
GFXTp4_PERp4 (1)
GFXTn4_PERn4 (1)
GFXTp5_PERp5 (1)
GFXTn5_PERn5 (1)
GFXTp6_PERp6 (1)
GFXTn6_PERn6 (1)
GFXTp7_PERp7 (1)
GFXTn7_PERn7 (1)
GFXTp8_PERp8 (1)
GFXTn8_PERn8 (1)PETn8_GFXRn8(1)
GFXTp9_PERp9 (1)
GFXTn9_PERn9 (1)
GFXTp10_PERp10 (1)
GFXTn10_PERn10 (1)
GFXTp11_PERp11 (1)
GFXTn11_PERn11 (1)
GFXTp12_PERp12 (1)
GFXTn12_PERn12 (1)
GFXTp13_PERp13 (1)
GFXTn13_PERn13 (1)
GFXTp14_PERp14 (1)
GFXTn14_PERn14 (1)
GFXTp15_PERp15 (1)
GFXTn15_PERn15 (1)
+PCIE_VDDC
402
R82.0K
402
R91.27K
For Tektronix LA only
Place close
to ASIC
AA
5
4
RV670 PRO
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
3
2
RH RV670 - ASIC PCIE_Interface
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
221
of
1
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
5
Recommended caps:
(see BOM for qualified values/vendors)
10uF , X6S, 0805, 6.3V, 1.4MM MAX THICK
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
3
2
RH RV670 - ASIC MAIN
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
321
of
1
Doc No.
RevDate:
2
105-B340xx-00
C151
1uF_6.3V
C133
1uF_6.3V
C141
1uF_6.3V
C981
1uF_6.3V
C961
1uF_6.3V
C972
100nF_6.3V
MC955
4.7uF_6.3V
C955
10uF_X6S
BLM15BD121SN1
B94
BLM15BD121SN1
B69
BLM15BD121SN1
NS70NS_VIA
12
GND_PVSS
B60
BLM15BD121SN1
5
C152
1uF_6.3V
C135
1uF_6.3V
C142
1uF_6.3V
C982
1uF_6.3V
C962
1uF_6.3V
C973
100nF_6.3V
C956
10uF_X6S
C121
1uF_6.3V
Use 0R
MB67
220R_2A
B67
220R_2A
NS64NS_VIA
12
GND_MPVSS
5
C153
1uF_6.3V
C143
1uF_6.3V
C963
1uF_6.3V
MC956
4.7uF_6.3V
C958
10uF_X6S
NS122 NS_VIA
12
GND_VSSRHC
+DPLL_PVDD
DNI
GND_MPVSS
GND_MPVSS
C136
1uF_6.3V
C983
1uF_6.3V
C964
1uF_6.3V
C974
100nF_6.3V
+3.3V
+DPLL_VDDC
GND_PVSS
C155
C156
C154
1uF_6.3V
1uF_6.3V
C138
C139
1uF_6.3V
1uF_6.3V
C145
C144
1uF_6.3V
MC958
4.7uF_6.3V
C959
10uF_X6S
+MPVDD
C146
1uF_6.3V
1uF_6.3V
C984
C985
1uF_6.3V
1uF_6.3V
C965
C966
1uF_6.3V
1uF_6.3V
C130
100nF_6.3V
MC959
4.7uF_6.3VC940
C126
10uF_X6S
NS123NS_VIA
12
GND_VSSRHD
C91
100nF_6.3V
+VDDR_DVP
C94
10uF_X6S
C60
C68
10uF_X6S
1uF_6.3V
C62
10uF_X6S
C67
10uF_X6S
1uF_6.3V
C975
1uF_6.3V
C147
1uF_6.3V
C986
1uF_6.3V
C967
1uF_6.3V
C134
C131
100nF_6.3V
100nF_6.3V
MC126
4.7uF_6.3V
C127
10uF_X6S
C120
1uF_6.3V
NS120NS_VIA
12
GND_VSSRHA
C122
1uF_6.3V
C123
1uF_6.3V
C92
100nF_6.3V
C69
100nF_6.3V
C64
C61
10nF
100nF_6.3V
C66
1uF_6.3V
C157
1uF_6.3V
C976
1uF_6.3V
C148
1uF_6.3V
C987
1uF_6.3V
C968
1uF_6.3V
MC127
4.7uF_6.3V
Overlapped Footprints
C128
10uF_X6S
C93
100nF_6.3V
C95
1uF_6.3V
+DPLL_PVDD
GND_PVSS
C63
1uF_6.3V
C65
100nF_6.3V
+MVDD
C150
1uF_6.3V
C132
1uF_6.3V
DD
CC
BB
AA
C140
1uF_6.3V
C980
1uF_6.3V
C960
1uF_6.3V
C971
100nF_6.3V
MC954
4.7uF_6.3V
10uF_X6S
+MVDD
B120
B121
BLM15BD121SN1
NS121 NS_VIA
12
GND_VSSRHB
B122
BLM15BD121SN1
B123
BLM15BD121SN1
+1.8V
+1.1V
+VDDCI_LDO
+VDDC
Recommended caps:
(see BOM for qualified values/vendors)
10uF , X6S, 0805, 6.3V, 1.4MM MAX THICK
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
RH RV670 - ASIC Power
+PCIE_VDDC
+PCIE_VDDR
C160
1uF_6.3V
MC187
4.7uF_6.3V
C1128
1uF_6.3V
C1132
1uF_6.3V
B920220R_2A
26R_600mA
C184
1uF_6.3V
MC181
4.7uF_6.3V
+VDDC
C1129
1uF_6.3V
C1134
1uF_6.3V
C943
100nF_6.3V
+VDDCI_LDO
MR910
0R
MR911
0R
B911220R_2A
B910220R_2A
1
+1.8V
B900
+VDDC
+VDDC
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
421
of
1
+1.1V
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
5
4
3
2
RH RV670 - ASIC Memory Interface (Channel A & B)
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
521
of
1
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
5
4
3
2
RH RV670 - ASIC Memory Interface (Channel C & D)
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
621
of
1
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
Place it at top edge of the
board on the bottom side.
+3.3V
TC47
100nF_6.3V
In production, this block
will not be populated.
Mating connector: 6010028300G
(HEADER 2X8 1.27MM PITCH, SMD)
When attaching the daughter card (B176) align it by mounting hole.
RP60A33R
81
RP60B33R
72
RP60C33R
63
RP60D33R
54
HPD2 (15)
EXT_12V_DET (13)
GPIO_19_CTF (13)
R5
1K
TR57 0R
DNI
R8001 0R
DNI
R8002 0R
GENERICB: Generic I2C_SDA
DVALID: Generic I2C_SCL
GPIO_8_R
GPIO_9_R
GPIO_10_R
ROMCSb_R
DNI
JTAG_MODE
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_TDO
DVALID
GENERICB
BUO
TJ47
1
3
5
7
9
11
13
15
2X8SOCKET
GENERICA (17)
3
Place SW1 & SW2 on the bottom side
(easily accessible).
Clearly Mark A & B contacts on the
silkscreen.
R64
0R
MR64
0R
GPIOs for VDDC Setting
GPIO_15_PWRCNTL_0 (13)
GPIO_18 (13)
GPIO_20_PWRCNTL_1 (13)
GPIO_21 (13)
TP47
TP46
35mil
35mil
For wire soldering
EXT_ADJ_1.8V
2
GPIO_8_T
4
ROMCSb_T
6
GPIO_9_T
8
GPIO_10_T
10
SDA
12
SCL
14
16
3
ThermINT (18)
HOT_PLUG_DET (13)
+3.3V
Place TRP61 & TR57 in a way
to minimize the stub when
they are not populated.
TRP61C33R
63
TRP61D33R
54
TRP61B33R
72
TRP61A33R
81
TR50
10K
35mil
GPIO_8_R
ROMCSb_R
GPIO_9_R
GPIO_10_R
TP50
100nF_6.3V
TC46
DNI
DNI
TBD
DNI
MR50 10K
MR51 10K
MR52 10K
MR53 10K
MR54 10K
NR55 1K
MR55 10K
MR56 10K
MR58 10K
MR59 10K
MR63 10K
MR62 10K
MR61 10K
MR65 10K
MR66 10K
MR67 10K
MR68 10K
MR70 10K
MR71 10K
MR72 10K
MR73 10K
MR74 10K
MR75 10K
MR76 10K
MR77 10K
MR78 10K
MR79 10K
MR60 10K
+3.3V+5V
TR48
TR47
4.7K
4.7K
BUOBUO
2
+3.3V
DNI
DNI
BUO
TBD
TBD
DNI
BUO
NTSC
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
R5010K
R5110K
R5210K
R5310K
R541K
R5510K
VR55 1K
R5610K
NR56 1K
R5710K
R5810K
R5910K
R6310K
R6210K
R6110K
R6510K
R6610K
R6710K
R6810K
R7010K
R7110K
R7210K
R7310K
R7410K
R7510K
R7610K
R7710K
R7810K
R7910K
R6010K
PIN BASED STRAPS
GPIO_0
GPIO_1
GPIO_2
GPIO_2
GPIO_3
GPIO_3
SW2B
BUO
DIP_SWX2
GPIO_5
SW2A
BUO
DIP_SWX2
GPIO_6
BUO
SW1B
GPIO_7GPIO_7
GPIO_8_R
DIP_SWX2
GPIO_9_R
CONFIG[3]
GPIO_13
GPIO_13
CONFIG[2]
GPIO_12
GPIO_12
CONFIG[1]
GPIO_11GPIO_11
GPIO_11GPIO_11
CONFIG[0]
GENERICC
VSYNC1 (1,3,15)
VSYNC1
VSYNC1
HSYNC1 (1,3,15)
HSYNC1
PSYNC
PSYNC
VID_0
VID_0
VID_1
VID_1
VID_2
VID_2
VID_3
VID_3
VID_4
VID_4
VID_5
VID_5
VID_6
VID_6
VID_7
VID_7
VSYNC2 (3,16)
VSYNC2
VSYNC2
HSYNC2 (3,16)
HSYNC2
HSYNC2
DVALID
DVALID
41
41
32
SW1A
DIP_SWX2
BUO
32
GPIO_4
Pull-Down Resistors are for BU until built-in pull-downs are verified.
Note: GPIO_21 is also pin strap and must not have pull-up (Default 0). See data book for details
GPIO_22_ROMCSb is pulled high by R46
SDA (3)
SCL (3)
R46
10K
ROMCSb_R
GPIO_8_R
PN 2280007900G for 1Mbit (PM25LV010A-100SCE)
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
2
RH RV670 - ASIC DVO, VIP & GPIOs
GPIO(0) - TX_PWRS_ENB (Transmitter Power Savings Enable)
0: 50% Tx output swing for mobile mode
1: full Tx output swing (Default setting for Desktop)
0: Slave VIP host port devices present (use if Theater is populated)
1: No slave VIP host port devices reporting presence during reset (use for
configurations without video-in)
AMD Board Feature II - (Default 0)
VGA DISABLE : 1 for disable (set to 0 for normal operation)
AMD Internal Use Only - Reserved (Default: 0)
MSI_DIS (Default: 0)
AMD Internal Use Only - Reserved (Default: 0)
AMD Board Feature III - (Default 0)
AMD Internal Use Only - Reserved (Default: 0)
64BAR_EN_A (Default: 0)
AMD Internal Use Only - Reserved (Default: 0)
AMD Internal Use Only - Reserved (Default: 0)
AMD Internal Use Only - Reserved for memory strap
AMD Internal Use Only - Reserved
BIF_CLK_PM_EN (Default 0)
0 - Disable CLKREQ# power management capability
1 - Enable CLKREQ# power management capability
+3.3V
U2
1
2
3
45
PM25LV512A-100SCE
CE#
SO
HOLD#
WP#
GNDSI
8
VCC
7
6
SCK
Sheet
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Saturday, September 08, 2007
721
GPIO_10_R
GPIO_9_R
of
1
Default: 0
C47
100nF_6.3V
1
1 - NTSC TVO0 - PAL TVO TV OUT STANDARD
BIOS1
BIOS
113-B339XX-XXX
VIDEO BIOS
FIRMWARE
Doc No.
AMD PCIE FEATURE I
AMD PCIE FEATURE II
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
5
4
3
2
RH RV670 - ASIC Grounds
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
821
of
1
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Sheet
RASB1b(5)
+MVDD
B301
220R_200mA
B302
220R_200mA
+MVDD
C380
10nF
C384
10nF
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
DRAM_RST(5,10)
R359
1.15K
R360
2K74
+MVDD
+MVDD
R361
1.15K
R362
2K74
+MVDD
+MVDD
C352
C351
100nF_6.3V
100nF_6.3V
C363
C362
1uF_6.3V
1uF_6.3V
+MVDD
C373
100nF_6.3V
C375
1uF_6.3V
RH RV670 - MEM GDDR3 CH A&B 128-bit 256MB
1
A1
VDDQ
A12
VDDQ#A12
C1
VDDQ#C1
C4
VDDQ#C4
C9
VDDQ#C9
C12
VDDQ#C12
E1
VDDQ#E1
E4
VDDQ#E4
E9
VDDQ#E9
E12
VDDQ#E12
J4
VDDQ#J4
J9
VDDQ#J9
N1
VDDQ#N1
N4
VDDQ#N4
N9
VDDQ#N9
N12
VDDQ#N12
R1
VDDQ#R1
R4
VDDQ#R4
R9
VDDQ#R9
R12
VDDQ#R12
V1
VDDQ#V1
V12
VDDQ#V12
A2
VDD
A11
VDD#A11
F1
VDD#F1
F12
VDD#F12
M1
VDD#M1
M12
VDD#M12
V2
VDD#V2
V11
VDD#V11
B1
VSSQ
B4
VSSQ#B4
B9
VSSQ#B9
B12
VSSQ#B12
D1
VSSQ#D1
D4
VSSQ#D4
D9
VSSQ#D9
D12
VSSQ#D12
G2
VSSQ#G2
G11
VSSQ#G11
L2
VSSQ#L2
L11
VSSQ#L11
P1
VSSQ#P1
P4
VSSQ#P4
P9
VSSQ#P9
P12
VSSQ#P12
T1
VSSQ#T1
T4
VSSQ#T4
T9
VSSQ#T9
T12
VSSQ#T12
A3
VSS
A10
VSS#A10
G1
VSS#G1
G12
VSS#G12
L1
VSS#L1
L12
VSS#L12
V3
VSS#V3
V10
VSS#V10
K1
VDDA
K12
VDDA#K12
J12
VSSA#J12
J1
VSSA
J3
RFU2
J2
RFU1
V4
RFU0
A9
MF
GND | VDD
C358
C357
C356
100nF_6.3V
100nF_6.3V
100nF_6.3V
C369
C368
C367
1uF_6.3V
1uF_6.3V
1uF_6.3V
C377
4.7uF_6.3V
Friday, September 07, 2007
921
of
1
+MVDD
Doc No.
C382
100nF
C359
100nF_6.3V
C370
1uF_6.3V
+MVDD
+MVDD
C383
10nF
C360
100nF_6.3V
C371
1uF_6.3V
C378
4.7uF_6.3V
105-B340xx-00
+MVDD
RevDate:
+MVDD
B351
220R_200mA
B352
220R_200mA
C361
100nF_6.3V
C372
1uF_6.3V
C379
4.7uF_6.3V
2
PDF created with pdfFactory Pro trial version www.pdffactory.com
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
8
Input Bulk CAPs
DD
CC
BB
UGATE1UGATE1
PHASE1
Q603
BSC042N03S
LGATE1
AA
Thermal
9
Pad
+12V_BUS
678
45
567
9
432
R696
300R
805
+VDDC_Source
C623
470uF_25V
TH 10x12.5mm
+VDDC_Source
C630
470uF_25V
TH 10x12.5mm
R609
R608
0R
0R
C633
C632
4.7uF_16V
4.7uF_16V
805805
Mirrored on PCB
C634
C635
4.7uF_16V
4.7uF_16V
805805805805
Q601
BSC119N03SG
123
8
Q604
BSC042N03S
1
LGATE1
+VDDC+VDDC
C645
Y5V
10uf
6.3V
12066.3V
8
L621
IND_0.47uH_7A
DUAL FOOTPRINT
C621
10UF_16V
Mirrored on PCB
C640
10UF_16V
Mirrored on PCB
678
9
Pad
Thermal
45
567
9
432
C647
C646
Y5V
10uf
10uf
12066.3V
12066.3V
+VDDC_ExtSource
+VDDC_ExtSource
L620
0.47uH
C622
10UF_16V
12061206
C663
10UF_16V
12061206
Q602
BSC119N03SG
123
8
1
C648
Y5V
10uf
1206
C626
470uF_25V
TH 10x12.5mm
C637
470uF_25V
TH 10x12.5mm
R607
FB_S
Y5V
7
C690
100uF
SM
6x5.5mm
C600
150nF_16V
603
L601
12
PCMB105T-R47MS
ML601220nH_31A
NL601
12
HC1018
L602
12
PCMB105T-R47MS
ML602220nH_31A
NL602
12
HC1018
R604
221R
1/10W
0603
C604 1UF_16V
R602
CSP1
7
MC690
100uF_16V
TH
6x7mm
overlap
+VDDC_Source
X7R
CSN1
Overlap
Overlap
R605
221R
C658
100nF
+VDDC
+VDDC_ExtSource
R615
221R
C661
15nF
MC695
100uF_16V
TH
6x7mm
overlap
Overlap
Overlap
C614 1UF_16V
R612
CSN2
C662
390pF
X7R
6
C695
100uF_16V
SM
6x5.5mm
12
PCMB105T-R47MS
ML611
220nH_31A
12
PCMB105T-R47MS
12
220nH_31A
12
R614
221R
1/10W
0603
CSP2
C649
100nF
402402603402402603
6
Choosing Different Gate Drive
5V Gate DriveR630, R670, C660,
8V Gate DriveR631, R632,
12V Gate Drive R630, C660,
12V Bus power for 12V
Gate Drive
R618
R610
0R
0R
C639
C625
150nF_16V
10UF_16V
603
Mirrored on PCB
C665
10UF_16V
1206
Mirrored on PCB
L611
NL611
HC1018
L612
ML612
NL612
HC1018
R617
FB_S
+VDDC+VDDC
C656
C650
390pF
15nF
5
PopulateDo Not PopulateGate Drive
R631, R632
R661, Q661
R630, C660,
R670
R661, Q661
R631, R632,
R670
R661, Q661
Pass Transistor Circuit for 8V Gate Drive
This circuit is only for 8V
+12V_BUS+12V_BUS
402
C624
10UF_16V
12061206
C664
10UF_16V
1206
678
123
45
567
8
432
1
gate drive application
R670
10R
+12V_EXT
L622
IND_0.47uH_7A
DUAL FOOTPRINT
C627
4.7uF_16V
Mirrored on PCB
C629
4.7uF_16V
Mirrored on PCBMirrored on PCB
9
Q612
Thermal
BSC119N03SG
Pad
Q611
BSC119N03SG
UGATE2UGATE2
9
Q613
BSC042N03S
5
Assume VCC consumes 200mA total including
5VCC providing buffered output sourcing a
minimum 20mA requirement
P(Q_8VCC)max = (12V-8V)*0.2A = 800mW
32
R661
10K
1
SI2304DS
Q661
VCC
L623
0.47uH
C628
4.7uF_16V
805805
C631
4.7uF_16V
678
9
Thermal
Pad
123
45
PHASE2
567
8
9
Q614
BSC042N03S
432
1
LGATE2LGATE2
VCCDRV
4
C670
10UF
1206
X5R
16V
+VDDC
***
NC641
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
+VDDC
***
NC642
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
+VDDC
***
NC643
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
+VDDC
***
NC644
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
4
TP601
PWRGD1
620NOPN008
D611
2
3
OPTIONAL
Rdroop
C694
1UF_16V
X7R
603
OPTIONAL
1
BAT54A
LGATE2
R664
100K
Droop Option
LGATE1
BAT54A
3
D601
+VDDC
***
MC641
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
Mirrored on PCB
+VDDC
***
MC642
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
Mirrored on PCB
+VDDC
***
MC643
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
Mirrored on PCB
+VDDC
***
MC644
470uF
***
2.5V, 9mR
SP/POSCAP,
SMT 7343 2MM H
Mirrored on PCB
UGATE2
C612
1uF
PHASE2
19
0R
R613
20
21
VCC
22
23
0R
R603
PHASE1
24
25
26
27
C602
28
29
1uF
1
UGATE1
R601 0R
2
R632 0R
Populate - For 5V Gate Drive application
Remove - For 8V or 12V Gate Drive application
3
POK > 1 used to control
other on-board enables
R634 10K
R611
0R
U601
uPI6201Q
18
UGATE 2
PHASE2
LGATE2
VCCDRV/DROOP
VCC
LGATE1
PHASE1
PGND
PGND26
PGND27
PGND28
UGATE1
PGND29
1
***
C641
820uF_2.5V
***
8 x 8 mm, TH
3
5VCC
2
VDDC_REFIN
Overlap the footprints
for MR655 and C655
PGND Option
Compensation
Css if
MR655
0R
15
16
17
BOOT2
BOOT1
2
REFIN/ EN
REFOU T/POK
5VCC
AGND
3
4
C660
1uF_6.3V
402
6.3V40210V
Y5V
5VCC applied externally or generated internally from the IC, must
be in regulation before IC start soft-start sequence.
1. For 5V Gate Drive application:
External filtered +5V_EXT is applied to this pin.
2. For 8V or 12V Gate Drive application:
+5VCC is generated internally and this is an output with
20mA minimum current capability
VDDC_EN(13)
+VDDC+VDDC+VDDC+VDDC
***
***
C643
C642
820uF_2.5V
820uF_2.5V
***
***
8 x 8 mm, TH
8 x 8 mm, TH
Place seperately
C655
current
6.8nF_25V
comp.
402
not
25V
used
SS_ICOMP
13
14
FB
SS/ICO MP
COMP/DROOP
RT
IOUT/IMAX/DROOP
CSP2
CSN2
CSN1
BUSEN
CSP1
5
6
C671
100nF
X5R
- When +12V_EXT=ON, PH2_ENb=Low, Phase 2 Enabled
- When +12V_EXT=OFF, PH2_ENb=Hi , Phase 2 Disabled
R686 0R
R685 0R
R684 0R
share pad
VDDC PWM Whole CHip Enable
***
C644
820uF_2.5V
***
8 x 8 mm, TH
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
RH RV670 - VDDC SMPS 03
2
12
11
10
9
8
7
R654
150R
402
402
6.3V
C654
2.2nF_50V
C607
220pF_50V
R_RT
402
C603
1nF
PH2_ENb
5VCC (13,14)
R655
51.1K
C613
1nF
C638
100nF
40210V
X5R
X7R402
50V
Iout
X7R402
50V
R616
R606
VCCDRV
SS_ICOMP
VDDC_REFIN
R658 0R
+VDDC
12
NS600
NS_VIA
VDDC_FB_TRACE
R1
RFB1
R651
10K
402
Droop Option
R662
100K
Rdroop
CSP2
CSN2
CSN1
CSP1
PH2_ENb (13)
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1121
VDDC_FB
R663
100K
Rdroop
Iout (13)
of
FB_S
X7R
50V
COMP_FB
Type III compensation Current
R3
R653
2.67K
402
C3
C653
2.2nF
402
R656 0R
VDDC_FB (13)VDDC_REFIN (13)
Doc No.
1
X7R
10V
1
COMP_GND
R657
0R
R2
R652
3.65K
402
C2C1
C651
C652
220pF_50V
10nF
402
402
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
8
7
6
5
4
3
2
1
Pad
Thermal
Pad
+MVDDC_S
9
6
7
8
Place Rs and Cs across QL
RC snubber values shown
are for reference only,
tuning is required
MVDDC_FB
+MVDDC_S
9
6
7
8
C716
C715
10UF_16V
10UF_16V
12061206
Mirrored on PCB
ML701
12
PCMC104T-1R5MN
L7011.7UH
12
11.7mm Hi Max
33MOHM
Rs
1210
1%
C708
10nF_25V
402
Cs
X7R
25V
4mm Hi
MVDD_FB_TRACE
+PW_MVDDC_LGDR
C717
4.7uF_16V
805805
Mirrored on PCB
overlap
R1
RFB1
R711
4.99K
402
1%
Place R1 and
R4 close to
PWM and
routed with
separate
20mil trace to
the ASIC
MQ702
45
3
2
1
FDS7096N3
C713
3.9nF
402
10%
R713
3.65K
402
5%
Thermal
C730
470uF_25V
TH 10x12.5mm
+MVDD
C722
C721
390pF
15nF
***
C725
820uF_2.5VR719
***
8 x 8 mm, TH
***
C726
820uF_2.5V
***
8 x 8 mm, TH
NS700
NS_VIA
C718
150nF_16V
603
C720
100nF
402402603
MULTI FOOTPRINT
C719
4.7uF_16V
12
16V
X7R
Pad
9
6
7
8
Q701
QH
+PW_MVDDC_LGD
+PW_MVDDC_HGD
+PW_MVDDC_M
R722 0R
603
DD
C703
0.22uF
MVDD_EN (13)
R70820K
402
+MVDDC_B
U703
1
+PW_MVDDC_HGD
+PW_MVDDC_LGD
R715
42.2K
CC
BOOT
2
UGATE
3
GND
45
LGATE VCC
APW7065
place R715 close to IC pin4
PHASE
COMP
+PW_MVDDC_M
8
MVDDC_COMP
7
MVDDC_FB
6
FB
+MVDD_VCC
R7210R
402
+PW_MVDDC_LGDR
+PW_MVDDC_HGDR
Q702
QL
Thermal
Pad
45
3
2
1
BSC119N03SG
MVDDC_FB(13)
45
3
2
1
BSC119N03SG
9
6
7
8
Layout guideline
1-Position the contr oller (U703) such that LGate(pin4) is the closet to gate of
the MOSFETs. You can place the gate resistors R721 and R722 next to the gate of
the MOSFETs. Make the gate drive traces(PW MVDDC LGD and PW MVDDC HGD) as short
and as wide as possible to reduce the trace inductance.
2-Place the bypass capacitors for Vcc as well as Boost caps as close to the
controller as possible. They are as follows;
Vcc bypass cap is C703, and Boost cap is C705.
3-Voltage amplifier compensation network. Place C714 close to the pin 7. Place
the rest of the compensation network close to the pins 7 and 6. These are R710,
R711, R713, C713 and R712, C711 and C712.
+PW_MVDDC_HGDR
BB
MQ701
Thermal
45
3
2
1
FDS7096N3
+PW_MVDDC_M
COMPENSATION CIRCUITFILTERED SMPS VCCBOOT CIRCUIT
+12V_BUS
402
AA
C711
15nF
10V
402
10%
R712
2.94K
402
1%
MVDDC_COMP
C712
390pF
50V
603
5%
NPOX7R
R714 0R
R709
0R
share pad of R714,R709
8
C714
100nF
402
X5R
MVDDC_FB
C706
150nF_16V
D701
BAT54A
+MVDDC_B
2
+PW_MVDDC_M
5
4
3
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
RH RV670 - MVDD SMPS 02
2
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1221
of
Doc No.
1
RevDate:
2
105-B340xx-00
+MVDD_VCC
+12V_BUS
603
X7R
C707
5%
100nF
7
10V
10%
1
3
C705
100nF
603X7R
5%
6
16V
PDF created with pdfFactory Pro trial version www.pdffactory.com
Put copper area under Q1230/1231 for heat dissipation.
Table 3
0: OFF / 1: ON
12V_BUS
0
10x Buffered VDDC Output Current Monitoring
+12V_BUS
Place caps very
close to power pin
C692
C691
100nF
Iout(11)
Iout
Temp Comp
R693
R695
3.32K
9.09K
RpRsRT
R694
7K68
Requi
U611
LM321MF_NOPB
R640 0R
C657
1nF
X7R
402
50V
R691
1K
1%
12V Supply Voltage single Op-Amp (U611) :
1. National LM321, SOT23-5
2. TI alternate
1
3
603
X7R
+
-
25
100nF
603
X7R
4
header_1x2_2mm_smt
MVDD Power Play (Not for production)
(Vout = 1.8V ~ 2.1V )
0R
VID_1(7)
VDDC_FB
RFB2
R650
20K
402
3
R1248
0R
VID_2(7)
MR1249
0R
VID_3(7)
R1249
Install Only One
TBV
R1238
1
5.1K
TBD
R1239
1
5.1K
R1236
0R
DNI
Q1 Q2 Q3 Q4
NA NA NA NA
NA
Install only R1270 or MR1270
TP603
TP_32mil_SM_top
R692
C693
9.09K
10nF
1%
J601
2 1
RS0
R1244
165K
VID0_MVDD
1
VID1_MVDD
2
+VDDC_Source
MQ1231
S
1
R1230
10K
R1231
G
10K
Q3
Q1232
MMBT3904
23
23
MMBT3904
Q1235
R1232
10K
R1233
10K
TBD
TBD
Q4
G
S
+MVDDC_S
0: OFF / 1: ON
1
111
000
0000
100R
MR1270
10K
R1270
R1275
2.05K
1
1
0
8
2
7
3
6
45
FDS6675
Q1
23
IRLML6402TR
Q1231
Q1230
IRLML6402TR
23
Q2
MQ1230
45
3
6
2
7
1
8
FDS6675
Status
No Power, No boot
Board is Powered
by 12V_BUS, action taken by software
No 12V_BUS, No boot
Boot up in normal condition
+VDDC
12
NS1271
NS_VIA
Connect to +VDDC &
+MVDD at the ASIC
R1271
1K
R1273
C1270
100nF_6.3V
D
D
1K
For testing only, not intended for production
32
Q1242
2N7002E
2N7002E
Q1243
0R
R1246
RS1
R1245
93.1K
1
32
Vref = 0.8V R1=10K
R4 = (R1 x 0.8V) / (Vout1 - 0.8V)
R4
RFB2
R710
7.15K
402
1%
2
MVDDC_FB (12)
For Production
Power up Sequencing
+VDDC
+12V_BUS
R843
5.1K
5%
R841
1K
1
C841
1uF_6.3V
+1.8V
R847 10K
C844
1uF_6.3V
+MVDD
16-bit ADC for voltage & current read back
12
NS1272
NS_VIA
A_VDDC_IOUT
A_VDDC
R1272
A_MVDD
1K
C1271
100nF_6.3V
R1274
C1272
1K
100nF_6.3V
+VDDC_Source
R1242
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
RH RV670 - Power Management
R844 5.1K
Q840
MMBT3904
23
R846 5.1K
1
Q843
23
MMBT3904
U1270
1
AIN0
2
AIN1
4
AIN2
5
AIN3
ADS1112
R1277
MVDD Input Option Circuit
R1243
0R
0R
+MVDDC_S
+3.3V_BUS
1
5%
1
5%
+12V_BUS
R848
100K
R849
10K
Q844
1
MMBT3904
23
6
VDD
7
SDA
8
SCL
10
A1
9
A0
3
GND
0R
63
81
72
RP12 02A0R
RP1202B0R
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Saturday, September 08, 2007
Sheet
1321
1
5.1K
R845
Q841
MMBT3904
23
Q842
MMBT3904
23
+3.3V_BUS
54
RP1202D0R
RP12 02C0R
of
1
LDO_EN
32
C842
10uF_X6S
C843
100NF
402
X5R
16V
C1279
100nF_6.3V
BLM15BD121SN1
63
54
81
72
RP1203A0R
RP12 03B0R
Q845
SI2304DS
+VDDC_ExtSource
RP1203C0R
RP1203D0R
LDO_EN (14)
MVDD_EN (12)
1
B1279
BLM15BD121SN1
R1279
100R
100R
R1278
B1278
+MVDDC_S
Doc No.
105-B340xx-00
+3.3V
R840
100K
LVT_EN (3)
+3.3V_BUS
DDC4DATA (3)
DDC4CLK (3)
RevDate:
2
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
8
7
6
5
4
3
2
1
LDO #2:Vout = +1.8V +/- 3%Vin = 2.5V to 3.6V MAXIout = 0.8A (TBV) RMS MAX
PCB: 50 to 70mm sq. copper area for cooling
Use 0.51 1/2W 1210 PN 3180003200G
0.1R
MR868
DD
+3.3V_BUS+1.8V+5V+1.8V
LDO #3:Vout = +1.1V +/- 3%
Overlap footprints
R868
0.50R
LDO_EN(13)
LDO2_VIN
LDO2_POK
LDO_EN
10uF_X6S
C865
U861
1
2
3
C866
C868
1uF_6.3V
45
uP7706U8
POK
GND#8
EN
VIN
VOUT
CNTL REFIN
GND#9
8
7
FB
6
R8660R
9
R865
33pF_50V
LDO2_FB
13.0K
R864
10.2K
R5
R4
C3
C862
10uF_X6S
DNIDNI
VOUT = Vref x (1 + R5/R4)
C861
10uF_X6S
Vin = +1.70V to 2.1VMAXIout = Up to 1.3A (TBV) RMS MAX
C864
100nF_6.3V
LDO2_POK
+3.3V
R899
1K
OSC_EN (3)
PCB: 50 to 70mm sq. copper area for cooling
0.1R
MR858
1/2W 1210
R858
0R
LDO_EN(13)
Overlap footprints
1/4W 1206
LDO3_VIN
C856
10uF_X6S
LDO_EN
C858
1uF_6.3V
U851
1
POK
GND#8
2
EN
FB
3
VIN
VOUT
45
CNTL REFIN
GND#9
uP7706U8
8
7
6
9
+MVDD
CC
LDO #6:Vout = +1.20V +/- 3%For fixed output voltage: Vin = +1.70V to 2.1V MAX
+1.1V+5V+1.1V
R8560R
DNI
LDO3_FB
VOUT = Vref x (1 + R5/R4)
R855
3.83K
R854
10.2K
R5
R4
C855
33pF_50V
C3
C851
C852
10uF_X6S
10uF_X6S
DNI
C854
100nF_6.3V
Iout = 1.3A (TBV) RMS MAX
PCB: 50 to 70mm sq. copper area for cooling
Regulators for +5V, +5V_VESA and +5V_VESA2
+12V_BUS
MR811
R811
MR812
27R
0805
1/8W
5%
27R
47R
1206
0805
1/4W
1/8W
MU810
MCP1702T-5002E/MB
23
INOUT
GND
1
U810
1
VIN
VOUT#2
5
NC
VOUT#3
8
NC#8
VOUT#6
47
ADJVOUT
LM317LCDR
Vout(V) = Vref (1+R2/R1)
R821
47R
12060805
MR821
27R
23
1
5
8
47
MU820
MCP1702T-5002E/MB
INOUT
GND
1
U820
VIN
VOUT#2
NC
VOUT#3
NC#8
VOUT#6
ADJVOUT
LM317LCDR
MR822
27R
0805
1/8W
5%
Vout(V) = Vref (1+R2/R1)
2
3
R813
6
499R
0402
R1
1uF_6.3V
R814
1.5K
0402
R2
2
3
R823
6
499R
0402
R1
1uF_6.3V
R824
1.5K
0402
R2
+12V_BUS
1206
1/4W
5%
C810
100nF
0603
16V
1206
1/4W
5%
C820
100nF
0603
16V
R812
47R
R822
47R
+5V_VESA
C811
+5V_VESA2
C821
LDO #6:Vout = TBDFor tracking VDDC: Vin = TBD
PCB: 50 to 70mm sq. copper area for cooling
BB
+MVDD
+3.3V_BUS
0.1R
MR878
R870
1R_1210
R872
1R_1210
R878
0R
1/2W each
1/2W 1210
Overlap footprints
1/4W 1206
R871
1R_1210
R873
1R_1210
LDO_EN(13)
LDO6_VIN
10uF_X6S
C876
0.1R
NR878
1/2W 1210
NR878 can share pad with MR878.
One of them must be installed
Add large copper area under R870~R873 for heat dissipation (~2W).
AA
8
0R
R877
0R
1
2
3
45
C878
1uF_6.3V
7
uP7706U8
+VDDC
DNI
MR877
LDO_EN
See BOM for Qualified Option
U871
8
POK
GND#8
7
EN
FB
6
VIN
VOUT
CNTL REFIN
9
GND#9
R876
DNI
0R
MR876
LDO6_VREF
10R
TBD
6
+VDDCI_LDO+5V+VDDCI_LDO
LDO6_FB
VOUT = Vref x (1 + R5/R4)
DNI
C879
100nF_6.3V
Iout = 1.3A (TBV) RMS MAX
C875
R875
33pF_50V
5.11K
R874
10K
R5
R4
C872
10uF_X6S
C3
DNI
+VDDCI_LDO+VDDC
12
NSR0320MW2T1G
5
+12V_BUS
R832
47R
1206
1/4W
5%
C871
C874
10uF_X6S
100nF_6.3V
TBD
D870
4
3
C830
100nF
0603
16V
+5V_BAK
5VCC
5VCC(11,13)
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
RH RV670 - Linear Regulators
R831
MR832
27R
0805
1/8W
5%
MR831
47R
27R
1206
0805
1/4W
1/8W
5%
5%
MU830
MCP1702T-5002E/MB
23
INOUT
GND
1
U830
1
VIN
VOUT#2
5
NC
VOUT#3
8
NC#8
VOUT#6
47
ADJVOUT
LM317LCDR
Vout(V) = Vref (1+R2/R1)
Install only R839 or MR839
See BOM for qualified option
+5V
R839
C839
1uF_6.3V
0R
C838
MR839
2
0R
1uF_6.3V
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1421
of
+5V_VESA
Doc No.
2
3
6
1
+5V_BAK
R833
499R
0402
R1
C831
1uF_6.3V
R834
1.5K
0402
R2
+5V_VESA2
R829
0R
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
8
A_DAC1_R(3)
A_DAC1_RB(3)
A_DAC1_G(3)
DD
A_DAC1_GB(3)
A_DAC1_B(3)
A_DAC1_BB(3)
R1027
37.4R
R1028
37.4R
R1029
37.4R
7
L1001 47nH
C1004
R1001
8.0pF
402
C1005
8.0pF
402
C1006
8.0pF
402
ML1001 36NH
L1002 47nH
ML1002 36NH
L1003 47nH
ML1003 36NH
75R
402
R1002
75R
402
R1003
75R
Pseudo differential RGB should be routed from the ASIC to the display
connector without switching reference plane or running over split plane.
L100x and ML100x footprints are overlapped
C1001
12pF_50V
402
C1002
12pF_50V
402
C1003
12pF_50V
402402
6
5
A_R_DAC1_F
A_G_DAC1_F
A_B_DAC1_F
DDCDATA_DAC1_R
DDCCLK_DAC1_R
HSYNC_DAC1_R
VSYNC_DAC1_R
4
For ESD ProtectionSee BOM for qualified filters
+3.3V
4
5
6
D1001
CH3
Vp
CH4
CM1213-04
CH2
CH1
3
+5V_VESA
3
2
Vn
1
D1002
4
5
6
CM1213-04
CH2
CH3
Vn
Vp
CH1
CH4
2
3
2
1
+5V_VESA
1
2
3
11
12
4
15
9
13
14
5
6
7
C1010
68pF
603
8
10
16
17
MJ1001
R
G
B
MS0
MS1
MS2
MS3
NC
HS
VS
VSS
VSS#6
VSS#7
VSS#8
VSS#10
CASE
CASE#17
SYNC and DDC should be routed from the ASIC to the display connector without switching reference plane or running over split plane
+5V
1
R1005
2.2K
DDCDATA_DAC1_5VDDCDATA_DAC1_R
32
BSH111
Q1001
+5V
1
R1008
2.2K
DDCCLK_DAC1_5V
32
BSH111
Q1002
R100633R
R100933R
R1010
R1011
10R
10R
402
402
402
402
DDCCLK_DAC1_R
HSYNC_DAC1_R
VSYNC_DAC1_R
T2X2M(3)
T2X2P(3)
T2X4M(3)
T2X4P(3)
DDCCLK_DAC1_R
DDCDATA_DAC1_R
VSYNC_DAC1_R
T2X1M(3)
+3.3V
Q1021
HPD2(7)
MMBT3904
23
R1023
10K
R1022 10K
1
T2X1P(3)
T2X3M(3)
T2X3P(3)
HPD_DVI2
T2X0M(3)
T2X0P(3)
T2X5M(3)
T2X5P(3)
T2XCP(3)
T2XCM(3)
A_R_DAC1_F
A_G_DAC1_F
A_B_DAC1_F
HSYNC_DAC1_R
DB15 pin
Standard VGA
DDC1 Host
Monitor ID bit 0
Monitor ID bit 1
Monitor ID bit 2
Monitor ID bit 3
N/C
Mechanical Key
Monitor ID bit 0
Data from display
Monitor ID bit 2
Open
+5V
50mA min
1A max
J1001
25
CASE
1
TMDS Data2-
2
TMDS Data2+
3
TMDS Data2/4 Shield
4
TMDS Data4-
5
TMDS Data4+
6
DDC Clock
7
DDC Data
8
Analog VSYNC
9
TMDS Data1-
10
TMDS Data1+
11
TMDS Data1/3 Shield
12
TMDS Data3-
13
TMDS Data3+
14
+5V Power
15
GND (for +5V)
16
Hot Plug Detect
17
TMDS Data0-
18
TMDS Data0+
19
TMDS Data0/5 Shield
20
TMDS Data5-
21
TMDS Data5+
22
TMDS Clock Shield
23
TMDS Clock+
24
TMDS Clock-
C1
Analog Red
C2
Analog Green
C3
Analog Blue
C4
Analog HYNC
C5
Analog GND
C6
Analog GND#C6
26
CASE#26
27
CASE#27
28
CASE#28
29
CASE#29
30
CASE#30
DVI_CONNECTOR
11
12
4
15
9
Hardware
Support NoYesYesNoYes
Based on VESA Display Data Channel (DDC) Standard Ver. 3 Dec. 15, 1997
+5V_VESA
DDC2B or
DDC2B+ Host
Monitor ID bit 0
SDA
Monitor ID bit 2
SCL
+5V
50mA min
1A max
DDC2AB Host
Monitor ID bit 0
SDA
Monitor ID bit 2
SCL
+5V
300mA min
1A max
DDC1/2 Display
Optional
SDA
Optional
SCL
Optional
AA
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
8
7
6
5
4
3
RH RV670 - DAC1/TMDS2
2
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1521
of
Doc No.
1
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
8
7
6
5
4
3
2
1
See BOM for qualified filters
A_DAC2_R(3)
A_DAC2_RB(3)
A_DAC2_G(3)
DD
A_DAC2_GB(3)
A_DAC2_B(3)
A_DAC2_BB(3)
R2027
37.4R
R2028
37.4R
R2029
37.4R
R2001
75R
R2002
75R
R2003
75R
402
402
L200147nH
C2004
ML200136NH
8.0pF
402
L2002 47nH
C2005
ML200236NH
8.0pF
402
L2003 47nH
C2006
8.0pF
ML200336NH
402
Pseudo differential RGB should be routed from the ASIC to the display
connector without switching reference plane or running over split plane.
Analog Red
Analog Green
Analog Blue
Analog HYNC
Analog GND
Analog GND#C6
CASE#26
CASE#27
CASE#28
CASE#29
CASE#30
DDC2AB Host
Monitor ID bit 0
SDA
Monitor ID bit 2
SCL
+5V
300mA min
1A max
DDC1/2 Display
Optional
SDA
Optional
SCL
Optional
8
7
6
5
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
4
3
RH RV670 - DAC2/TMDS1
2
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1621
of
Doc No.
1
RevDate:
2
105-B340xx-00
8
DD
7
6
A_DAC2_Y(3)
R3001
75R
5
L3001 470nH_250mA
C3001
47pF_50V
DAC2_Y_F
C3004
47pF_50V
4
3
2
1
A_DAC2_C(3)
A_DAC2_COMP(3)
CC
402
R30110R
Install for Dell
GENERICA(7)
DAC2_C_F
DAC2_COMP_F
BB
R30040R
R30050R
R30060R
DNI for Dell
Place near connector
0R leaves footprint for Ferrite
Beads if req'd for EMI
STV/HDTV#_DETPIN6
402
DAC2_Y_DINDAC2_Y_F
402
DAC2_C_DIN
402
DAC2_COMP_DIN
R3002
75R
R3003
75R
+3.3V
R3008
10K
402402
C3007
82pF
- 4-pin Svideo MiniDIN P/N 6070001000G
C3002
47pF_50V
C3003
47pF_50V
Install for Dell
R30100R
R30090R
C3008
82pF
402402402
L3002 470nH_250mA
L3003 470nH_250mA
402
C3009
82pF
DAC2_C_F
C3005
47pF_50V
DAC2_COMP_F
C3006
47pF_50V
R3007
0R
402
DNI for Dell
Install for Dell only when it's needed for EMI
C3010
82pF
402
TV Out
J3001
6
HDTV_OUT_DET#
3
Y-OUT
4
C-OUT
7
Comp_out
CompIn
5
SYNC
1
GND
2
GND#2
8
Rpin5
CASE
9
CASE#9
10
CASE#10
Conn_DIN_Mini_Circular_7_Pin_with_O_Ring
AA
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
8
7
6
5
4
3
RH RV670 - TV OUT
2
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1721
of
Doc No.
105-B340xx-00
1
RevDate:
2
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
8
+3.3V+3.3V
R4032
R4003
2.61K
10K
DDC3CLK(1,3)
DDC3DATA(3)
DD
TS_FDO(3)
R4001100R
R4002100R
Warning: TS_FDO is not 5V tolerant. MAX sink current 1.65mA
SCL_R
SDA_R
ThermINT
7
C4002
C4001
10uF_X6S
1uF_6.3V
U4001
8
SMBCLK
7
SMBDAT
6
ALERT
54
GNDPWM
LM63CIMAX
VDD
C4003
100pF_50V
D+
D-
6
R4004
13.3K
LM63_PWM
TS_FDO
GPU_DPLUS
C4004
2.2nF_50V
GPU_DMINUS
1
2
3
R4006
R4007
GPU_DPLUS (3)
GPU_DMINUS (3)ThermINT(7)
33R
33R
PWM
5
For 4-WIRE FAN, Production
R4005 33R
1
+3.3V_BUS
23
R4030
5.1K
Q4001
MMBT3904
4
+3.3V_BUS
R4036
DNI
10K
R4031
1
Q4030
1K
MMBT3904
23
3
TP4001
35mil
TP4002
35mil
TACH Connection is for testing
and RPM measurement only
Overlap R4000 & B4002
TACH
C4030
10nF
DNI
B4002
26R_600mA
R40341K
R4033
3.83K
2
+VDDC_Source
R4035
10K
R4000
0.1R
+12V_BUS
B4001
26R_600mA
USE PN 4212047500G
4.7uF, 0805, 16V
C4008
C4009
1uF
1uF
4
3
2
1
1X4 3A 2MM
J4030 is 2mm, and
it does not follow
2.54mm spacing as 4-wire
PWM Fan Specification
1
J4030
For 2-WIRE FAN, Socket Board Only
+12V_BUS
TR4011
10K
TR4010
FAN_FULL_SPEED#(13)
If Critical Temperature is reached this will force the fan to run at full
H1E
H1A
CC
RV670_SS_HP
1234567
8
H1F
RV670_SS_HP
41424344454647
48
H1B
RV670_SS_HP
9101112131415
H1G
RV670_SS_HP
49505152535455
16
56
H1C
RV670_SS_HP
17181920212223
H1H
RV670_SS_HP
57585960616263
64
H1D
RV670_SS_HP
24
25262728293031
H1I
RV670_SS_HP
65666768697071
65666768697071
72
72
RV670_SS_HP
33343536373839
32
H1J
RV670_SS_HP
speed while power is removed from GPU & rest of the board.
This is an open collector signal. Active level is hard pull down to ground.
40
73747576777879
80
73747576777879
80
1
TQ4011
23
MMBT3904
10K
TC4011
1uF
0805
16V
1
TJ4010
1
2
32
TQ4010
SI2304DS
BB
AA
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
8
7
6
5
4
3
RH RV670 - Thermal Management
2
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1821
of
Doc No.
105-B340xx-00
1
RevDate:
2
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
5
ASSY-SCREW2
SCREW
ASSY-SCREW1
SCREW
JACKPOST, HEX, 3/16 AF, 4-40 INT/EXT
<3rd part field>
ASSY-SCREW3
DD
SCREW
JACKPOST, HEX, 3/16 AF, 4-40 INT/EXT
<3rd part field>
ASSY1
ANTISTATIC
BAG
6_X_11
CC
JACKPOST, HEX, 3/16 AF, 4-40 INT/EXT
<3rd part field>
ASSY-SCREW4
SCREW
JACKPOST, HEX, 3/16 AF, 4-40 INT/EXT
<3rd part field>
BKT1
BRACKET
8020038600G
BKT2
80200386B0G
BKT1: DVI - DIN -DVI
BRACKET
BKT2: DVI - DVI
ASSY-SCREW5 only for Slim-VGA with upper or lower tab bracket
ASSY-SCREW5
SCREW
SCREW
4
MT1
MT_Hole_0.136 TM 5.5 BM 7.0
SK1
Socket_RV670/M88L
MT2
MT_Hole_0.136_in_6VIA
PCB1
PCB
109-B34031-00
3
2
1
BB
AA
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
5
4
3
2
RH RV670 - Mechanical
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
1921
of
1
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
5
<Variant Na
me>
Title
RH PCIE RV670 512MB GDDR3 DUAL DL-DVI-I VO FHFriday, September 07, 2007
4
3
2
1
Date:Schematic No.
105-B340xx-00
REVISION HISTORY
NOTE:
DD
Sch
PCB
Rev
0
100B
200
CC
BB
Date
Rev
07/05/11
00A
07/08/1(pg 1) Adding R1 and connecting switch #7 of TSW1. Some mother boards require B7 to be grounded. Table-1 updated accordingly
07/09/06(pg 16) Adding back C2001
Initial design for RV670 GDDR3 (Revival) based on B339
(pg 7) Adding R64 and MR64 to select HOT_PLUG_DET or ThermINT as the interrupt source.
(pg 13) Adding R1617, MR1617, R1616, Q1613, R1615, R1618, and R1619 as option to support hot plug detection of external cable.
(pg 13) Adding R1282, MR1282, R1283, MR1283, R1284, MR1284, R1281, R1285, Q1280, and C1280 as option for thermal protection for VDDC SMPS MOSFETs
(pg 13) Adding MC1603 (overlapped with C1603)
(pg 14) Adding D870 as option for power up sequencing
(pg 18) Adding heatsink symbol/footprint
(Layout) Increasing spacing between DDC4DATA & DDC4CLK going to U1270 to reduce the crosstalk
(pg 13) Removing overlapped parts R1284, and MR1283 to address DFM
(pg 13) Adding C1660, C1661, and C1662 to improve EMI
(Layout) Fill in the gap between vias in +MVDD and +VDDC planes
This schematic represents the PCB, it does not represent any specific SKU.
For Stuffing options (component values, DNI, ? please consult the product specific BOM.
Please contact AMD representative to obtain latest BOM closest to the application desired.
REVISION DESCRIPTION
Rev
2
AA
5
4
3
2
1
PDF created with pdfFactory Pro trial version www.pdffactory.com
CONFIDENTIAL & PROPRIETARY TO ADVANCED MICRO DEVICES INC.
?2007 Advanced Micro Devices
This AMD Board schematic and design is the exclusive property of AMD,
and is provided only to entities under a non-disclosure agreement
with AMD for evaluation purposes. Further distribution or disclosure
is strictly prohibited. Use of this schematic and design for any purpose
other than evaluation requires a Board Technology License Agreement
with AMD. AMD makes no representations or warranties of any kind
regarding this schematic and design, including, not limited to,
any implied warranty of merchantibility or fitness for a particular
purpose, and disclaims responsibility forany consequences resulting
from use of the information included herein.
Title
5
4
3
2
RH PCIE RV670 512MB GDDR3 DUAL DL-DVI-I VO FH
Advanced Micro Devices Inc.
1 Commerce Valley Drive East
Markham, Ontario
Friday, September 07, 2007
Sheet
2121
of
1
Doc No.
RevDate:
2
105-B340xx-00
PDF created with pdfFactory Pro trial version www.pdffactory.com
www.vinafix.vn
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