Acknowledge: This Design Is Leveraged From Mark Shelton's Landrover 1x2 BP Design
REVISIONS
REV
X00INITIAL PROTOTYPE
X01PROTOTYPE UNIT TEST BUILD
X02PROTOTYPE PRODUCT TEST BUILD
DESCRIPTIONECODATE
D
APPROVED
7/28/03
8/21/03
12/10/03
1
Corvette 1x2 SCSI BP
1
TABLE OF CONTENTS
I2C
FRU
IPMB
PWRGOOD
12V and 5V
POWER
CONNECTOR
SIGNAL
DRIVE PRESENCE<0..1>
BACKPLANE/DTR
MATING
CONNECTOR
SCSI BUS A
CONNECTOR
2
FAULT
LEDS
PAGEDESCRIPTION
1 BLOCK DIAGRAM
2
ROUTING & OTHER RULES, STACKUP
3
BP/DTR MATING & SCSI CONNECTORS
LVD SCSI SLOTS 0 - 1
4
5
I2C CIRCUITRY and 3.3V LDO
6
PWRCONN and SIGCONN
7
IMP. COUPONS,GND CLIPS,CPTV SCREWS
SCHEMATIC IS CONFIGURED TO USE
THE XLBOM UTILITY:
BUILD0 IS PROTOTYPE BUILD
BUILD1 IS PRODUCTION BUILD
2
ACTIVITY
LEDS
SCSI ID0
ONLINE
LEDS
SCSI ID1
3
3
LVD SCSI
CONNECTOR A
A CURRENT ISSUE OF THIS DRAWING MUST
INCLUDE A COPY OF THE FOLLOWING
ECO'S:
ECO
ECO
ECO
ECO
ECO
ECO
ECO
4
THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS
AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS
ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER
CORP., EXCEPT AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN
ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE
REPRODUCED IN WHOLE OR IN PART AND MUST BE RETURNED TO DELL
EXPORT RESTRICTION:
THE EXPORT OF THE INFORMATION, SCHEMATICS AND OTHER TECHNICAL DATA CONTAINED IN THIS DOCUMENT
IS CONTROLLED BY THE U.S. GOVERNMENT. THE EXPORT, DEEMED EXPORT OR OTHER TRANSFER OF THIS DATA
TO CERTAIN COUNTRIES AND INDIVIDUALS IS RESTRICTED. ANY TRANSFER, EXPORT OR REEXPORT, MUST BE
IN COMPLIANCE WITH THE U.S. EXPORT ADMINISTRATION REGULATIONS.
COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION
OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM NOR THE
INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS
NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH
THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF
DELL COMPUTER CORPORATION.
PROPRIETARY NOTE
DRAWN
DESIGNED
CHECKED
APPROVED
APPROVED
APPROVED
APPROVED
RELEASED
Mark Shelton/Dan Rao
M. Shelton/D. Rao/J. Melanson/R. Hemingway
ECO
TITLE
SCHEM, BKPLN, 1X2, PE2800
DWG NO.
DATE
D1392
12/5/20031 OF 7
DATE
DATE
DATE
DATE
DATE
DATE
DATE
DATE
COMPUTER
CORPORATION
AUSTIN,TEXAS
SHEET
REV.
X02
4
-03
DCBA
Page 2
ABC
D
STACKUP AND ROUTING RULES
1
NOTE ON COMPONENT PLACEMENT:
--> ALL COMPONENTS SHOULD BE PLACED ON THE TOP SIDE IF POSSIBLE EXCEPT:
SCSIA, PWRCONN, SIGCONN CONNECTORS
NOTE ON SCSI ROUTING RULES:
--> SCSI SIGNALS ARE NAMED SCSI_D_*. THERE ARE 27 DIFFERENTIAL PAIRS.
THEY HAVE FIRST PRIORITY WHEN ROUTING.
--> AVOID VIAS WHENEVER POSSIBLE. USE THE SAME NUMBER OF VIAS BETWEEN PAIRS
IF UNAVOIDABLE.
--> ROUTE SCSI_D_SREQ* AND SCSI_D_SACK* FIRST. ISOLATION FROM OTHER PAIRS IS
1.5X (22MIL) SINCE THEY ARE MORE SUSCEPTIBLE TO CROSSTALK.
--> TRY TO ROUTE ALL THE ± DIFFERENTIAL SIGNALS ON INNER LAYERS (IN1-2 & IN5-6)
IF POSSIBLE AS EDGE COUPLED DIFFERENTIAL PAIRS.
--> ALL SCSI SIGNALS SHALL BE LENGTH MATCHED TO WITHIN 100MILS ~17PS WITHIN BUS
AND VARIATION WITHIN PAIR SHALL BE < 5 MILS. RULE FILE WILL BE PROVIDED
TO ACHIEVE THIS.
--> SCSI TRACE WIDTH AND SPACING MUST BE MAINTAINED AS IN THE TABLE. THE ONLY
2
ACCEPTABLE DEVIATION FROM THE SPACING IS WHERE THE SIGNALS MUST ROUTE
THROUGH THE Z-PACK CONNECTOR
Trace/ Space / Trace/space_to_other pairLayer Restrictions
GNDGND
2
4/10/4/15 (119.1) Ref L2&L5Allowed
GENERAL (NON-SCSI) ROUTING RULES:
--> FOR EXTERNAL LAYERS (TOP AND BOTTOM), USE 6 MIL TRACE,
6MIL SPACING FOR 60 OHM SIGNALS.
--> FOR INTERNAL LAYERS (IN1 AND IN2), USE 6 MIL TRACE
12MIL SPACING FOR 60 OHM SIGNALS.
--> ALL NON-SCSI TRACES SHALL BE ISOLATED FROM LVD SCSI SIGNALS BY 50MILS.
--> I2C SIGNALS SHOULD BE ROUTED SERIALLY. THERE SHOULD NOT BE ANY LONG
STUBS OR BRANCHES.
TRY TO KEEP THESE SIGNALS AWAY FROM SCSI LVD SIGNALS.
POWER SIGNALS ROUTING RULES:
--> TRY TO USE ISLANDS FOR ALL POWER SIGNALS WITH NO POWER PLANE.
IF ISLANDS ARE NOT POSSIBLE, USE AT LEAST 30 MIL TRACES.
--> USE MULTIPLE VIAS WHERE THE POWER SIGNALS CHANGE LAYERS,
3
I.E. FROM THE POWER SOURCE ON THE TOP/BOTTOM LAYER
TO THE POWER PLANE ON THE INNER LAYER
--> FOR LARGE CERAMIC CAP PACKAGE, I.E. 1210 PACKAGE, USE MULTIPLE VIAS AND MAKE SURE
THE TRACE IS KEPT AS SHORT AS POSSIBLE.
--> SHORTEN THE PATH FROM THE CAPACITOR PADS TO THE GROUND VIAS (10MIL < L < 20MIL)
AND KEEP THE TRACE AT LEAST 20MILS WIDE TO REDUCE INDUCTANCE.
--> DO NOT SHARE POWER OR GROUND VIAS FOR DECOUPLING CAPS.
TESTABILITY AND TOOLING HOLE:
--> REFER TO SEPERATE TESTABILITY DOCUMENT TEST POINT PLACEMENT REQUIREMENT.
--> AT LEAST THREE TOOLING HOLES MUST BE INCLUDED ON THE BOARD.
4IN21/2 oz0.7
Core7.0+/-1 mil4.3
5VCC1 oz1.4
Prepreg5.0+/-2 mil4.3
6Gnd21 oz1.4
Core7.0+/-1 mil4.3
7IN51/2 oz0.7
Prepreg20.0+/-3 mil4.3
8IN61/2 oz0.7
Core7.0+/-1 mil4.3
9VC21 oz1.4
Prepreg8.0+/-2 mil4.3
10Bot1.5 oz2.1
Total Thickness101.6+/- 10mil
4/10/4/15 (119.1) Ref L2&L5NOT ALLOWED
VCCVCC
Gnd2Gnd2
4/10/4/15 (119.1) Ref L6&L9Allowed
4/10/4/15 (119.1) Ref L6&L9NOT ALLOWED
3
VC2VC2
5/11/5/30 (120.5) Ref L9NOT ALLOWED
SILKSCREEN:
--> ALL COMPONENTS SHOULD HAVE PIN 1 LABELED.
--> ON MANY PIN COMPONENTS AND CONNECTORS, THERE SHOULD BE A TICK MARK EVERY 10 PINS.
--> ALL REFERENCE DESIGNATORS SHALL BE VISIBLE WHEN THE PARTS ARE PLACED.
4
IMPEDANCE COUPON:
--> PLEASE FOLLOW THE SEPERATE IMPEDANCE COUPON DOCUMENT FOR SPECIFIC REQUIREMENT.
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP. EXCEPT
AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP. EXCEPT
AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP. EXCEPT
AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.
R195
12
RLEDACT0
220-5%
R193
12
RLEDONLN0
220-5%
R194
12
RLEDFALT0
220-5%
R159
4.7K
12
GRN LED
DS13
1
2
G
43
Y
GRN / YEL LEDS
+5V
DS12
21
LVD SCSI SLOTS 0 - 1
TITLE
SCHEM, BKPLN, 1X2, PE2800
DWG NO.
DATE
D1392
12/5/20034 OF 7
DCBA
COMPUTER
CORPORATION
AUSTIN,TEXAS
REV.
SHEET
4
X02
Page 5
ABC
3.3V LDO & FRU DEVICE
D
+3.3V
1
3.3V POWER
+5V
+3.3V
U_LDO
32
INOUT
41
TABGND
LT1085CM
SUB=SUB*_P4636
2
C13
12
22uF 10V
6.3V-20%
C9
NET_PHYSICAL_TYPE=PLANE
6.3V-20%
12
22uF
22uF
C14
12
0.1uF 16V
C15
12
R212
220-5%
12
NP
NP
+3.3V
NP
R143
R139
4.7K
12
12
NP
220
R142
R140
21
21
NP
R141
4.7K
4.7K
12
FRU_A0
FRU_A1
FRU_A2
NP
220
220
R138
21
FRU DEVICE
FRU
NP
1
A0
2
A1
36
A2SCL
4
GND1
24C02
ROOM=BPFRU
TOP VIEW
18(VCC)
(GND)4
DPN: 1E161
GND2
FRU
PINOUT
VCC
SDA
8
7
FRU_PD7
5
NP
R151
5
0.1uF 16V
C74
12
PLACE C74 AS CLOSE TO
FRU.8 AS POSSIBLE
I2C_SCL_R
I2C_SDA1_R
21
220
R191
NP
12
0-5%
R192
NP
12
0-5%
I2C1_CLK_DC
I2C1_SDA_DC
3
3
1
2
ADDRESS: 1010 110x = ACh
3
3
I2C BUS DEVICES AND LDO
4
TITLE
COMPUTER
CORPORATION
AUSTIN,TEXAS
4
SCHEM, BKPLN, 1X2, PE2800
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP. EXCEPT
AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.
DWG NO.
DATE
D1392
SHEET
REV.
X02
5 OF 712/5/2003
DCBA
Page 6
ABC
D
POWER/SIGNAL CONNECTORS
1
1
PIN OUT MATCH WIRING DIAGRAM VER 1.1
SIGCONN
1
2
3
4
5
6
POCKET SHR
EXT. SOLDER TAIL
SUB=SUB*_G3247
2
PCI_RESET_N
IPMB_RST_N
ISO_IPMB_DATA
ISO_IPMB_CLK
3
1X2_RESET_N
3
3
3
R2
12
0-5%
DC_PWRGOOD
3
2
+5V
+5V
3
+12V
PWRCONN
1
2
3
4
PWR CONN
SUB=SUB*_8G518
16V 10%
10uF
1
C19
2
16V 10%
10uF
C40
21
+12V
16V 10%
10uF
1
C20
2
16V 10%
10uF
21
16V 10%
10uF
1
2
0.1uF 16V
21
C41
16V 10%
10uF
C21
0.1uF 16V
C16
0.1uF 16V
1
C18
2
21
C10
21
C11
3
ROOM=PWRCONN
PLACE NEAR POWER/PLANAR CONNECTOR (PWRCONN)
--- AVOID PLACING DECOUPLING CAPS TO CONNECTOR PINS WITH LONG TRACES (>25MILS)
--- INSTEAD, PLACE CAPS AS CLOSE TO CONNECTOR AS POSSIBLE, AND TIE THEM
DIRECTLY TO POWER PLANE WITH VERY SHORT TRACES
4
--- EACH CAP SHOULD HAVE ITS OWN POWER/GND PAIR. AVOID SHARING VIAS.
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP. EXCEPT
AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.
POWER/SIGNAL CONNECTOR
COMPUTER
CORPORATION
TITLE
AUSTIN,TEXAS
SCHEM, BKPLN, 1X2, PE2800
DWG NO.
DATE
D1392
12/5/20036 OF 7
SHEET
REV.
4
X02
DCBA
Page 7
ABC
D
ROOM=IMPTST
1
+5V
+12V
LYR4
1
RX
3
RY
NP*
ZDI4PINS2R
COUPON TEST
1
RX
3
RY
NP*
ZDI4PINS2R
COUPON TEST
LYR8
+
-
2
4
2
+
4
-
Z_SCSI_P_L4
Z_SCSI_N_L4
Z_SCSI_P_L8
Z_SCSI_N_L8
ZEP5
1
1
NP*
ZEP
COUPON TEST
ZEP6
1
1
NP*
ZEP
COUPON TEST
ZEP9
1
1
NP*
ZEP
COUPON TEST
ZEP10
1
1
NP*
ZEP
COUPON TEST
+5V
+12V
LYR3
1
RX
3
RY
NP*
ZDI4PINS2R
COUPON TEST
1
RX
3
RY
NP*
ZDI4PINS2R
COUPON TEST
LYR7
+
-
2
4
2
+
4
-
Z_SCSI_P_L3
Z_SCSI_N_L3
Z_SCSI_P_L7
Z_SCSI_N_L7
ZEP3
1
1
NP*
ZEP
COUPON TEST
ZEP4
1
1
NP*
ZEP
COUPON TEST
ZEP7
1
1
NP*
ZEP
COUPON TEST
ZEP8
1
1
NP*
ZEP
COUPON TEST
MH1
2
3
4
5
6
7
8
9
NP*
.145 DRILL
.330 PAD
8 GND VIAS
MH3
2
3
4
5
6
7
8
9
NP*
.145 DRILL
.330 PAD
8 GND VIAS
2
MH2
2
3
4
5
6
7
8
9
NP*
.145 DRILL
.330 PAD
8 GND VIAS
MH4
2
3
4
5
6
7
8
9
NP*
.145 DRILL
.330 PAD
8 GND VIAS
1
2
Mounting Holes
X00 SCHEMATICS REV CHANGE TRACKER
X00-01 Initial ECAD schematics release
X00-02 Change SCSI connector back to solder tail connector on 5/19/03
X00-03 Change SCSI SCA-2 connectors to DPN 10519 on 5/21/03
X00-04 On page 6, change power connector to 8G518 on 5/21/03
X00-05 On page 5, Removed LM75 footprint and added 3.3V LDO on 5/22/03
On page 4, Consolidated resistor values on 5/22/03
X00-06, changes made based on CDR on 5/27/03
On Page 3, changed ground symbol to make it consistent
On Page 5, consolidate resistor values, add decoupling cap on 3.3V LDO. Add 0ohm resistors on FRU I2C signals.
NOTES ON ROUTING FOR COUPONS:
--> HOLES TO BE ARRANGED ON 100 MIL CENTERS FOR PROBE
--> FINISHED HOLE DIAMETER = 0.029"
--> TRACES NEED TO BE AT LEAST 6" LONG, THE LONGER THE BETTER
3
--> MIRROR PLACEMENT OF HOLES SO THAT SIGNAL ROUTING IS PRIORITY
--> BRING SIGNALS TOGETHER AS SOON AS POSSIBLE AND AS SIMILARLY AS POSSIBLE
--> AVOID VIAS, PLATED HOLES, AND COPPER EDGE OF PCB BY MIN 50 MILS
--> FOLLOW SAME ROUTING CONSTRAINTS AS THAT SPECIFIED FOR THE LAYER
--> CHECK LAYOUT ONE LAYER AT A TIME, AND WITH THERMAL VIEW
X00-10, Changed 68 pin SCSI connector to through hole connector J2042 to save cost on 7/2/03
X00-11, Changed LDO to LM1085 on 7/9/03
X00-12, On page 4, changed 5VCHARGE_0 property to MIN_LINE_WIDTH=25mil to match layout. Changed on 7/24/03
X01 SCHEMATICS REV CHANGE TRACKER
NOTES ON SILKSCREEN FOR COUPONS:
--> DO SILKSCREEN BOX AND LABELING AT ONE END ONLY, EG. "A" EN
--> SILKSCREEN NEEDS TO BE LEGIBLE AND EASY TO SEE
X01-02 On page 4,Changed all Y5V 0.1uF caps 78087 to X7R caps 05735 on 8/21/03
On Page 7, corrected impedance coupon routing connection
On Page 4, change SCA-2 drive connectors to solder tail connectors DPN 2E846 on 5/27/03
X00-07, changes made based on manufacturing feedback on 5/30/03
X00-08, change SIGCONN pin out to match wiring diagram ver 1.1 on 6/4/03
X00-09, change 12V decoupling cap from 48JCT to 2832P to save cost on 6/17/03
X01-01 Removed R9 on 8/15/03
On Page 3, change DTRCONN pin out to match pin out ver 1.7 on 6/9/03
On page 5, added one 0.1uF decoupling cap on 7/2/03
General, changed VCC symbol to +5V on 7/2/03
On Page 6, Removed extra 3.3V decoupling caps on 7/2/03
On Page 4, Changed HD_PRES*_N pull up to 3.3V on 7/2/03
Change DTRCONN.C15 to GND and changed DTRCONN.A1 signal name to C2_PRES_N on 8/15/03
Change SIGCONN to G3247 to ensure proper protrusion length on 8/15/03
Removed R11 and R12 at the input of LDO on 8/15/03
Removed C111 and C114 on 8/15/03
Removed R7 on 8/15/03
On page 3,Added mechanical part formex Y2657 on 8/21/03
Power connection per SI request
VOLTAGE = XX
+5V
VOLTAGE=5
VOLTAGE=0
+12V
VOLTAGE=12
+3.3V
VOLTAGE=3.3
3
X02 SCHEMATICS REV CHANGE TRACKER
EXAMPLE PLACEMENT/ROUTING:
4
REF
REF
BUS NAME
Layer #
+
-
NOTE: IT IS NECESSARY ONLY TO INCLUDE IMPEDANCE COUPONS
ON THOSE LAYERS THAT CONTAIN SCSI BUS DIFFERENTIAL PAIRS
X02-00 Added R7, R9, R11 pull up resistor on HD_PRES2-4_N on 11/24/03
X02-01 Updated stackup on page 2 on 12/2/03
X02-01 Updated mounting holes to mh145s330 on 12/2/03
X02-02 Changed U_LDO part number to P4636 on 12/3/03
X02-02 Added VOLTAGE attribute to power nets on 12/3/03
X02-03 Added load resistor R212 on the output of LDO 12/5/03
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL COMPUTER CORP. AUSTIN, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL COMPUTER CORP. EXCEPT
AS AUTHORIZED BY DELL COMPUTER CORP., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL COMPUTER CORP. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL COMPUTER CORPORATION.
COMPUTER
CORPORATION
TITLE
AUSTIN,TEXAS
SCHEM, BKPLN, 1X2, PE2800
DWG NO.
DATE
D1392
12/5/2003
SHEET
REV.
X02
7 OF 7
4
DCBA
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