and the Motorola symbol are registered trademarks of Motorola, Inc.
®
is a registered trademark and Celeron™ is a trademark of Intel Corporation.
®
is a registered trademark of Wind River Systems, Inc.
®
is a registered trademark of Linus Torvalds.
®
and Windows NT® are registered tra demarks of Microsoft i n the U.S. and other
countries.
All other products ment io ned i n this document are trademarks or registered trademark s of
their respective holders.
Page 3
Safety Summary
Warning
The following general safety precautions must be observed during all phases of operation, service, and repair of
this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual
could result in personal injury or damage to the equipment.
The safety preca utio ns li sted bel ow repr es ent wa rn ings of ce rta in da nge rs o f wh ich M o toro la i s aw are. You, as
the user of the product, should follow these warnings and all other safety precautions necessary for the safe
operation of the equipment in your operating environment.
Ground the Instrument.
To minimize s hock haz ard, th e equi pment chas sis a nd enclo sure must b e conn ected to an ele ctrical ground. If the
equipment is supplied with a three-conductor AC power cable, the power cable must be plugged into an approved
three-contact electrical outlet, with the grounding wire (green/yellow) reliably connected to an electrical ground
(safety ground) at the power outlet. The power jack and mating plug of the power cable meet International
Electrotechnical Commission (IEC) safety standards and local electrical regulatory codes.
Do Not Operate in an Explosive Atmosphere.
Do not operate the equi pment in any ex plos ive atmosp here su ch as in the pr esenc e of flammable gases or fumes .
Operation of any el ectri cal equip ment i n such an environ ment c ould re sult in an e xplosi on and cause in jury or
damage.
Keep Away From Live Circuits Inside the Equipment.
Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or other
qualified service personnel may remove equipment covers for internal subassembly or component replacement
or any internal adjustment. Service personnel should not replace components with power cable connected. Under
certain condit ions, dangero us voltages may exist e ven with the power cabl e removed. To avoid injuries, such
personnel shou ld al w ays disconnect power and discharge circuits before touching components.
Use Caution When Exposing or Handling a CRT.
Breakage of a Cathod e-Ray Tube (CRT) causes a high-veloc ity scatterin g of glass fragme nts (implosion) . To
prevent CRT implosion, do not handle the CRT and avoid rough handling or jarring of the equipment. Handling
of a CRT should be done only by qualified s er vi ce personnel using ap proved safety mask and gl oves.
Do Not Substitute Parts or Modify Equipment.
Do not install substitut e parts or perfor m any un authorized modifi cation o f the equ ipment. C ontact y our local
Motorola representative for service and repair to ensure that all safety features are maintained.
Observe Warnings in Manual.
Warnings, such as the example below, precede potentially dangerous procedures throughout this manual.
Instructions contained in the w arnings must be follow ed. You should also em ploy all other sa fety pre cautions
which you deem ne cessary for the operation of the equip m ent in your operatin g environment.
Warnin g
To prevent serious injury or death from dangerous voltages, use extreme
caution when handling, testing, and adjusting this equipment and its
components.
Page 4
Flammability
!
Caution
!
Caution
Attention
!
Vorsicht
!
All Motorola PWBs (printed wiring boards) are manufactured with a flammabilit y rating
of 94V-0 by UL-recognized manufacturers.
EMI Caution
Caution
This equipment generate s, uses a nd can ra diate elect romagnet ic ene r gy. It
may cause or be susceptible to electromagnetic interference (EMI) if not
installed and used with adequate EMI protection.
Lithium Battery Caution
This product contains a lithium battery to power the clock and calendar circuitry.
Caution
Caution
Caution
Danger of explos ion if batt ery is repla ced incorr ectly . Repla ce battery o nly
with the same or equivalent type recommended by the equipment
manufacturer. Dispose of used batteries according to the manufacturer’s
instructions.
Il y a danger d’explosion s’il y a remplacement incorrect de la batterie.
Remplacer uniquement avec une batterie du même type ou d’un type
équivalent recommandé par le constructeur. Mettre au rebut les batteries
usagées conformément aux instructions du fabricant.
Explosionsgefahr bei unsachgemäßem Austausch der Batt er ie. Ersatz nur
durch denselben oder einen v om Hersteller empfohlene n Typ. Entsor gung
gebrauchter Batterien nach Angaben des Herstellers.
Page 5
CE Notice (European Community)
Motorola Compute r Group pro ducts wi th the CE mar king co mply with the EMC Dir ective
(89/336/EEC). Compliance with this directive implies conformity to the following
European Norms:
EN55022 “Limits and Methods of Meas urement of Radio Int erferen ce Chara cteri stic s
of Information Technology Equipment”; this product tested to Equipment Class B
EN55024 “Information te chnology equipment—Immunity char acteristics—Limits and
methods of measurement”
Board products are tested in a representative system to show compliance with the above
mentioned requirements. A proper installation in a CE-marked system will maintain the
required EMC performance.
In accordance with European Community directives, a “Declaration of Conformity” has
been made and is available on request. Please contact your sales representative.
Notice
While reasonable efforts have been made to assure the accuracy of this document,
Motorola, Inc. a ssumes n o lia bility r esulti ng from any omissio ns in this docu ment, or from
the use of the information obtained therein. Motorola reserves the right to revise this
document and to ma ke c hanges from time to ti me in t he content hereof without obligation
of Motorola to notify any person of such revision or changes.
Electronic versions of this material may be read online, downloaded for personal use, or
referenced in another document as a URL to the Motorola Computer Group website. The
text itself may not b e published commerci ally in print o r electronic for m, edited, transla ted,
or otherwise altered with out the permission of Moto rola, Inc.
It is possible th at t hi s publication may contain ref erence to or information abou t Motorola
products (machines and pr ograms), progra mming, or services that are not av ailable in your
country. Such references or information must not be construed to mean that Motorola
intends to announce such Motorola products, programming, or services in your country.
Page 6
Limited and Restricted Rights Legend
If the documentation contained herein is supplied, directly or indirectly, to the U.S.
Government, the following notice shall apply unless otherwise agreed to in writing by
Motorola, Inc.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in
subparagraph (b)(3) of t he Rig hts i n Technic al Dat a cl ause a t DFARS 252.2 27-7013 (Nov.
1995) and of the Rights in Noncommerc ial Computer Software and Docume ntation c lause
at DFARS 252.227-7014 (Jun. 1995).
Motorola, Inc.
Computer Group
2900 South Diablo Way
Tempe, Arizona 85282
Page 7
About This Manual
Overview of Contents .............................................................................................. xiii
Comments and Suggestions ......................................................................................xiv
Conventions Used in This Manual .............................................................................xv
T ab le C-3. Related Specifications ...................................... ...... ...............................C-3
xi
Page 12
Page 13
About This Manual
This manual provides information on hardware preparation and
installation for the VP22 microATX motherbo ard (hereinafter referre d to
as the VP22). In addition, it also provides the features and specifications
applicable to the motherboard.
For BIOS information and programming details for the VP22
motherboard, refer to the VP22 microATX Motherboard BIOS and
Programmer’s Reference Guide, listed in Append ix C, Rela te d
Documentation.
The information in this manual applies to model numbers listed in the
following table.
Model NumberDescription
All models include: Ethernet, three DIMM sockets, four PCI slots, two EIDE
ports, video and audio interfaces, two async serial ports and two USB ports.
VP22-566C566 MHz Celeron processor with heatsink option
VP22-733P733 MHz Pentium III processor with heatsink
option
VP22-866P866 MHz Pentium III processor with heatsink
Overview of Contents
This manual is divided into the following chapters and appendices:
Chapter 1, Hardware Preparation and Installation, provides
information on hardware preparation and installation for the VP22
motherboard.
Chapter 2, Functional Description, describes the VP22 motherboard
computer on a block diagram level.
option
xiii
Page 14
Chapter 3, Connector Pin Assignments, summarizes the pin
assignments for I/O and power cable interconnect signals on the VP22
motherboard.
Appendix A, Specifications, lists the power requirements and other
specifications for the VP22 motherboard.
Appendix B, Thermal Analysis, provides information to conduct
thermal evaluations and identifies thermally significant components
along with their maximum allowable operating temperatures.
Appendix C, Related Documentation, lists all documentation related
to the VP22 motherboard.
Comments and Suggestions
Motorola welcomes and appreciates your comments on its doc umentation.
W e want to know wh at you think about our manuals and how we can make
them better. Mail comments to:
Motorola Computer Group
Reader Comments DW164
2900 S. Diablo Way
Tempe, Arizona 85282
xiv
You can also submit comments to the following e-mail address:
reader-comments@mcg.mot.com
In all your correspondenc e, pleas e list your name, pos itio n, and company.
Be sure to include the title and par t number of the manual and tell how you
used it. Then tell us your feelings about its strengths and weaknesses and
any recommendations for improvements.
Page 15
Conventions Used in This Manual
The following typographical conventions are used in this document:
bold
is used for user inpu t that you t ype just as i t appears ; it is al so used for
commands, options and arguments to commands, and names of
programs, directories and files.
italic
is used for names of variables to which you assign values. Italic is also
used for comments in screen dis plays and examples, and to introdu ce
new terms.
courier
is used for system output (for example, screen displays, reports),
examples, and system prompts.
<Enter>, <Return> or <CR>
represents the carriage r eturn or Enter key.
Ctrl
represents the Control key. Execute control characters by pressin g the
Ctrl key and the letter simultaneously, for example, Ctrl-d.
xv
Page 16
Page 17
1Hardware Preparation and
Introduction
The VP22 is a standard microATX form factor motherboard that supports
a single Pentium
side bus) on the Intel 815E chipset with integrated graphics. This
motherboard is targeted to run Windows NT
and VxWorks
Features of the full-function VP22 include the following:
❏Single Intel PGA370 Pentium III or Celeron microprocessor
❏Inte l 815E chips et with support for 66/100/133 pr ocessor -side bus
❏256MB of L2 cache (Pentium III), 128MB of L2 cache (Celeron)
❏Three 168-pin DIMM sockets for 32MB to 512MB PC133
❏Four 32-bit, 33 MHz PCI expansion slots
❏One 10BaseT/ 100 Base TX Ethe rne t port
®
SDRAM
Installation
®
III or Celeron™ processor (66/ 100/13 3 MHz pro cessor-
®
, Windows® 2000, Linux®
.
1
❏Two EIDE Ultra DMA/100 hard drive ports
❏Video and audio interfaces
❏Two asynchronous serial ports
❏One peripheral parallel port
❏Floppy port, keyboard port, mouse port and IrDA header
❏Three Universal Serial Bus (USB) ports
❏Hardware monitor
❏Jumper-less operation for selection of processor types and bus
speeds
❏Supported by industry-standard operating systems such as
Windows NT, Windows 2000, Linux and VxWorks
1-1
Page 18
1
Hardware Preparation and Installation
Overview
The following table li sts the th ings you will need to do bef ore you can use
this board and t ells where to find the infor mation you n eed to perform e ach
step. Be sure to read this entire chapter, including all cautions and
warnings, before you begin.
Table 1-1. Startup Overview
What you need to do...Refer to...
Unpack the hardware.Unpacking Guidelineson page 1-2
Configure the hardware by setting
jumpers on the motherboard.
Install the motherboard in the chassis.VP22 Motherboard Installation on page 1-7
Ensure that DIMM memory module(s)
are properly installed on the
motherboard.
If applicable, install a PCI adapter board
on the motherboard.
Connect other equipment you will be
using.
Verify the hardware is installed.Completing the Installati onon page 1-13
Power up the equipment.Refer to the VP22 microATX Motherboard
VP22 Motherboard Preparation on page 1-3
DIMM Memory Installation on page 1-8
PCI Adapter Board Installation (Optional)
on page 1-9
Connection to Peripherals on page 1-11
For more infor mation on optional devices and
equipment, refer to the documentation
provided with the equipment.
BIOS and Programmer’s Reference Guide,
listed in Appendix C, Related
Documentation.
Unpacking Guidelines
NoteIf the shipping carton is damaged upon receipt, request that the
carrier’s agent be pre sent durin g the unpacking and inspection of
the equipment.
1-2Computer Group Literature Center Web Site
Page 19
Hardware Configuration
!
Caution
Unpack the equipment from the shipping carton. Refer to the packing list
and verify that al l items are present. Save the packing materia l for storing
and reshipping of equipment.
1
Caution
Avoid touching areas of integrated circuitry; static discharge can damage
circuits.
Hardware Configuration
To produce the desired configuration and ensure proper operation of the
VP22 motherboard, you may need to carry out certain hardware
modifications before installing the motherboard.
The VP22 provides software control ove r all but one op tion, CMOS clear.
This option is controlled through the manual installation or removal of a
header jumper.
VP22 Motherboard Preparation
Figure 1-1 illustrates the placement of the header, connectors and various
other components on the VP22 motherboard. The only manually
configurable header on the motherboard is l isted in T able 1-2. The header’s
default setting is enclosed in brackets. For the connector pin assignments
on the VP22, refer to Chapter 3, Connector Pin Assignments.
Table 1-2. VP22 Ju mper Settings
JumperFunctionSettings
JP1CMOS Clear[1-2]
2-3
NoteItems in brackets are factory default settings.
The VP22 is factory tested and sh ipped with the configura tion described in
the followin g section.
http://www.motorola.com/computer/literature1-3
Normal
CMOS clear
Page 20
1
Hardware Preparation and Installation
CN2CN1
PCI 4
JP1
CN9
CN15
FN2FN3
BT1
U13
U15
U1
X1
PCI 3
PCI 2
U14
CN13CN14
BZ1
PCI 1
CN8
PH1 PH2 PH3
CN6
U7
DIMM1
DIMM2
DIMM3
CN10
CN12
CN17
CN16
CN5
U6
X2
U10
X4
L22
U16
CN7
CN4
O1O3
O1
U9
CN11
Q5
L23
CN3
FN1
Figure 1-1. VP22 Motherboard Layout
1-4Computer Group Literature Center Web Site
Page 21
CMOS Clear Header (JP1)
The CMOS Clear function is controll ed by a 3-pin header . Putting a jumper
on JP1 pins 1-2 is the no rmal se tting and put ting a jumper o n JP1 pin s 2-3
clears the CMOS. The default setting is with a jumpe r installed on pi ns 1-2.
CMOS Clear Header (JP1)
1
JP1
3
2
1
CMOS Clear
JP1
3
2
1
Normal
(factory configuration) (factory configuration)
If you encounter any of the f ollowing, you ca n reconfigure the system wi th
the default values stored in the ROM BIOS.
❏CMOS data becomes corrupted
❏You forgot the supervisor or user password
❏You are unable to boot-up the computer system because the
processor’s clock/ratio was incorrectly set in the BIOS
To load the d efault value s stored in the ROM BIOS, follow the steps
below:
1. Power off the system.
2. Remove jumper from JP1 pins 1-2 and put on JP1 pins 2-3. Wait
for a few seconds and set JP1 back to its default setting, pins 1-2.
3. Power on the system.
4. After powering on the system, press <Del> to enter the BIOS
setup utility. Refer to the VP22 microATX Motherboard BIOS and
Programmer’s Reference Guide for more information.
http://www.motorola.com/computer/literature1-5
Page 22
1
Use ESD
Wrist Strap
!
Warning
Hardware Preparation and Installation
Hardware Installation
The following sections discuss the placement of adapter boards on the
VP22 motherboard, the instal lation of the complete VP22 assembly int o an
ATX chassis, and the system considerations relevant to the installation.
Before installing the VP22 board, ensure that the header jumper is
configured as desired.
Installation Preliminaries
This section applies to all hardware installations you may perform on
VP22 motherboards.
ESD
Motorola strongly recommends that you use an a ntistatic wrist stra p and a
conductive foam pad when installing or upgrading a system. Electronic
components, such as d isk dr ives, c omputer boards , and memor y modules ,
can be extremely sensitive to electrostatic discharge (ESD). After
removing the component from its protective wrapper or from the system,
place the componen t flat on a grounded, static -free surface (an d, in the case
of a board, component side up). Do not slide the component over any
surface.
If an ESD station is not available, you can avoid damage resulting from
ESD by wearing an antistatic wrist strap (available at electronics stores)
that is attached to an active electrical ground. Note that a system chassis
may not be grounded if it is unplugged.
Warnin g
To prevent serious injury or death from dangerous voltages, before
connecting peripheral s, disconnect the power cord from the power source.
Only qualified, experienced electronics personnel should access the
interior of a system.
1-6Computer Group Literature Center Web Site
Page 23
VP22 Motherboard Installation
!
Caution
!
Warning
!
Caution
To install a VP22 motherboard in your chassis, follow the procedure
below.
1.Attach an ESD strap to your wrist. Attach the other end of the ESD
strap to an electrical ground (refer to Installation Preliminaries). The
ESD strap must be secur ed to your wrist a nd to grou nd througho ut the
procedure.
2.Ensure that the AC or DC power is switched off and remove the AC
cord or DC power lines from the system.
VP22 Motherboard Installation
1
Caution
Inserting or removing modules with power applied may result in
damage to module components.
Warnin g
Dangerous voltages, capable of causing death, are present in this
equipment. Use extreme caution when handling, testing, and
adjusting.
3.Remov e the chass is cover. If necessary , loose n or temporar ily remove
chassis components (power suppl y, fans, etc.) as needed for access to
the interior of the chassis.
4.I nstall meta l standof fs on the floor o f the chass is in alig nment with the
VP22 motherboard mounting holes. Use as many standoffs as fe asible.
Caution
Avoid touching areas of integrated circuitry; static discharge can
damage these circuits.
5.Set the VP22 motherboard on the chassis standoffs and start the
screw(s) provided into the standoffs, without tightening them
completely.
6.With all screws in place, tighten them snugly.
http://www.motorola.com/computer/literature1-7
Page 24
1
!
Caution
Hardware Preparation and Installation
DIMM Memory Installation
DIMM modules install into the DIMM 1, DIMM 2 and DIMM 3 sockets
on the VP22 motherboard. To install the DIMM memory, refer to the
procedure and figure below.
1.Attach an ESD strap to your wrist. Attach the other end of the ESD
strap to the chassis as a ground (refer to Installation Preliminaries on
page 1-6). The ESD stra p must be secu red to your wrist and to g round
throughout the procedure.
2.Perf orm an operating sys tem shutdown. T urn the AC or DC power of f
and remove the AC cord or DC power line s from the syst em. Remove
chassis or system cover (s ) as neces sary fo r acces s to t he motherb oard.
Caution
1-8Computer Group Literature Center Web Site
Removing modules with power applied may result in damage to
module components.
Page 25
PCI Adapter Board Installation (Optional)
!
Warning
!
Caution
1
Warnin g
Dangerous voltages, capable of causing death, are present in this
equipment. Use extreme caution when handling, testing, and
adjusting.
Caution
Avoid touching areas of integrated circuitry; static discharge can
damage these circuits.
3.Gently spread the release tabs on each side of the memory socket.
NOTCH
PIN 1
PIN 72
RELEASE TABS
4.Gen tly press the DIMM into the m emory socket until the tab s snap into
place.
5.Repeat this procedure for all other DIMMs you want to install.
PCI Adapter Board Installation (Optional)
PCI adapter boards are instal led int o PCI 1, PCI 2, PCI 3, and PCI 4 slots
on the VP22 motherboard. To install PCI adapter boards, proceed as
follows:
1.Attach an ESD strap to your wrist. Attach the other end of the ESD
strap to the chassis as a ground (refer to Installation Preliminaries on
http://www.motorola.com/computer/literature1-9
Page 26
1
!
Caution
!
Warning
!
Caution
Hardware Preparation and Installation
page 1-6). The ESD stra p must be secu red to your wrist and to g round
throughout the procedure.
2.Perf orm an operating sys tem shutdown. T urn the AC or DC power of f
and remove the AC cord or DC power line s from the syst em. Remove
chassis or system cover (s ) as neces sary fo r acces s to t he motherb oard.
Caution
Inserting or removing modules with power applied may result in
damage to module components.
Warnin g
Dangerous voltages, capable of causing death, are present in this
equipment. Use extreme caution whe n handlin g, testi ng, and adj usting
Caution
Avoid touching areas of integrated circuitry; static discharge can
damage these circuits.
3.Remove the PCI filler from the chassis.
1-10Computer Group Literature Center Web Site
Page 27
Connection to Peripherals
4.Install the PCI adapter board into one of the PCI slots.
1
Connection to Peripherals
When the VP22 motherb oard is inst alled in a ch assis and modules are
installed on the VP22, you are ready to connect peripherals and apply
power to the board.
Figure 1-1 on page 1-4 shows the locations of the vario us cable connectors.
They are al so listed in Table 1-3 with the rest of the connectors.
http://www.motorola.com/computer/literature1-11
Page 28
1
Hardware Preparation and Installation
For the pin assignments of the connectors listed, refer to Chapter 3,
Connector Pin Assignments.
Table 1-3. VP22 Board Connectors
ConnectorFunction
I/O Panel Connectors
CN1SVGA panel connector
CN2COM1 serial port panel conne ctor
CN3Keyboard/mouse panel connectors
CN4Parallel port panel connector
CN5Dual Universal Serial Bus (USB) panel connectors
Ethernet panel connector
PH1Audio MIC IN panel connector
PH2Audio LINE IN panel connector
PH3Audio LINE OUT panel connector
Board Surface Connectors
CN6CD-IN board connector
CN7COM2 serial board connector
CN8Secondary IDE board connector
CN9Temperature sensor board connector
CN10Primary IDE bo ard connecto r
CN11ATX power boar d connector
CN12Floppy disk drive board connector
CN13IrDA boar d connector
CN14Front panel board connector
CN15Open chassis alarm board connector
CN16Compact fl oppy disk drive board connector
CN17Internal Universal Serial Bus (USB) board connector
Verify that hardware is installed and the power/peripheral cables
connected are appropriate for your system configuration.
Replace the chassis or syste m cover, re connect the system to the AC or DC
power source, and turn the equipment power on.
Processor Removal and Replacement
Microprocessors in Motorola board products are factory-installed and
tested to ensure proper operation under board-specific BIOS software
within specified power and cool ing requirements. Fiel d re placement of t he processor is not recommended. A processor of a different type or with a
different stepping mask may not be supported by the BIOS. Also, faster
processors may alter cooling and power requirements beyond
specifications.
http://www.motorola.com/computer/literature1-13
Page 30
1
Warning
!
Warning
Hardware Preparation and Installation
Motorola is continually improving its products to use the latest processor
speeds and technologies as they become available. If your application
requires a different processor, consult your local Motorola representative.
Replacing Lithium Batteries
Follow these safety rules for proper battery operation and to reduce
equipment and personal injury hazards when handling lithium batteries.
Use the battery for its intended application only.
NoteDo not recharge, open, puncture or crush, incinerate, expose to
high temperatures or dispose of in your general trash collection.
T o replace the lithium battery , observe the following gu idelines and follow
the steps below.
NoteWhen replacing the battery, power must be applied to the board
to prevent data loss.
Warnin g
To prevent serious injury or death from dangerous voltages, use extreme
caution when handling, testing, and adjusting this equipment and its
components.
Warnin g
Lithium batteries incorporate flammable materials such as lithium and
organic solvents . If lithium batter ies are short -circuited or ex posed to high
temperature or pressure , they may burst open and ignite, possibly resulting
in injury and/or fire. When dealing with lithium batteries, carefully follow
the precautions listed below in order to prevent accidents.
❏Do not short-circuit.
❏Do not disassemble, deform, or apply excessive pressure.
❏Do not heat or incinerate.
❏Do not apply solder directly.
❏Do not use different models, or new and old batteries together.
1-14Computer Group Literature Center Web Site
Page 31
❏Do not charge.
!
Caution
Caution
Use ESD
Wrist Strap
❏Always check proper polarity.
Replacing Lithium Batteries
1
Caution
Danger of explosion if battery is replaced incorrectly.
Replace battery only with the same or equivalent type recommended by
the equipment manufacturer. Dispose of used batteries according to local
regulations and manufacturer’s instructions.
Caution
Avoid touching areas of integrated circuitry; static discharge can damage
circuits.
ESD
Attach an ESD strap to your wrist. Attach the other end of the ESD strap
to an electrical gr ound. (Note tha t the system chass is may not be gr ounded
if it is unplugged.) The ESD strap must be secured to your wrist and to
ground throughout the procedure.
1.To remove the battery from the module, carefully pull th e battery from
the socket.
2.Before installing a new battery, ensure that the battery pins are clean.
3.Note the battery polarity and press the new battery into the socket.
NoteWhen the battery is in the socket, no soldering is required.
4.Rec ycle or dispose of the old bat tery according to local re gulations and
manufacturer’s instructions.
http://www.motorola.com/computer/literature1-15
Page 32
Page 33
2Functional Description
Introduction
This chapter describes the VP22 motherboard on a block diagram level.
The General Description provi de s an ove rvi ew of t he VP22, followed by
a detailed description of several blocks of circuitry. Figure 2-1 shows a
block diagram of the overall board architecture.
2
Socket 370
Processor
SVGA
1600 X 1200
256 colors
10/100 Ethernet
EIDE A
ATA/100
EIDE B
USB A
USB B
USB C
AC97
IEEE-1284
EIA-232
EIA-232
Keyboard
& mouse
Analog Video
Intel
82815E
82801BA
I/O
Controller
Hub2
(ICH2)
LPC Bus
33 MHz, 32-bit PCI Bus
82802BA
Firmware
Hub
LPC
Super I/O
83627HF
Figure 2-1. VP22 Block Diagram
Floppy
IrDA
Three 168-pin, 3.3V
DIMM sockets
PCI Slot
PCI Slot
PCI Slot
PCI Slot
Legend
Rear panel I/O
On-board header
2-1
Page 34
Functional Descr iption
2
Features
The following table lists the features of the VP22 motherboard.
Table 2-1. VP22 Motherboard Features Summary
FeatureDescription
Microprocessor–Single Intel PGA370 socket Pentium III or Celeron processor
–66/100/133 MHz front-side bus (FSB) frequency
L2 cache memory–256KB on-die Advanced Transfer Cache (ATC) for the Pentium III
processor
–128KB on-die ATC for the Celeron processor
DRAM–Three 168-pin DIMM sockets, 3.3V, with serial presence detect (SPD)
–SDRAM (PC133) at 133 MHz FSB
–Unbuffered, non-ECC (no parity)
–Supports 16/32/64/128/256 MB DIMM types
–Hardware monitor (83627HF) allowing software to monitor
temperature, fans and voltage
PCI interface–Four PCI expansion slots
–32-bit data, 33 MHz operation
Audio–AC ’97 compliance
Graphics–SVGA interface at rear I/O
Form Factor–Standard microATX
2-2Computer Group Literature Center Web Site
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General Description
Table 2-1. VP22 Motherboard Features Summary (continued)
FeatureDescription
BIOS–Support for 4/8 Mbit in 82802BA Firmware Hub
Timers–Three interval timers
Onboard Peripheral
Support
Miscellaneous–Reset switch input on planar header
–Two EIDE Ultra DMA/100 hard drive ports
–T wo asynchronous serial ports
–10BaseT/100BaseTX Ethernet interface
–IEEE-1284 parallel port
–PS/2 keyboard/mouse por ts
–Floppy drive port
–Three USB ports
–IrDA header
–Open chassis alarm connector
–Three fan connectors
General Description
2
The VP22 is a microA TX for m factor motherboard. It hosts the Penti um III
or Celeron processor with the Intel 815E chipset for cost-effective
performance. Standar d onboard payload includes f our 32-bit, 33 MHz PCI
expansion slots, three 168-pin DIMM sockets for PC133 SDRAM, one
10/100BaseTX Ethernet po rt, a peripheral parallel port, on e asynchronous
serial port, video and audio ports, keyboard/mouse and two USB ports.
There are headers on the board for an asynchron ous serial port, floppy port,
IrDA port, internal USB port and two EIDE ports.
As implemented on the VP22, the 815E chipset includes a Graphics
Memory Controller Hub (GMCH), an I/O Controller Hub2 (ICH2) and a
Firmware Hub (FWH).
http://www.motorola.com/computer/literature2-3
Page 36
Functional Descr iption
2
VP22 Processor
The VP22 motherboard sup ports a singl e Intel PGA370 s ocket Pentium III
or Celeron processor. The Pentium III has a FSB speed of 100/133 MHz
and the Celeron has a FSB speed of 66 MHz. The 815E chipset keeps the
FSB operation at 66/100/133 MHz (auto-selected).
System Memory
The VP22 motherboard supports synchronous DRAM memory and
accepts the standard (unbuffered) SDRAM DIMM memory. SDRAM
speed, type and size is determined by the BIOS reading the DIMM
presence detect bits on the SMBus (System Management Bus). The
SDRAM timing register, which provides the DRAM speed contr ol for th e
entire array, must be programmed to use the timings of the slowest
DRAMs installed.
This motherboard supports up to 512MB of SDRAM memory with three
168-pin DIMM sockets. It suppo rts 3.3 V single- or double-si ded DIMMs
and the individual SDRAMs on the DIMMs must be (x8) or (x16) parts;
(x4) parts are not supported. The DIMM sockets can be populated in any
order. SDRAM operation at 133MHz and 100MHz is supported.
L2 Cache
The Pentium III has an on-die 256KB L2 Advanced Transfer Cache
(ATC). The on-die cache has a 256-bit data bus from the processor core.
The Celeron has 128KB L2 ATC.
Universal Serial Bus
Three Universal Serial Bus (USB) ports are supported on the VP22
motherboard; two USB ports are located at the rear panel and one 5-pin
header is onboard for internal use. USB allows for the easy addition of
peripherals such as a mouse, keyboard, speakers, etc. Transfer rates up to
12Mb/s are supported. The 12Mb/s high-speed connection requires
shielded cables.
2-4Computer Group Literature Center Web Site
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PCI Expansion Slots
The VP22 provides the stan dard 0.5 A a t 5 V to t he peri phera ls. Power on
each USB port is prot ected by a single pol yswitch fuse (size 6 V/ 1.1 A, this
current rating allows for inrush currents). Additional ports can be added
through the use of an external USB hub.
PCI Expansion Slots
The VP22 supports four 32-bit, 33 MHz PCI expansion slots. These are
+5 V signaling slots that accommodate either +5 V or universal PCI
boards.
Ethernet Interface
The VP22 provides a 10/100BaseTX Ethernet transceiver interface using
an Intel 82562EM integrated Ethernet device. The Ethernet interface is
accessed via an industry-standard, rear-panel-mounted RJ-45 connector.
The 82562EM chip is assigned an Ethernet Station Address. The address
is unique for each board (assembly) and is displayed on a label affixed to
the board. In addition, the Ethernet address is stored in the configuration
ROM interfaced to the 82562EM Ethernet device.
The Ethernet interface on the rear panel of the VP22 motherboard is
accompanied by two LED indi cators. Table 2-2 details the functionality of
each indicator.
2
Table 2-2. Ethernet LED Functions
IndicatorStatusFunction
LED 1: Activity
(Amber)
LED 2: Link Status
(Green)
http://www.motorola.com/computer/literature2-5
BlinkingData transfer in progress
OFFNo data transfer
ONLink
OFFOff line
Page 38
Functional Descr iption
2
Super I/O Device
The VP22 uses the Super I/O (SIO) device to provide two asynchronous
serial ports, a peripheral parallel port, a PS/2 floppy port, PS/2
keyboard/mouse ports and an IrDA header.
Asynchronous Serial Ports
Two 16550-compatible asynchronous serial ports are supported on the
VP22 motherboard. The EIA-232 drivers and receivers reside onboard.
COM1 is routed to an industry-standard DB-9 connector accessible from
the rear panel an d COM2 is routed t o an optional 10-pin header . Bo th ports
are configured as DTE. Maximum data rate on any port is 115.2K baud.
Firmware initializes the two serial ports as COM1 and COM2 with ISA I/O
base addresses of 3F8h and 2F8h respectively. This default configuration
also assigns COM1 to IRQ4 and COM2 to IRQ3.
Peripheral Parallel Port
All parallel I/ O interf ace signa ls are r outed to an indust ry-sta ndard DB-25
connector, accessible from the rear panel. This port supports the full
IEEE-1284 capability, which provides the basic printer interface.
Firmware initializes the parallel port as LPT1 with ISA I/O base address of
378h. This default configuration also assigns the parallel port to IRQ7.
PS/2 Floppy Port
The floppy port is confi gured for PS/2 compatibility a nd supports bot h the
legacy 34-pin header and the compact f loppy disk drive (FDD) co nnector.
Up to two floppy drives are supported.
Keyboard and Mouse Ports
Two 6-pin circular DIN connectors are located on the rear panel of the
VP22 motherboard for the keyboard and mouse connections. The power
provided to the keyboard and mouse is protected by a polyswitch rated at
1.1 A.
2-6Computer Group Literature Center Web Site
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Interval Timers
Interval Timers
The voltage regulat or has thr ee count ers t hat are typica ll y progra mmed to
provide the following functions:
❏Counter 0 is associated with IRQ0 and can be used for system
timing functions, such as timer interrupt for a time-of-day.
❏Counter 1 is used to g enerate a re fresh request signal fo r ISA
memory every 15.6 us.
❏Counter 2 is typically programmed to provide a speaker tone.
Real-Time Clock and NVRAM
The real-time clock provides a century calendar, as well as a time-of-day
function. In addition , 256 bytes of battery-backed RAM is available for use
by the BIOS. A separate 3 V coin cell battery provides battery-backup.
BIOS
The VP22 supports the Intel 82802BA Firmware Hub (FWH). A boot
block device allows recovery of the BIOS in the event of a catastrophic
failure (power fail during BIOS update). Flash write protection is
implemented under so ftware control and this bit must be set to 1 before any
write is allow ed to the BIOS Flash. For mor e information o n the VP22
motherboard’ s BI OS, refer to the VP22 mi cr oA TX Motherboar d BIOS and
Programmer’s Reference Guide, listed in Append ix C, Rela te d
Documentation.
2
Audio Interface
The VP22 provides a two channel, multimedia audio device capable of
Audio Codec ’97 (AC ’97). Three connectors are available on the rear
panel: MIC IN, LINE IN and LINE OUT.
http://www.motorola.com/computer/literature2-7
Page 40
Functional Descr iption
2
Video Interface
Standard SVGA analog output i s available on the r ear I/O panel. The video
function is provided via the Intel 8 2815 Graphics Memory Cont roller Hub
(GMCH). The BIOS must have a selection in the CMOS setup to disable
the onboard video to allow the user t o use a PCI video as the primary video
controller. The BIOS must also have a selection in the CMOS setup to
disable the onboard video to allow the user to reclaim the memory for
applications without having to add another video card.
Reset
The VP22 has a circuit that monitors system power and provides the
PWROK signal to the 82801BA I/O Controller Hub2 (ICH2). This circu it
distributes the res et to the rest of the boa rd by generating the CPU, PCI and
IDE resets. This board can also be reset by an external switch that is
connected to an onboard header.
Environmental Monitoring
The Winbond 83627HF hardware monitor device on the VP22
motherboard provides a number of useful system management features.
These features include temperature, fan and voltage monitoring. The
hardware monitor allows software to monitor voltages with its analog-todigital converters. An alarm sounds when the system voltage is ±10
percent.
CPU Temperature Monitor
An internal Pentium III thermal sensor monito rs microprocess or
temperature. An overtemperature condition produces an alarm signal.
Open Chassis Alarm
The VP22 implements an open chassis circuit that can latch an open
chassis event even when the system is turned off, as long as battery or
standby power is still present. The open chassis interrupt is fed into the
83627HF hardware monitor chip. This circuit can only be reset via
2-8Computer Group Literature Center Web Site
Page 41
Environmental Monit oring
software using SMI# Mask Register 2, as described in the 83627HF data
sheet that is listed in Appendix C, Related Documentation.
Watchdog Timer
A watchdog timer is embedded in the 83627HF hardware monitor chip.
The watchdog timer is an 8-bit counter with one second resolution. The
watchdog has either a one second granularity up to 255 seconds or a one
minute granularity up to 255 minutes. The watchdog output is connected
to reset.
2
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Page 42
Page 43
3Connector Pin Assignments
Connector Pin Assignments
This section summarizes the pin assignments for I/O and power cable
connectors on the VP22 motherboard.
Ethernet interfaceOne RJ-45 connector on rear panel
Serial port interface
(asynchronous)
Parallel port interfaceOne 25-pin D-sub on rear panel
USB interfaceTwo Type A connectors on rear panel and
Operating
Non-operating
Nonoperating
Length9.6 inches (244 mm)
0° C to 60° C (32° F to 140° F)
C to 85° C (–40° F to 185° F)
−40°
–500 to 5,000 m (–1,640 to 16,404 ft.)
–500 to 15,000 m (–1,640 to 49,213 ft.)
5% to 95% (noncondensing)
5% to 95% (noncondensing
0.5 G peak fr om 10 to 1000 Hz r andom
6.0 G peak fr om 10 to 1000 Hz r andom
One DB-9 connector on rear panel and one
10-pin header
one header onboard
Keyboard interface6-pin D-sub on rear panel
Mouse interface6-pin D-sub on rear panel
A-2Computer Group Literature Center Web Site
Page 55
BThermal Analysis
B
Board component temperatures are affected by ambient temperature, air
flow, board electrical operation, and software operation. In order to
evaluate the thermal perf ormance of a circuit board assembly, it is
necessary to test the board under actual operating conditions. These
operating conditions vary depending on system design.
While Motorola Computer Group (MCG) performs thermal analysis in a
representative system to verify operation within specified ranges (see
Appendix A, Specific ations), you should evaluate the thermal performance
of the board in your application.
This appendix provides sys tems integrators with inf ormation which can be
used to conduct thermal evaluations of the board in their specific system
configuration. It identifies thermally significant components and lists the
corresponding maximum allowa ble component oper ating temperat ures. It
also provides example procedures for component-level temperature
measurements.
Thermally Significant Components
The following table summarizes components that exhibit significant
temperature rises. These are the components that should be monitored in
order to assess thermal performance. The table also supplies the
component reference designator and the maximum allowable operating
temperature.
You can find components on the board by their reference designators as
shown in Table B-1 and Figure B-1. Versions of the board that are not fu lly
populated may not contain some of these components.
The preferred measurement location for a component may be junction,
case, or air as specified in the tabl e. Junction temperature refers to the
temperature measured by an on-chip thermal device. Case temperature
B-1
Page 56
Thermal Analysis
B
refers to the temperature at the top, center surface of the component. Air
temperature refers to the ambient temperature near the component.
NoteAll of the thermally significant components are located on the
primary side of the VP22 motherboard.
B-2Computer Group Literature Center Web Site
Page 57
Component Temperature Measurement
U1
U7
U10
U14
U15
U9
B
Figure B-1. Thermally Significant Components—Primary Side
Component Temperature Measurement
The following secti ons outline general t emperature measurement methods.
For the specific typ es of measu rements req uired for ther mal ev aluat ion of
this board, see Table B-1.
Preparation
We recommend 40 AWG (American wire gauge) thermocouples for all
thermal measurements. Larger gauge thermocouples can wick heat away
from the components and disturb air flowing past the board.
http://www.motorola.com/computer/literatureB-3
Page 58
Thermal Analysis
B
Allow the board to reach thermal equ ilibrium before ta king measurements.
Most circuit boards will reach thermal equilibrium within 30 minutes.
After the warm up period, monitor a small number of components over
time to assure that equilibrium has been reached.
Measuring Junction Temperature
Some components have an on-chip thermal measuring device such as a
thermal diode. For instructions on measuring temperatures using the
onboard device, refer to the component manufacturer’s documentation
listed in Appendix C, Rela ted Documentation.
Measuring Case Temperature
Measure the case temperature at the center of the top of the component.
Make sure there is good thermal contact between the thermocouple
junction and the component. We recommend you use a thermally
conductive adhesive such as Loctite 384.
If components are covered by mecha nical parts such as heats inks, you will
need to machine these par ts to route the the rmocouple wire. Make sure tha t
the thermocouple junction contacts only the electrical component. Also
make sure that heatsink s la y fla t on el ectrical components. The following
figure shows one method of machining a heatsink base to provide a
thermocouple routing path.
NoteMachining a heatsink base reduces the contact area between the
heatsink and the electrical component. You can partially
compensate for this effect by filling the m achined areas with
thermal grease. The gr ease should not contact the t hermocouple
junction.
B-4Computer Group Literature Center Web Site
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Thermocouple
junction bonded
to component
Measuring Case Temperature
B
Machined groove for
thermocouple wire
routing
ISOMETRIC VIEW
Through hole for thermocouple
junction clearance (may require
removal of fin material)
Also use for alignment guidance
during heatsink installation
Thermal pad
Machined groove for
thermocouple wire
routing
Heatsink base
HEATSINK BOTTOM VIEW
Figure B-2. Mounting a Thermocouple Under a Heatsink
http://www.motorola.com/computer/literatureB-5
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Thermal Analysis
B
Measuring Local Air Temperature
Measure local component ambient temperature by placing the
thermocouple downstrea m of the component . This method is conservativ e
since it includ es heati ng of the air by the component. The fol lowing f igure
illustrates one method of mounting the thermocouple.
Tape thermocouple wire to
top of component
Thermocouple
junction
Air flow
PWB
Figure B-3. Measuring Local Air Temperature
B-6Computer Group Literature Center Web Site
Page 61
CRelated Documentation
Motorola Computer Group Documents
The Motorola pub lications listed bel ow are refe renced i n this manu al. You
can obtain paper or electronic copies of Motorola Computer Group
publications by:
❏Contacting your local Motorola sales office
❏Visiting Motorola Computer Group’s World Wide Web literature
site, http://www.motorola.com/computer/literature
Table C-1. Motorola Computer Group Documents
C
Document Title
VP22 microATX Motherboard BIOS and
Programmer’s Reference Guide
To obtain the most up-to-date product information in PDF or HTML
format, visit http://www.motorola.com/computer/literature.
Manufacturers’ Documents
For additional information, refer to the following table for manufacturers’
data sheets or user’ s manuals. As an ad ditional hel p, a source for t he listed
Motorola Publication
Number
VP22BIOSA/RM
C-1
Page 62
Related Documentation
document is provided. Please note that, while these sources have been
verified, the information is subject to change without notice.
For additional information, refer to the following table for related
specifications. As an additional help, a source for the listed document is
C-2Computer Group Literature Center Web Site
Page 63
URLs
provided. Please note that, while these sources have been verified, the
information is subject to change without notice.
Table C-3. Related Specifications
Document Title and SourcePublication Number
Peripheral Component Interconnect (PCI) Local Bus Specification,
Revision 2.0, 2.1, 2.2; PCI Special Interest Group;
http://www.picmg.com/
IEEE – PCI Mezzanine Card Specification (PMC)
Institute of Electrical and Electronics Engineers, Inc.
Univers a l Serial Bus (USB)
Intel Corporation;
http://www.intel.com/design/litcentr/
Accelerated Graphics Port Interface Specification, Revision 2.0;
Intel Corporation;
http://www.intel.com/technology/agp/agp_index.htm
PCI Local Bus
Specification
P1386.1 Draft 2.0
297773-001
agp10.pdf
URLs
The following URLs (uniform resource locators) may provide helpful
sources of addition al info rmatio n abou t this pr oduct, rel ated ser vices , and
development tools. Pleas e note that, whil e these URLs have been ver ified,
they are subject to change without notice.
C
❏Motorola Computer Group, http://www.motorola.com/compute r
❏Motoro la Co mpute r Group OEM Services,
replacing 1-14
open chassis alarm 2-8
operating temperatures, maximum B-1
P
parallel port 2-6
PCI adapter board, installation 1-9
PCI slots 2-5
pin assignments 3-1 to 3-10
ATX power connector 3-5
audio LINE IN connector 3-10
audio LINE OUT connector 3-10
audio MIC IN connector 3-10
CD-IN connector 3-3
chassis fan connector 3-9
COM1 serial port connector 3-1
COM2 connector 3-4
compact floppy disk drive
connector 3-8
CPU fan connector 3-9
Ethernet connector 3-3
floppy disk drive connector 3-6
front panel connector 3-7
internal USB 2 connector 3-9
IrDA connector 3-6
keyboard/mouse connector 3-2
open chassis alarm connector 3-8
parallel port connect or 3-2
IN-2Computer Group Literature Center Web Site
Page 67
second fan connector 3-9
secondary/primary IDE connector 3-4
SVGA connector 3-1
temperature sensor connector 3-5
USB0, 1 connector 3-3
pinouts 3-1 to 3-10
power requirements A-1
processor 2-4
remove and replace 1-13
R
real-time clock 2-7
rear I/O connectors A-2
related documentation C-1
related specifications C-2
relative humidity A-2
reset circuit 2-8
suggestions, submitting xiv
T
temperature measurement B-1, B-3, B-4
temperature monitor, CPU 2-8
temperature range A-2
temperatures, component B-1
thermal performance B-1
thermocouple, mounting B-5
timers, programm a ble 2-7
typeface, meaning of xv
U
unpacking guidelines 1-2
URLs (uniform resource locators) C-3
USB (universal serial bus) 2-4
S
SDRAM 2-4
serial ports 2-6
shielded cables 2-4
specifications, board A-1
specifications, related C-2
startup overview 1-2
V
vibration A-2
video interfac e 2-8
W
watchdog timer 2-9
Winbond 83627HF 2-8
I
N
D
E
X
http://www.motorola.com/computer/literatureIN-3
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