Motorola T56LV1 Users manual
APPLICANT MOTOROLA INC. FCC ID: IHDT56LV1
INSTRUCTION MANUAL
A representative version of the user's manual follows:
Exhibit 8
MOTOROLA HSPA LGA Module User Guide
HSPA LGA module (HTM1100-L)
User Guide
DOCUMENT CONTROL NUMBER:
Version No.: 1.0
Date: March 2010
Copyright 2010 Motorola Inc. All rights reserved. This document and the
information contained in it is CONFIDENTIAL INFORMATION of Motorola,
and shall not be used, published, disclosed, or disseminated outside of Motorola
in whole or in part without Motorola’s consent. This document contains trade
secrets of Motorola. Copyright notice does not imply publication of this document.
Motorola Confidential Proprietary – Disclosed Under NDA
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MOTOROLA HSPA LGA Module User Guide
HSPA LGA MODULE (HTM1100-L)........................................................................................................ 1
USER GUIDE ............................................................................................................................................... 1
1. INTRODUCTION............................................................................................................................... 4
1.1 REVISION HISTORY ...................................................................................................................... 4
1.2 PURPOSE ...................................................................................................................................... 4
1.3 SCOPE .......................................................................................................................................... 4
1.4 TARGET AUDIENCE ...................................................................................................................... 4
1.5 ABBREVIATIONS........................................................................................................................... 5
2. REFERENCES.................................................................................................................................... 6
3. PRODUCT OVERVIEW ................................................................................................................... 7
4. HARDWARE ARCHITECTURE..................................................................................................... 8
5. SOFTWARE ARCHITECTURE ...................................................................................................... 9
5.1.1 Inter-Processor Communication........................................................................................... 10
5.1.2 Modem Software Architecture Overview .............................................................................. 10
5.1.3 ARM9 Software Architecture Overview................................................................................ 11
6. HTM1100-L MODULE FEATURE SUMMARY .......................................................................... 12
6.1 HARDWARE REVISION:............................................................................................................... 12
6.2 2G.............................................................................................................................................. 12
6.3 3G.............................................................................................................................................. 12
6.4 ADVANCED SERVICES ................................................................................................................ 12
6.5 AUDIO ........................................................................................................................................ 12
6.6 INTERNAL MEMORY................................................................................................................... 13
6.7 SYSTEM REQUIREMENTS ............................................................................................................ 13
6.8 SECURITY................................................................................................................................... 13
6.9 CONNECTIVITY........................................................................................................................... 13
6.10 POWER UP SEQUENCE ................................................................................................................ 13
7. SPECIFICATIONS........................................................................................................................... 15
7.1.1 Electrical Specification......................................................................................................... 15
7.1.2 Mechanical Specification...................................................................................................... 15
8. LGA MODULE INTERFACES ...................................................................................................... 17
8.1.1 LGA Interface Signals .......................................................................................................... 17
8.1.2 SIM Interface ........................................................................................................................ 20
8.1.3 WWAN_LED......................................................................................................................... 20
8.1.4 Audio Interface ..................................................................................................................... 20
9. COMMUNICATION WITH HOST ............................................................................................... 21
9.1.1 Overview............................................................................................................................... 21
9.1.2 Link Details .......................................................................................................................... 22
9.1.3 Host Modem Wakeup Mechanism......................................................................................... 23
10. AT COMMANDS......................................................................................................................... 25
10.1 LGA MODULE AT COMMAND INTERFACE ALLOWS THE BELOW MENTIONED FUNCTIONALITY ON
HIGH LEVEL USING
10.1.1 Network Connection Management................................................................................... 25
10.1.2 Registration or Mobility Management............................................................................. 26
10.1.3 SMS.................................................................................................................................. 26
10.1.4 USIM and Phonebook...................................................................................................... 26
DIFFERENT AT COMMANDS:....................................................................................... 25
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11. NVM/FLASH................................................................................................................................27
12. RF CALIBRATION/PHASING.................................................................................................. 27
13. PLATFORM VALIDATION...................................................................................................... 28
13.1 RF PERFORMANCE TESTING....................................................................................................... 28
13.1.1 Equipment........................................................................................................................ 28
13.1.2 Equipment list .................................................................................................................. 28
13.1.3 Setup ................................................................................................................................29
14. HARDWARE INSTALLATION................................................................................................ 30
14.1 HTM1100 LGA MODULE REFLOW PROCESS ............................................................................. 30
15. LGA MODULE DRIVER INSTALLATION............................................................................ 32
16. LIVE NETWORK CONNECTION ........................................................................................... 35
16.1 PLUGGING IN THE CARD IN PC.................................................................................................... 35
16.2 SETTING UP DIAL UP NETWORKING (DUN) CONNECTION USING LGA MODULE AS A MODEM.. 35
17. KNOWN ISSUES......................................................................................................................... 43
17.1 LGA MODULE POWER UP TIMING.............................................................................................. 43
Figure 1: HTM1100-L Bottom Pad view............................................................................ 7
Figure 2: HTM1100 high level block diagram ................................................................... 8
Figure 3: Software Architecture Partitioning...................................................................... 9
Figure 4: Power Management by CPCAP ........................................................................ 14
Figure 5: HTM1100-L Component View and Pad View (Top View).............................. 16
Figure 6: Communication between Host and LGA Module............................................. 21
Figure 7: HTM1100-L Modem interface.......................................................................... 22
Figure 8: GPIO remote wakeup signaling ........................................................................ 24
Figure 9: LGA Module test set up .................................................................................... 28
Figure 10 : LGA module inside Test Socket .................................................................... 31
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MOTOROLA HSPA LGA Module User Guide
1. Introduction
1.1 Revision History
Revision Date Author Description
Customer
1.0 March 2010
1.2 Purpose
This document describes the product design and specification for HSPA LGA
module (HTM1100-L). The HTM1100-L supports multi-mode (2G/3G) with
HSDPA/HSUPA capabilities.
Operations –
Lauren Holmes
(GTJM87)
Initial Draft
1.3 Scope
This document describes platform architecture, hardware/software interactions,
Technical/Electrical Specifications.
1.4 Target Audience
This document is intended to provide design details about HSPA LGA module
(HTM1100-L) to the teams involved in product integration.
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1.5 Abbreviations
AES Advanced Encryption Standard
AGPS Assisted Global Positioning System
AMR-NB Adaptive Multi-Rate Narrow Band
AMR-WB Adaptive Multi-Rate Wide Band
AP Applications Processor
BP Baseband Processor
DES Data Encryption Standard
DDR Double Data Rate
DTM Dual Transfer Mode
DUN Dial Up Networking
EDGE Enhanced Data rate for GSM Evolution
EFR Enhanced Full Rate
FPS Frames-Per-Second
FR Full Rate
GEA GSM Encryption Algorithm
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global System for Mobile communications
HR Half Rate
HS High Speed
HSDPA High-Speed Downlink Packet Access
HSUPA High-Speed Uplink Packet Access
IMEI International Mobile Equipment Identity
IMS IP Multimedia Subsystems
IPC Inter Processor Communications
LGA Land Grid Array
NAND Not AND (electronic logic gate)
OHA Open Handset Alliance
OMA Open Mobile Alliance
OTG On-The-Go
PCI Peripheral Component Interconnect
PMIC Power Management IC
RF Radio Frequency
SAM Stand Alone Modem
SDRAM Synchronous Dynamic Random Access Memory
SIM Subscriber Identity Module
UEA UMTS Encryption Algorithm
UICC Universal Integrated Circuit Card
USB Universal Serial Bus
USIM Universal SIM
W3G Wrigley3G (Motorola 3G baseband processor)
WCDMA Wideband Code Division Multiple Access
WLAN Wireless Local Area Network
WWAN Wireless Wide Area Network
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MOTOROLA HSPA LGA Module User Guide
2. References
HTM1100-L is compliant with 3GPP specification Release6, December 2006 version.
Release 6 specifications can be found at www.3gpp.org
HTM1100-L pads comply with electrical specifications of PCIe Express specification 1.2.
PCIe Express specification 1.2 can be downloaded from
http://www.pcisig.com/specifications/pciexpress/
HTM1100-L USB signals and remote host wake up mechanism comply with USB
specification 2.0. USB2.0 specification can be downloaded from
http://www.usb.org/developers/docs/
JEDEC standards: http://www.jedec.org/
ESD protection is in compliance with JESD22-A114.
Moisture sensitivity level complies with Ref J-STD-020B section 7.
Reflow process is in compliant with J-STD-020C.
Linux source code drivers for HTM1100-L product are available at
http://opensource.motorola.com
Host Modem communication details are provided in the document HTM1100-L Host
Modem Communication 12-17-09 Ver 1-0-1.pdf
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MOTOROLA HSPA LGA Module User Guide
3. Product Overview
HTM1100-L is a LGA module supporting tri-band HSPA and quad-band EDGE/GPRS,
with data rates of up to 10.1Mbps downlink and 5.76Mbps uplink. Signals on LGA
module comply with Electrical spec of PCIe interface Version 1.2.
HTM1100-L is based on a custom 3G baseband processor that was developed by
Motorola. Other main hardware components on this platform are the RF transceiver from
Infineon, the Power Management IC, the RF analog front end and Power amplifiers.
HTM1100-L has internal DDR SDRAM and NAND flash memories, which were
packaged on top of the baseband processor (POP). HTM1100-L uses USB signals to
connect with a PC, netbook or MID.
J
I
H
G
F
E
D
C
B
A
HTM1100-L Bottom View HTM1100-L Bottom view
(Engineering Sample) (Production version)
Figure 1: HTM1100-L Bottom Pad view
J
I
H
G
F
E
D
C
B
A
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4. Hardware Architecture
Figure 2: HTM1100 high level block diagram
.
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MOTOROLA HSPA LGA Module User Guide
_
_
5. Software Architecture
The HTM1100-L module software architecture is based on:
• Linux kernel running on the ARM9 application processor of the W3G.
• Native services running on top of the Linux kernel in the user space.
• Hardware specific adapters, drivers and software stacks.
• A 3GSM Single Core Modem architecture running on the C55x+ DSP of the
W3G.
The following diagram shows a high level overview of the software partitioning:
SmartiUEMD
RF
W 3 G
RF IF
DDR SDRAM
SDRC
9
ARM
Native Services
Android Kernel
C
55
2G/3
G Stack
HSUSB
OTG
ULPI
CPCAP POWER IC
NAND
FLASH
GPMC
SIM IF
L
G
A
N
T
E
R
F
A
C
E
I
+x
GPIO
USB
XVR
UICC
USB
USB
D+
D-
Figure 3: Software Architecture Partitioning
The ARM9 in W3G hosts Linux kernel and some native services that are running
in the user space. The external peripherals that the LGA module supports are
limited to UICC and PCI Express connector which includes USB connectivity
lines. The internal peripherals that W3G supports are limited to DDR SDRAM
and NAND Flash memories, the RF transceiver SmartiUEMD from Infineon and
the CPCAP power management IC.
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5.1.1 Inter-Processor Communication
The Inter-Processor Communication (IPC) infrastructure between the Single Core
Modem and Application Subsystem is made up of a shared RAM between the
ARM9 and the C55x+, and a mailbox mechanism, on top of which the NetMux
software infrastructure exposes virtual channels to client components on both
Application (AP) and Baseband Processor (BP) sides.
5.1.2 Modem Software Architecture Overview
In this platform, the W3G processor includes a C55x+ DSP that runs the whole
2G/3G modem stack (supporting HSDPA/HSUPA) thus leaving the ARM9 fully
dedicated to native services.
This approach enables native services to run on the application processor without
the complexity of mixing hard real-time software (modem) with the applications.
The SCM architecture enables running all the modem functions: 2G and 3G
Signal Processing Layer (SPL) and 2G Stack and 3G stack on the SAM core
(C55x+ core).
Only what is needed to support modem functions is implemented on the C55x+
DSP core.
Interfaces have been split into 3 main domains: SPL, Stack and Infrastructure.
The Single Core Modem Software architecture is composed of the following
elements:
• The Signal Processing Layer (SPL): this software layer implements the
physical layer.
o Uplink signal processing: channel coding and modulation, GSM
convolutional encoding and WCDMA convolutional encoding or
Turbo-encoding.
o Downlink signal processing: GSM equalization, GSM channel
decoding, WCDMA interface/control and WCDMA hardware
accelerators (3G Sub-System).
• Stack component is the component from L1 Control to L3 handling all the
logical part of the GSM/GPRS/EGPRS and WCDMA protocols:
o GSM/GPRS/EDGE protocols: Layer 1, Layer2-Link Access Protocol
on the Dm channel (L2-LAPDm), GPRS Radio Link Control (RLC),
Logical Link Control (LLC) and the Sub-Network Dependent
Convergence Protocol (SNDCP).
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MOTOROLA HSPA LGA Module User Guide
o WCDMA protocols: WCDMA Layer 1, Radio Resource Control
(RRC), WCDMA Radio Link Control (W-RLC), Broadcast Message
Control (BMC) and the Packet Data Convergence Protocol (PDCP).
o Dual Mode protocols: Layer 1, GPRS Radio Resource/Radio Resource
management (GRR/RR/RRC/RRLP), Mobility Management (MM),
GPRS Mobility Manager (GMM), Session Management (SM),
Intelligent Data Router (IDR) and Connection Management (CM),
which consists of Call Control (CC), Supplementary Services (SS) and
Short Message Management (SMS) entities. A new created entity is
the Translation Layer (TL) which allows the 2G/WCDMA Engine
Layer to interface with the AP (especially L3/L4 interface).
The Infrastructure: this is the component providing the low-level mechanisms required by
other SCM entities (Stack, SPL, IPC, AGPS and Audio control). It contains hardware
drivers required by the others components like interrupt, watchdog, GPIO, and also
entities for communicating with the application processor (IPC). Finally, it contains
modules to relay functions to the application processor like NVM proxy, SIM proxy and
Audio Proxy.
5.1.3 ARM9 Software Architecture Overview
The Application Software Architecture uses the MotoAndroid architecture. The
Android Linux kernel is made of the Linux Kernel with some additional patches
including alarm, ashmem, binder, power management, low memory killer, kernel
debugger, and logger. The Linux kernel version is 2.6.27 and includes several
improvements made by OHA to the reference release in kernel.org.
The layers provide a view in which system functionality is increasingly abstracted
from hardware at the bottom layer, towards user functionality at the top layer.
The Linux kernel provides the operating system kernel services. It separates all
higher layers from the device hardware. Android relies on Linux version 2.6.27
for core system services such as security, memory management, process
management, network stack, and driver model. The kernel also acts as an
abstraction layer between the hardware and the rest of the software stack.
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MOTOROLA HSPA LGA Module User Guide
6. HTM1100-L Module Feature Summary
Key capabilities of the LGA module and associated features of the platform are
listed below. The following summary describes some of the platform capabilities.
6.1 Hardware Revision:
6.2 2G
• 3GPP Release 6 December 2006 version compliant
• Quad-band GSM 850/900/1800/1900 MHz
• GPRS Class 12
• EDGE Class 12
• A5/1-3 (unused because no voice) and GEA/1-3 Encryption
• DARP (Downlink Advanced Receiver Performance)
• 2G to 3G handoffs based on 3GPP specification
• Sensitivity (2% BER in voice call): less than -106dBm (-108dBm typical)
• GPRS/EDGE Tx Output power(GMSK): Power Class 4, 33dBm(850 and
900Mhz) and Power Class1, 30dBm(1800MHz and 1900MHz)
• EDGE Tx Power (8-PSK): Power class E2 (27dBm in 850/900 MHz and
26dBm in 1800/1900 MHz)
6.3 3G
• 3GPP Release 6 December 2006 version compliant,
• Frequency Bands
o 850/1900/2100 MHz (Supported)
• WCDMA 384kbps uplink (UL) – 384kbps downlink (DL)
• HSDPA 7.2 / 10.1 Mbps
• HSUPA 1.46 / 2 / 5.76 Mbps
• UEA01, UEA02, UIA1, UIA2 Encryption
• 3G Rx Diversity in all bands
• 3G to 2G handoffs based on 3GPP specification
• Sensitivity (0.1% BER in 12.2k voice call): less than -108dBm (-110dBm
typical)
• Output Power 23dBm
6.4 Advanced Services
• GPS is not supported.
6.5 Audio
• PCM signals are available on the LGA module
• The master Clock is provided by LGA module. Support for Slave Clock will
be available upon request
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• Supports PCM data formats: Word (16-bit) and 4 slots network mode
• Mode 1 will be supported in initial release, Mode 2 is in development (see
section 7.1.3.1)
6.6 Internal Memory
• 64MByte NAND Flash Memory
• 32MByte DDR-333 166 MHz clock SDRAM
6.7 System Requirements
• Linux Android Kernel (2.6.27) in the ARM9 of the W3G
• VTRXmc in the C55x+ of the W3G
6.8 Security
• High Assurance Boot with Multiple Super Root Key Support
• MD5, SHA-1, SHA-256, 3DES, AES 128, RC4, RSA
• Subsidy Lock
• IMEI Protection
6.9 Connectivity
• SIM or UICC (SIM and USIM)
• USB client 2.0 HS Support (PC connectivity)
• 3GDigRF RF interface version 3.07
6.10 Power Up Sequence
The main power management function is performed by Power management IC (CPCAP),
which receives an input voltage of 3.3V.
CPCAP is capable of accepting input voltage in the range of 3V to 4.5V. This input
voltage range is being tested on LGA module.
CPCAP manages all the power requirements on module; it includes 2 bucks, 1 boost and
8 linear regulators.
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MOTOROLA HSPA LGA Module User Guide
Figure 4: Power Management by CPCAP
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