Motorola PZT2907AT1 Datasheet

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Motorola PZT2907AT1 Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by PZT2907AT1/D

PNP Silicon

Epitaxial Transistor

This PNP Silicon Epitaxial transistor is designed for use in linear and switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.

NPN Complement is PZT2222AT1

The SOT-223 package can be soldered using wave or reflow

SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering eliminating the possibility of

damage to the die.

 

COLLECTOR

Available in 12 mm tape and reel

2,4

Use PZT2907AT1 to order the 7 inch/1000 unit reel.

 

 

 

 

Use PZT2907AT3 to order the 13 inch/4000 unit reel.

BASE 1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

EMITTER

MAXIMUM RATINGS (TC = 25°C unless otherwise noted)

 

 

 

 

PZT2907AT1

Motorola Preferred Device

SOT-223 PACKAGE

PNP SILICON

TRANSISTOR

SURFACE MOUNT

1 2

3

CASE 318E-04, STYLE 1

TO-261AA

Rating

Symbol

 

 

Value

 

Unit

 

 

 

 

 

 

 

 

Collector-Emitter Voltage

VCEO

 

± 60

 

 

Vdc

Collector-Base Voltage

VCBO

 

± 60

 

 

Vdc

Emitter-Base Voltage

VEBO

 

± 5.0

 

 

Vdc

Collector Current

IC

 

± 600

 

 

mAdc

Total Power Dissipation @ T = 25°C(1)

P

 

1.5

 

 

Watts

A

D

 

 

 

 

 

mW/°C

Derate above 25°C

 

 

12

 

 

 

 

 

 

 

 

 

 

Operating and Storage Temperature Range

TJ, Tstg

 

± 65 to 150

 

°C

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance Ð Junction-to-Ambient (surface mounted)

RqJA

 

83.3

 

 

°C/W

Lead Temperature for Soldering, 0.0625″ from case

TL

 

260

 

 

°C

Time in Solder Bath

 

 

10

 

 

Sec

 

 

 

 

 

 

 

 

DEVICE MARKING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P2F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

 

 

 

 

 

 

 

Characteristic

Symbol

Min

 

Typ

 

Max

Unit

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector-Base Breakdown Voltage (IC = ±10 mAdc, IE = 0)

V(BR)CBO

± 60

 

°Ð °

 

Ð

Vdc

Collector-Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0)

V(BR)CEO

± 60

 

Ð

 

Ð

Vdc

Emitter-Base Breakdown Voltage (IE = ±10 mAdc, IC = 0)

V(BR)EBO

± 5.0

 

°Ð °

 

Ð

Vdc

Collector-Base Cutoff Current (VCB = ±50 Vdc, IE = 0)

ICBO

Ð

 

°Ð °

 

±10

nAdc

Collector-Emitter Cutoff Current (VCE = ±30 Vdc, VBE = 0.5 Vdc)

ICEX

Ð

 

Ð

 

± 50

nAdc

Base-Emitter Cutoff Current (VCE = ±30 Vdc, VBE = ±0.5 Vdc)

IBEX

Ð

 

Ð

 

± 50

nAdc

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 4

Motorola, Inc. 1996

PZT2907AT1

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)

 

 

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

ON CHARACTERISTICS(2)

 

 

 

 

 

 

DC Current Gain

 

 

hFE

 

 

 

Ð

(IC = ±0.1 mAdc, VCE = ±10 Vdc)

 

75

Ð

Ð

 

(IC = ±1.0 mAdc, VCE = ±10 Vdc)

 

100

Ð

Ð

 

(IC = ±10 mAdc, VCE = ±10 Vdc)

 

100

Ð

Ð

 

(IC = ±150 mAdc, VCE = ±10 Vdc)

 

100

Ð

300

 

(IC = ±500 mAdc, VCE = ±10 Vdc)

 

50

Ð

Ð

 

Collector-Emitter Saturation Voltages

VCE(sat)

 

 

 

Vdc

(IC = ±150 mAdc, IB = ±15 mAdc)

 

Ð

Ð

± 0.4

 

(IC = ± 500 mAdc, IB = ± 50 mAdc)

 

Ð

Ð

±1.6

 

Base-Emitter Saturation Voltages

 

VBE(sat)

 

 

 

Vdc

(IC = ±150 mAdc, IB = ±15 mAdc)

 

Ð

Ð

±1.3

 

(IC = ±500 mAdc, IB = ±50 mAdc)

 

Ð

Ð

± 2.6

 

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

Current-Gain Ð Bandwidth Product (I C = ±50 mAdc, VCE = ±20 Vdc, f = 100 MHz)

fT

200

Ð

Ð

MHz

Output Capacitance (VCB = ±10 Vdc, IE = 0, f = 1.0 MHz)

Cc

Ð

Ð

8.0

pF

Input Capacitance (VEB = ±2.0 Vdc, IC = 0, f = 1.0 MHz)

Ce

Ð

Ð

30

pF

SWITCHING TIMES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Turn-On Time

(VCC = ±30 Vdc, IC = ±150 mAdc,

ton

Ð

Ð

45

ns

Delay Time

td

Ð

Ð

10

 

I

= ±15 mAdc)

 

 

B1

 

 

 

 

 

 

Rise Time

 

 

tr

Ð

Ð

40

 

Turn-Off Time

(VCC = ±6.0 Vdc, IC = ±150 mAdc,

toff

Ð

Ð

100

ns

Storage Time

ts

Ð

Ð

80

 

I

= I = ±15 mAdc)

 

 

B1

B2

 

 

 

 

 

Fall Time

 

 

tf

Ð

Ð

30

 

2. Pulse Test: Pulse Width 300 μs, Duty Cycle = 2.0%.

 

 

 

 

 

 

 

 

± 30 V

 

 

INPUT

 

 

200

INPUT

 

Zo = 50 Ω

 

 

Zo = 50

Ω

 

 

 

PRF = 150 Hz

 

 

 

PRF = 150 Hz

RISE TIME 2.0 ns

 

1.0 k

TO OSCILLOSCOPE

RISE TIME 2.0 ns

 

 

 

 

 

 

RISE TIME 5.0 ns

 

 

0

 

 

0

 

 

 

 

 

± 16 V

50

 

 

± 30 V

 

200 ns

 

 

 

200 ns

+15 V

± 6.0 V

1.0 k

 

37

1.0 k

 

TO OSCILLOSCOPE

 

RISE TIME 5.0 ns

 

 

50

1N916

Figure 1. Delay and Rise

Figure 2. Storage and Fall

Time Test Circuit

Time Test Circuit

2

Motorola Small±Signal Transistors, FETs and Diodes Device Data

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