Motorola PATX3070 User Manual pwr

PATX3070 ATX Motherboard

Installation and Use

PATX3070A/IH1

February 2001

© Copyright 2000, 2001 Motorola, Inc.

All rights reserved.

Printed in the United States of America.

Intel and Pentium and Celeron and MMX are registered trademarks trademarks of Intel
Corporation.

Windows and Windows NT are registered trademarks of Microsoft Corporation.
QNX is a registered trademark of QNX Software Systems Ltd.
LynxOS is a trademark of Lynx Real-Time Systems, Inc.
Linux is a registered trademark of Linus Torvalds.
Adaptec, AIC, and RAIDport are trademarks of A daptec, Inc., which may be registered in

some jurisdictions.
VxWorks is a registered trademark of Wind River Systems, Inc.
SanDisk is a registered trademark and CompactFlash is a trademark of SanDisk

Corporation.
Motorola and the stylized Motorola logo are registered trademarks of Motorola, Inc.

All other product or service names are trademarks or registered trademarks of their
respective owners.

Safety Summary

The following general safety precautions must be observed during all phases of operation, service, and repair of this
equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual could result
in personal injury or damage to the equipment.

The safetyprecautions listed below represent warnings of certain dangers of which Motorola is aware. You, as the user
of the product, should follow these warnings and all other safety precautions necessary for the safe operation of the
equipment in your operating environment.

Ground the Instrument.

To minimize shock hazard, the equipment chassis and enclosure m ust be connected to an electrical ground. If the
equipment is supplied with a three-conductor AC power cable, the power cable must be plugged into an approved
three-contact e lectrical outlet, with the grounding wire (green/yellow) reliably connected to an electrical ground
(safety ground) at the power o utlet. The power jack and mating plug of the power cable meet International
Electrotechnical Commission (IEC) safety standards and local electrical regulatory codes.

Do Not Operate in an Explosive Atmosphere.

Do not operate the equipment in any explosive atmosphere such as in the presence of flammable gases or fumes.
Operation of any electrical equipment in such an environment could result in an explosion and cause injury or damage.

Keep Away From Live Circuits Inside the Equipment.

Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or other
qualifiedservice personnelmay remove equipmentcoversfor internalsubassembly or component replacementor any
internal adjustment. Service personnel should not replace components with power cable connected. Under certain
conditions, dangerous voltages may existeven with the power cable removed. Toavoid injuries, such personnel should
always disconnect power and discharge circuits before touching components.

Use Caution When Exposing or Handling a CRT.

Breakage of a Cathode-Ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion). To prevent
CRT implosion, do not handle the CRT and avoid rough handling or jarring of the equipment. Handling of a CRT
should be done only by qualified service personnel using approved safety mask and gloves.

Do Not Substitute Parts or Modify Equipment.

Do not install substitute parts or perform any unauthorized modification of the equipment. Contact your local
Motorola representative for service and repair to ensure that all safety features a re maintained.

Observe Warnings in Manual.

Warnings, such as the example below, precede potentially dangerous procedures throughout this manual. Instructions
contained in the warnings must be followed. You should also employ all other safety precautions which you deem
necessary for the operation of the equipment in your operating environment.

To prevent serious injury or death from dangerous voltages, use extreme
caution when handling, testing, and adjusting this equipment and its

Warning

components.

Flammability

All Motorola PWBs (printed wiring boards) are manufactured with a flammability rating
of 94V-0 by UL-recognized manufacturers.

EMI Caution

This equipment generates, uses and can radiate electromagnetic energy. It

!

Caution

This product contains a lithium battery to power the clock and calendar circuitry.

!

Caution

may cause or be susceptible to electromagnetic interference (EMI) if not
installed and used with adequate EMI protection.

Lithium Battery Caution

Dangerof explosionif batteryis replaced incorrectly.Replacebattery only
with the same or equivalent type recommended by the equipment
manufacturer. Dispose of used batteries according to the manufacturer’s
instructions.

!

Attention

!

Vorsicht

Il y a danger d’explosion s’il y a remplacement incorrect de la batterie.
Remplacer uniquement avec une batterie du même type ou d’un type
équivalent recommandé par le constructeur. Mettre au rebut les batteries
usagées conformément aux instructions du fabricant.

Explosionsgefahr bei unsachgemäßem Austausch der Batterie. Ersatz nur
durch denselben oder einen vom Herstellerempfohlenen Typ. Entsorgung
gebrauchter Batterien nach Angaben des Herstellers.

CE Notice (European Community)

MotorolaComputer Group products with the CE marking comply with the EMC Directive
(89/336/EEC). Compliance with this directive implies conformity to the following
European Norms:

EN55022 “Limits and Methods of Measurement of Radio Interference Characteristics
of Information Technology Equipment”; this product tested to Equipment Class B

EN50082-1:1997 “ElectromagneticCompatibility—Generic Immunity Standard, Part

1. Residential, Commercial and Light Industry”

System products also fulfillEN60950 (product safety)which is essentiallythe requirement
for the Low Voltage Directive (73/23/EEC).

Board products are tested in a representative system to show compliance with the above
mentioned requirements. A proper installation in a CE-marked system will maintain the
required EMC/safety performance.

In accordance with European Community directives, a “Declaration of Conformity” has
been made and is on file within the European Union. The “Declaration of Conformity” is
available on request. Please contact your sales representative.

Notice

While reasonable efforts have been made to assure the accuracy of this document,
Motorola,Inc. assumes no liability resulting from any omissions in this document, or from
the use of the information obtained therein. Motorola reserves the right to revise this
document and to m ake changes from time to time in the content hereof without obligation
of Motorola to notify any person of such revision or changes.

Electronic versions of this material may be read online, downloaded for personal use, or
referenced in another document as a URL to the Motorola Computer Group website. The
textitself may notbe publishedcommercially in print or electronicform, edited, translated,
or otherwise altered without the permission of Motorola, Inc.

It is possible that this publication may contain reference to or information about Motorola
products(machines and programs), programming, or services that are not available in your
country. Such references or information must not be construed to mean that Motorola
intends to announce such Motorola products, programming, or services in your country.

Limited and Restricted Rights Legend

If the documentation contained herein is supplied, directly or indirectly, to the U.S.
Government, the following notice shall apply unless otherwise agreed to in writing by
Motorola, Inc.

Use, duplication, or disclosure by the Government is subject to restrictions as set forth in
subparagraph (b)(3) of the Rights in Technical Data clause at DFARS252.227-7013 (Nov.

1995) and of the Rights in Noncommercial Computer Software and Documentation clause
at DFARS 252.227-7014 (Jun. 1995).

Motorola, Inc.
Computer Group
2900 South Diablo Way
Tempe, Arizona 85282

Contents

About This Manual

Overview of Contents ................................................................................................xiii

Comments and Suggestions .......................................................................................xiv

Conventions Used in This Manual.............................................................................xiv

CHAPTER 1 Hardware Preparation and Installation

Introduction ................................................................................................................1-1

Overview....................................................................................................................1-4

Unpacking Instructions..............................................................................................1-5

Hardware Configuration ............................................................................................1-5

PATX3070 Motherboard Preparation .................................................................1-6

Backup Battery Selection (J7 and BT1) ......................................................1-9

CompactFlash Configuration (J9) ...............................................................1-9

CMOS-to-EEPROM Backup (J27) ...........................................................1-10

USB Port 1 Routing (J33)..........................................................................1-11

CMOS Battery Backup Control (PIIX RTC CMOS CLR J34).................1-12

Watchdog Timer Enable (J43)...................................................................1-13

Hardware Installation...............................................................................................1-13

Installation Preliminaries..................................................................................1-13

PATX3070 Motherboard Installation................................................................1-14

I/O Shield...................................................................................................1-14

Motherboard ..............................................................................................1-15

DIMM Memory ................................................................................................1-18

AGP Graphics Slot............................................................................................1-19

PCI Expansion Cards........................................................................................1-20

ISA Module(s) ..................................................................................................1-21

SanDisk IDE CompactFlash.............................................................................1-22

CPU Cooler.......................................................................................................1-23

Connection to Peripherals.................................................................................1-25

Completing the Installation...............................................................................1-27

Processor Removal and Replacement......................................................................1-28

Replacing Lithium Batteries ....................................................................................1-28

vii

CHAPTER 2 BIOS Self-Test and Setup

Introduction ...............................................................................................................2-1

Description.................................................................................................................2-1

Configuration Information.........................................................................................2-1

The Setup Interface....................................................................................................2-2

Menu Bar............................................................................................................2-3

Legend Bar .........................................................................................................2-3

Field Help Window.....................................................................................2-3

Field Options Window ................................................................................2-4

Navigation in Setup.....................................................................................2-4

Getting Help ..............................................................................................................2-5

In Case of Difficulty..................................................................................................2-5

BIOS Messages and Beep Codes...............................................................................2-6

CHAPTER 3 Features and Specifications

Features......................................................................................................................3-1

Environmental Monitoring and System Management........................................3-3

LM79 Hardware Monitor............................................................................3 -3

CPU Temperature Monitor .........................................................................3-3

AC Fail Circuit............................................................................................3-4

Specifications.............................................................................................................3-4

Cooling Requirements...............................................................................................3-5

CHAPTER 4 Connector Pin Assignments

PATX3070 Cable Connectors....................................................................................4-1

PATX3070 Socket Connectors ................................................................................4-14

APPENDIX A Related Documentation

Motorola Computer Group Documents....................................................................A-1

Manufacturers’ Documents ......................................................................................A-1

Related Specifications ..............................................................................................A-4

URLs.........................................................................................................................A-5

viii

List of Figures

Figure 1-1. PATX3070 Motherboard Block Diagram................................................1-3

Figure 1-2. PATX3070 Motherboard Layout.............................................................1-8

Figure 1-3. Installing the I/O Shield on the Motherboard .......................................1-15

Figure 1-4. Installing the PATX3070 Motherboard in a Chassis .............................1-17

Figure 1-5. Installing Memory DIMM(s) ................................................................1-18

Figure 1-6. Installing an AGP Graphics Card..........................................................1-19

Figure 1-7. Installing PCI Module(s).......................................................................1-20

Figure 1-8. Installing ISA Module(s).......................................................................1-21

Figure 1-9. Installing a SanDisk IDE CompactFlash Card......................................1-22

Figure 2-1. The Basic Setup Screen...........................................................................2-2

ix

List of T ables

Table 1-1. Startup Overview ......................................................................................1-4

Table 1-2. PATX3070 Jumper and Switch Settings ...................................................1-6

Table 1-3. PATX3070Board Connectors.................................................................1-26

Table 2-1. BIOS Setup Menus ...................................................................................2-3

Table 2-2. Keys for Navigation in Setup....................................................................2-4

Table 3-1. PATX3070 Motherboard Features Summary............................................3-1

Table 3-2. PATX3070 Motherboard Specifications ...................................................3-4

Table 4-1. Keyboard/Mouse Panel Connector (J1)....................................................4-1

Table 4-2. Dual USB Panel Connector (J2) ...............................................................4-1

Table 4-3. COM2 Auxiliary Board Connector (J3) ...................................................4-2

Table 4-4. Parallel Printer Panel Connector (J3, top) ................................................4-2

Table 4-5. Ethernet 1 Panel Connector (J4)...............................................................4-3

Table 4-6. Ethernet 2 Panel Connector (J5)...............................................................4-3

Table 4-7. External Battery Cable Header (J7)..........................................................4-3

Table 4-8. POWER IN Connector (J8) ......................................................................4-4

Table 4-9. Dual Serial Port Panel Connector (J9)......................................................4-5

Table 4-10. Power Supply Fan Cable Header (J10)...................................................4-5

Table 4-11. Reset Cable Header (J14)........................................................................4-6

Table 4-12. Chassis Fan Cable Header (J15).............................................................4-6

Table 4-13. Secondary IDE Connector (J16).............................................................4-6

Table 4-14. Primary IDE Connector (J17).................................................................4-7

Table 4-15. CPU Fan Cable Header (J18)..................................................................4-8

Table 4-16. Ethernet LED Cable Header (J20, J24)) .................................................4-8

Table 4-17. SCSI Channel A/B Connectors (J19, J21)..............................................4-8

Table 4-18. Floppy Disk Drive Connector Header (J23)...........................................4-9

Table 4-19. USB 1 Cable Header (J26)....................................................................4-10

Table 4-20. RAIDport Connector Header (J30).......................................................4-10

Table 4-21. LED/Power S witch/Keylock/Speaker Header (J32).............................4-11

Table 4-22. Infrared Interface Cable Header (J35) ..................................................4-12

Table 4-23. Chassis Intrusion Detection Cable Header (J37) ..................................4-13

Table 4-24. CompactFlash Connector (J13) ............................................................4-14

Table 4-25. AGP Connector (J22)............................................................................4-15

Table 4-26. PCI Connectors (J28/29/31/36/38) .......................................................4-16

Table 4-27. ISA Connectors (J39/41) ......................................................................4-17

xi

Table 4-28. DIMM Module Sockets (U12-U15).....................................................4-18

Table 4-1. Motorola Computer Group Documents...................................................A-1

Table A-2. Manufacturers’ Documents ...................................................................A-2

Table A-3. Related Specifications ...........................................................................A-4

xii

About This Manual

This manual provides information on hardware preparation and
installation for the PATX3070 Intel PGA370 ATX Motherboard
(hereinafter referred to as the PATX3070). In addition, it also provides a
brief description of the BIOS power-on self-test (POST) and lists the
features and specifications applicable to the motherboard.

For programming information or for additional details on BIOS routines,
refer to the PATX3070BIOS and Programmer’s ReferenceGuide, listed in

Appendix A, Related Documentation.

The information in this manual applies to model numbers listed in the
following table.

Model Number Description

PATX3070-104 Single Ethernet Interface and five PCI slots
PATX3070-105 Dual Ethernet Interfaces and two PCI slots
PATX3070-108 Dual Ethernet Interfaces, SCSI, and five PCI slots

Overview of Contents

Chapter 1, Hardware Preparation and Installation, provides information

on hardware preparation and installation for the PATX3070.

Chapter 2, BIOS Self-Test and Setup, provides a brief description of the

BIOS power-on self-test (POST) and lists the features and specifications
applicable to the motherboard.

Chapter 3, Features and Specifications, describes features and

specifications of the PATX3070.

Chapter 4, Connector Pin Assignments, summarizes the pin assignments

for I/O and power cable interconnect signals on the PATX3070
motherboard.

AppendixA, Related Documentation, listsall documentationrelatedto the

PATX3070.

xiii

Comments and Suggestions

Motorolawelcomes and appreciates your comments on its documentation.
We w ant to know what you think about our manualsand how we can make
them better. Mail comments to:

Motorola Computer Group
Reader Comments DW164
2900 S. Diablo Way
Tempe, Arizona 85282

You can also submit comments to the following e-mail address:

[e-mail]

In all your correspondence, please list your name, position, and company.
Be sureto include the titleand part number of the manual and tell how you
used it. Then tell us your feelings about its strengths and weaknesses and
any recommendations for improvements.

Conventions Used in This Manual

The following typographical conventions are used in this document:

xiv

bold

is used for user input that you type just as it appears; it is also used for
commands, options and arguments to commands, and names of
programs, directories and files.

italic

is used for names of variablesto which you assign values. Italicis also
used for comments in screen displays and examples, and to introduce
new terms.

courier

is used for system output (for example, screen displays, reports),
examples, and system prompts.

<Enter>, <Return>or<CR>

<CR> represents the carriage return or Enter key.

CTRL

representsthe Control key. Execute control characters by pressing the
Ctrl key and the letter simultaneously, for example, Ctrl-d.

xv

1Hardware Preparation and

Introduction

The PATX3070 is an Intel Architecture ATX form factor computer
motherboard targeted to run Windows NT
and LynxOS
the Intel Pentium

Features of the full-function PATX3070 include the following:

❏ Intel 440BX chipset with support for 66/100 MHz processor-side

❏ four 3.3V DIMM slots (with support for up to 1GB SDRAM)
❏ 10BaseT/100 BaseTX EthernetInterfaces(singleor dual population

❏ two Ultra ATA/33 EIDE interfaceconnectors, supporting up to four

❏ CompactFlash

®

, in an embedded environment. The PATX3070 is based on

bus

options)

hard drives

Installation

®

, QNX®, VxWorks®,Linux®,

®

III or C eleronTMprocessor for the PGA370 socket.

TM

Type II socket

1

❏ dual-channel Wide Ultra SCSI interface with optional RAID

support

❏ two RS-232 serial ports, parallel, floppy, PS/2 keyboard/mouse

support and IrDA header

❏ watchdog, interval timers, hardware monitor
❏ one 2x AGP slot, two 32-bit/33 MHz PCI slots, five 32-bit/33 MHz

PCI slots if configured with additional PCI-to-PCI bridge (one
shared if PCI-to-PCI bridge option used), and two ISA expansion
slots (one shared if PCI-to-PCI bridge option used).

Note Please see the table in the About This Manual on page -xiii

section for a list of model numbers.

1-1

1

Hardware Preparation and Installation

The block diagramin Figure1-1onpage1-3shows the architectureof the
PATX3070motherboard.Chapter 3, Featuresand Specifications,contains
complete features and specifications for the board.

1-2 Computer Group Literature Center Web Site

Introduction

1

ITP Test Port

Intel

Socket 370

Programmable

Power Supply

Wide Ultra SCSI

(HD68)

Wide Ultra SCSI

(HD68)

Ethernet

EthernetUSBKBD/MSIEEE-1284

USB

I/O Shield

COM 1

COM 2

100 MHz Bus

Temp

Sensor

82559ER
Controller

82559ER
Ethernet

Controller

Adaptec

AIC-7895
Ultra SCSI
Controller

Intel

Ethernet

Intel

optional

optional

82443BX

82443BX

North Bridge

North Bridge

AGP/Memory

AGP/Memory

Controller &

Controller &

Processor to

Processor to

PCI Bridge

PCI Bridge

Super I/O

National

PC97317

IR

Header

Primary PCI Bus

Floppy

Header

DIMMs (168 pins, 3.3V, SDRAM, ECC)

AGP Slot

AGP Slot

SMBus

RAIDport

32-bit PCI Slot

32-bit PCI Slot

PCI to ISA/IDE Controller

USB 1

USB 2

LM79

Monitor

BIOS
Flash

Watchdog

MAX705

Tick Timers

2-82C54

Secondary

PCI Bus

DEC21152
PCI to PCI

Bridge

optional

PIIX4E

South Bridge

Intel 82371EB

RTC

Battery

ISA

Primary
Header

EIDE Primary

IDE

Serial

EEPROM

Clock

Clock

Generator

Generator

Reset

Reset

Control

Control

32-bit PCI Slot

EIDE Secondary

CompactFlash

Secondary

IDE

Header

32-bit PCI Slot

Shared Slot

ISA Slot

Type 2

32-bit PCI Slot

ISA Slot

Figure 1-1. PATX3070 Motherboard Block Diagram

http://www.motorola.com/computer/literature 1-3

1

Hardware Preparation and Installation

Overview

The following table l ists the things you will need to do before you can use
this board and tells where to find the information you need to perform each
step. Be sure to read this entire chapter, including all cautions and
warnings, before you begin.

Table 1-1. Startup Overview

What you need to do... Refer to...

Unpack the hardware. Unpacking Instructions on page 1-5
Configure t he hardware by setting jumpers on

the motherboard.
If necessary, install an I/O shield on the

motherboard.
Install the motherboard in the chassis. Motherboard on page 1-15
Ensure that DIMM memory module(s) are

properly installed on the motherboard.
If applicable, install an AGP Graphics card on

the motherboard.
If applicable, install any PCI expansion cards on

the motherboard.
If applicable, install any ISA expansion cards on

the motherboard.

®

If applicable, install a SanDisk
CompactFlash module on the motherboard.

Connect a display terminal and any other
equipment you will be using.

Power up the system. Chapter 2, BIOS Self-Test and Setup

IDE

PATX3070 Motherboard Preparation on page
1-6

I/O Shield on page 1-14

DIMM Memory on page 1-18

AGP Graphics Slot on page 1-19

PCI Expansion Cards on page 1-20

ISA Module(s) on page 1-21

SanDisk IDE CompactFlash on page 1-22

Connection to Peripherals on page 1-25

For more information on optional devices and
equipment, refer to the documentation
provided with the equipment.

1-4 Computer Group Literature Center Web Site

Unpacking Instructions

Table 1-1. Startup Overview (Continued)

What you need to do... Refer to...

Note that the BIOS initializes the PATX3070
motherboard.

Initialize the system clock. Chapter 2, BIOS Self-Test and Setup
Program the board as needed for your

applications.

Chapter 2, BIOS Self-Test and Setup

You may also wish to consult the PATX3070
BIOS and Programmer’s Reference Guide,
listed in Appendix A, Related Documentation

PATX3070 BIOS and Programmer’s Reference

Guide

, listed in Appendix A, Related

Documentation

.

Unpacking Instructions

Note If the shipping carton is damaged upon receipt, request that the

carrier's agent be present during the unpacking and inspection of
the equipment.

1

.

Unpack the equipment from the shipping carton. Refer to the packing list
and verify that all items are present. Save the packing material for storing
and reshipping of equipment.

Avoid touching areas of integrated circuitry; static discharge can damage
circuits.

Caution

Hardware Configuration

To produce the desired configuration and ensure that the PATX3070
motherboard operates properly, you may need to carry out certain
hardware modifications before installing the motherboard.

http://www.motorola.com/computer/literature 1-5

1

Hardware Preparation and Installation

Some PATX3070 motherboard functions, such as the timers, are
controlled by setting bits in registers. These and other registers are
described in the PATX3070 BIOS and Programmer’s Reference Guide or
in vendordocumentation as listed in Appendix A,Related Documentation.

Many options, however, are controlled through manual installation or
removal of header jumpers or interface modules on the motherboard.

PATX3070 Motherboard Preparation

Figure 1-2 on page 1-8 illustrates the placement of the jumper headers,

connectors, and various other components on the PATX3070
motherboard. Manually configurable jumper headers on the motherboard
are listed in the following table. Default settings are enclosed in brackets.
For the connector pin assignmentson the PATX3070, refer to the Chapter

4, Connector Pin Assignments.

Table 1-2. PATX3070 Jumper and Switch Settings

Jumper Function Settings

J7

J9

J27

J33

J34

J43

Backup Battery
Selection (J7 and
BT1)

CompactFlash
Configuration (J9)

CMOS-to-EEPROM
Backup (J27)

USB Port 1 Routing
(J33)

CMOS Battery
Backup Control (PIIX
RTC CMOS CLR J34)

Watchdog Timer
Enable (J43)

[1-2]
No jumper

1-2
[No jumper]

1-2
[2-3]

[1-3, 2-4, 9-10]
3-5, 4-6, 7-8

1-2
[2-3]

1-2
[No jumper]

On-board battery selected
External battery selected (cable installed)

CompactFlash is master device
CompactFlash is slave device

CMOS contents not copied to EEPROM
CMOS backup copy stored in EEPROM

Rear panel connector J2 selected
Board connector header J26 selected

Batterybackup disabled, CMOS cleared
Battery backup enabled

Watchdog timer enabled at power-up
Watchdog timer disabled

Note Items in brackets are factory default settings.

1-6 Computer Group Literature Center Web Site

Hardware Configuration

ThePATX3070 motherboardis testedand shipped with the configurations
described in the following sections. The PATX3070’s required and
factory-installed BIOS performs its power-up self-test (POST) with those
factory settings.

1

http://www.motorola.com/computer/literature 1-7

1

Hardware Preparation and Installation

U12

U13

U14

13

13

13

J1

J18

P1

J2

J3

L1

J10

J15

J6

1
2

Q2

192

J12

8

U12

Q3

J4

T1

U15

J9

J11

21

J14

BTI

4

1

J8

10

J7

1

11

50

1
2

1
2

1

20

J13

J16

J17

J5

A1

B1

A1

B1

T2

21

J20

43

21

J24

43

A2
B1

A2
B1

A2
B1

A2
B1

A2
B1

A1
B2

A1

B2
A1

B2
A1

B2
A1

B2
A1

B2

J28

J29

J31

J36

J38

J39

J41

J22

A65
B66

J30

A1

B2

12

J25

U23

U24

J33

2
1

3

10

1

9

J34

U27

U29

J45

1
2

J19

J21

J23

9

10

J40

U30

1

J43

2

J44

13

33
34

J26

14

U26

J35

J37

13

J32

1

J27

3

1

1
2

26

2811 0800

Figure 1-2. PATX3070 Motherboard Layout

1-8 Computer Group Literature Center Web Site

Backup Battery Selection (J7 and BT1)

J7 is the battery backup configuration point. BT1 is the socket for the on­board battery.

To use the on-board battery for backup, verify that a battery (Panasonic
CR2032) is installedsecurely in socket BT1. With a jumper installedat J7
(pins 1-2 together), the on-board battery is enabled (this is the factory
default).

To use an external battery for backup, remove the jumper from pins 1-2
and instead connect the external battery cable to J7. Pin 1 connects to the
negative side of the external battery, pin 4 to the positive side.

−

Hardware Configuration

1

J7

+

−

CompactFlash Configuration (J9)

The SanDisk CompactFlash cards, which can be used on the PATX3070,
contain an intelligent controller for management of the Flash media. The
CompactFlash implementation mimics the file structure of a hard disk
drive.These characteristicsmake it possible forthe PATX3070to treat t he
CompactFlash card as a bootable device.

With a jumper installed across J9 pins 1-2, the CompactFlash device is in
‘‘master’’ mode. This configuration enables the PATX3070 to boot from
the CompactFlash card.

21

{

INT BAT

BT1

4

3

+

http://www.motorola.com/computer/literature 1-9

1

Hardware Preparation and Installation

With the jumper removed from J9 (the factory configuration), the
CompactFlash device is in ‘‘slave’’ mode.

J9

CompactFlash in Master mode

CMOS-to-EEPROM Backup (J27)

You have the option to store, in EEPROM, a backup copy of the current
BIOS configuration (contained in CMOS RAM on the Intel 82371EB
PIIX4E PCI/ISA bridge device). J27 controls the CMOS-to-EEPROM
backup configuration. If the CMOS-to-EEPROM backup is enabled, the
BIOS configuration is copied to EEPROM each time the power-on self­test (POST) executes.

The factory configuration has a jumper between J27 pins 2-3, so that a
fresh copy of the CMOS RAM contents is stored in EEPROM each time
you power up the system. If you move the jumper to J27 pins 1-2, the
CMOS-to-EEPROM backup is disabled.

J27

J9

2121

CompactFlash in Slave mode

(factory configuration)

J27

3
2

1

CMOS backup enabled

(factoryconfiguration)

3
2

1

CMOS backup disabled

If the BIOS configurationdata becomes corruptedwhile you are operating
the board with the CMOS-to-EEPROM backup enabled, you may need to
momentarily disable the backup, clear CMOS, and reconfigure the BIOS.
This is done as follows:

1. Turn off the power to the board.

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2. Move the jumper on J27 from pins 2-3 to pins 1-2, disabling the
CMOS-to-EEPROM backup.

3. Clear the CMOS by moving the jumper on J34 (CMOS battery
backupcontrol)momentarily from pins2-3 topins 1-2. Aftera lapse
of several seconds, return the jumper to pins 2-3.

4. Turn on the power to the board, start the Setup utility, and
reconfigure the BIOS as needed (refer to Chapter 2, BIOS Self-Test

and Setup).

5. Power down the board once more. Return the jumper on J27 to pins
2-3, re-enabling the CMOS-to-EEPROM backup.

6. Power up the board once more. The board will reinitializeusing the
BIOS configuration data you have entered, and a copy of the data
will be placed in EEPROM.

USB Port 1 Routing (J33)

The PATX3070 is equipped with two USB (Universal Serial Bus) ports.
The primary port, Port 0, is routed to a USB panel connector. The
secondary USB, Port 1, may be directed either to a panel connector or to a
connector header on the board.

Hardware Configuration

1

J33is the 2ND USB routing header.The settingof J33determines whether
I/O signals on USB port 1 are directed to a panel connector or to a
connector header on the board. The default factory configuration has
jumpers between pins 1-3, 2-4, and 9-10, directingthe signals to the upper
panel connector of J2. To route the signals to connector header J26, place
the jumpers between pins 3-5, 4-6, and 7-8.

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Hardware Preparation and Installation

J33

10

8
6

4
2

To Connector

(factory configuration)

9
7

5
3
1

J33

10

8
6

4
2

To Header

CMOS Battery Backup Control (PIIX RTC CMOS CLR J34)

J34 controls battery backup power to the CMOS RAM on the PATX3070
motherboard. The factory configuration has a jumper between J34 pins 2­3, enabling battery power to the CMOS RAM. If you move the jumper to
J34 pins 1-2, when the board is powered down, the CMOS memory is
cleared and BIOS default settings take over. Refer also to CMOS-to-

EEPROM Backup (J27).

J34

3

J34

3

9
7

5
3
1

2

1

Batterybackup enabled

(factory configuration)

NORMAL

2

1

Clear CMOS

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Watchdog Timer Enable (J43)

J43 is the watchdog timer enable header. Putting a jumper on J43 pins 1-2
enables the watchdog timer upon power-up. J43 is empty in the factory
configuration, leaving the watchdog timer function disabled at power-up.

Hardware Installation

1

J43

21

No connection - Watchdog timer disabled

(factory configuration)

Hardware Installation

The following sections describe the placement of CPU and DIMM
Memroy modules, as well as PCI Expansion Cards, ISA Module(s), and
other user-supplied plug-ins, on the motherboard.

Installation Preliminaries

This section applies to all hardware installations you may perform on
PATX3070 motherboards.

Use ESD

Wrist Strap

Motorola strongly recommends that you use an antistatic wrist strap and a
conductive foam pad when installing or upgrading a system. Electronic
components, such as disk drives, computer boards, and memory modules,
can be extremely sensitive to electrostatic discharge (ESD). After
removing the component from its protective wrapper or from the system,
placethe component flaton a grounded,static-freesurface(and, in thecase
of a board, component side up). Do not slide the component over any
surface.

J43

21

Watchdog timer enabled

If an ESD station is not available, you can avoid damage resulting from
ESD by wearing an antistatic wrist strap (available at electronics stores)
that is attached to an active electrical ground. Note that a system chassis
may not be grounded if it is unplugged.

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1

Hardware Preparation and Installation

To prevent serious injury or death from dangerous voltages, before
connectingperipherals, disconnect the power cord from the power source.

Warning

Only qualified, experienced electronics personnel should access the
interior of a system.

PATX3070 Motherboard Installation

With headers properly configured, you are ready to mount (if necessary)
the I/O shield and install the PATX3070 motherboard in a chassis or
system enclosure. You can then plug the memory modules, CompactFlash
module, and the various application-specific daughter boards into the
motherboard and cable up the peripherals. Proceed as described in the
following sections to accomplish these tasks.

I/O Shield

The I/O shield for the PATX3070 must be in place before you install the
board in a chassis. In most cases, the I/O shield is a factory-installeditem.
If you need to install the shield yourself, however, refer to Figure 1-3 on

page 1-15 and follow the procedure below:

1. Carefully remove the PATX3070 from its packaging and lay it flat,
with the connectors facing you.

Avoid touching areas of integrated circuitry; static discharge can damage
these circuits.

Caution

2. Position the I/O shield on the motherboard I/O connectors, with
icons facing outward.

3. Install jackposts at the printer port and the serial ports (the
connectors are identifiable by the icons on the face plate).

4. Hand-tighten the jackposts to clamp the I/O shield in position.

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Figure 1-3. Installing the I/O S hield on the Motherboard

Motherboard

Hardware Installation

1

2812 0800

To install a PATX3070 motherboard in your chassis,refer toFigure 1-4 on

page 1-17 and follow the procedure below. (The chassis shown is a

Motorola unit. With other chassis, the procedure may differ slightly.)

1. Attach an ESD strap to your wrist. Attach the other end of the ESD
straptoanelectricalground(refertoInstallation Preliminaries on

page 1-13). The ESD strap must be secured to your wrist and to

ground throughout the procedure.

2. Ensure that the AC or DC power is switched off and remove the AC
cord or DC power lines from the system.

Inserting or removing modules with power applied may result in damage
to module components.

Caution

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1

Hardware Preparation and Installation

Dangerous voltages, capable of causing death, are present in this
equipment. Use extreme caution when handling, testing, and adjusting.

Warning

3. Remove the chassis cover. If necessary, loosen or temporarily
remove chassis components (fans, etc.) as needed for access to the
interior of the chassis.

4. Install metal standoffs on the floor of the chassis in alignment with
the PATX3070 motherboard mounting holes. Use as many
standoffs as feasible.

Avoid touching areas of integrated circuitry; static discharge can damage

!

Caution

these circuits.

5. Set the PATX3070 motherboard on the chassis standoffs and start
the screw(s) provided into the standoffs, without tightening them
completely. (The chassis shown is a Motorola unit. With other
chassis, the procedure may differ slightly.)

6. Thread two screws through the back wall of the chassis into the
upper corners of the I/O shield.

7. With all screws in place, tighten them snugly.

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Hardware Installation

1

2813 0800

Figure 1-4. Installing the PATX3070 Motherboard in a Chassis

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1

Hardware Preparation and Installation

DIMM Memory

See Figure 1-5 below. You can install from one to four SDRAM DIMMs
in any order, but you may find it more convenient to start with the inner
DIMM slot and finish with the outer one. In other words, install DIMMs
first in U15, then U14, then U13, then U12 (DIMM MODULE Slots 3
through 0).

Note For information on other DIMMs that may be suitable for use

with this product, refer to Intel’s Web site, listed in Appendix A,

Related Documentation.

2463 0101

Figure 1-5. Installing Mem ory DIMM(s)

1-18 Computer Group Literature Center Web Site

AGP Graphics Slot

See Figure 1-6 below. Install an AGP (Accelerated Graphics Port)
graphics card in the AGP Slot J22.

Hardware Installation

1

Figure 1-6. Installing an AGP Graphics Card

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1

Hardware Preparation and Installation

PCI Expansion Cards

See Figure 1-7 below. You can install one, two, three, four, or five PCI
expansion cards in any order, but you may find it more convenient to start
with the inner PCI slot and finishwith the outerone. In otherwords, install
PCI module(s)first in J28, then J29, then J31, then J36, then J38 (SLOT 1,
SLOT 2, SLOT 3, SLOT 4, SLOT 5).

Figure 1-7. Installing PCI Module(s)

Notes Boards that occupy PCI Slot 5 and the adjacent ISA Slot (J39)

share I/O space in the back panel. If the ISA slot is occupied,PCI
Slot 5 must remain vacant, and vice versa.

The two PCI slots closest to the processor are the primary PCI
Slots (J28 and J29) and provide a greater degree of performance.
However, if an expansion card f ails to operate in any of the
primary PCI slots, install the card in the secondary PCI slots.

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ISA Module(s)

See Figure 1-8 below. You can install either one or two ISA modules in
either order, but you may find it more convenient to start with the inner
ISA slot and finish with the outer one. In other words, install the first ISA
module in Slot J39, the second in Slot J41.

Hardware Installation

1

Figure 1-8. Installing ISA Module(s)

Note Boardsthat occupy ISASlot J39and theadjacentPCI Slot5 (J38)

share I/O space in the back panel. If the ISA slot is occupied,PCI
Slot 5 must remain vacant, and vice versa.

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1

Hardware Preparation and Installation

SanDisk IDE CompactFlash

The SanDisk CompactFlash cards, which can be used on the PATX3070,
contain an intelligent controller for management of the Flash media. The
CompactFlash implementation mimics the file structure of a hard disk
drive. With a CompactFlash card installed, you can store and manipulate
files on the card as you would on a hard disk or floppy disk. For details on
installing this component, refer to the SanDisk IDE FlashDrive
Installation Guide at http://www.sandisk.com/cons/prod_lit.htm.

The general installation procedure is as follows (see Figure 1-9 below):

1. Start the CompactFlash card into the card guides on the
CompactFlash connector, J13.

2. Press the card gently into the connector until it seats.

2467 0101

Figure 1-9. Installing a SanDisk IDE CompactFlash Card

1-22 Computer Group Literature Center Web Site

CPU Cooler

Hardware Installation

1

Notes Be sure that the CompactFlash master/slave setting (jumper

header J9) is compatible with the secondary IDE devices
installed.

If the CompactFlash card is the only device installed on the
secondary bus, set it to master mode. If an additional IDE device
is present on the bus, the CompactFlash card can be in e ither
master or slave mode, with the other IDE device being set the
opposite way. (If an ATAPI device is present on the bus,
however,the CompactFlash cardmust be in mastermode and the
ATAPI device in slave mode.)

A CPU cooler is installed on the Intel PGA 370 socket to keep your
microprocessor cool. A CPU cooler includes a heat sink as well as a fan
and is more efficient than a heat sink alone. See the following procedure
and illustrations for installation instructions.

b

a

1. Hold the air cooler with the shorter end metal spring clip (point "a")
toward your wrist.

2. Set the guide pin all the way to the left.

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1

Hardware Preparation and Installation

b

a

3. Clasp the spring clip over the tab (point a) at the narrow end of the

socket (opposite CAM side of socket).

b

a

4. Clasp the spring clip over the tab (point b) at the CAM end of the

socket.

1-24 Computer Group Literature Center Web Site

Hardware Installation

a

b

5. Twist the air cooler counter-clockwise about 1/2 inch, making sure
the spring clip features are securely seated over the socket tabs.
Verify the heat sink is firmly locked in place.

1

6. Plug the 3-pin connector into the 3-pin header (J18) on the
motherboard.

The air cooler is ready to work.

Connection to Peripherals

With the I/O shield in place, the PATX3070 motherboard installed in a
chassis,and modulesinstalled on the PATX3070, you are readyto connect
peripherals and apply power to the board.

Figure1-2 on page 1-8 shows thelocationsof thevarious cable connectors.

They are also listed in Table 1-3 on page 1-26 with the rest of the
connectors.

For the pin assignments of the connectors listed, refer to Chapter 4,

Connector Pin Assignments.

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1

Hardware Preparation and Installation

Note In the following table, an asterisk (*) denotes a connector which

maynot befoundon reduced-functionversions ofthePATX3070
motherboard. The others are used on all versions.

Table 1-3. PATX3070 Board Connectors

Connector Function

I/O Panel Connectors

J2 (bottom) USB0 (Universal Serial Bus 0) panel connector
J2 (top) USB1 (Universal Serial Bus 1) panel connector
J1 (bottom) KB (keyboard) panel connector
J1 (top) MSE (mouse) panel connector
J3 (left) COM1panel connector
J3 (right) COM2 panel connector
J4 *Ethernet 1 panel connector
J5 *Ethernet 2 panel connector
J3 (top) Parallel printer panel connector

Board Surface Connectors

J7 External battery cable header
J8 Power-in board connector
J9 CompactFlash master/slave select
J10 Power supply fan cable header
J12 COM2 auxiliary board connector
J13 *CompactFlash board connector
J14 Reset cable header
J15 Chassis fan cable header
J16 Secondary (IDE) board connector
J17 Primary (IDE) board connector
J18 CPU fan cable header
J19 *SCSI (channel B) board connector

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Hardware Installation

Table 1-3. PATX3070 Board Connectors (Continued)

Connector Function

J20 *Ethernet 1 LED cable header
J21 *SCSI (channel A) board connector
J22 AGP board connector
J23 Floppyboard connector
J24 *Ethernet 2 LED cable header
J26 USB1 (Universal Serial Bus 1) header
J28 PCI Slot 1 board connector
J29 PCI Slot 2 board connector
J30 *RAIDport board connector
J31 *PCI Slot 3 board connector
J32 LED/power switch/keylock/speaker cable header
J33 USB1 routing
J34 CMOS clear

1

J35 Infrared interface cable header
J36 *PCI Slot 4 board connector
J37 Chassis intrusion detection cable header
J38 *PCI Slot 5 board connector
J39 ISA Slot 1 board connector
J41 ISA Slot 2 board connector
J43 Watchdog timer enable
U4 CPU connector
U12-U15 DIMM module sockets

Completing the Installation

Verify that hardware is installed and the power/peripheral cables
connected as appropriate for your system configuration.

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1

Hardware Preparation and Installation

Replacethe chassisor systemcover, reconnectthe system to theAC or DC
power source, and turn the equipment power on.

Processor Removal and Replacement

Microprocessors in Motorola board products are factory-installed and
tested to ensure proper operation under board-specific BIOS software
withinspecified powerand cooling requirements. Fieldreplacement of the
processor is not recommended. A processor of a different type or with a
different stepping mask may not be supported by the BIOS. Also, faster
processors may alter cooling and power requirements beyond
specifications.

Motorola is continually improving its products to use the latest processor
speeds and technologies as they become available. If your application
requires a different processor, consult your local Motorola representative.

Replacing Lithium Batteries

Follow these safety rules for proper battery operation and to reduce
equipment and personal injury hazards when handling lithium batteries.
Use the battery for its intended application only.

Note Do not recharge, open, puncture or crush, incinerate, expose to

high temperatures or dispose of in your general trash collection.

Toreplace thelithiumbattery, observe thefollowing guidelines andfollow
the steps below.

Note When replacing the battery, power must be applied to the board

to prevent data loss.

1-28 Computer Group Literature Center Web Site

Warning

!

Warning

Replacing Lithium Batteries

1

To prevent serious injury or death from dangerous voltages, use extreme
caution when handling, testing, and adjusting this equipment and its
components.

Lithium batteries incorporate flammable materials such as lithium and
organic solvents. If lithium batteriesare short-circuitedor exposed to high
temperatureor pressure,they mayburst openand ignite, possibly resulting
in injury and/or fire. When dealing with lithium batteries, carefully follow
the precautions listed below in order to prevent accidents.

❏ Do not short-circuit.
❏ Do not disassemble, deform, or apply excessive pressure.
❏ Do not heat or incinerate.
❏ Do not apply solder directly.
❏ Do not use different models, or new and old batteries together.
❏ Do not charge.
❏ Always check proper polarity.

Danger of explosion if battery is replaced incorrectly.

!

Caution

Replace battery only w ith the same or equivalent type recommended by
the equipment manufacturer. Dispose of used batteries according to local
regulations and manufacturer’s instructions.

Avoid touching areas of integrated circuitry; static discharge can damage
circuits.

Caution

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1

Hardware Preparation and Installation

Use ESD

Wrist Strap

Attach an ESD strap to your wrist. Attach the other end of the ESD strap
to an electrical ground. (Notethat the system chassismay not be grounded
if it is unplugged.) The ESD strap must be secured to your wrist and to
ground throughout the procedure.

1. To remove the battery from the module, carefully pull the battery
from the socket.

2. Before installing a new battery, ensure that the battery pins are
clean.

3. Note the battery polarity and press the new battery into the socket.

Note When the battery is in the socket, no soldering is required.

4. Recycle or dispose of the old battery according to local regulations
and manufacturer’s instructions.

1-30 Computer Group Literature Center Web Site

2BIOS Self-Test and Setup

Introduction

The BIOS on the PATX3070 motherboard is a customized version of an
industry-standard B IOS for IBM PC AT-compatible personal computers.
It supports Intel x86 and compatible processors, including those of the
Pentium family. The BIOS provides important low-level support for the
board’s central processing, memory, and I/O subsystems.

Description

The BIOS is immediately activated when you first turn on the computer.
The BIOS reads system configuration information from CMOS RAM and
begins the process of checking out the system and configuring it through
the power-on self-test (POST).

Whenthese preliminariesare finished,theBIOS seeksan operating system
on one of the data storage devices (hard drive, floppy drive, etc.). The
BIOS then launches the operating system and surrenders controlof system
operations to it.

2

Configuration Information

The system configurationinformation which the BIOS reads from CMOS
RAM during power-up has been stored there by means of the Setup utility.
The Setup utility uses a number of menus for making changes and for
turning special features on or off. Should you wish to change any of the
configuration information, you can start the Setup utility during POST by
pressing <F2> at any time while the following message is displayed at the
bottom of the screen:

PRESS <F2> TO ENTER SETUP

2-1

BIOS Self-Test and Setup

2

Setup, you can restart the system for another attempt by any of the
following means:

If the m essage disappears before you respond and you still wish to enter

❏ Cycling power
❏ Pressing the RESET button on the system case
❏ Simultaneously pressing the <Ctrl>, <Alt>, and <Delete>keys

The Setup Interface

The Setup utility uses a m enu-driven interface. As shown in the following
illustration, each Setup screen has a menu bar, a legend bar, and a field­specific help window. For each field with predefined values, an options
window is available as well.

Menu Bar

Main Memory Advanced Status Security Power Boot Exit

BIOS Setup Utility

Item Specific Help

Field Help
Window

Field Options
Window

F1 Help Select Item -/+ Change Values F9 Setup Defaults
ESC Exit Select Menu Enter Select Sub-Menu F10 Save and Exit

Legend Bar

Figure 2-1. The Basic Setup Screen

2-2 Computer Group Literature Center Web Site

The Setup Interface

Menu Bar

Menu Function

Main Set time and other basic elements of system configuration.
Memory View and configure system memory.
Advanced Set up drives or configure I/O and advanced chipset features.
Status View fan, temperature, and power status.
Security Set passwords and access options.
Power Configure power management options.
Boot Specify boot options.
Exit Exit the Setup Utility with or without saving changes.

The menu bar at the top of the window enables you to select from the
principalSetup functions. Usethe left/rightarrow keysto selectamong the
principalfunctions; use the up/down arrow keys and the <Return>keyto
accept and enter the associated sub-menus.

The Setup menus are summarized below. For further details on using the
Setup utility, consult the PATX3070 BIOS and Programmer’s Reference
Guide, listed in Appendix A, Related Documentation

.

Table 2-1. BIOS Setup Menus

2

Legend Bar

The legend bar lists keys and commands that are helpful in navigating the
Setup utility and configuring its functions. Refer to Navigation in Setup
below for details.

Field Help Window

For most fields and submenus, item-specific help is displayed in a field
help window on the right side of each screen. The help window contains a
brief description of the field or sub-menu, and/or directions for using it.

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BIOS Self-Test and Setup

2

Field Options Window

Pressing the <Return> key after you select a given field or submenu
displays the options available for that field.

Navigation in Setup

To select a menu, use the left/right arrow keys.
To select a submenu or field within a menu, use the up and down arrow

keys.
Tochange thevalue of a field,usethe plusand minuskeys tocycle through

the field’s values, or press <Enter> to display an options window with all
values for that field. With the options window displayed, use the up/down
arrows to select a new value. Press <Enter>again to set the selected value,
or press <Esc> to close the options widow and retain the previous setting.

To display a submenu, use the arrow keys to move the cursor to the
submenuyou want (a pointer marksall submenus). Then press<Enter>.

To exit a submenu and return to the menu above it, press <Esc>. Pressing
<Esc> in a principal menu (such as Main or Security, for example) takes
youdirectlytotheExitmenu.

Note Pressing <Esc> in a m enu or s ubmenu does not cancel any

changes you have made in that menu.

The following table lists all keys available for navigation in the Setup

utility.

Table 2-2. Keys for Navigation in Setup

Key Function

<F1>or<Alt-H> Open General Help Window.
<Esc> Exit a menu or window.

→←arrow keys Select a different menu.
↑↓arrow keys Move cursor up and down.

<Tab>or<Shift-Tab> Move cursor within a field.

2-4 Computer Group Literature Center Web Site

Getting Help

Table 2-2. Keys for Navigation in Setup (Continued)

Key Function

<Home>or<End> Move cursor to top or bottom of window.
<PgUp>or<PgDn> Move cursor to next or previous page (in Help).
<F5>or<–> Select the previous value for a field.
<F6>or<+>or<Space> Select the next value for a field.
<F9> Load the default configuration values for all menus.
<F10> Save all changes and exit.
<Enter> Execute command, select submenu ( ), or display options window.

Getting Help

Pressing <F1>or<Alt-H> on any menu brings up the General Help
window that describes the legend keys and their alternates.

The scroll bar on the right of any window indicates that there is more than
one page of information in the window. Use <PgUp>and<PgDn>to
display all the pages. Pressing <Home>and<End> displays the first and
last page. Pressing <Enter> displays each page and then exits the window.

2

Press <Esc> to exit the current window.

In Case of Difficulty

Itis stronglyrecommended that you only alter settingsthat you thoroughly

!

Caution

http://www.motorola.com/computer/literature 2-5

understand. Even seemingly small changes may cause the system to
become unstable.

If, after making and saving system changes with Setup, you discover that
your computer no longer is able to boot, the BIOS supports an override
that, after five failed boot attempts, boots using the BIOS defaults. You
should then enter Setup, make any needed adjustments, and save the
changes.

BIOS Self-Test and Setup

2

As indicated in Table 2-2 on page 2-4, pressing <F1>or<Alt-H> brings
up a Help window with information pertaining to specific menus.

In addition, the hardware override described under CM OS Battery Backup

Control (PIIX RTC CMOS CLR J34) on page 1-12 enables you to restore

the BIOS default settings without resorting to repeated boot attempts.
Once the defaults are restored, you can restart the Setup utility and make
necessary adjustments.

Forfurther detailson the Setup menus andthe BIOS ingeneral, referto the

PATX3070 BIOS and Programmer’s Reference Guide, listed in Appendix

A, Related Documentation.

BIOS Messages and Beep Codes

During POST, the BIOS may display status/error messages. For details on
those status/error messages, refer to the PATX3070 BIOS and

Programmer’s Reference Guide, listed in Appendix A, Related

Documentation.

2-6 Computer Group Literature Center Web Site

3Features and Specifications

Features

ThePATX3070 is anATX form factormotherboard.It supportsMicrosoft
Windows NT and various other Intel x86-based real-time operating
systems in an embedded environment.

The board’s Architecture incorporates an Intel 440BX chipset which fully
supports both Pentium III and Celeron processors. It is available in both
reduced-function and full-function configurations, the latter being the
more integrated version of the board.

The following table lists the features of the PATX3070 motherboard.

Table 3-1. PATX3070 Motherboard Features Summary

Feature Description

Processor – Single Intel PGA370 Pentium III or Celeron processor with auto

selection of bus frequency and core voltages

– 66/100 MHz front side bus (FSB) frequency

3

L2 Cache – 256KB on-die Advanced Transfer Cache (ATC)

–128KB ATC for the Celeron Processor

DRAM – Four 168-pin DIMM sockets, 3.3V, I

– SDRAM (PC100) at 100 MHz
– Unbuffered or registered DIMMs
– ECC or non-ECC (no parity)

Intel 440BX
AGPset

– 82443BX (memory controller, processor-to-PCI bridge, AGP controller)
– 82371EB PIIX4E (PCI-to-ISA bridge, USB support, Ultra DMA/33

EIDE support, system interrupt controller)

2

C serial presence detect (SPD)

3-1

Features and Specifications

Table 3-1. PATX3070 Motherboard Features Summary (Continued)

Peripheral Support – One IEEE-1284 parallel port

3

– One PS/2 floppy port
– One PS/2 keyboard port and one PS/2 mouse port
– Two EIDE Ultra DMA/33 hard drive ports
– IrDA (infrared) port
–TwoUSBports

– Up to two 10BaseT/100BaseTX Ethernet interfaces (Intel 82559ER)
– Dual-channel Wide Ultra SCSI (AIC-7895) with RAIDport connector

(population option)

– CompactFlash Type II socket

RTC &
CMOS RAM

Form Factor – Standard ATX (9.6 inches by 12 inches)
Interrupt

Controllers
PCI Interface –5V 32-bit interface at up to 33 MHz

ISA Interface – 82371EB PCI-to-ISA/IDE Xcelerator (PIIX4E)

Graphics AGP slot 2x/1x
BIOS Support for 4/8MB BIOS Flash on ISA bus
Miscellaneous – Two-level watchdog timer

– DS1287 and MC146818 compatibility via 82371EB PIIX4E device
– 242 bytes of battery-backed RAM available for BIOS
– EEPROM backup for CMOS RAM

– Intel 82371EB PIIX4E (82C59 compatible)

– 5 PCI expansion slots, 3 of which are optional and are expanded across

the PCI-to-PCI bridge (DEC21152)

– Two ISA expansion slots (one shared if extended PCI option used)

–Two82C54timers
– Fan and temperature monitoring (LM79)
– Voltage and chassis intrusion monitoring (LM79)
– Wake-on-LAN capability

3-2 Computer Group Literature Center Web Site

Environmental M onitoring and System Management

The National LM79 hardware monitor device on the PATX3070
motherboard operates in tandem with the Intel 82559ER Ethernet
controller, the MAX1617 CPU temperature sensor, and the PIIX4E PCI­to-ISA/IDE bridge and interrupt controller to provide a number of useful
system management features. These features are summarized below. For
details on their implementation,refer to the device data sheets and to t he
PATX3070 BIOS and Programmer’s Reference Guide, listed in Appendix

A, Related Documentation.

LM79 Hardware Monitor

TheLM79 devicemonitors systemvoltages,temperatures, and fan speeds.
Its readings can be sampled by system management software at any time.
It has programmable limit registers which can be configured to generate
SMIs (systemmanagement interrupts)as appropriate for your application.
SMI signals from the LM79 are routed to the PIIX4E’s EXTSMI input.

The PATX3070 also includes circuitry for the detection of chassis
intrusion events. When implemented with appropriate sensory devices in
an enclosure, the intrusion detection circuitry is active continually (even
while t he system is shut down, as long as backup battery or standby power
is present). Interrupts generated through chassis intrusion are also fed to
the LM79.

Features

3

CPU Temperature Monitor

The PATX3070 includes a Maxim MAX1617 device to directly monitor
the temperatureof the processor.An over-temperature conditionproduces
an alarm signal. The MAX1617 allows system management software to
read processor temperatures, set temperature sample rates, specify alarm
threshold values, and clear the alarm output after processing the interrupt.
Alarm signals from the MAX1617 are routed to the LM79 and to the
PIIX4E (refer to the device data sheets and to the PATX3070 BIOS and
Programmer’s Reference Guide for programming details).

http://www.motorola.com/computer/literature 3-3

Features and Specifications

AC Fail Circuit

The PATX3070 incorporatesan AC fail circuit that allows the hardwareto
detect the operating state of the board at the time of a power failure. When

3

power is restored, the board will remain off if it was off when the power
failed, or, if it was on when power failed, it will automatically boot.

Note Some power supplies may defeatthis circuit,causingthe boardto

remain off when power is restored even if the board was running
at the time of failure.

Specifications

The following table lists the specifications for the PATX3070
motherboard.

Table 3-2. PATX3070 Motherboard Specifications

Characteristics Specifications

Power Requirements (exclusive of attached daughter boards and/or peripherals)

One PGA370 socket; supports either a
300+ MHz Celeron processor or a 600+
MHz Pentium III processor.

Environmental Parameters

Temperature Operating 0° C to 45° C at point of entry of forced air cooling

Non-operating −40° C to 85° C

Altitude Operating −500 to 5,000 meters (−1640 to 16,405 feet)

Non-operating −500 to 15,000 meters (−1640 to 49,215 feet)

Relative humidity Operating 5% to 95% (non-condensing)

Non-operating 5% to 95% (non-condensing)

Physical Dimensions

3-4 Computer Group Literature Center Web Site

+5VDC (±5%), 5A typical, 15.8A maximum
+3.3VDC (±5%), 4A typical, 12.7A maximum
+12VDC (±5%), 0.3A typical, 0.5A maximum

−12VDC (±5%), 0.05A typical, 0.1A maximum

−5VDC (±5%), 0A typical, 0A maximum

Cooling Requirements

Table 3-2. PATX3070 Motherboard Specifications (Continued)

Characteristics Specifications

Motherboard Height 2.5 i nches (64 mm) with CPUs only

3.2 inches (81 mm) with CPUs and expansion
modules

Length/Width Standard ATX form factor:

9.6 inches wide by 12 inches long
(244 mm x 305 mm)

Motherboard I/O Connectors

Ethernet interface One or two Intel 82559ER controllers. One or two

RJ-45 connectors. 10/100 Mbps interface speed.
Serial port interface (asynchronous) 9-pin D-sub, panel I/O
Parallel port interface 25-pin D-sub, panel I/O
Mouse interface 6-pinmini DIN, panel I/O
Keyboard interface 6-pin mini DIN, panel I/O
USB Dual independent USB channels for 1.5Mbps and

12Mbps transfer rates allow for easy, hot plugging

of USB peripherals
Super I/O device National PC97317 controller. Two asynchronous

serial ports, one parallel port, PS/2 floppy port,

PS/2 keyboard/mouse interfaces, and an infrared

header.

3

SCSI interface Adaptec AIC-7895 (dual-channel Wide Ultra)

controller. Transfer rate of up to 40MBps per

channel. PCI bus master.HD-68 connector for each

channel.

Cooling Requirements

The PATX3070 motherboard is designed and tested to operate reliably in
openambient airwith a temperaturerange from 0° to45° C (32° to 113° F)
with the fan heat sink providing the cooling for the CPU.

http://www.motorola.com/computer/literature 3-5

Features and Specifications

A powersupply fan and a chassis fan m ay be required to properly cool any
expansion modules (AGP cards, PCI cards, and ISA cards). The
PATX3070 provides headers (J10, J15) to power these fans if necessary.

3

While the exact amount of airflow required for cooling depends on the
ambient air temperature, enclosure venting, and the type, number, and
location of expansion modules and other heat sources, an average airflow
of 40 CFM (cubic feet/minute) should provide adequate cooling for most
applications.

3-6 Computer Group Literature Center Web Site

4Connector Pin Assignments

PATX3070 Cable Connectors

This section summarizes the pin assignments for I/O and power cable
interconnectsignalsonthe PATX3070motherboard.For devicesocketpin
assignments, refer to PATX3070 Socket Connectors on page 4-14.

Table 4-1. Keyboard/Mouse Panel Connector (J1)

1KBDAT_FB∗ Keyboard
2
3 CH_GND
4KB5V_FB
5 KBCLK_FB∗
6
7MSDAT_FB∗ Mouse Interface
8
9 CH_GND
10 KB5V_FB
11 MSCLK_FB∗
12

Interface
(Bottom)

(Top)

4

Table 4-2. Dual USB Panel Connector (J2)

L1 USBV0 USB Port 0
L2 USBP0−
L3 USBP0+
L4 USBG0

(Bottom)

4-1

Connector Pin Assignments

Table 4-2. Dual USB Panel Connector (J2) (Continued)

U1 USBV0 USB Port 1
U2 USBP1−
U3 USBP1+
U4 USBG1

(Top)

4

Table 4-3. COM2 Auxiliary Board Connector (J3)

1 SP_DCD1 SP_DSR1 2
3 SP_RXD1 SP_RTS1 4
5 SP_TXD1 SP_CTS1 6
7SP_DTR1 SP_RI1 8
9 GND Key 10

Table 4-4. Parallel Printer Panel Connector (J3, top)

1STB∗ AFD∗ 14
2PD0 ERR∗ 15
3 PD1 INIT∗ 16
4PD2 SLIN∗ 17
5 PD3 GND 18
6 PD4 GND 19
7 PD5 GND 20
8 PD6 GND 21
9 PD7 GND 22
10 ACK∗ GND 23
11 BUSY GND 24
12 PE GND 25
13 SLCT

4-2 Computer Group Literature Center Web Site

PATX3070 Cable Connectors

Table 4-5. Ethernet 1 Panel Connector (J4)

1TX1+
2TX1−
3RX1+
4TC2RR1
5TC2RR1
6RX1−
7TC2RR
8TC2RR

Table 4-6. Ethernet 2 Panel Connector (J5)

1TX2+
2TX2−
3RX2+
4TC2RR2
5TC2RR2
6RX2−
7TC2RR
8TC2RR

4

Table 4-7. External Battery Cable Header (J7)

1 GND
2BAT_G
3Key
4VBAT

http://www.motorola.com/computer/literature 4-3

Connector Pin Assignments

Table 4-8. POWER IN Connector (J8)

1 +3.3V +3.3V 11
2 +3.3V −12V 12

4

3 GND GND 13
4+5V PS_ON∗ 14
5 GND GND 15
6 +5V GND 16
7 GND GND 17
8 POWER_GOOD −5V 18
9 +5VSTB +5V 19
10 +12V +5V 20

4-4 Computer Group Literature Center Web Site

PATX3070 Cable Connectors

Table 4-9. Dual Serial Port Panel Connector (J9)

P1 SP_DCD0 COM1 Serial
P2 SP_RXD0
P3 SP_TXD0
P4 SP_DTR0
P5 GND
P6 SP_DSR0
P7 SP_RTS0
P8 SP_CTS0
P9 SP_RI0
Q1 SP_DCD1 COM2 Serial
Q2 SP_RXD1
Q3 SP_TXD1
Q4 SP_DTR1
Q5 GND
Q6 SP_DSR1
Q7 SP_RTS1
Q8 SP_CTS1
Q9 SP_RI1

Port (Bottom)

Port (Top)

4

Table 4-10. Power Supply Fan Cable Header (J10)

1GND
2 +12.0V
3 FANTACH2

http://www.motorola.com/computer/literature 4-5

Connector Pin Assignments

Table 4-11. Reset Cable Header (J14)

1RSTBTN∗
2GND

4

Table 4-12. Chassis Fan Cable Header (J15)

1GND
2 +12.0V
3 FANTACH1

Table 4-13. Secondary IDE Connector (J16)

1IDERSTS∗ GND 2
3 DDS7R DDS8R 4
5 DDS6R DDS9R 6
7 DDS5R DDS10R 8
9 DDS4R DDS11R 10
11 DDS3R DDS12R 12
13 DDS2R DDS13R 14
15 DDS1R DDS14R 16
17 DDS0R DDS15R 18
19 GND Key 20
21 IDEDRQ1R GND 22
23 IDEIOW1∗R GND 24
25 IDEIOR1∗R GND 26
27 IDEIORDY1R IDESELB 28
29 IDEDACK1∗R GND 30
31 IDEIRQ1R 32

4-6 Computer Group Literature Center Web Site

PATX3070 Cable Connectors

Table 4-13. Secondary IDE Connector (J16) (Continued)

33 SDA1R SPDIAG∗ 34
35 SDA0R SDA2R 36
37 IDECS11∗RIDECS13∗R38
39 HDACTB* GND 40

Table 4-14. Primary IDE Connector (J17)

1IDERSTP∗R GND 2
3PDD7R PDD8R 4
5PDD6R PDD9R 6
7PDD5R PDD10R 8
9 PDD4R PDD11R 10
11 PDD3R PDD12R 12
13 PDD2R PDD13R 14
15 PDD1R PDD14R 16
17 PDD0R PDD15R 18
19 GND Key 20
21 IDEDRQ0R GND 22
23 IDEIOW0∗R GND 24
25 IDEIOR0∗R GND 26
27 IDEIORDY0R IDESELA 28
29 IDEDACK0∗R GND 30
31 IDEIRQ0R 32
33 PDA1R 34
35 PDA0R PDA2R 36
37 IDECS01∗RIDECS03∗R38
39 HDACTA∗ GND 40

4

http://www.motorola.com/computer/literature 4-7

Connector Pin Assignments

Table 4-15. CPU Fan Cable Header (J18)

1GND
2 +12.0V

4

3 FANTACH3

Table 4-16. Ethernet LED Cable Header (J20, J24))

1 100Mbit LED (+)

10Mbit LED (−)

3 Activity LED (−) Activity LED (+)4

100Mbit LED (−)
10Mbit LED (+)

2

Table 4-17. SCSI Channel A/B Connectors (J19, J21)

1 GND GND 2
3 GND GND 4
5 GND GND 6
7 GND GND 8
9 GND GND 10
11 GND GND 12
13 GND GND 14
15 GND GND 16
17 +5.0V TERMPWR +5.0V TERMPWR 18
19 No Connection GND 20
21 GND GND 22
23 GND GND 24
25 GND GND 26
27 GND GND 28
29 GND GND 30

4-8 Computer Group Literature Center Web Site

PATX3070 Cable Connectors

Table 4-17. SCSI Channel A/B Connectors (J19, J21) (Continued)

31 GND GND 32
33 GND GND 34
35 SCDB∗(12) SCDB
37 SCDB
39 SCDPH
41 SCDB
43 SCDB
45 SCDB
47 SCDB

∗(14) SCDB∗(15) 38

∗ SCDB∗(0) 40
∗(1) SCDB∗(2) 42
∗(3) SCDB∗(4) 44
∗(5) SCDB∗(6) 46
∗(7) SCDPL∗ 48

49 GND GND 50
51 +5.0V TERMPWR +5.0V TERMPWR 52
53 No Connection GND 54
55 SATN
57 SBSY
59 SRST
61 SSEL
63 SREQ
65 SCDB
67 SCDB

∗ GND 56

∗ SACK∗ 58
∗ SMSG∗ 60
∗ SCD∗ 62

∗ SIO∗ 64
∗(8) SCDB∗(9) 66
∗(10) SCDB∗(11) 68

∗(13) 36

4

Table 4-18. Floppy Disk Drive Connector Header (J23)

1 GND FLPREDWC∗ 2
3 GND 4
5 KEY FLPDRATE0 6
7 GND FLPINDEX∗ 8
9 GND FLPMOTEA∗ 10
11 GND FLPDRVSB∗ 12
13 GND FLPDRVSA∗ 14
15 GND FLPMOTEB∗ 16

http://www.motorola.com/computer/literature 4-9

Connector Pin Assignments

Table 4-18. Floppy Disk Drive Connector Header (J23) (Continued)

17 GND FLPDIR∗ 18
19 GND FLPSTEP∗ 20
21 GND FLPWDATA∗ 22
23 GND FLPWGATE∗ 24

4

25 GND FLPTRK0∗ 26
27 GND FLPWPT∗ 28
29 GND FLPRDATA∗ 30
31 GND FLPSIDE1∗ 32
33 GND FLPDSKCHG∗ 34

Table 4-19. USB 1 Cable Header (J26)

1USBV1−I
2 USBP1−I
3USBV1+I
4USBG1I

Table 4-20. RAIDport Connector Header (J30)

Row A Ro w B

1 No Connection No Connection 1
2 No Connection No Connection 2
3 No Connection GND 3
4 No Connection 4
5 EXTARBACK∗ EXTARBREQ∗ 5
6 No Connection No Connection 6
7 No Connection No Connection 7
8 No Connection No Connection 8
9 IDDAT SCSILED∗ 9
10 No Connection No Connection 10

4-10 Computer Group Literature Center Web Site

PATX3070 Cable Connectors

Table 4-20. RAIDport Connector Header (J30) (Continued)

11 No Connection No Connection 11
12 SCSI_RST∗ No Connection 12
13 US_ROMCS∗ RAID40MHZ 13
14 US_RAMCS∗ GND 14
15 GND US_MRW 15
16 US_MDP US_MD(0) 16
17 US_MD(1) US_MD(2) 17
18 US_RAMPS∗ US_MD(4) 18
19 US_MD(3) GND 19
20 US_MD(5) US_MD(6) 20
21 US_MA(13) US_MA(14) 21
22 US_MD(7) US_MA(12) 22
23 US_MA(11) US_MA(10) 23
24 US_MA(9) US_MA(8) 24
25 US_MA(7) ARO_PRSNT∗ 25
26 GND US_MA(6) 26
27 US_MA(5) US_MA(4) 27
28 US_MA(3) GND 28
29 US_SEECS US_MA(2) 29
30 US_MA(1) US_MA(0) 30

4

Table 4-21. LED/Power Switch/Keylock/Speaker Header (J32)

1GND
2SUSPLED
3 PLED
4 No Connection
5
6 No Connection
7

http://www.motorola.com/computer/literature 4-11

Connector Pin Assignments

Table 4-21. LED/Power Switch/Keylock/Speaker Header (J32) (Continued)

8PWRON∗R
9GND
10 No Connection
11

4

12 HDLED
13
14 HARDDRV
15 HDLED
16
17 GND
18
19 PLED
20
21 KBLOCK∗
22 GND
23 No Connection
24 SPK_P
25 No Connection
26 SPK_N

Table 4-22. Infrared Interface Cable Header (J35)

1+5V IRSL1 2
3 IRSL0 GND 4
5IRRXD IRSL2 6
7 GND ID3 8
9 IRTXD GND 10

4-12 Computer Group Literature Center Web Site

PATX3070 Cable Connectors

Table 4-23. Chassis Intrusion Detection Cable Header (J37)

1
2 CHASINTV
3 CHAS_INT

4

http://www.motorola.com/computer/literature 4-13

Connector Pin Assignments

PATX3070 Socket Connectors

Table 4-24. CompactFlash Connector (J13)

1 GND DDS3R 2
3 DDS4R DDS5R 4

4

5 DDS6R DDS7R 6
7IDECS1∗RGND 8
9 GND GND 10
11 GND GND 12
13 +5.0V GND 14
15 GND GND 16
17 GND SDA2R 18
19 SDA1R SDA0R 20
21 DDS0R DDS1R 22
23 DDS2R CF_IOCS16∗ 24
25 CD2∗ CD1∗ 26
27 DDS11R DDS12R 28
29 DDS13R DDS14R 30
31 DDS15R IDECS3∗R32
33 CF_VS1∗ IDEIOR1∗R34
35 IDEIOW1∗RCF_WE∗ 36
37 IDEIRQ1R +5.0V 38
39 CF_CSEL∗ CF_VS2∗ 40
41 IDERSTS∗R IDEIORDY1R 42
43 CF_INPACK∗ CF_REG∗ 44
45 DASP∗ SPDIAG∗ 46
47 DDS8R DDS9R 48
49 DDS10R GND 50

4-14 Computer Group Literature Center Web Site

PATX3070 Socket Connectors

Table 4-25. AGP Connector (J22)

RowA RowB

1 +12V Reserved 2 1 AGPOC
3 Reserved USBAGP− 43+5V USBAGP+4
5 GROUND PIRQ3
7 PCIRST

∗ GGNT∗ 8 7 GCLKO GREQ∗ 8

∗A 6 5 GROUND PIRQ3∗B6

9 +3.3V GST1 10 9 +3.3V GST0 10
11 Reserved GPIPE

∗ 12 11 GST2 GRBF∗ 12

13 GROUND Reserved 14 13 GROUND Reserved 14
15 GSBA1 +3.3V 16 15 GSBA0 +3.3V 16
17 GSBA3 Reserved 18 17 GSBA2 GSB_STB 18
19 GROUND GSBA5 20 19 GROUND GSBA4 20
21 GSBA7
23
25

GAD30 26 25 GAD31 26

22 21 GSBA6 22
24 23 24

27 GAD28 +3.3V 28 27 GAD29 +3.3V 28
29 GAD26 GAD24 30 29 GAD27 GAD25 30
31 GROUND Reserved 32 31 GROUND GAD_STB132

∗ +5V 2

4

33 GCBE3

∗ +3.3V 34 33 GAD23 +3.3V 34

35 GAD22 GAD20 36 35 GAD21 GAD19 36
37 GROUND GAD18 38 37 GROUND GAD17 38
39 GAD16 +3.3V 40 39 GCBE
41 GFRAME

∗ Reserved 42 41 GIRDY∗ Reserved 42

∗2 +3.3V 40

43 GROUND Reserved 44 43 GROUND Reserved 44
45 +3.3V GTRDY
47 GSTOP

∗ AGP_PME∗ 48 47 +3.3V GPERR∗ 48

49 GROUND GPAR 50 49 GROUND GSERR
51 GAD15 +3.3V 52 51 GCBE1

∗ 46 45 +3.3V GDEVSEL∗ 46

∗ 50

# +3.3V 52

53 GAD13 GAD11 54 53 GAD14 GAD12 54

http://www.motorola.com/computer/literature 4-15

Connector Pin Assignments

Table 4-25. AGP Connector (J22) (Continued)

55 GROUND GAD09 56 55 GROUND GAD10 56
57 GCBE0

# +3.3V 58 57 GAD08 +3.3V 58

59 Reserved GAD06 60 59 GAD_STB0 GAD07 60
61 GROUND GAD04 62 61 GROUND GAD05 62

4

63 GAD02 +3.3V 64 63 GAD03 +3.3V 64
65 GAD00 Reserved 66 65 GAD01 Reserved 66

Table 4-26. PCI Connectors (J28/29/31/36/38)

Row A Row B

1 PCI_TRST
3 PCI_TMS PCI_TDI 4 3 GROUND RESERVED 4
5+5V INTA* 65+5V +5V 6
7INTC* +5V 87INTB* INTD* 8
9 RESERVED +5V 10 9 PCI0 RESERVED 10
11 RESERVED GROUND 12 11 PCI1 GROUND 12
13 GROUND RESERVED 14 13 GROUND RESERVED 14
15 PCIRESET* +5V 16 15 GROUND PCLK 16
17 PGNT* GROUND 18 17 GROUND PREQ* 18
19 PME* AD30 20 19 +5V AD31 20
21 +3.3V AD28 22 21 AD29 GROUND 22
23 AD26 GROUND 24 23 AD27 AD25 24
25AD24 IDSEL 2625+3.3V CBE
27 +3.3V AD22 28 27 AD23 GROUND 28
29 AD20 GROUND 30 29 AD21 AD19 30
31 AD18 AD16 32 31 +3.3V AD17 32
33 +3.3V FRAME
35 GROUND TRDY
37 GROUND STOP
39 +3.3V SDONE 40 39 PLOCK

∗ +12V 2 1 −12V PCI_TCK 2

∗326

∗ 34 33 CBE∗2 GROUND 34

# 36 35 IRDY# +3.3V 36

∗ 38 37 DEVSEL∗ GROUND 38

∗ PERR∗ 40

4-16 Computer Group Literature Center Web Site

PATX3070 Socket Connectors

Table 4-26. PCI Connectors (J28/29/31/36/38) (Continued)

41 SBO∗ GROUND 42 41 +3.3V SERR# 42
43PAR AD15 4443+3.3V CBE

∗144

45 +3.3V AD13 46 45 AD14 GROUND 46
47 AD11 GROUND 48 47 AD12 AD10 48
49 AD09
51

CBE0# 52 51 AD08 52

50 49 GROUND 50

53 +3.3V AD06 54 53 AD07 +3.3V 54
55 AD04 GROUN D 56 55 AD05 AD03 56
57 AD02 AD00 58 57 GROUND AD01 58
59 +5V REQ64S0

∗ 60 59 +5V ACK64S0∗ 60

61 +5V +5V 62 61 +5V +5V 62

Table 4-27. ISA Connectors (J39/41)

Row A Row B Row C Row D

4

1IOCHK∗ GROUND SBHE∗ MEMCS16∗ 1
2 SD7 RSTIS LA23 IOCS16∗ 2
3 SD6 +5V LA22 IRQ10 3
4 SD5 IRQ9 LA21 IRQ11 4
5 SD4 –5V LA20 IRQ12 5
6 SD3 DRQ2 LA19 IRQ15 6
7 SD2 –12V LA18 IRQ14 7
8SD1 ZWS∗ LA17 DACK0∗ 8
9 SD0 +12V MEMR∗ DRQ0 9
10 IOCHRDY GROUND MEMW∗ DACK5∗ 10
11 AEN SMEMW∗ SD8 DRQ5 11
12 SA19 SMEMR∗ SD9 DACK6∗ 12
13 SA18 IOW∗ SD10 DRQ6 13
14 SA17 IOR∗ SD11 DACK7∗ 14
15 SA16 DACK3∗ SD12 DRQ7 15

http://www.motorola.com/computer/literature 4-17

Connector Pin Assignments

Table 4-27. ISA Connectors (J39/41) (Continued)

16 SA15 DRQ3 SD13 +5V 16
17 SA14 DACK1∗ SD14 MASTER∗ 17
18 SA13 DRQ1 SD15 GROUND 18
19 SA12 REFRESH∗

4

20 SA11 SYSCLK
21 SA10 IRQ7
22 SA9 IRQ6
23 SA8 IRQ5
24 SA7 IRQ4
25 SA6 IRQ3
26 SA5 DACK2∗
27 SA4 TC
28 SA3 BALE
29 SA2 5V
30 SA1 OSC
31 SA0 GROUND

Table 4-28. DIMM Module Sockets (U12-U15)

Pin/Signal

1 Vss 22 CB1 43 Vss 64 Vss
2 DQ0 23 Vss 44 DU12 65 DQ21
3 DQ1 24 No Connection 45 CS2∗ 66 DQ22
4 DQ2 25 No Connection 46 DQM2 67 DQ23
5 DQ3 26 Vcc 47 DQM3 68 Vss
6Vcc 27WE∗ 48 No Connection 69 DQ24
7 DQ4 28 DQM0 49 Vcc 70 DQ25
8 DQ5 29 DQM1 50 No Connection 71 DQ26
9 DQ6 30 CS0∗ 51 No Connection 72 DQ27
10 DQ7 31 DU11 52 CB2 73 Vcc

4-18 Computer Group Literature Center Web Site

PATX3070 Socket Connectors

Table 4-28. DIMM Module Sockets (U12-U15) (Continued)

11 DQ8 32 Vss 53 CB3 74 DQ28
12 Vss 33 A0 54 Vss 75 DQ29
13 DQ9 34 A2 55 DQ16 76 DQ30
14 DQ10 35 A4 56 DQ17 77 DQ31
15 DQ11 36 A6 57 DQ18 78 Vss
16 DQ1 2 37 A8 58 DQ 19 79 CLK2
17 DQ13 38 A10 59 Vcc 80 No Connection
18 Vcc 39 A12 60 DQ20 81 WP
19 DQ14 40 Vcc 61 No Connection 82 SDA
20 DQ15 41 Vcc 62 No Connection 83 SCL
21 CB0 42 CLK0 63 CKE1 84 Vcc
85 Vss 106 CB5 127 Vss 148 Vss
86 DQ32 107 Vss 128 CKE0 149 DQ53
87 DQ33 108 No Connection 129 CS3∗ 150 DQ54
88 DQ34 109 No Connection 130 DQM6 151 DQ55
89 DQ35 110 Vcc 131 DQM7 152 Vss
90 Vcc 111 CAS∗ 132 VSS 153 DQ56
91 DQ3 6 112 DQM4 133 Vcc 154 DQ57
92 DQ37 113 DQM5 134 No Connection 155 DQ58
93 DQ38 114 CS1∗ 135 No Connection 156 DQ59
94 DQ39 115 RAS∗ 136 CB6 157 Vcc
95 DQ40 116 Vss 137 CB7 158 DQ60
96 Vss 117 A1 138 Vss 159 DQ61
97 DQ41 118 A3 139 DQ48 160 DQ62
98 DQ42 119 A5 140 DQ49 161 DQ63
99 DQ43 120 A7 141 DQ50 162 Vss
100 DQ44 121 A9 142 DQ51 163 CLK3
101 DQ45 122 A11 143 Vcc 164 No Connection

4

http://www.motorola.com/computer/literature 4-19

Connector Pin Assignments

Table 4-28. DIMM Module Sockets (U12-U15) (Continued)

102 Vcc 123 A13 144 DQ52 165 SA0
103 DQ46 124 Vcc 145 No Connection 166 SA1
104 DQ47 125 CLK1 146 No Connection 167 SA2
105 CB4 126 DU1 147 DOREGE 168 Vcc

4

4-20 Computer Group Literature Center Web Site

ARelated Documentation

Motorola Computer Group Documents

The Motorola publicationslisted below are referencedin thismanual. You
can obtain paper or electronic copies of Motorola C omputer Group
publications by:

❏ Contacting your local Motorola sales office
❏ Visiting Motorola C omputer Group’s World Wide Web literature

site, http://www.motorola.com/computer/literature

Table 4-1. Motorola Computer Group Documents

Document Title Motorola

Publication Number

PATX3070 BIOS and Programmer’s Reference Guide P3070BOSA/RM

To obtain the most up-to-date product information in PDF or HTML
format, visit http://www.motorola.com/computer/literature.

A

Manufacturers’ Documents

For additionalinformation, refer to the following table for manufacturers’
data sheetsor user’s manuals. As an additional help, a source for the listed
document is provided. Please note that, while these sources have been
verified, the information is subject to change without notice.

A-1

A

Related Documentation

Please note that in many cases, the information is preliminary and the
revision levels of the documents are subject to change without notice.

Table A-2. Manufacturers’ Documents

Document Title and Source Publication

Number

Pentium III Processor for the PGA370 socket at 500 MHz to 1.0B GHz—
Data Sheet; Intel Corporation;

http://developer.intel.com/design/pentiumiii/datashts/245264.htm

Celeron Processor Data Sheet; Intel Corporation

http://developer.intel.com/design/celeron/datashts/243658.htm

Intel 440BX AGPset: 82443BX Host Bridge/Controller — Data Sheet
Intel Corporation;

http://developer.intel.com/design/chipsets/datashts/290633.htm

Intel 82371AB PCI-to-ISA/IDE Xcelerator (PIIX4) — Specification and
Update

Intel Corporation;

http://developer.intel.com/design/chipsets/datashts/290562.htm

Intel 82559ER Fast Ethernet PCI Bus Controller with Integrated PHY —
External Design Specification; Intel Corporation;

http://developer.intel.com/design/network/datashts/738259.htm

82C54 CMOS Programmable Interval Timer Data Sheet
Intersil Corporation; http://www.intersil.com/search

AIC-7895 PCI Bus Master Single-Chip SCSI Host Adapter — Data Book
Adaptec, Inc.; http://www.adaptec.com/pdfs/aic7895.pdf

DEC 21152 PCI-to-PCI Bridge — Data Sheet; Intel Corporation;

http://developer.intel.com/design/bridge/datashts

LM79 Microprocessor System Hardware Monitor; National
Semiconductor Corporation; http://www.national.com/pf/LM/LM79.html

MAX1617 Remote/Local Temperature Sensor with SMBus Serial
Interface; Maxim Corporation;

http://pdfserv.maxim-ic.com/arpdf/1855.pdf

MAX705 Supervisory Circuit — Data Sheet
Maxim Corporation; http://pdfserv.maxim-ic.com/arpdf/1151.pdf

24526406.pdf

24365816.pdf

29063301.pdf

29056201.pdf

73825902.pdf

FN2970.pdf

aic7895.pdf

27822701.pdf

LM79.html

1855.pdf

1151.pdf

A-2 Computer Group Literature Center Web Site

Manufacturers’ Documents

Table A-2. Manufacturers’ Documents (Continued)

Document Title and Source Publication

Number

PC87307VUL ISA Super I/OTMDevice — Data Manual (documentation
applies to PC97317 as well); National Semiconductor Corporation;

http://www.national.com/pf/PC/PC87307.html

2

PCA8550 4-Bit 1-of-2 I

http://www.semiconductors.com/acrobat/datasheets/PCA8550_3.pdf

SanDisk CompactFlash cartridge; SanDisk Corporation;

http://www.sandisk.com/cons/prod_lit.htm

Smart 5 Boot Block Flash Memory Family 2, 4, 8 Mbit — Specification
Intel Corporation;

http://developer.intel.com/design/flcomp/PRODBREF/297810.htm

C Multiplexer; Philips Semiconductor;

PC87307.html

PCA8550_2.pdf

CompactFlash
Product Data

297810.htm

A

http://www.motorola.com/computer/literature A-3

A

Related Documentation

Related Specifications

For additional information, refer to the following table for related
specifications. As an additional help, a s ource for the listed document is
provided. Please note that, while these sources have been verified, the
information is subject to change without notice.

Table A-3. Related Specifications

Document Title and Source Publication

Number

ATX Specification
Version 2.03; Intel Corporation

http://www.teleport.com/~ffsupprt/spec/atx/atx2_03p1/pdf

Bidirectional Parallel Port Interface Specification
Institute of Electrical and Electronics Engineers, Inc.

http://standards.ieee.org/catalog/

atx2_03p1.pdf

IEEE Standard
1284

Peripheral Component Interconnect (PCI) Local Bus Specification,
Revision 2.0

PCI Special Interest Group;

http://www.pcisig.com/

Information Technology - Local and Metropolitan Networks - Part 3:
Carrier Sense Multiple Access with Collision Detection (CSMA/CD)
Access Method and Physical Layer Specifications
Global Engineering Documents;

http://global.ihs.com/index.cfm (for publications)

(This document can also be obtained throughthe national standards body
of member countries.)

Interface Between Data Terminal Equipment and Data Circuit­Terminating Equipment Employing Serial Binary Data Interchange;

Electronic Industries Alliance;

http://global.ihs.com/index.cfm (for publications)

PCI Local Bus
Specification

ISO/IEC 8802-3

TIA/EIA-232
Standard

A-4 Computer Group Literature Center Web Site

Table A-3. Related Specifications (Continued)

Document Title and Source Publication

Number

Open HCI; Open Host Controller Interface Spec for USB
Compaq Corporation, Microsoft Corporation, National Semiconductor

http://www3.compaq.com/support
http://www.national.com/
http://www.microsoft.com/

Accelerated Graphics Port Interface Specification, Revision 1.0
Intel Corporation

http://www.intel.com/technology/agp/agp_index.htm

Universal Host Controller Interface (UHCI) Design Guide
Intel Corporation;

http://www.intel.com/design/litcentr/

Universal Serial Bus (USB)
Intel Corporation;

http://www.intel.com/design/litcentr/

Open HCI
Release 1.0
12/15/95

agp10.pdf

297650-002

297773-001

URLs

A

URLs

The following URLs (uniform resource locators) may provide helpful
sources of additional information about this product, related services, and
developmenttools. Please note that, while these URLs have been verified,
they are subject to change without notice.

❏ Motorola C omputer Group, http://www.motorola.com/computer
❏ Motorola C omputer Group OEM Services,

http://www.motorola.com/computer/support

http://www.motorola.com/computer/literature A-5

Index

B

battery, backup 1-9
BIOS (Basic I/O System)

configuration 2-1

Setup menu 2-2
BIOS data, reconfiguring 1-10
board

characteristics 3-1

configuration 1-7

installation 1-15

layout 1-6

pin assignments 4-1

C

cable connections 1-25
chassis intrusion 3-3
connector pin assignments 4-1
connectors, board/panel 1-25
cooling requirements 3-3

D

DIMMs (dual inline memory modules) 1-18

E

environmental monitoring 3-3
external battery backup 1-9

F

features, hardware 3-1

H

hardware monitor 3-3

I

installation

AGP module 1-19
battery replacement 1-28
cpu cooler 1-23
I/O shield 1-14
ISA module(s) 1-21
memory modules 1-18
PATX3000 motherboard 1-15
PCI module(s) 1-20
processor 1-28
SanDisk IDE CompactFlash card 1-22

J

jumpers

J13 (CompactFlash configuration) 1-9,

1-23

J32 (CMOS-to-EEPROM backup con-

figuration) 1-10
J42 (second USB routing) 1-11
J44 (CMOS batterybackup control)1-12
J51 (watchdog timer enable) 1-13
J8 (backup battery selection) 1-9

jumpers and switches, setting 1-7

M

manufacturers’ documents A-1
master/slave mode, CompactFlash 1-9
motherboard

characteristics 3-1
configuration 1-5, 1-7
installation 1-15
pin assignments 4-1

IN-1

O

operating systems 3-1

P

PCI/ISA slot, shared 1-20

R

reconfiguring the BIOS 1-10
related specifications A-4

S

setting jumpers and switches 1-7
shared PCI/ISA slot 1-20
specifications, PATX3000 motherboard 3-4
specifications, related A-4
system management features 3-3
system startup overview 1-4

T

temperature monitor, CPU 3-3

U

URLs (uniform resource locators) A-5

Index

N
D
E
X

I

IN-2 Computer Group Literature Center Web Site