MOTOROLA 3G PCIe Half Mini Card User Guide
HTM1000 PCIe Half Mini Card
User Guide
DOCUMENT CONTROL NUMBER:
Version No.: 1.0
Date: 7/01/2009
Copyright 2003 - 2009 Motorola Inc. All rights reserved. This document
and the information contained in it is CONFIDENTIAL INFORMATION of
Motorola, and shall not be used, published, disclosed, or disseminated
outside of Motorola in whole or in part without Motorola’s consent. This
document contains trade secrets of Motorola. Copyright notice does not
imply publication of this document.
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MOTOROLA 3G PCIe Half Mini Card User Guide
HTM1000 PCIE HALF MINI CARD......................................................................................................... 1
USER GUIDE............................................................................................................................................... 1
1. INTRODUCTION............................................................................................................................... 4
1.1 REVISION HISTORY ........................................................................................................................... 4
1.2 PURPOSE ........................................................................................................................................... 4
1.3 SCOPE ............................................................................................................................................... 4
1.4 TARGET AUDIENCE........................................................................................................................... 4
1.5 ABBREVIATIONS ............................................................................................................................... 5
2. PRODUCT OVERVIEW................................................................................................................... 6
3. HARDWARE ARCHITECTURE..................................................................................................... 7
4. HTM1000 DATA CARD FEATURE SUMMARY..........................................................................7
4.1 HARDWARE REVISION: P2B.............................................................................................................. 7
4.2 2G..................................................................................................................................................... 7
4.3 3G..................................................................................................................................................... 8
4.4 ADVANCED SERVICES....................................................................................................................... 8
4.5 AUDIO............................................................................................................................................... 8
4.6 EXTERNAL MEMORY ........................................................................................................................ 8
4.7 SYSTEM REQUIREMENTS................................................................................................................... 8
4.8 SECURITY.......................................................................................................................................... 8
4.9 CONNECTIVITY ................................................................................................................................. 8
4.10 POWER UP SEQUENCE.................................................................................................................. 9
4.11 POWER CONSUMPTION................................................................................................................. 9
5. MECHANICAL SPECIFICATIONS.............................................................................................. 10
5.1.1 Electrical Specification......................................................................................................... 10
5.1.2 Mechanical Specification...................................................................................................... 10
5.1.3 Ther mal Specification...........................................................................................................10
6. DATA CARD INTERFACES.......................................................................................................... 10
6.1.1 PCIe Interface....................................................................................................................... 10
6.1.2 SIM Interface........................................................................................................................ 12
6.1.3 Audio Interface..................................................................................................................... 12
7. AT COMMANDS.............................................................................................................................. 12
7.1.1 Network Connection Management........................................................................................ 13
7.1.2 Registration or Mobility Management.................................................................................. 13
7.1.3 SMS....................................................................................................................................... 14
7.1.4 USIM and Phonebook........................................................................................................... 14
8. NVM/FLASH .................................................................................................................................... 14
9. RF CALIBRATION/PHASING...................................................................................................... 15
10. HARDWARE INSTALLATION..................................................................................................... 15
10.1 HTM1000 DATA CARD INSTALLATION...................................................................................... 15
11. MOTOROLA DATA CARD DRIVER INSTALLATION........................................................... 18
12. LIVE NETWORK CONNECTION................................................................................................ 21
12.1 SETTING UP DIAL UP NETWORKING (DUN) CONNECTION USING DATA CARD AS A MODEM..... 21
12.2 TROUBLE SHOOTING LIVE NETWORK CONNECTION .................................................................. 28
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MOTOROLA 3G PCIe Half Mini Card User Guide
13. KNOWN ISSUES.............................................................................................................................. 28
13.1 P2B HW REVISION..................................................................................................................... 28
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MOTOROLA 3G PCIe Half Mini Card User Guide
1. Introduction
1.1 Revision History
Revision Date Author Description
1.0 July 2009
1.2 Purpose
This document describes the product design and specification for HTM1000
half mini PCIe card. HTM1000 supports multi-mode (2G/3G) with
HSDPA/HSUPA capabilities.
Customer
Operations
Initial Draft
1.3 Scope
This document describes: the platform architecture, the hardware / software
interactions, Technical/Electrical Specifications.
1.4 Target Audience
This document is intended to provide a design specification for the teams
involved in and an introduction to the platform for product integration teams.
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MOTOROLA 3G PCIe Half Mini Card User Guide
1.5 Abbreviations
AES Advanced Encryption Standard
AGPS Assisted Global Positioning System
AMR-NB Adaptive Multi-Rate Narrow Band
AMR-WB Adaptive Multi-Rate Wide Band
AP Applications Processor
BP Baseband Processor
DES Data Encryption Standard
DDR Double Data Rate
DTM Dual Transfer Mode
DUN Dial Up Networking
EDGE Enhanced Data rate for GSM Evolution
EFR Enhanced Full Rate
FM Frequency Modulation
FPS Frames-Per-Second
FR Full Rate
GEA GSM Encryption Algorithm
GPRS General Packet Radio Service
GPS Global Positioning Syst em
GSM Global System for Mobile communications
HR Half Rate
HS High Speed
HSDPA High-Speed Downlink Packet Access
HSUPA High-Speed Uplink Packet Access
IMEI International Mobile Equipment Identity
IMS IP Multimedia Subsystems
IPC Inter Processor Communications
NAND Not AND (electronic logic gate)
OHA Open Handset Alliance
OMA Open Mobile Alliance
OTG On-The-Go
PCI Peripheral Component Interconnect
PMIC Power Management IC
RF Radio Frequency
SAM Stand Alone Modem
SDRAM Synchronous Dynamic Random Access Memory
SIM Subscriber Identity Module
UEA UMTS Encryption Algorithm
UICC Universal Integrated Circuit Card
USB Universal Serial Bus
USIM Universal SIM
W3G Wrigley3G (Motorola 3G baseband processor)
WCDMA Wideband Code Division Multiple Access
WLAN Wireless Local Area Network
WWAN Wireless Wide Area Network
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MOTOROLA 3G PCIe Half Mini Card User Guide
2. Product Overview
HTM1000 is a half mini data card supporting tri-band HSPA and quad-band
EDGE/GPRS, with data rates of up to 10.1Mbps downlink and 5.76Mbps uplink.
It complies with PCIe Mini CEM spec, version 1.2.
HTM1000 is based on a custom 3G baseband processor that was developed by
Motorola. Other main hardware components on this platform are the RF
transceiver from Infineon, the Power Management IC, the RF analog front end
and Power amplifiers. HTM1000 has external DDR SDRAM and NAND flash
memories, packaged on top of the baseband processor (POP).
HTM1000 uses USB signals on PCIe interface to connect with a PC, netbook or
MID. HTM1000 uses 3.3V power supply on PCIe interface for power up.
Main
Antenna
Aux
Antenna
Top View Bottom View
Figure 1 -HTM 1000 Half Mini PCIe card (Top and Bottom views)
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MOTOROLA 3G PCIe Half Mini Card User Guide
3. Hardware Architecture
NAND
FLASH
DDR
Baseband
Processor
PMIC
3G DigRF
RFIC
+FE+PAs
HS-USB
D+/D-
PCI Express connector
USIM
WWAN LED
Half Mini Card
Figure 2 – HTM1000 high level block diagram
4. HTM1000 Data Card Feature Summary
Key capabilities for the data card and associated features of the platform
are listed below. The following summary describes some of the platform
capabilities.
4.1 Hardware Revision: P2B
PC
4.2 2G
• Release 6 compliant
• Quad-band GSM 850/900/1800/1900 MHz
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• GPRS Class 12
• EDGE Class 12
• DTM Class 11 (unused because no voice)
• A5/1-3 (unused because no voice) and GEA/1-3 Encryption
• DARP
4.3 3G
• Release 6 compliant
• Frequency Bands
• WCDMA 384kbps uplink (UL) – 384kbps downlink (DL)
• HSDPA 7.2 / 10.1 Mbps
• HSUPA 1.46 / 2 / 5.76 Mbps
• UEA01, UEA02, UIA1, UIA2 Encryption
• 3G Rx Diversity in all bands
MOTOROLA 3G PCIe Half Mini Card User Guide
o 850/1900/2100 MHz (Supported)
o 900/1900/2100 MHz (Available upon request)
o 1700/1900 MHz (Available upon request)
4.4 Advanced Services
• GPS is not supported in this revision of the data card.
4.5 Audio
• Audio is not supported in this revision of the data card.
• Audio is supported in hardware via PCM signals in data card
revisions of P2B and higher. External audio codecs are required to
process PCM data from baseband.
4.6 External Memory
• 64MB64MByte NAND Flash Memory
• 32MB32MByte DDR-333 166 MHz clock SDRAM
4.7 System Requirements
• Linux Android Kernel in the ARM9 of the W3G
• VTRXmc in the C55x+ of the W3G
4.8 Security
• High Assurance Boot with Multiple Super Root Key Support
• MD5, SHA-1, SHA-256, 3DES, AES 128, RC4, RSA
• Subsidy Lock
• IMEI Protection
4.9 Connectivity
• SIM or UICC (SIM and USIM)
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MOTOROLA 3G PCIe Half Mini Card User Guide
• USB client 2.0 HS Support (PC connectivity)
• EMU local Bus Support
• 3GDigRF RF interface version 3.07
4.10 Power Up Sequence
The main power management function is performed by Power management IC
(CPCAP), which receives its voltage input from the PCIe interface. 3.3V on PCIe
interface supplies power to PMIC.
CPCAP manages all data card power; it includes 2 bucks, 1 boost and 8 linear
regulators.
4.11 Power Consumption
Following table shows data card power consumption.
Typical Power
Supply 3.3V DC
HSDPA 7.2Mbps download @ 0dBm < 1.5W
EDGE 4RX 200kbps < 0.5W
Idle Mode < 20mW
Sleep Mode (radio disabled) < 10mW
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