MOTOROLA 3G PCIe Half Mini Card User Guide
HTM1000 PCIe Half Mini Card
User Guide
DOCUMENT CONTROL NUMBER:
Version No.: 1.0
Date: 7/01/2009
Copyright 2003 - 2009 Motorola Inc. All rights reserved. This document and the information contained in it is CONFIDENTIAL INFORMATION of Motorola, and shall not be used, published, disclosed, or disseminated outside of Motorola in whole or in part without Motorola’s consent. This document contains trade secrets of Motorola. Copyright notice does not imply publication of this document.
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MOTOROLA 3G PCIe Half Mini Card User Guide
HTM1000 PCIE HALF MINI CARD......................................................................................................... |
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USER GUIDE ............................................................................................................................................... |
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1. INTRODUCTION............................................................................................................................... |
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1.1 |
REVISION HISTORY ........................................................................................................................... |
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1.2 |
PURPOSE ........................................................................................................................................... |
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1.3 |
SCOPE ............................................................................................................................................... |
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TARGET AUDIENCE ........................................................................................................................... |
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ABBREVIATIONS ............................................................................................................................... |
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2. |
PRODUCT OVERVIEW ................................................................................................................... |
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3. |
HARDWARE ARCHITECTURE..................................................................................................... |
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4. |
HTM1000 DATA CARD FEATURE SUMMARY .......................................................................... |
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4.1 |
HARDWARE REVISION: P2B.............................................................................................................. |
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4.2 |
2G..................................................................................................................................................... |
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4.3 |
3G..................................................................................................................................................... |
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4.4 |
ADVANCED SERVICES ....................................................................................................................... |
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4.5 |
AUDIO............................................................................................................................................... |
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4.6 |
EXTERNAL MEMORY ........................................................................................................................ |
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4.7 |
SYSTEM REQUIREMENTS................................................................................................................... |
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4.8 |
SECURITY.......................................................................................................................................... |
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4.9 |
CONNECTIVITY ................................................................................................................................. |
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4.10 |
POWER UP SEQUENCE .................................................................................................................. |
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4.11 |
POWER CONSUMPTION ................................................................................................................. |
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5. MECHANICAL SPECIFICATIONS.............................................................................................. |
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5.1.1 |
Electrical Specification......................................................................................................... |
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5.1.2 |
Mechanical Specification...................................................................................................... |
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5.1.3 |
Thermal Specification........................................................................................................... |
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6. DATA CARD INTERFACES .......................................................................................................... |
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6.1.1 |
PCIe Interface....................................................................................................................... |
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6.1.2 |
SIM Interface ........................................................................................................................ |
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6.1.3 |
Audio Interface ..................................................................................................................... |
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7. AT COMMANDS.............................................................................................................................. |
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7.1.1 |
Network Connection Management........................................................................................ |
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7.1.2 Registration or Mobility Management.................................................................................. |
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7.1.3 |
SMS....................................................................................................................................... |
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7.1.4 |
USIM and Phonebook........................................................................................................... |
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NVM/FLASH .................................................................................................................................... |
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9. |
RF CALIBRATION/PHASING ...................................................................................................... |
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10. |
HARDWARE INSTALLATION..................................................................................................... |
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10.1 |
HTM1000 DATA CARD INSTALLATION...................................................................................... |
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11. |
MOTOROLA DATA CARD DRIVER INSTALLATION ........................................................... |
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12. |
LIVE NETWORK CONNECTION ................................................................................................ |
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12.1 |
SETTING UP DIAL UP NETWORKING (DUN) CONNECTION USING DATA CARD AS A MODEM..... |
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12.2 |
TROUBLE SHOOTING LIVE NETWORK CONNECTION .................................................................. |
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MOTOROLA 3G PCIe Half Mini Card User Guide |
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13. KNOWN ISSUES.............................................................................................................................. |
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13.1 P2B HW REVISION ..................................................................................................................... |
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MOTOROLA 3G PCIe Half Mini Card User Guide
1.1 |
Revision History |
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Revision |
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1.0 |
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July 2009 |
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Initial Draft |
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Operations |
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1.2 |
Purpose |
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This document describes the product design and specification for HTM1000 half mini PCIe card. HTM1000 supports multi-mode (2G/3G) with
HSDPA/HSUPA capabilities.
This document describes: the platform architecture, the hardware / software interactions, Technical/Electrical Specifications.
This document is intended to provide a design specification for the teams involved in and an introduction to the platform for product integration teams.
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MOTOROLA 3G PCIe Half Mini Card User Guide
AES |
Advanced Encryption Standard |
AGPS |
Assisted Global Positioning System |
AMR-NB |
Adaptive Multi-Rate Narrow Band |
AMR-WB |
Adaptive Multi-Rate Wide Band |
AP |
Applications Processor |
BP |
Baseband Processor |
DES |
Data Encryption Standard |
DDR |
Double Data Rate |
DTM |
Dual Transfer Mode |
DUN |
Dial Up Networking |
EDGE |
Enhanced Data rate for GSM Evolution |
EFR |
Enhanced Full Rate |
FM |
Frequency Modulation |
FPS |
Frames-Per-Second |
FR |
Full Rate |
GEA |
GSM Encryption Algorithm |
GPRS |
General Packet Radio Service |
GPS |
Global Positioning System |
GSM |
Global System for Mobile communications |
HR |
Half Rate |
HS |
High Speed |
HSDPA |
High-Speed Downlink Packet Access |
HSUPA |
High-Speed Uplink Packet Access |
IMEI |
International Mobile Equipment Identity |
IMS |
IP Multimedia Subsystems |
IPC |
Inter Processor Communications |
NAND |
Not AND (electronic logic gate) |
OHA |
Open Handset Alliance |
OMA |
Open Mobile Alliance |
OTG |
On-The-Go |
PCI |
Peripheral Component Interconnect |
PMIC |
Power Management IC |
RF |
Radio Frequency |
SAM |
Stand Alone Modem |
SDRAM |
Synchronous Dynamic Random Access Memory |
SIM |
Subscriber Identity Module |
UEA |
UMTS Encryption Algorithm |
UICC |
Universal Integrated Circuit Card |
USB |
Universal Serial Bus |
USIM |
Universal SIM |
W3G |
Wrigley3G (Motorola 3G baseband processor) |
WCDMA |
Wideband Code Division Multiple Access |
WLAN |
Wireless Local Area Network |
WWAN |
Wireless Wide Area Network |
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MOTOROLA 3G PCIe Half Mini Card User Guide
HTM1000 is a half mini data card supporting tri-band HSPA and quad-band
EDGE/GPRS, with data rates of up to 10.1Mbps downlink and 5.76Mbps uplink. It complies with PCIe Mini CEM spec, version 1.2.
HTM1000 is based on a custom 3G baseband processor that was developed by Motorola. Other main hardware components on this platform are the RF transceiver from Infineon, the Power Management IC, the RF analog front end and Power amplifiers. HTM1000 has external DDR SDRAM and NAND flash memories, packaged on top of the baseband processor (POP).
HTM1000 uses USB signals on PCIe interface to connect with a PC, netbook or MID. HTM1000 uses 3.3V power supply on PCIe interface for power up.
Main |
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Aux |
Antenna |
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Antenna |
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Top View |
Bottom View |
Figure 1 -HTM 1000 Half Mini PCIe card (Top and Bottom views)
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MOTOROLA 3G PCIe Half Mini Card User Guide
NAND |
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FLASH |
Baseband |
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RFIC |
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DDR |
3G DigRF |
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Processor |
+FE+PAs |
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PMIC |
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HS-USB |
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Half Mini Card |
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D+/D- |
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PCI Express connector |
PC |
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USIM |
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WWAN LED |
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Figure 2 – HTM1000 high level block diagram
Key capabilities for the data card and associated features of the platform are listed below. The following summary describes some of the platform capabilities.
4.1Hardware Revision: P2B
4.22G
•Release 6 compliant
•Quad-band GSM 850/900/1800/1900 MHz
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MOTOROLA 3G PCIe Half Mini Card User Guide
•GPRS Class 12
•EDGE Class 12
•DTM Class 11 (unused because no voice)
•A5/1-3 (unused because no voice) and GEA/1-3 Encryption
•DARP
4.33G
•Release 6 compliant
•Frequency Bands
o 850/1900/2100 MHz (Supported)
o 900/1900/2100 MHz (Available upon request)
o1700/1900 MHz (Available upon request)
•WCDMA 384kbps uplink (UL) – 384kbps downlink (DL)
•HSDPA 7.2 / 10.1 Mbps
•HSUPA 1.46 / 2 / 5.76 Mbps
•UEA01, UEA02, UIA1, UIA2 Encryption
•3G Rx Diversity in all bands
•GPS is not supported in this revision of the data card.
•Audio is not supported in this revision of the data card.
•Audio is supported in hardware via PCM signals in data card revisions of P2B and higher. External audio codecs are required to process PCM data from baseband.
•64MB64MByte NAND Flash Memory
•32MB32MByte DDR-333 166 MHz clock SDRAM
•Linux Android Kernel in the ARM9 of the W3G
•VTRXmc in the C55x+ of the W3G
•High Assurance Boot with Multiple Super Root Key Support
•MD5, SHA-1, SHA-256, 3DES, AES 128, RC4, RSA
•Subsidy Lock
•IMEI Protection
•SIM or UICC (SIM and USIM)
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MOTOROLA 3G PCIe Half Mini Card User Guide
•USB client 2.0 HS Support (PC connectivity)
•EMU local Bus Support
•3GDigRF RF interface version 3.07
The main power management function is performed by Power management IC
(CPCAP), which receives its voltage input from the PCIe interface. 3.3V on PCIe interface supplies power to PMIC.
CPCAP manages all data card power; it includes 2 bucks, 1 boost and 8 linear regulators.
Following table shows data card power consumption.
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Typical Power |
Supply |
3.3V DC |
HSDPA 7.2Mbps download @ 0dBm |
< 1.5W |
EDGE 4RX 200kbps |
< 0.5W |
Idle Mode |
< 20mW |
Sleep Mode (radio disabled) |
< 10mW |
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