MRF1500
2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = 60 mAdc, VBE = 0) V
(BR)CES
70 — — Vdc
Collector–Base Breakdown Voltage (IC = 60 mAdc, IE = 0) V
(BR)CBO
70 — — Vdc
Emitter–Base Breakdown Voltage (IE = 10 mAdc, IC = 0) V
(BR)EBO
4.0 — — Vdc
Collector Cutoff Current (VCB = 50 Vdc, IE = 0) I
CBO
— — 40 mAdc
ON CHARACTERISTICS
DC Current Gain (IC = 5.0 Adc, VCE = 5.0 Vdc) h
FE
20 40 — —
FUNCTIONAL TESTS
Common–Base Amplifier Power Gain
(VCC = 50 Vdc, P
out
= 500 W Peak, f = 1090 MHz)
G
PB
5.2 — — dB
Collector Efficiency
(VCC = 50 Vdc, P
out
= 500 W Peak, f = 1090 MHz)
η 37 — — %
Load Mismatch
(VCC = 50 Vdc, P
out
= 500 W Peak, f = 1090 MHz,
Load VSWR = 10:1 All Phase Angles)
ψ No Degradation in Output Power
C1 — 82 pF 100 mil Chip Capacitor
C2 — 82 pF 100 mill Chip Capacitor
C3 — 0.1 µF
C4 — 10 µF 100 V, Electrolytic
C5 — 1000 µF 60 V, Electrolytic
C4C2 C3 C5
+
–
C1
Z8Z6Z1 Z2 Z3 Z4 Z5 Z9 Z10 Z11 Z14Z13Z12
Z7
D.U.T.
RF
INPUT
++
RF
OUTPUT
141
1.200
50
50
182
1.598
50
50
1.183 418
840
1.576
698
630
182
508
277
205
380
50
383
528
217
5050
383
50
182
464
431
1.332
331
50
L1 — 3 Turns, #18 AWG, 1/8″ ID, 0.18 Long
Z1–Z14 — Microstrip, See Details Below
Board Material — Teflon–Glass Laminate,
Dielectric Thickness = .020″,
∈r = 2.55, 2 oz. Copper
Figure 1. Test Circuit