Motorola MRF148 Datasheet

1
MRF148MOTOROLA RF DEVICE DATA
The RF MOSFET Line
   
N–Channel Enhancement–Mode
Designed for power amplifier applications in industrial, commercial and
amateur radio equipment to 175 MHz.
Superior High Order IMD
Output Power = 30 Watts Power Gain = 18 dB (Typ) Efficiency = 40% (Typ)
IMD
(d3)
(30 W PEP) — –35 dB (Typ)
IMD
(d11)
(30 W PEP) — –60 dB (Typ)
100% Tested For Load Mismatch At All Phase Angles With 30:1 VSWR
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain–Source Voltage V
DSS
120 Vdc
Drain–Gate Voltage V
DGO
120 Vdc
Gate–Source Voltage V
GS
±40 Vdc
Drain Current — Continuous I
D
6.0 Adc
Total Device Dissipation @ TC = 25°C
Derate above 25°C
P
D
115
0.66
Watts
W/°C
Storage Temperature Range T
stg
–65 to +150 °C
Operating Junction Temperature T
J
200 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
θJC
1.52 °C/W
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
Order this document
by MRF148/D
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SEMICONDUCTOR TECHNICAL DATA
30 W, to 175 MHz
N–CHANNEL MOS
LINEAR RF POWER
FET
CASE 211–07, STYLE 2
Motorola, Inc. 1995
D
G
S
REV 1
MRF148 2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage (VGS = 0, ID = 10 mA) V
(BR)DSS
125 Vdc
Zero Gate Voltage Drain Current (VDS = 50 V, VGS = 0) I
DSS
1.0 mAdc
Gate–Body Leakage Current (VGS = 20 V, VDS = 0) I
GSS
100 nAdc
ON CHARACTERISTICS
Gate Threshold Voltage (VDS = 10 V, ID = 10 mA) V
GS(th)
1.0 3.0 5.0 Vdc
Drain–Source On–Voltage (VGS = 10 V, ID = 2.5 A) V
DS(on)
1.0 3.0 5.0 Vdc
Forward Transconductance (VDS = 10 V, ID = 2.5 A) g
fs
0.8 1.2 mhos
DYNAMIC CHARACTERISTICS
Input Capacitance (VDS = 50 V, VGS = 0, f = 1.0 MHz) C
iss
50 pF
Output Capacitance (VDS = 50 V, VGS = 0, f = 1.0 MHz) C
oss
35 pF
Reverse Transfer Capacitance (VDS = 50 V, VGS = 0, f = 1.0 MHz) C
rss
8.0 pF
FUNCTIONAL TESTS (SSB)
Common Source Amplifier Power Gain (30 MHz)
(VDD = 50 V, P
out
= 30 W (PEP), IDQ = 100 mA) (175 MHz)
G
ps
— —
18 15
— —
dB
Drain Efficiency (30 W PEP)
(VDD = 50 V, f = 30 MHz, IDQ = 100 mA) (30 W CW)
η
40 50
— —
%
Intermodulation Distortion
(VDD = 50 V, P
out
= 30 W (PEP),
f = 30; 30.001 MHz, IDQ = 100 mA)
IMD
(d3)
IMD
(d11)
— —
–35 –60
— —
dB
Load Mismatch
(VDD = 50 V, P
out
= 30 W (PEP), f = 30; 30.001 MHz,
IDQ = 100 mA, VSWR 30:1 at all Phase Angles)
ψ
No Degradation in Output Power
CLASS A PERFORMANCE
Intermodulation Distortion (1) and Power Gain
(VDD = 50 V, P
out
= 10 W (PEP), f1 = 30 MHz,
f2 = 30.001 MHz, IDQ = 1.0 A)
G
PS
IMD
(d3)
IMD
(d9–13)
— — —
20 –50 –70
— — —
dB
NOTE:
1. To MIL–STD–1311 Version A, Test Method 2204B, Two Tone, Reference Each Tone.
Figure 1. 2.0 to 50 MHz Broadband Test Circuit
C1, C2, C3, C4, C5, C6 — 0.1 µF Ceramic Chip or Equivalent C7 — 10 µF, 100 V Electrolytic C8 — 100 pF Dipped Mica L1 — VK200 20/4B Ferrite Choke or Equivalent (3.0 µH) L2 — Ferrite Bead(s), 2.0 µH
R1, R2 — 200 , 1/2 W Carbon R3 — 4.7 , 1/2 W Carbon R4 — 470 , 1.0 W Carbon T1 — 4:1 Impedance Transformer T2 — 1:2 Impedance Transformer
RF
OUTPUT
RF
INPUT
BIAS
0– 10 V
50 V
+
C1
+ –
C4 C5 C6 C7
C2
C3
R1
R3
T1
T2
DUT
L1
L2
R4
C8
R2
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