Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyershallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
1
Revision History
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DOCUMENT NUMBER
9S12DT128BDGV1/D
Version
Number
V01.00
V01.01
V01.02
V01.03
V01.04
V01.05
V01.06
V01.07
Revision
Date
18 Jun
2001
23 July
2001
23 Sep
2001
12 Oct
2001
27 Feb
2002
4 Mar
2002
8 July
2002
16 Aug
2002
Effective
Date
18 June
2001
23 July
2001
23 Sep
2001
12 Oct
2001
27 Feb
2002
4 Mar
2002
22 July
2002
16 Aug
2002
AuthorDescription of Changes
Initial version (parent doc v2.03 dug for dp256).
Updated version after review
Changed Partname, added pierce mode, updated electrical
characteristics
some minor corrections
Replaced Star12 by HCS12
Updated electrical spec after MC-Qualification (IOL/IOH), Data for
Pierce, NVM reliability
New document numbering. Corrected Typos
Increased VDD to 2.35V, removed min. oscillator startup
Removed Document order number except from Cover Sheet
Added:
Pull-up columns to signal table,
example for PLL Filter calculation,
Thermal values for junction to board and package,
BGND pin pull-up
Part Order Information
Global Register Table
Chip Configuration Summary
Modified:
Reduced Wait and Run IDD values
Mode of Operation chapter
changed leakage current for ADC inputs down to +-1uA
Corrected:
Interrupt vector table enable register inconsistencies
PCB layout for 80QFP VREGEN position
Minor corrections in table 1-1 & section 1.5.1
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyer shallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
The Device User Guide provides information about the MC9S12DT128B device made up of standard
HCS12 blocks and the HCS12 processor core.
This document is part of the customer documentation. A complete set of device manuals also includes the
HCS12 Core UserGuideandall the individual Block User Guides of theimplementedmodules.In a effort
to reduce redundancy all module specific information is located only in the respective Block User Guide.
If applicable, special implementation details of the module are given in the block description sections of
this document.
This document also covers the MC9S12DG128B, MC9S12DJ128B and MC9S12DB128B.
Table 0-1 shows the availability of peripheral modules on the various derivatives. For details about the
compatibility within the MC9S12D-Family refer also to engineering bulletin EB386.
✓: Available for this device, ✕: Not available for this device
PVPV/FUPV/FUPV
An errata exists
contact Sales
Office
An errata exists
contact Sales
Office
An errata exists
contact Sales
13
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The following figure provides an ordering number example for the MC9S12D128B devices.
MC9S12 DJ128B C FU
Package Option
Temperature Option
Temperature Options
C = -40˚C to85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Device Title
Package Options
Controller Family
FU = 80QFP
PV = 112LQFP
Figure 0-1 Order Partnumber Example
See Table 0-2 for names and versions of the referenced documents throughout the Device User Guide.
Table 0-2 Document References
User GuideVersionDocument Order Number
HCS12_V1.5 Core User Guide1.2HCS12COREUG
Clock and Reset Generator (CRG) Block User GuideV03S12CRGV3/D
Enhanced Capture Timer 16 Bit 8 Channel (ECT_16B8C) Block User GuideV01S12ECT16B8CV1/D
Analog to Digital Converter 10 Bit 8 Channel (ATD_10B8C) Block User GuideV02S12ATD10B8CV2/D
Inter IC Bus (IIC) Block User GuideV02S12IICV2/D
Asynchronous Serial Interface (SCI) Block User GuideV02S12SCIV2/D
Serial Peripheral Interface (SPI) Block User GuideV02S12SPIV2/D
Pulse Width Modulator 8 Bit 8 Channel (PWM_8B8C) Block User GuideV01S12PWM8B8CV1/D
128K Byte Flash (FTS128K) Block User GuideV01S12FTS128KV1/D
2K Byte EEPROM (EETS2K) Block User GuideV01S12EETS2KV1/D
Byte Level Data Link Controller -J1850 (BDLC) Block User GuideV01S12BDLCV1/D
Motorola Scalable CAN (MSCAN) Block User GuideV02S12MSCANV2/D
Voltage Regulator (VREG) Block User GuideV01S12VREGV1/D
Port Integration Module (PIM_9DT128) Block User GuideV01S12PIMDT128V1/D
Byteflight (BF) Block User GuideV01S12BFV1/D
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Section 1 Introduction
1.1 Overview
The MC9S12DT128B microcontroller unit (MCU) is a 16-bit device composed of standard on-chip
peripherals including a 16-bit central processing unit (HCS12 CPU), 128K bytes of Flash EEPROM, 8K
bytes of RAM, 2K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), two
serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, two 8-channel, 10-bit
analog-to-digital converters(ADC),an 8-channel pulse-width modulator(PWM),a digital Byte Data Link
Controller (BDLC), 29 discrete digital I/O channels (Port A, Port B, Port K and Port E), 20 discrete digital
I/O lines with interrupt and wakeup capability, three CAN 2.0 A, B software compatible modules
(MSCAN12), a Byteflight module and an Inter-IC Bus. The MC9S12DT128B has full 16-bit data paths
throughout. However, the external bus can operate in an 8-bit narrow mode so single 8-bit wide memory
can be interfaced for lower cost systems. The inclusion of a PLL circuit allows power consumption and
performance to be adjusted to suit operational requirements.
1.2 Features
•HCS12 Core
–16-bit HCS12 CPU
i. Upward compatible with M68HC11 instruction set
ii. Interrupt stacking and programmer’s model identical to M68HC11
iii.20-bit ALU
iv.Instruction queue
•CRG (Clock and Reset Generator)
–Choice of low current Colpitts oscillator or standard Pierce Oscillator
–PLL
–COP watchdog
–real time interrupt
–clock monitor
•8-bit and 4-bit ports with interrupt functionality
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–Digital filtering
–Programmable rising or falling edge trigger
•Three 1M bit per second, CAN 2.0 A, B software compatible modules
–Five receive and three transmit buffers
–Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit or 8x8bit
–Four separate interrupt channels for Rx, Tx, error and wake-up
–Low-pass filter wake-up function
–Loop-back for self test operation
•Enhanced Capture Timer
–16-bit main counter with 7-bit prescaler
–8 programmable input capture or output compare channels
–Two 8-bit or one 16-bit pulse accumulators
•8 PWM channels
–Programmable period and duty cycle
–8-bit 8-channel or 16-bit 4-channel
–Separate control for each pulse width and duty cycle
–Center-aligned or left-aligned outputs
–Programmable clock select logic with a wide range of frequencies
–Fast emergency shutdown input
–Usable as interrupt inputs
•Serial interfaces
–Two asynchronous Serial Communications Interfaces (SCI)
–Two Synchronous Serial Peripheral Interface (SPI)
–Byteflight
•Byte Data Link Controller (BDLC)
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•SAE J1850 Class B Data Communications Network Interface
–Compatible and ISO Compatible for Low-Speed (<125 Kbps) Serial Data Communications in
Automotive Applications
•Inter-IC Bus (IIC)
–Compatible with I2C Bus standard
–Multi-master operation
–Software programmable for one of 256 different serial clock frequencies
•112-Pin LQFP and 80-Pin QFP package options
–I/O lines with 5V input and drive capability
–5V A/D converter inputs
–Operation at 50MHz equivalent to 25MHz Bus Speed
–Development support
–Single-wire background debug™ mode (BDM)
–On-chip hardware breakpoints
•Special Operating Modes
–Special Single-Chip Mode with active Background Debug Mode
–Special Test Mode (Motorola use only)
–Special Peripheral Mode (Motorola use only)
Low power modes
•Stop Mode
•Pseudo Stop Mode
•Wait Mode
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1.4 Block Diagram
Figure 1-1 shows a block diagram of the MC9S12DT128B device.
18
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VSSR
VREGEN
VDD1,2
VSS1,2
BKGD
XFC
VDDPLL
VSSPLL
EXTAL
XTAL
RESET
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
TEST
Multiplexed
Wide Bus
Multiplexed
Narrow Bus
Internal Logic 2.5V
V
DD1,2
V
SS1,2
PLL 2.5V
V
DDPLL
V
SSPLL
Figure 1-1 MC9S12DT128B Block Diagram
128K Byte Flash EEPROM
8K Byte RAM
2K Byte EEPROM
Voltage Regulator
Single-wire Background
Debug Module
Clock and
Reset
PLL
Generation
Module
XIRQ
IRQ
R/
W
LSTRB
PTE
PA7
ADDR15
DATA15
DATA7
ECLK
DDRE
MODA
MODB
XCLKS
NOACC/
Multiplexed Address/Data Bus
DDRADDRB
PTAPTB
PA4
PA3
PA2
PA1
ADDR11
ADDR10
ADDR9
DATA11
DATA10
DATA9
DATA3
DATA2
DATA1
PA0
ADDR8
DATA8
DATA0
PA6
PA5
ADDR12
ADDR14
ADDR13
DATA12
DATA14
DATA13
DATA4
DATA6
DATA5
I/O Driver 5V
V
DDX
V
SSX
A/D Converter 5V &
Voltage Regulator Reference
V
DDA
V
SSA
Voltage Regulator 5V & I/O
V
DDR
V
SSR
CPU12
Periodic Interrupt
COP Watchdog
Clock Monitor
Breakpoints
System
Integration
Module
(SIM)
PB4
PB6
PB5
ADDR6
ADDR5
DATA6
DATA5
PB3
ADDR4
ADDR3
DATA4
DATA3
PB7
ADDR7
DATA7
PB2
PB1
ADDR2
ADDR1
DATA2
DATA1
ATD0
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
Enhanced Capture
Timer
SCI0
SCI1
SPI0
BDLC
(J1850)
CAN0
PB0
CAN1
BYTEFLIGHT
ADDR0
DATA0
CAN4
IIC
MISO
MOSI
SCK
SS
SPI1
MC9S12DT128B Device User Guide — V01.07
VRH
VRL
VDDA
VSSA
PAD00
PAD01
PAD02
PAD03
PAD04
AD0
PAD05
PAD06
PAD07
PPAGE
MISO
MOSI
SCK
SS
RxB
TxB
RxCAN
TxCANPM1
RxCAN
TxCAN
RX_BF
TX_BF
BF_PSYN
BF_PROK
BF_PERR
BF_PSLM
RxCAN
TxCAN
SDA
SCL
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
PWM6
PWM7
ATD1
PIX0
PIX1
PIX2
PIX3
PIX4
PIX5
ECS
IOC0
IOC1
IOC2
IOC3
IOC4
IOC5
IOC6
IOC7
RXD
TXD
RXD
TXD
Module to Port Routing
KWJ0
KWJ1
KWJ6
KWJ7
KWP0
KWP1
KWP2
KWP3
KWP4
KWP5
KWP6
KWP7
KWH0
KWH1
KWH2
KWH3
KWH4
KWH5
KWH6
KWH7
VRH
VRL
VDDA
VSSA
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
DDRK
DDRT
DDRS
DDRM
DDRJ
DDRP
DDRH
AD1
PTK
PTT
PTS
PTM
PTJ
PTP
PTH
VRH
VRL
VDDA
VSSA
PAD08
PAD09
PAD10
PAD11
PAD12
PAD13
PAD14
PAD15
PK0
PK1
PK2
PK3
PK4
PK5
PK7
PT0
PT1
PT2
PT3
PT4
PT5
PT6
PT7
PS0
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PM0
PM2
PM3
PM4
PM5
PM6
PM7
PJ0
PJ1
PJ6
PJ7
PP0
PP1
PP2
PP3
PP4
PP5
PP6
PP7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
XADDR14
XADDR15
XADDR16
XADDR17
XADDR18
XADDR19
ECS
Signals shown in Bold are not available in the 80 Pin Package Option
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1.5 Device Memory Map
Table 1-1 and Figure 1-2 show the device memory map of the MC9S12DT128B after reset. Note that
after reset the EEPROM ($0000
($0000 - $1FFF). The bottom 1K Bytes of RAM ($0000 - $03FF) are hidden by the register space.
– $07FF) is hidden by the register space ($0000 - $03FF) and the RAM
Table 1-1 Device Memory Map
AddressModule
$0000 – $0017 CORE (Ports A, B, E, Modes, Inits, Test)24
Fixed Flash EEPROM array
incl. 0.5K, 1K, 2K or 4K Protected Sector at start
Size
(Bytes)
16384
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Table 1-1 Device Memory Map
$0000
$0400
$0800
$1000
$2000
$4000
$8000
AddressModule
Fixed Flash EEPROM array
$C000 – $FFFF
incl. 0.5K, 1K, 2K or 4K Protected Sector at end
and 256 bytes of Vector Space at $FF80
Figure 1-2 MC9S12DT128B Memory Map
EXT
– $FFFF
$0000
$03FF
$0800
$0FFF
$2000
$3FFF
$4000
$7FFF
$8000
Size
(Bytes)
16384
1K Register Space
Mappable to any 2K Boundary
2K Bytes EEPROM
Mappable to any 2K Boundary
8K Bytes RAM
Mappable to any 8K Boundary
0.5K, 1K, 2K or 4K Protected Sector
16K Fixed Flash EEPROM
16K Page Window
eight * 16K Flash EEPROM Pages
$C000
$FF00
$FFFF
NORMAL
SINGLE CHIP
The address does not show the map after reset, but a useful map. After reset the map is:
$0000 – $03FF: Register Space
$0000 – $1FFF: 8K RAM
$0000 – $07FF: 2K EEPROM (not visible)
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after
reset). The read-only value is a uniquepartIDforeachrevisionof the chip. Table 1-3showstheassigned
part ID number.
Table 1-3 Assigned Part ID Numbers
DeviceMask Set Number
MC9S12DT128B0L85D$0100
MC9S12DT128B1L85D$0101
NOTES:
1. The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-8: Minor family identifier
Bit 7-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor - non full - mask set revision
Part ID
1
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset). Table 1-4 shows the read-only values of these registers. Refer to section Module
Mapping and Control (MMC) of HCS12 Core User Guide for further details.
Table 1-4 Memory size registers
Register nameValue
MEMSIZ0$13
MEMSIZ1$80
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Section 2 Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the Block
User Guides of the individual IP blocks on the device.
2.1 Device Pinout
The MC9S12DT128B and its derivatives are available in a 112-pin low profile quad flat pack (LQFP) and
in a 80-pin quad flat pack (QFP). Most pins perform two or more functions, as described in the Signal
Descriptions.Figure 2-1 and Figure 2-2 show the pin assignments for different packages.
Figure 2-2 Pin Assignments in 80 QFP for MC9S12DG128B, MC9S12DJ128B Bondout
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2.2 Signal Properties Summary
Table 2-1 summarizes the pin functionality. Signals shown in bold are not available in the 80 pin
package.
Table 2-1 Signal Properties
Internal Pull
Pin Name
Function 1
EXTAL————VDDPLLNANA
XTAL————VDDPLLNANA
RESET————VDDRNoneNoneExternal Reset
TEST————N.A.NoneNoneTest Input
VREGEN————VDDXNANA
XFC————VDDPLLNANAPLL Loop Filter
BKGD
PAD[15]AN1[7]ETRIG1——VDDANoneNone
PAD[14:8]AN1[6:0]———VDDANoneNone
PAD[7]AN0[7]ETRIG0——VDDANoneNone
PAD[6:0]AN0[6:0]———VDDANoneNone
PA[7:0]
PB[7:0]
PE7NOACC
PE6IPIPE1MODB——VDDR
PE5IPIPE0MODA——VDDR
PE4ECLK———VDDR
PE3
PE2R/
Pin Name
Function 2
TAGHIMODC——VDDR
ADDR[15:8]/
DATA[15:8]
ADDR[7:0]/
DATA[7:0]
LSTRBTAGLO——VDDR
W———VDDR
Pin Name
Function 3
———VDDR
———VDDR
XCLKS——VDDR
Pin Name
Function 4
Pin Name
Function 5
Powered
by
Resistor
CTRL
Always
Up
PUCR/
PUPAE
PUCR/
PUPBE
PUCR/
PUPEE
While
PUCR/
PUPEE
PUCR/
PUPEE
PUCR/
PUPEE
Reset
State
Up
Disabled
Disabled
Up
RESET pin
low:
Down
Up
Up
Up
Description
Oscillator Pins
Voltage Regulator
Enable Input
Background Debug,
Tag High, Mode Input
Port AD Input,
Analog Inputs,
External Trigger
Input (ATD1)
Port AD Input,
Analog Inputs
(ATD1)
Port AD Input, Analog
Inputs, External
Trigger Input (ATD0)
Port AD Input, Analog
Inputs (ATD0)
Port A I/O,
Multiplexed
Address/Data
Port B I/O,
Multiplexed
Address/Data
Port E I/O, Access,
Clock Select
Port E I/O, Pipe
Status, Mode Input
Port E I/O, Pipe
Status, Mode Input
Port E I/O, Bus Clock
Output
Port E I/O, Byte
Strobe, Tag Low
Port E I/O, R/
expanded modes
W in
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Pin Name
Function 1
PE1IRQ———VDDR
PE0
PH7KWH7---——VDDR
PH6KWH6---——VDDR
PH5KWH5---——VDDR
PH4KWH4---——VDDR
PH3KWH3
PH2KWH2SCK1——VDDR
PH1KWH1MOSI1——VDDR
PH0KWH0MISO1——VDDR
PJ7KWJ7TXCAN4SCL—VDDX
PJ6KWJ6RXCAN4SDA—VDDX
PJ[1:0]KWJ[1:0]———VDDX
PK7
PK[5:0]
PM7BF_PSLMTXCAN4——VDDX
PM6BF_PERRRXCAN4——VDDX
PM5BF_PROKTXCAN0TXCAN4SCK0VDDX
PM4BF_PSYNRXCAN0RXCAN4MOSI0VDDX
Pin Name
Function 2
XIRQ———VDDR
ECSROMCTL——VDDX
XADDR[19:
14]
Pin Name
Function 3
SS1——VDDR
———VDDX
Pin Name
Function 4
Pin Name
Function 5
Powered
by
Internal Pull
Resistor
CTRL
Always
Up
Always
Up
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERJ/
PPSJ
PERJ/
PPSJ
PERJ/
PPSJ
PUCR/
PUPKE
PUCR/
PUPKE
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
Reset
State
Up
Up
Disabled Port H I/O, Interrupt
Disabled Port H I/O, Interrupt
Disabled Port H I/O, Interrupt
Disabled Port H I/O, Interrupt
Disabled
Disabled
Disabled
Disabled
Up
Up
UpPort J I/O, Interrupts
Up
Up
Disabled
Disabled
Disabled
Disabled
Description
Port E Input,
Maskable Interrupt
Port E Input, Non
Maskable Interrupt
Port H I/O,Interrupt,
SS of SPI1
Port H I/O,Interrupt,
SCK of SPI1
Port H I/O,Interrupt,
MOSI of SPI1
Port H I/O,Interrupt,
MISO of SPI1
Port J I/O, Interrupt,
TX of CAN4, SCL of
IIC
Port J I/O, Interrupt,
RX of CAN4, SDA of
IIC
Port K I/O,
Emulation Chip
Select, ROM Control
Port K I/O, Extended
Addresses
Port M I/O, BF slot
mismatch pulse, TX
of CAN4
Port M I/O, BFillegal
pulse/message
format error pulse,
RX of CAN4
Port M I/O, BF
reception ok pulse,
TX of CAN0, CAN4,
SCK of SPI0
Port M I/O, BF sync
pulse (Rx/Tx) OK
pulse o/p, RX of
CAN0, CAN4, MOSI
of SPI0
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Pin Name
Function 1
PM3TX_BFTXCAN1TXCAN0SS0VDDX
PM2RX_BFRXCAN1RXCAN0MISO0VDDX
PM1TXCAN0TXB——VDDX
PM0RXCAN0RXB——VDDX
PP7KWP7PWM7——VDDX
PP6KWP6PWM6——VDDX
PP5KWP5PWM5——VDDX
PP4KWP4PWM4——VDDX
PP3KWP3PWM3
PP2KWP2PWM2SCK1—VDDX
PP1KWP1PWM1MOSI1—VDDX
PP0KWP0PWM0MISO1—VDDX
PS7
PS6SCK0———VDDX
PS5MOSI0———VDDX
PS4MISO0———VDDX
PS3TXD1———VDDX
PS2RXD1———VDDX
PS1TXD0———VDDX
PS0RXD0———VDDX
PT[7:0]IOC[7:0]———VDDX
Pin Name
Function 2
SS0———VDDX
Pin Name
Function 3
Pin Name
Function 4
SS1—VDDX
Pin Name
Function 5
Powered
by
Internal Pull
Resistor
CTRL
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERT/
PPST
Reset
State
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Up
Up
Up
Up
Up
Up
Up
Up
Disabled
Description
Port M I/O, TX of BF,
CAN1, CAN0, SS of
SPI0
Port M I/O, RX of BF,
CAN1, CAN0, MISO
of SPI0
Port M I/O, TX of
CAN0, RX of BDLC
Port M I/O, RX of
CAN0, RX of BDLC
Port P I/O, Interrupt,
Channel 7 of PWM
Port P I/O, Interrupt,
Channel 6 of PWM
Port P I/O, Interrupt,
Channel 5 of PWM
Port P I/O, Interrupt,
Channel 4 of PWM
Port P I/O, Interrupt,
Channel 3 of PWM,
SS of SPI1
Port P I/O, Interrupt,
Channel 2 of PWM,
SCK of SPI1
Port P I/O, Interrupt,
Channel 1 of PWM,
MOSI of SPI1
Port P I/O, Interrupt,
Channel 0 of PWM,
MISO2 of SPI1
Port S I/O,
SPI0
Port S I/O, SCK of
SPI0
Port S I/O, MOSI of
SPI0
Port S I/O, MISO of
SPI0
Port S I/O, TXD of
SCI1
Port S I/O, RXD of
SCI1
Port S I/O, TXD of
SCI0
Port S I/O, RXD of
SCI0
Port T I/O, Timer
channels
SS of
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2.3 Detailed Signal Descriptions
2.3.1 EXTAL, XTAL — Oscillator Pins
EXTAL andXTALare the crystal driver and externalclockpins.On reset all the deviceclocksarederived
from the EXTAL input frequency. XTAL is the crystal output.
2.3.2 RESET — External Reset Pin
An active low bidirectional control signal, it acts as an input to initialize the MCU to a known start-up
state, and an output when an internal MCU function causes a reset.
2.3.3 TEST — Test Pin
This input only pin is reserved for test.
NOTE:
The TEST pin must be tied to VSS in all applications.
2.3.4 XFC — PLL Loop Filter Pin
PLL loop filter. Please ask your Motorola representative for the interactive application note to compute
PLL loop filter elements. Any current leakage on this pin must be avoided.
XFC
MCU
R
C
S
C
P
VDDPLLVDDPLL
Figure 2-3 PLL Loop Filter Connections
2.3.5 BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin
The BKGD/TAGHI/MODC pin is used as a pseudo-open-drain pin for the background debug
communication. In MCU expanded modes of operation when instruction tagging is on, an input low on
this pin during the falling edge of E-clock tags the high half of the instruction word being read into the
instruction queue. It is used as a MCU operating mode select pin during reset. The state of this pin is
latched to the MODC bit at the rising edge of
RESET. This pin has a permanently enabled pull-up device.
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2.3.6 PAD[15] / AN1[7] / ETRIG1 — Port AD Input Pin [15]
PAD15 is a general purpose input pin and analog input of the analog to digital converter ATD1. It can act
as an external trigger input for the ATD1.
2.3.7 PAD[14:8] / AN1[6:0] — Port AD Input Pins [14:8]
PAD14 - PAD8 are general purpose input pins and analog inputs of the analog to digital converter ATD1.
2.3.8 PAD[7] / AN0[7] / ETRIG0 — Port AD Input Pin [7]
PAD7 is a general purpose input pin and analog input of the analog to digital converter ATD0. It can act
as an external trigger input for the ATD0.
2.3.9 PAD[6:0] / AN0[6:0] — Port AD Input Pins [6:0]
PAD6 - PAD8 are general purpose input pins and analog inputs of the analog to digital converter ATD0.
2.3.10 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA7-PA0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.11 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB7-PB0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.12 PE7 / NOACC / XCLKS — Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC
signal, when enabled, is used to indicate that the current bus cycle is an unused or “free” cycle. This signal
will assert when the CPU is not using the bus.
XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts
The
(low power) oscillator isusedorwhether Pierce oscillator/external clock circuitry is used. The state of this
pin is latched at the rising edge of
external clockdrive.If input is a logichighan oscillator circuit is configured onEXTALand XTAL. Since
this pin is an input with a pull-up device during reset, if the pin is left floating, the default configuration is
an oscillator circuit on EXTAL and XTAL.
RESET. If the input is a logic low the EXTAL pin is configured for an
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EXTAL
CDC*
MCU
C
1
Crystal or
ceramic resonator
XTAL
C
2
VSSPLL
* Due to the nature of a translated ground Colpitts oscillator a
DC voltage bias is applied to the crystal
Please contact the crystal manufacturer for crystal DC
* Rs can be zero (shorted) when used with higher frequency crystals.
Refer to manufacturer’s data.
Figure 2-5 Pierce Oscillator Connections (PE7=0)
MCU
EXTAL
XTAL
not connected
CMOS-COMPATIBLE
EXTERNAL OSCILLATO
(VDDPLL-Level)
R
Figure 2-6 External Clock Connections (PE7=0)
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2.3.13 PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of
instruction queue tracking signalIPIPE1.Thispinis an input with a pull-down device which is only active
RESET is low.
when
RESET. This pin is shared with the
2.3.14 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of
instruction queue tracking signalIPIPE0.Thispinis an input with a pull-down device which is only active
RESET is low.
when
RESET. This pin is shared with the
2.3.15 PE4 / ECLK — Port E I/O Pin 4
PE4 is a general purpose input or output pin. It can be configured to drive the internal bus clock ECLK.
ECLK can be used as a timing reference.
2.3.16 PE3 / LSTRB / TAGLO — Port E I/O Pin 3
PE3 is a general purpose input or output pin. In MCU expanded modes of operation, LSTRB can be used
for the low-byte strobe function to indicate the type of bus access and when instruction tagging is on,
TAGLO is used to tag the low half of the instruction word being read into the instruction queue.
2.3.17 PE2 / R/W—Port E I/O Pin 2
PE2 is a general purpose input or output pin. In MCU expanded modes of operations, this pin drives the
read/write output signal for the external bus. It indicates the direction of data on the external bus.
2.3.18 PE1 / IRQ — Port E Input Pin 1
PE1 is a general purpose input pin and the maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.19 PE0 / XIRQ — Port E Input Pin 0
PE0 is a general purpose input pin and the non-maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.20 PH7 / KWH7 — Port H I/O Pin 7
PH7isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
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2.3.21 PH6 / KWH6 — Port H I/O Pin 6
PH6isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.22 PH5 / KWH5 — Port H I/O Pin 5
PH5isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.23 PH4 / KWH4 — Port H I/O Pin 2
PH4isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.24 PH3 / KWH3 / SS1 — Port H I/O Pin 3
PH3isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as slave select pin
1 (SPI1).
SS of the Serial Peripheral Interface
2.3.25 PH2 / KWH2 / SCK1 — Port H I/O Pin 2
PH2isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
toexitSTOP or WAITmode.It can beconfigured as serial clockpin SCK
1 (SPI1).
oftheSerial Peripheral Interface
2.3.26 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1
PH1isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI
of the Serial Peripheral Interface 1 (SPI1).
2.3.27 PH0 / KWH0 / MISO1 — Port H I/O Pin 0
PH0isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO
PJ7 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as the transmit pin TXCAN for the Motorola Scalable
Controller Area Network controller 4 (CAN4) or the serial clock pin SCL of the IIC module.
PJ6 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as the receive pin RXCAN for the Motorola Scalable
Controller Area Network controller 4 (CAN4) or the serial data pin SDA of the IIC module.
2.3.30 PJ[1:0] / KWJ[1:0] — Port J I/O Pins [1:0]
PJ1 and PJ0 are general purpose input or output pins. They can be configured to generate an interrupt
causing the MCU to exit STOP or WAIT mode.
2.3.31 PK7 / ECS / ROMCTL — Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, this pin is used
as the emulation chip select output (
enable the Flash EEPROM memory in the memory map (ROMCTL). At the rising edge of
stateofthis pin islatchedto the ROMONbit.For a completelist of modesreferto 4.2 ChipConfigurationSummary.
ECS). During MCU expanded modes of operation, this pin is used to
RESET, the
2.3.32 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK5-PK0 are general purpose input or output pins. In MCU expanded modes of operation, these pins
provide the expanded address XADDR[19:14] for the external bus.
2.3.33 PM7 / BF_PSLM / TXCAN4 — Port M I/O Pin 7
PM7 is a general purpose input or output pin. It can be configured as the slot mismatch output pulse pin
of Byteflight. It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area
Network controllers 4 (CAN4).
2.3.34 PM6 / BF_PERR / RXCAN4 — Port M I/O Pin 6
PM6 is a general purpose input or output pin. It can be configured as the illegal pulse or message format
error output pulse pin of Byteflight. It can be configured as the receive pin RXCAN of the Motorola
Scalable Controller Area Network controllers 4 (CAN4).
2.3.35 PM5 / BF_PROK / TXCAN0 / TXCAN4 / SCK0 — Port M I/O Pin 5
PM5 is a general purpose input or output pin. It can be configured as the reception OK output pulse pin of
Byteflight. It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area
Network controllers 0or4(CAN0 or CAN4). It can be configured as the serialclockpinSCK of the Serial
Peripheral Interface 0 (SPI0).
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2.3.36 PM4 / BF_PSYN / RXCAN0 / RXCAN4/ MOSI0 — Port M I/O Pin 4
PM4 is a general purpose input or output pin. It can be configured as the correct synchronisation pulse
reception/transmission output pulse pin of Byteflight. It can be configured as the receive pin RXCAN of
the Motorola Scalable Controller Area Network controllers 0 or 4 (CAN0 or CAN4). It can be configured
as the master output (during master mode) or slave input pin (during slave mode) MOSI
Peripheral Interface 0 (SPI0).
for the Serial
2.3.37 PM3 / TX_BF / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3
PM3 is a generalpurposeinputoroutput pin. It can be configured as the transmit pinTX_BF of Byteflight.
It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area Network
controllers 1 or 0 (CAN1 or CAN0). It can be configured as the slave select pin
Interface 0 (SPI0).
SS of the Serial Peripheral
2.3.38 PM2 / RX_BF / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2
PM2 is a general purpose input or output pin. It can be configured as the receive pin RX_BF of Byteflight.
It can be configured as the receive pin RXCAN of the Motorola Scalable Controller Area Network
controllers 1or0 (CAN1 or CAN0). It canbeconfigured as the master input(duringmaster mode) or slave
output pin (during slave mode) MISO
for the Serial Peripheral Interface 0 (SPI0).
2.3.39 PM1 / TXCAN0 / TXB — Port M I/O Pin 1
PM1 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the transmit pin
TXB of the BDLC.
2.3.40 PM0 / RXCAN0 / RXB — Port M I/O Pin 0
PM0 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the receive pin
RXB of the BDLC.
2.3.41 PP7 / KWP7 / PWM7 — Port P I/O Pin 7
PP7 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 7 output.
2.3.42 PP6 / KWP6 / PWM6 — Port P I/O Pin 6
PP6 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 6 output.
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2.3.43 PP5 / KWP5 / PWM5 — Port P I/O Pin 5
PP5 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 5 output.
2.3.44 PP4 / KWP4 / PWM4 — Port P I/O Pin 4
PP4 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 4 output.
2.3.45 PP3 / KWP3 / PWM3 / SS1 — Port P I/O Pin 3
PP3 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 3 output. It
can be configured as slave select pin
SS of the Serial Peripheral Interface 1 (SPI1).
2.3.46 PP2 / KWP2 / PWM2 / SCK1 — Port P I/O Pin 2
PP2 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 2 output. It
can be configured as serial clock pin SCK of the Serial Peripheral Interface 1 (SPI1).
2.3.47 PP1 / KWP1 / PWM1 / MOSI1 — Port P I/O Pin 1
PP1 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 1 output. It
can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of
the Serial Peripheral Interface 1 (SPI1).
2.3.48 PP0 / KWP0 / PWM0 / MISO1 — Port P I/O Pin 0
PP0 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 0 output. It
can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of
the Serial Peripheral Interface 1 (SPI1).
2.3.49 PS7 / SS0 — Port S I/O Pin 7
PS7 is a general purpose input or output pin. It can be configured as the slave select pin SS of the Serial
Peripheral Interface 0 (SPI0).
2.3.50 PS6 / SCK0 — Port S I/O Pin 6
PS6 is a general purpose input or output pin. It can be configured as the serial clock pin SCK of the Serial
Peripheral Interface 0 (SPI0).
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2.3.51 PS5 / MOSI0 — Port S I/O Pin 5
PS5 is a general purpose input or output pin. It can be configured as master output (during master mode)
or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.52 PS4 / MISO0 — Port S I/O Pin 4
PS4 is a general purpose input or output pin. It can be configured as master input (during master mode) or
slave output pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.53 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 1 (SCI1).
2.3.54 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 1 (SCI1).
2.3.55 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 0 (SCI0).
2.3.56 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 0 (SCI0).
2.3.57 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0]
PT7-PT0 are general purpose input or output pins. They can be configured as input capture or output
compare pins IOC7-IOC0 of the Enhanced Capture Timer (ECT).
2.4 Power Supply Pins
MC9S12DT128B power and ground pins are described below.
Table 2-2 MC9S12DT128B Power and Ground Connection Summary
Mnemonic
Pin Number
112-pin QFP
VDD1, 213, 652.5V
VSS1, 214, 660V
Nominal
Voltage
Description
Internal power and ground generated by internal regulator
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Mnemonic
VDDR415.0V
VSSR400V
VDDX1075.0V
VSSX1060V
VDDA835.0VOperating voltage and ground for the analog-to-digital
VSSA860V
VRL850V
VRH845.0V
VDDPLL432.5VProvides operating voltage and ground for the Phased-Locked
VSSPLL450V
VREGEN975VInternal Voltage Regulator enable/disable
NOTE:
Pin Number
112-pin QFP
All VSS pins must be connected together in the application.
Nominal
Voltage
Description
External power and ground, supply to pin drivers and internal
voltage regulator.
External power and ground, supply to pin drivers.
converters and the reference for the internal voltageregulator,
allows the supply voltage to the A/D to be bypassed
independently.
Reference voltages for the analog-to-digital converter.
Loop. This allows the supply voltage to the PLL to be
bypassed independently. Internal power and ground
generated by internal regulator.
2.4.1 VDDX,VSSX — Power & Ground Pins for I/O Drivers
External power and ground for I/O drivers. Because fast signal transitions place high, short-duration
current demandsonthepower supply, use bypass capacitors withhigh-frequencycharacteristics and place
them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are
loaded.
2.4.2 VDDR, VSSR — Power & Ground Pins for I/O Drivers & for Internal
Voltage Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Because fast signal
transitions place high, short-duration current demands on the power supply, use bypass capacitors with
high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements
depend on how heavily the MCU pins are loaded.
2.4.3 VDD1, VDD2, VSS1, VSS2 — Core Power Pins
Power is supplied to the MCU through VDD and VSS. Because fast signal transitions place high,
short-duration current demands on the power supply, use bypass capacitors with high-frequency
characteristics and place them as close to the MCU as possible. This 2.5V supply is derived from the
internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is
turned off, if VREGEN is tied to ground.
NOTE:
62
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2.4.4 VDDA, VSSA — Power Supply Pins for ATD and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the analog to
digital converter. It also provides the reference for the internal voltage regulator. This allows the supply
voltage to the ATD and the reference voltage to be bypassed independently.
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the
supply voltage to the Oscillator and PLL to be bypassed independently.This 2.5V voltage is generated by
the internal voltage regulator.
NOTE:
No load allowed except for bypass capacitors.
2.4.7 VREGEN — On Chip Voltage Regulator Enable
Enables the internal 5V to 2.5V voltage regulator. If this pin is tied low, VDD1,2 and VDDPLL must be
supplied externally.
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Section 3 System Clock Description
3.1 Overview
The Clock and Reset Generator provides the internal clock signals for the core and all peripheral modules.
Figure 3-1 shows the clock connections from the CRG to all modules.
Consult the CRG Block User Guide for details on clock generation.
S12_CORE
core clock
Flash
RAM
EXTAL
XTAL
CRG
bus clock
oscillator clock
Figure 3-1 Clock Connections
EEPROM
ECT
ATD0, 1
PWM
SCI0, SCI1
SPI0, 1
CAN0, 1, 4
IIC
BDLC
PIM
BF
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Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DT128B. Each mode has an
associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device.
4.2 Chip Configuration Summary
The operatingmode out of resetisdetermined by the statesof the MODC, MODB,andMODA pins during
reset (Table4-1).TheMODC,MODB, and MODA bits intheMODE register show the currentoperating
modeandprovide limited modeswitchingduring operation. Thestates of theMODC,MODB, and MODA
pinsarelatched into thesebitson the risingedge of theresetsignal. The ROMCTLsignalallows the setting
of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the
memory map. ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin
is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
Internal Voltage Regulator disabled, VDD1,2 and
VDDPLL must be supplied externally with 2.5V
4.3 Security
The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
•Protection of the contents of FLASH,
•Protection of the contents of EEPROM,
•Operation in single-chip mode, No BDM possible
•Operation from external memory with internal FLASH and EEPROM disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of theinternal program. This code would defeat the purpose
of security. At the same time the user may also wish to put a back door inthe user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters stored in EEPROM.
4.3.1 Securing the Microcontroller
Once the user has programmed the FLASH and EEPROM (if desired), the part can be secured by
programming the security bits located in the FLASH module. These non-volatile bits will keep the part
secured through resetting the part and through powering down the part.
The security byte resides in a portion of the Flash array.
Check the Flash Block User Guide for more details on the security configuration.
4.3.2 Operation of the Secured Microcontroller
4.3.2.1 Normal Single Chip Mode
This will bethemostcommon usage of the secured part. Everything will appear thesameasif the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
4.3.2.2 Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH and EEPROM will be disabled. BDM
operations will be blocked.
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4.3.3 Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH and EEPROM must be erased. This can be
done through an external program in expanded mode.
Once the user has erased the FLASH and EEPROM, the part can be reset into special single chip mode.
This invokes a program that verifies the erasure of the internal FLASH and EEPROM. Once this program
completes,theuser can eraseandprogram the FLASHsecurity bits totheunsecured state. Thisisgenerally
done through the BDM, but the user could also change to expanded mode (by writing the mode bits
through the BDM) and jumping to an external program (again through BDM commands). Note that if the
part goes through a reset before the security bits are reprogrammed to the unsecure state, the part will be
secured again.
4.4 Low Power Modes
The microcontroller features three main low power modes. Consult the respective Block User Guide for
information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of
information about the clock system is the Clock and Reset Generator User Guide (CRG).
4.4.1 Stop
Executing the CPU STOP instruction stops all clocks andthe oscillator thus putting the chip in fully static
mode. Wake up from this mode can be done via reset or external interrupts.
4.4.2 Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running
and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full STOP mode, but the wake up time from this
mode is significantly shorter.
4.4.3 Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute
instructions.Theinternal CPU signals(addressand databus) willbe fully static.Allperipherals stay active.
For further power consumption the peripherals can individually turn off their local clocks.
4.4.4 Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save
power.
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Section 5 Resets and Interrupts
5.1 Overview
Consult the Exception Processing section of the HCS12 Core User Guide for information on resets and
interrupts.
5.2 Vectors
5.2.1 Vector Table
Table 5-1 lists interrupt sources and vectors in default order of priority.
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block User Guides for register reset states.
5.3.1 I/O pins
Refer to the HCS12 Core User Guides for mode dependent pin configuration of port A, B, E and K out of
reset.
Refer to the PIM Block User Guide for reset configurations of all peripheral module ports.
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NOTE:
For devices assembled in 80-pin QFP packages all non-bonded out pins should be
configured as outputs after reset in order to avoid current drawn from floating
inputs. Refer to
Table 2-1
for affected pins.
5.3.2 Memory
Refer to Table 1-1 for locations of the memories depending on the operating mode after reset.
The RAM array is not automatically initialized out of reset.
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Section 6 HCS12 Core Block Description
Consult the HCS12 Core User Guide for information about the HCS12 core modules, i.e. central
processing unit (CPU), interrupt module (INT), module mapping control module (MMC), multiplexed
external bus interface (MEBI), breakpoint module (BKP) and background debug mode module (BDM).
Section 7 Clock and Reset Generator (CRG) Block
Description
Consult the CRG Block User Guide for information about the Clock and Reset Generator module.
7.1 Device-specific information
7.1.1 XCLKS
The XCLKS input signal is active low (see 2.3.12 PE7 / NOACC / XCLKS — Port E I/O Pin 7).
Consult the ECT_16B8C Block User Guide for information about the Enhanced Capture Timer
module.When the ECT_16B8C Block User Guide refers to freeze mode this is equivalent to active BDMmode.
Section 9 Analog to Digital Converter (ATD) Block
Description
There are two Analog to Digital Converters (ATD1 and ATD0) implemented on the MC9S12DT128B.
Consult the ATD_10B8C Block User Guide for information about each Analog to Digital Converter
module. When the ATD_10B8C Block User Guide refers to freeze mode this is equivalent to active BDMmode.
Section 10 Inter-IC Bus (IIC) Block Description
Consult the IIC Block User Guide for information about the Inter-IC Bus module.
Section 11 Serial Communications Interface (SCI) Block
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Description
There are two Serial Communications Interfaces (SCI1 and SCI0) implemented on theMC9S12DT128B
device. Consult the SCI Block User Guide for information about each Serial Communications Interface
module.
Section 12 Serial Peripheral Interface (SPI) Block
Description
There aretwoSerial Peripheral Interfaces (SPI1 andSPI0)implemented on MC9S12DT128B. Consultthe
SPI Block User Guide for information about each Serial Peripheral Interface module.
Section 13 J1850 (BDLC) Block Description
Consult the BDLC Block User Guide for information about the J1850 module.
Section 14 Byteflight (BF) Block Description
Consult the BF Block User Guide for information about the 10 Mbps Byteflight module.
Consult the PWM_8B8C Block User Guide for information about the Pulse Width Modulator module.
When the PWM_8B8C Block User Guide refers to freeze mode this is equivalent to active BDM mode.
Section 16 Flash EEPROM 128K Block Description
Consult the FTS128K Block User Guide for information about the flash module.
Section 17 EEPROM 2K Block Description
Consult the EETS2K Block User Guide for information about the EEPROM module.
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Section 18 RAM Block Description
This module supports single-cycle misaligned word accesses without wait states.
Section 19 MSCAN Block Description
There are three MSCAN modules (CAN4, CAN1 and CAN0) implemented on the MC9S12DT128B.
Consult the MSCAN Block User Guide for information about the Motorola Scalable CAN Module.
Section 20 Port Integration Module (PIM) Block Description
Consult the PIM_9DTB128 Block User Guide for information about the Port Integration Module.
Section 21 Voltage Regulator (VREG) Block Description
Consult the VREG Block User Guide for information about the dual output linear voltage regulator.
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
•Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1 – C6).
•Central point of the ground star should be the VSSR pin.
•Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
•VSSPLL must be directly connected to VSSR.
•Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7,
C8, C11 and Q1 as small as possible.
•Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the
connection area to the MCU.
•Central power input should be fed in at the VDDA/VSSA pins.
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Figure 22-1 Recommended PCB Layout for 112LQFP Colpitts Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
C4
C9
R1
C5
C10
C8
C11
VSSPLL
VDDPLL
C7
Q1
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Figure 22-2 Recommended PCB Layout for 80QFP Colpitts Oscillator
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
C1
VDD1
VSS1
VSSR
VDDR
C4
C9
R1
C5
C10
C8
C11
VSSPLL
VDDPLL
VSS2
C2
VDD2
C7
Q1
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Figure 22-3 Recommended PCB Layout for 112LQFP Pierce Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
VDDPLL
C4
C9
R1
C5
C10
C8
Q1
R2
R3
VSSPLL
C7
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Figure 22-4 Recommended PCB Layout for 80QFP Pierce Oscillator
VDDX
C6
VSSX
VDD1
C1
VSS1
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
C4
C9
R1
C5
C10
R2
Q1
C8
VSSPLL
VDDPLL
VSSPLL
R3
C7
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Appendix A Electrical Characteristics
A.1 General
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
P:
Those parameters are guaranteed during production testing on each individual device.
C:
Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations. They are regularly verified by production monitors.
T:
Those parameters are achieved by design characterization on a small sample size from typical
devices. All values shown in the typical column are within this category.
D:
Those parameters are derived mainly from simulations.
A.1.2 Power Supply
The MC9S12DT128B utilizes several pins to supply power to the I/O ports, A/D converter, oscillator and
PLL as well as the digital core.
The VDDA, VSSA pairsuppliestheA/D converter and the resistor ladder of the internal voltage regulator.
The VDDX, VSSX, VDDR and VSSR pairs supply the I/O pins ,VDDR supplies also the internal voltage
regulator.
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the digital logic, VDDPLL, VSSPLL supply the
oscillator and the PLL.
VSS1 and VSS2 are internally connected by metal.
VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD
protection.
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NOTE:
In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5
is used for either VSSA, VSSR and VSSX unless otherwise noted.
IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR
pins.
VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and
VSSPLL.
IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3 Pins
There are four groups of functional pins.
A.1.3.1 5V I/O pins
Those I/O pins have a nominal level of 5V. This class of pins is comprised of all port I/O pins, the analog
inputs, BKGDpin and the RESETinputs.Theinternal structure of allthosepins is identical, howeversome
of the functionality may be disabled. E.g. for the analog inputs the output drivers, pull-up and pull-down
resistors are disabled permanently.
A.1.3.2 Analog Reference
This class is made up by the two VRH and VRL pins.
A.1.3.3 Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied
by VDDPLL.
A.1.3.4 TEST
This pin is used for production testing only.
A.1.3.5 VREGEN
This pin is used to enable the on chip voltage regulator.
A.1.4 Current Injection
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
injection current may flowoutofVDD5and could result in external power supply going out of regulation.
Insure external VDD5 load will shunt current greater than maximum injection current. This will be the
greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is
very low which would reduce overall power consumption.
or VDD range during instantaneous and
DD5
in
>V
) is greater than I
DD5
DD5
, the
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A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
SS5
or V
DD5
).
Table A-1 Absolute Maximum Ratings
1
NumRatingSymbolMinMaxUnit
1I/O, Regulator and Analog Supply Voltage
2
Digital Logic Supply Voltage
3
PLL Supply Voltage
4Voltage difference VDDX to VDDR and VDDA
5Voltage difference VSSX to VSSR and VSSA
6Digital I/O Input Voltage
7Analog Reference
8XFC, EXTAL, XTAL inputs
9TEST input
Instantaneous Maximum Current
10
Single pin limit for all digital I/O pins
Instantaneous Maximum Current
11
Single pin limit for XFC, EXTAL, XTAL
Instantaneous Maximum Current
12
Single pin limit for TEST
13Storage Temperature Range
NOTES:
1. Beyond absolute maximum ratings device might be damaged.
2. The device contains an internal voltage regulator to generatethe logic and PLL supply out of the I/O supply.
The absolute maximum ratings apply when the device is powered from an external source.
3. All digital I/O pins are internally clamped to V
4. Those pins are internally clamped to V
5. This pin is clamped low to V
2
2
3
4
5
and V
SSX
and V
SSPLL
, but not clamped high. This pin must be tied low in applications.
SSPLL
DDX
DDPLL
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
V
IN
V
RH,VRL
V
ILV
V
TEST
I
D
I
DL
I
DT
T
stg
, V
and V
SSR
.
-0.36.0V
-0.33.0V
-0.33.0V
-0.30.3V
-0.30.3V
-0.36.0V
-0.36.0V
-0.33.0V
-0.310.0V
-25+25mA
-25+25mA
-0.250mA
– 65155°C
DDR
or V
SSA
and V
DDA
.
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM) and the Charge Device Model.
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A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2 ESD and Latch-up Test Conditions
ModelDescriptionSymbolValueUnit
Series ResistanceR11500Ohm
Storage CapacitanceC100pF
Human Body
Machine
Number of Pulse per pin
positive
negative
Series ResistanceR10Ohm
Storage CapacitanceC200pF
Number of Pulse per pin
positive
negative
–
–
–
3
3
–
3
3
Latch-up
Minimum input voltage limit–2.5V
Maximum input voltage limit7.5V
Table A-3 ESD and Latch-Up Protection Characteristics
Num CRatingSymbolMinMaxUnit
1C Human Body Model (HBM)
2C Machine Model (MM)
3C Charge Device Model (CDM)
Latch-up Current at 125°C
4C
5C
positive
negative
Latch-up Current at 27°C
positive
negative
V
V
V
HBM
MM
CDM
I
LAT
I
LAT
2000–V
200–V
500–V
+100
–100
+200
–200
A.1.7 Operating Conditions
–mA
–mA
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE:
Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
86
and the junction temperature TJ. For power dissipation
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calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
Table A-4 Operating Conditions
RatingSymbolMinTypMaxUnit
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
MC9S12DT128BC
Operating Ambient Temperature Range
MC9S12DT128BV
Operating Ambient Temperature Range
MC9S12DT128BM
Operating Ambient Temperature Range
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
2. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the relation between ambient temperature T
2
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
1
and device junction temperature TJ.
A
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
f
osc
f
bus
T
J
2
T
A
T
J
2
T
A
T
J
2
T
A
4.555.25V
2.352.52.75V
2.252.52.75V
-0.100.1V
-0.100.1V
0.5-16MHz
0.5-25MHz
-40-100°C
-402785°C
-40-120°C
-4027105°C
-40-140°C
-4027125°C
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
J
A
Junction Temperature, [°C]=
Ambient Temperature, [°C]=
)in°C can be
J
T
T
J
A
P
D
ΘJA•()+=
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P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Total Chip Power Dissipation, [W]=
D
JA
INT
1.Internal Voltage Regulator disabled
Package Thermal Resistance, [°C/W]=
P
Chip Internal Power Dissipation, [W]=
P
INT
Which is the sum of all output currents on I/O ports associated with VDDX and VDDM.
I
⋅I
DDVDD
P
IO
P
D
INT
DDPLLVDDPLL
R
∑
DSON
i
PIO+=
⋅I
⋅=
I
+V
DDA
2
IO
i
⋅+=
DDA
For R
respectively
2.Internal voltage regulator enabled
I
DDR
additionally contains the current flowing into the external loads with output high.
Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.
is valid:
DSON
R
DSON
R
DSON
P
INT
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
P
V
OL
------------ for outputs driven low;=
I
OL
V
DD5
------------------------------------ for outputs driven high;=
8T Junction to Board QFP80
9T Junction to Case QFP80
10T Junction to Package Top QFP80
2
θ
JA
θ
JA
θ
JB
θ
JC
Ψ
JT
θ
JA
θ
JA
θ
JB
θ
JC
Ψ
JT
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
––54
––41
––31
––11
––2
––51
––41
––27
––14
––3
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not alwaysapplicable, e.g.
not all pins feature pull up/down resistances.
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Table A-6 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P Input High Voltage
T Input High Voltage
2P Input Low Voltage
T Input Low Voltage
3C Input Hysteresis
V
V
V
V
V
HYS
IH
IH
IL
IL
0.65*V
DD5
–V
––
––
V
SS5
– 0.3
––V
250mV
V
DD5
0.35*V
+ 0.3
DD5
Input Leakage Current (pins in high ohmic input
1
mode)
4P
Vin= V
ADC Inputs AN15:0
All other Ports (A, B, E, K, M, S, T)
DD5
or V
SS5
I
in
-1.0
–2.5
–
1.0
2.5
Output High Voltage (pins in output mode)
5C
Partial Drive IOH= –2.0mA
P
Full Drive IOH= –10.0mA
V
OH
V
DD5
– 0.8
––V
Output Low Voltage (pins in output mode)
6C
7P
8C
9P
10C
Partial Drive IOL= +2.0mA
P
Full Drive IOL= +10.0mA
Internal Pull Up Device Current,
tested at V
Max.
IL
Internal Pull Up Device Current,
tested at V
IH
Min.
Internal Pull Down Device Current,
tested at V
IH
Min.
Internal Pull Down Device Current,
tested at V
Max.
IL
11D Input Capacitance
2
12T
Injection current
Single Pin limit
Total Device Limit. Sum of all injected currents
13P
14P
Port H, J, P Interrupt Input Pulse filtered
Port H, J, P Interrupt Input Pulse passed
3
3
V
OL
I
PUL
I
PUH
I
PDH
I
PDL
C
I
ICS
I
ICP
t
PULSE
t
PULSE
––0.8V
–– –130µA
–10––µA
––130µA
10––µA
in
–2.5
–25
6–pF
–2.5
25
3µs
10µs
NOTES:
1. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for
each 8 C to 12 C in the temperature range from 50 C to 125 C.
2. Refer to Section A.1.4 Current Injection, for more details
3. Parameter only applies in STOP or Pseudo STOP mode.
V
µA
mA
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A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator in
Colpitts mode. Production testing is performed using a square wave signal at the EXTAL input.
A.1.10.2 Additional Remarks
In expanded modesthecurrents flowing in the system are highly dependentonthe load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
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given. A very good estimate is to take the single chip currents and add the currents due to the external
loads.
Table A-7 Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P
Run supply currents
Wait Supply current
2P
P
C
P
C
C
3
P
C
P
C
P
Pseudo Stop Current (RTI and COP enabled)
C
C
C
4
C
C
C
C
Stop Current
C
P
C
C
5
P
C
P
C
P
Single Chip, Internal regulator enabled
All modules enabled, PLL on
only RTI enabled
Pseudo Stop Current (RTI and COP disabled)
"C" Temp Option 100°C
"V" Temp Option 120°C
“M” Temp Option 140°C
2
"C" Temp Option 100°C
"V" Temp Option 120°C
“M” Temp Option 140°C
1, 2
-40°C
27°C
70°C
85°C
105°C
125°C
1, 2
-40°C
27°C
70°C
85°C
105°C
125°C
140°C
-40°C
27°C
70°C
85°C
105°C
125°C
I
DD5
I
DDW
1
55
30
5
mA
mA
370
400
500
450
I
DDPS
550
600
1600
µA
650
800
2100
850
1200
5000
570
600
I
DDPS
650
750
µA
850
1200
1500
12
25
100
100
I
DDS
130
160
1200
µA
200
350
1700
400
600
5000
NOTES:
1. PLL off, Oscillator in Colpitts Mode
2. At those low power dissipation levels T
92
= TA can be assumed
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A.2 ATD Characteristics
This section describes the characteristics of the analog to digital converter.
A.2.1 ATD Operating Characteristics
The Table A-8 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
V
≤ VRL≤ VIN≤ VRH≤ V
SSA
beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively
be clipped.
Table A-8 ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
Reference Potential
1D
2C
3D ATD Clock Frequency
4D
5D
6D
7P Reference Supply current (Both ATD modules on)
8P Reference Supply current (Only one ATD module on)
NOTES:
1. Full accuracy is not guaranteed when differential voltage is less than 4.50V
2. The minimumtime assumes a final sample periodof 2 ATD clocks cycles whilethe maximum time assumes a finalsample
Differential Reference Voltage
ATD 10-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
ATD 8-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
Stop Recovery Time (V
period of 16 ATD clocks.
DDA
. This constraint exists since the sample buffer amplifier can not drive
DDA
Low
High
1
Clock Cycles
ATDCLK
Clock Cycles
ATDCLK
=5.0 Volts)
(2)
2
V
RL
V
RH
VRH-V
f
ATDCLK
N
CONV10
T
CONV10
N
CONV8
T
CONV8
t
SR
I
REF
I
REF
RL
V
V
SSA
DDA
/2
V
DDA
V
/2
DDA
4.505.005.25V
0.52.0MHz
14
7
12
6
28
14
26
13
20µs
0.75mA
0.375mA
V
V
Cycles
µs
Cycles
µs
A.2.2 Factors influencing accuracy
Three factors – source resistance, source capacitance and current injection – have an influence on the
accuracy of the ATD.
A.2.2.1 Source Resistance:
Due to the input pin leakage current as specified in Table A-6 in conjunction with the source resistance
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
S
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specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or
operatingconditionsare less thanworstcase or leakage-inducederror is acceptable,largervalues of source
resistance is allowed.
A.2.2.2 Source capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C
≥ 1024 * (C
f
INS
– C
INN
).
A.2.2.3 Current injection
There are two cases to consider.
1.A current is injected into the channel being converted. The channel being stressed has conversion
values of$3FF($FF in 8-bit mode) for analoginputsgreater than V
unless the current is higher than specified as disruptive conditions.
V
RL
and $000forvalues less than
RH
2.Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as V
I
INJ
, with I
being the sum of the currents injected into the two pins adjacent to the converted
INJ
=K*RS*
ERR
channe
Table A-9 ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1C Max input Source Resistance
Total Input Capacitance
2T
3C Disruptive Analog Input Current
4C Coupling Ratio positive current injection
5C Coupling Ratio negative current injection
Non Sampling
Sampling
R
S
C
INN
C
INS
I
NA
K
p
K
n
--1KΩ
10
22
-2.52.5mA
-4
10
-2
10
pF
A/A
A/A
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A.2.3 ATD accuracy
Table A-10 specifies the ATD conversion performance excluding any errors due to current injection,
input capacitance and source resistance.
Table A-10 ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
V
= VRH - VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV
shows only definitions, for specification values refer to
Table A-10
2
8-Bit Resolution
1
Vin
mV
.
96
A.3 NVM, Flash and EEPROM
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NOTE:
Unless otherwise noted the abbreviation NVM (Non Volatile Memory) is used for
both Flash and EEPROM.
A.3.1 NVM timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency f
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash and EEPROM program and erase operations are timed using a clock derived fromtheoscillator
using the FCLKDIV and ECLKDIV registers respectively. Thefrequency of this clock must be set within
the limits specified as f
The minimum program and erase times shown in Table A-11 are calculated for maximum f
maximum f
A.3.1.1 Single Word Programming
. The maximum times are calculated for minimum f
bus
NVMOSC
NVMOP
is required for performing program or erase operations. The NVM modules
.
and
NVMOP
and a f
of 2MHz.
bus
NVMOP
The programming time for single word programming is dependant on the bus frequency as a well as on
the frequency f¨
A.3.1.2 Burst Programming
This applies onlytothe Flash where up to 32 wordsinarow can be programmed consecutively using burst
programming by keeping the command pipeline filled. The time to program a consecutive word can be
calculated as:
The time to program a whole row is:
Burst programming is more than 2 times faster than single word programming.
NVMOP
and can be calculated according to the following formula.
t
swpgm
t
bwpgm
t
brpgm
1
⋅25
9
--------------------f
NVMOP
1
⋅9
4
--------------------f
NVMOP
t
swpgm
31 t
⋅+=
1
⋅+=
---------f
bus
1
⋅+=
---------f
bus
bwpgm
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A.3.1.3 Sector Erase
Erasing a 512 byte Flash sector or a 4 byte EEPROM sector takes:
1
t
era
4000
The setup times can be ignored for this operation.
A.3.1.4 Mass Erase
Erasing a NVM block takes:
⋅≈
--------------------f
NVMOP
1
t
mass
20000
The setup times can be ignored for this operation.
A.3.1.5 Blank Check
The time it takes to perform a blank check on the Flash or EEPROM is dependant on the location of the
first non-blank word starting at relative address zero. Ittakes one bus cycle per word to verify plus a setup
of the command.
⋅≈
--------------------f
NVMOP
t
check
location t
cyc
10 t
⋅+⋅≈
cyc
Table A-11 NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1D External Oscillator Clock
2D Bus frequency for Programming or Erase Operations
3D Operating Frequency
4P Single Word Programming Time
5D
6D
7P Sector Erase Time
8P Mass Erase Time
9D Blank Check Time Flash per block
10D Blank Check Time EEPROM per block
NOTES:
1. Restrictions for oscillator in crystal mode apply!
3. Maximum Erase and Programming times are achieved under particular combinations of f
Flash Burst Programming consecutive word
Flash Burst Programming Time for 32 Words
f
.
bus
Refer to formulae in Sections A.3.1.1 - A.3.1.5 for guidance.
4
4
f
NVMOSC
f
NVMBUS
f
NVMOP
t
swpgm
t
bwpgm
t
brpgm
t
era
t
mass
t
check
t
check
0.5
1MHz
150200kHz
2
46
2
20.4
2
678.4
5
20
5
100
6
11
6
11
NVMOP
andmaximum busfrequency
and bus frequency f
NVMOP
50
74.5
31
1035.5
26.7
133
32778
2058
1
3
MHz
3
3
3
7
µs
µs
3
µs
ms
ms
7
t
cyc
t
cyc
.
bus
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4. Burst Programming operations are not applicable to EEPROM
5. Minimum Erase times are achieved under maximum NVM operating frequency f
6. Minimum time, if first word in the array is not blank
7. Maximum time to complete check on an erased block
NVMOP
.
A.3.2 NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
The failure rates for data retention and program/erase cycling are specified at the operating conditions
noted.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
NOTE:
All values shown in
Table A-12
are target values and subject to further extensive
characterization
Table A-12 NVM Reliability Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingCycles
1C Flash/EEPROM (-40˚C to +125˚C)
2C EEPROM (-40˚C to +125˚C)
NOTE:
Flash cycling performance is 10 cycles at -40˚C to +125˚C. Data retention is
specified for 15 years.
NOTE:
EEPROM cycling performance is 10K cycles at -40˚C to 125˚C. Data retention is
specified for 5 years on words after cycling 10K times. However if only 10 cycles
are executed on a word the data retention is specified for 15 years.
10
10,000
Data Retention
Lifetime
15Years
5Years
Unit
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