Datasheet MC74VHCT541AMEL, MC74VHCT541AML1, MC74VHCT541AML2, MC74VHCT541ADTR2, MC74VHCT541ADW Datasheet (MOTOROLA)

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
SEMICONDUCTOR TECHNICAL DATA
1
REV 0
Motorola, Inc. 1997
6/97
  
The MC74VHCT541A is an advanced high speed CMOS octal bus buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
The MC74VHCT541A is a noninverting, 3–state, buffer/line driver/line receiver. When either OE1
or OE2 is high, the terminal outputs are in the
high impedance state.
The VHCT inputs are compatible with TTL levels. This device can be used as a level converter for interfacing 3.3V to 5.0V , because it has full 5V CMOS level output swings.
The VHCT541A input and output (when disabled) structures provide protection when voltages between 0V and 5.5V are applied, regardless of the supply voltage. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc.
High Speed: tPD = 5.4ns (Typ) at VCC = 5V
Low Power Dissipation: ICC = 4µA (Max) at TA = 25°C
TTL–Compatible Inputs: VIL = 0.8V; VIH = 2.0V
Power Down Protection Provided on Inputs and Outputs
Balanced Propagation Delays
Designed for 4.5V to 5.5V Operating Range
Low Noise: V
OLP
= 1.6V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
Chip Complexity: 134 FETs or 33.5 Equivalent Gates
18
Y1
2
A1
17
Y2
3
A2
16
Y3
4
A3
15
Y4
5
A4
14
Y5
6
A5
13
Y6
7
A6
12
Y7
8
A7
11
Y8
9
A8
OE1
OE2
1
19
OUTPUT
ENABLES
DATA
INPUTS
NONINVERTING OUTPUTS
LOGIC DIAGRAM

PIN ASSIGNMENT
A5
A3
A2
A1
OE1
GND
A8
A7
A6
A4 5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Y3
Y2
Y1
OE2
V
CC
Y8
Y7
Y6
Y5
Y4
DW SUFFIX
20–LEAD SOIC PACKAGE
CASE 751D–04
ORDERING INFORMATION
MC74VHCTXXXADW MC74VHCTXXXADT MC74VHCTXXXAM
SOIC TSSOP SOIC EIAJ
DT SUFFIX
20–LEAD TSSOP PACKAGE
CASE 948E–02
M SUFFIX
20–LEAD SOIC EIAJ PACKAGE
CASE 967–01
L L H X
L L X H
L H X X
FUNCTION TABLE
Inputs
Output Y
OE1 OE2 A
L H Z Z
MC74VHCT541A
MOTOROLA VHC Data – Advanced CMOS Logic
DL203 — Rev 1
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage
– 0.5 to + 7.0
V
V
in
DC Input Voltage
– 0.5 to + 7.0
V
Î
Î
V
out
ОООООООООООО
Î
DC Output Voltage Outputs in 3–State
High or Low State
ÎÎÎÎ
Î
– 0.5 to + 7.0
– 0.5 to VCC + 0.5
Î
Î
V
I
IK
Input Diode Current
– 20
mA
I
OK
Output Diode Current (V
OUT
< GND; V
OUT
> VCC)
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 75
mA
Î
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air, SOIC Packages†
TSSOP Package†
ÎÎÎÎ
Î
500 450
Î
Î
mW
Î
Î
T
stg
ОООООООООООО
Î
Storage Temperature
ÎÎÎÎ
Î
– 65 to + 150
Î
Î
_
C
* Absolute maximum continuous ratings are those values beyond which damage to the device
may occur. Exposure to these conditions or conditions beyond those indicated may adversely
affect device reliability . Functional operation under absolute–maximum–rated conditions is not
implied. †Derating — SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage
4.5
5.5
V
V
in
DC Input Voltage
0
5.5
V
ÎÎ
Î
V
out
ОООООООООООО
Î
DC Output Voltage Outputs in 3–State
High or Low State
Î
Î
0 0
Î
Î
5.5
V
CC
Î
Î
V
T
A
Operating Temperature
– 40
+ 85
_
C
tr, t
f
Input Rise and Fall Time VCC =5.0V ±0.5V
0
20
ns/V
DC ELECTRICAL CHARACTERISTICS
V
ОООООООО
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
Test Conditions
V
CC
V
ÎÎÎ
Min
Typ
ÎÎÎ
Max
Min
Max
Unit
V
IH
Minimum High–Level Input Voltage
4.5 to
5.5
ÎÎÎ
2.0
ÎÎÎ
2.0
V
ÎÎ
Î
V
IL
ООООО
Î
Maximum Low–Level Input Voltage
ОООООÎÎÎ
Î
4.5 to
5.5
ÎÎÎ
ÎÎÎÎÎ
Î
ÎÎÎ
ÎÎ
Î
0.8
ÎÎÎÎÎ
Î
0.8
Î
V
V
OH
Minimum High–Level
IOH = – 50µA
4.5
ÎÎÎ
4.4
4.5
ÎÎÎ
4.4
V
Output Voltage
Vin = VIH or V
IL
IOH = – 8mA
4.5
ÎÎÎ
3.94
ÎÎÎ
3.80
ÎÎ
Î
V
OL
ООООО
Î
Maximum Low–Level
ООООО
Î
IOL = 50µA
ÎÎ
Î
4.5
ÎÎÎ
ÎÎÎÎÎ
Î
0.0
ÎÎÎ
ÎÎ
Î
0.1
ÎÎÎÎÎ
Î
0.1
Î
V
ÎÎÎООООО
Î
Output Voltage
Vin = VIH or V
IL
ООООО
Î
IOL = 8mA
ÎÎ
Î
4.5
ÎÎÎ
ÎÎÎÎÎ
Î
ÎÎÎ
ÎÎ
Î
0.36
ÎÎÎÎÎ
Î
0.44
Î
I
in
Maximum Input Leakage Current
Vin = 5.5 V or GND
0 to 5.5
ÎÎÎ
ÎÎÎ
± 0.1
± 1.0
µA
ÎÎ
Î
I
OZ
ООООО
Î
Maximum 3–State Leakage Current
ООООО
Î
Vin = VIL or V
IH
V
out
= VCC or GND
ÎÎ
Î
5.5
ÎÎÎ
ÎÎÎÎÎ
Î
ÎÎÎ
ÎÎ
Î
± 0.25
ÎÎÎÎÎ
Î
± 2.5εA
ÎÎ
Î
I
CC
ООООО
Î
Maximum Quiescent Supply Current
ООООО
Î
Vin = VCC or GND
ÎÎ
Î
5.5
ÎÎÎ
ÎÎÎÎÎ
Î
ÎÎÎ
ÎÎ
Î
4.0
ÎÎÎÎÎ
Î
40.0
Î
µA
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
MC74VHCT541A
VHC Data – Advanced CMOS Logic DL203 — Rev 1
3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS
Unit
TA = – 40 to 85°C
ОООООООО
TA = 25°C
V
CC V
Test Conditions
Parameter
Symbol
Unit
Max
Min
ÎÎÎ
Max
Typ
ÎÎÎ
Min
V
CC V
Test Conditions
Parameter
Symbol
ÎÎ
Î
I
CCT
ООООО
Î
Quiescent Supply Current
ООООО
Î
Per Input: VIN = 3.4V Other Input: VCC or GND
ÎÎ
Î
5.5
ÎÎÎ
ÎÎÎÎÎ
Î
ÎÎÎ
ÎÎ
Î
1.35
ÎÎÎÎÎ
Î
1.50ÎmA
ÎÎ
Î
I
OPD
ООООО
Î
Output Leakage Current
ООООО
Î
V
OUT
= 5.5V
ÎÎ
Î
0
ÎÎÎ
ÎÎÎÎÎ
Î
ÎÎÎ
ÎÎ
Î
0.5
ÎÎÎÎÎ
Î
5.0
Î
µA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= tf = 3.0ns)
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Min
Max
Unit
ÎÎ
Î
t
PLH
,
t
PHL
ОООООО
Î
Maximum Propagation Delay, A to Y
ООООООО
Î
VCC = 5.0 ± 0.5V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
5.0
5.5
ÎÎ
Î
6.9
7.9
Î
Î
1.0
1.0
ÎÎ
Î
8.0
9.0
ns
ÎÎ
Î
t
PZL
,
t
PZH
ОООООО
Î
Output Enable TIme, OE
to Y
ООООООО
Î
VCC = 5.0 ± 0.5V CL = 15pF RL = 1k CL = 50pF
ÎÎÎÎ
Î
8.3
8.8
ÎÎ
Î
11.3
12.3
Î
Î
1.0
1.0
ÎÎ
Î
13.0
14.0
ns
t
PLZ
,
t
PHZ
Output Disable Time, OE
to Y
VCC = 5.0 ± 0.5V CL = 50pF RL = 1k
9.4
11.9
1.0
13.5
ns
ÎÎ
Î
t
OSLH
,
t
OSHL
ОООООО
Î
Output to Output Skew
ООООООО
Î
VCC = 5.0 ± 0.5V CL = 50pF (Note NO TAG)
ÎÎÎÎÎÎÎ
Î
1.0
ÎÎÎÎ
Î
1.0
ns
C
in
Maximum Input Capacitance
4
10
10
pF
ÎÎ
Î
C
out
ОООООО
Î
Maximum Three–State Output Capacitance (Output in High Impedance State)
ОООООООÎÎÎÎÎ
Î
9
ÎÎÎÎÎÎÎ
Î
pF
Typical @ 25°C, VCC = 5.0V
C
PD
Power Dissipation Capacitance (Note NO T AG)
19
pF
1. Parameter guaranteed by design. t
OSLH
= |t
PLHm
– t
PLHn
|, t
OSHL
= |t
PHLm
– t
PHLn
|.
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I
CC(OPR
)
= CPD VCC fin + ICC/8 (per bit). CPD is used to determine the no–load
dynamic power consumption; PD = CPD V
CC
2
fin + ICC VCC.
NOISE CHARACTERISTICS (Input t
r
= tf = 3.0ns, CL = 50pF, VCC = 5.0V)
TA = 25°C
Symbol Parameter
Typ Max
Unit
V
OLP
Quiet Output Maximum Dynamic V
OL
1.2 1.6 V
V
OLV
Quiet Output Minimum Dynamic V
OL
–1.2 –1.6 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
MC74VHCT541A
MOTOROLA VHC Data – Advanced CMOS Logic
DL203 — Rev 1
4
Figure 1. Figure 2.
OE1 or OE2
Y
Y 1.5V
t
PZL
t
PLZ
t
PZHtPHZ
3V
HIGH IMPEDANCE
VOL +0.3V VOH –0.3V
HIGH IMPEDANCE
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Test Circuit
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE UNDER
TEST
OUTPUT
Figure 4. Test Circuit
CONNECT TO VCC WHEN TESTING t
PLZ
AND t
PZL
. CONNECT TO GND WHEN TESTING t
PHZ
AND t
PZH
.
1 k
TEST CIRCUITS
SWITCHING WAVEFORMS
GND
t
PHL
Y
A
t
PLH
1.5V
1.5V
3V
V
OL
V
OH
1.5V
1.5V GND
MC74VHCT541A
VHC Data – Advanced CMOS Logic DL203 — Rev 1
5 MOTOROLA
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B
S
T
D20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X
K
C
–T–
SEATING PLANE
M
R
X 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
__
__
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
DIMAMIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177 C 1.20 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
110
1120
PIN 1 IDENT
A
B
–T–
0.100 (0.004)
C
D
G
H
SECTION N–N
K
K1
JJ1
N
N
M
F
–W–
SEATING PLANE
–V–
–U–
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252 ––– –––
S
U0.15 (0.006) T
MC74VHCT541A
MOTOROLA VHC Data – Advanced CMOS Logic
DL203 — Rev 1
6
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
––– 0.81 ––– 0.032
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MA TERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
H
E
A
1
L
E
Q
1
_
c
A
Z
D
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b c
D
E e
L
M
Z
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MC74VHCT541A/D
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