Datasheet MC74LVX86DTR2, MC74LVX86D, MC74LVX86DR2 Datasheet (MOTOROLA)


SEMICONDUCTOR TECHNICAL DATA
1
REV 0
Motorola, Inc. 1997
6/97
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High Speed: t
PD
= 5.8ns (Typ) at VCC = 3.3V
Low Power Dissipation: I
CC
= 2µA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: V
OLP
= 0.5V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
Figure 1. 14–Lead Pinout (Top View)
Figure 2. Logic Diagram
1314 12 11 10 9 8
21 34567
VCCA2 B2 O2 A3 B3 O3
A0 B0 O0 A1 B1 O1 GND
3
O0
1
A0
2
B0
6
O1
4
A1
5
B1
11
O2
13
A2
12
B2
8
O3
10
A3
9
B3
LVX

LOW–VOLTAGE CMOS
D SUFFIX
14–LEAD SOIC PACKAGE
CASE 751A–03
DT SUFFIX
14–LEAD TSSOP PACKAGE
CASE 948G–01
M SUFFIX
14–LEAD SOIC EIAJ PACKAGE
CASE 965–01
PIN NAMES
Function
Data Inputs Outputs
Pins
An, Bn On
L L H H
L H L H
Inputs Outputs
An Bn
L H H L
On
FUNCTION TABLE
MC74LVX86
MOTOROLA LCX DATA
BR1339 — REV 3
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage
–0.5 to +7.0
V
V
in
DC Input Voltage
–0.5 to +7.0
V
V
out
DC Output Voltage
–0.5 to VCC +0.5
V
I
IK
Input Diode Current
–20
mA
I
OK
Output Diode Current
±20
mA
I
out
DC Output Current, per Pin
±25
mA
I
CC
DC Supply Current, VCC and GND Pins
±50
mA
P
D
Power Dissipation
180
mW
T
stg
Storage Temperature
–65 to +150
_
C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage
2.0
3.6
V
V
in
DC Input Voltage
0
5.5
V
V
out
DC Output Voltage
0
V
CC
V
T
A
Operating Temperature, All Package Types
–40
+85
_
C
t/V
Input Rise and Fall Time
0
100
ns/V
DC ELECTRICAL CHARACTERISTICS
ОООООО
V
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
ОООООО
Test Conditions
V
CC
V
Min
Typ
Max
Min
Max
Unit
ÎÎ
Î
V
IH
ОООООО
Î
High–Level Input Voltage
ОООООО
ОООООÎÎ
Î
2.0
3.0
3.6
ÎÎ
Î
1.5
2.0
2.4
ÎÎÎÎÎÎÎ
Î
1.5
2.0
2.4
ÎÎÎÎ
V
ÎÎ
Î
V
IL
ОООООО
Î
Low–Level Input Voltage
ОООООО
ОООООÎÎ
Î
2.0
3.0
3.6
ÎÎÎÎÎÎÎ
Î
0.5
0.8
0.8
ÎÎÎÎÎ
Î
0.5
0.8
0.8
Î
V
ÎÎ
Î
ÎÎ
Î
V
OH
ОООООО
Î
ОООООО
Î
High–Level Output Voltage (Vin = VIH or VIL)
ОООООО
ООООО
Î
ООООО
Î
IOH = –50µA IOH = –50µA IOH = –4mA
Î
Î
Î
Î
2.0
3.0
3.0
ÎÎ
Î
ÎÎ
Î
1.9
2.9
2.58
Î
Î
Î
Î
2.0
3.0
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
1.9
2.9
2.48
ÎÎ
Î
ÎÎ
Î
Î
Î
V
ÎÎ
Î
V
OL
ОООООО
Î
Low–Level Output Voltage (Vin = VIH or VIL)
ОООООО
ООООО
Î
IOL = 50µA IOL = 50µA IOL = 4mA
Î
Î
2.0
3.0
3.0
ÎÎÎÎ
Î
0.0
0.0
ÎÎ
Î
0.1
0.1
0.36
ÎÎÎÎÎ
Î
0.1
0.1
0.44
Î
V
I
in
Input Leakage Current
ОООООО
Vin = 5.5V or GND
3.6
±0.1
±1.0
µA
I
CC
Quiescent Supply Current
ОООООО
Vin = VCC or GND
3.6
2.0
20.0
µA
MC74LVX86
LCX DATA BR1339 — REV 3
3 MOTOROLA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= tf = 3.0ns)
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Min
Max
Unit
ÎÎ
Î
t
PLH
,
t
PHL
ОООООО
Î
Propagation Delay , Input to Output
ООООООО
Î
VCC = 2.7V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
7.5
10.0
ÎÎ
Î
14.5
18.0
Î
Î
1.0
1.0
ÎÎ
Î
17.5
21.0
ns
ÎÎÎООООООÎООООООО
Î
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
5.8
8.3
ÎÎ
Î
9.3
12.8
Î
Î
1.0
1.0
ÎÎ
Î
11.0
14.5
ÎÎ
Î
t
OSHL
t
OSLH
ОООООО
Î
Output–to–Output Skew (Note 1.)
ООООООО
Î
VCC = 2.7V CL = 50pF VCC = 3.3 ±0.3V CL = 50pF
ÎÎÎÎÎÎÎ
Î
1.5
1.5
ÎÎÎÎ
Î
1.5
1.5
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
OSHL
) or LOW–to–HIGH (t
OSLH
); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
Min
Typ
Max
Min
Max
Unit
C
in
Input Capacitance
4
10
10
pF
C
PD
Power Dissipation Capacitance (Note 2.)
18
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= CPD VCC fin + ICC/4 (per gate). CPD is used to determine the no–load
dynamic power consumption; PD = CPD V
CC
2
fin + ICC VCC.
NOISE CHARACTERISTICS (Input t
r
= tf = 3.0ns, CL = 50pF, VCC = 3.3V , Measured in SOIC Package)
TA = 25°C
Symbol Characteristic
Typ Max
Unit
V
OLP
Quiet Output Maximum Dynamic V
OL
0.3 0.5 V
V
OLV
Quiet Output Minimum Dynamic V
OL
–0.3 –0.5 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
Figure 3. Switching Waveforms
V
CC
GND
50%
50% V
CC
A or B
O
t
PHL
t
PLH
*Includes all probe and jig capacitance
Figure 4. Test Circuit
CL*
TEST POINT
DEVICE UNDER
TEST
OUTPUT
MC74LVX86
MOTOROLA LCX DATA
BR1339 — REV 3
4
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
8.55
3.80
1.35
0.35
0.40
0.19
0.10 0
°
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25 7
°
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004 0
°
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009 7
°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A
–B–P 7 PL
G
C
K
SEATING PLANE
D 14 PL
M
J
R
X 45°
1
7
814
0.25 (0.010) T B A
M
S S
B0.25 (0.010)
M M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
Z
D
HEE
1
14 8
7
b
A
1
A
e
L
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
--- 1.42 --- 0.056
A
1
A
b c
D
E e
L
M
Z
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
c
M
_
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MA TERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)
MC74LVX86
LCX DATA BR1339 — REV 3
5 MOTOROLA
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1 IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
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MC74LVX86/D
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