
SEMICONDUCTOR TECHNICAL DATA
1
REV 0
Motorola, Inc. 1997
6/97
" "! !
! ! "!
The MC74LVX86 is an advanced high speed CMOS 2–input
Exclusive–OR gate. The inputs tolerate voltages up to 7V, allowing the
interface of 5V systems to 3V systems.
• High Speed: t
PD
= 5.8ns (Typ) at VCC = 3.3V
• Low Power Dissipation: I
CC
= 2µA (Max) at TA = 25°C
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Low Noise: V
OLP
= 0.5V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
• ESD Performance: HBM > 2000V; Machine Model > 200V
Figure 1. 14–Lead Pinout (Top View)
Figure 2. Logic Diagram
1314 12 11 10 9 8
21 34567
VCCA2 B2 O2 A3 B3 O3
A0 B0 O0 A1 B1 O1 GND
3
O0
1
A0
2
B0
6
O1
4
A1
5
B1
11
O2
13
A2
12
B2
8
O3
10
A3
9
B3
LVX
LOW–VOLTAGE CMOS
D SUFFIX
14–LEAD SOIC PACKAGE
CASE 751A–03
DT SUFFIX
14–LEAD TSSOP PACKAGE
CASE 948G–01
M SUFFIX
14–LEAD SOIC EIAJ PACKAGE
CASE 965–01
PIN NAMES
Function
Data Inputs
Outputs
Pins
An, Bn
On
L
L
H
H
L
H
L
H
Inputs Outputs
An Bn
L
H
H
L
On
FUNCTION TABLE

MC74LVX86
MOTOROLA LCX DATA
BR1339 — REV 3
2
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
_
C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied.
RECOMMENDED OPERATING CONDITIONS
Operating Temperature, All Package Types
DC ELECTRICAL CHARACTERISTICS
High–Level Output Voltage
(Vin = VIH or VIL)
IOH = –50µA
IOH = –50µA
IOH = –4mA
Low–Level Output Voltage
(Vin = VIH or VIL)
IOL = 50µA
IOL = 50µA
IOL = 4mA

MC74LVX86
LCX DATA
BR1339 — REV 3
3 MOTOROLA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= tf = 3.0ns)
Propagation Delay , Input to
Output
VCC = 2.7V CL = 15pF
CL = 50pF
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
Output–to–Output Skew
(Note 1.)
VCC = 2.7V CL = 50pF
VCC = 3.3 ±0.3V CL = 50pF
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
OSHL
) or LOW–to–HIGH (t
OSLH
); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Power Dissipation Capacitance (Note 2.)
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= CPD VCC fin + ICC/4 (per gate). CPD is used to determine the no–load
dynamic power consumption; PD = CPD V
CC
2
fin + ICC VCC.
NOISE CHARACTERISTICS (Input t
r
= tf = 3.0ns, CL = 50pF, VCC = 3.3V , Measured in SOIC Package)
Symbol Characteristic
Typ Max
Unit
V
OLP
Quiet Output Maximum Dynamic V
OL
0.3 0.5 V
V
OLV
Quiet Output Minimum Dynamic V
OL
–0.3 –0.5 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
Figure 3. Switching Waveforms
V
CC
GND
50%
50% V
CC
A or B
O
t
PHL
t
PLH
*Includes all probe and jig capacitance
Figure 4. Test Circuit
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT

MC74LVX86
MOTOROLA LCX DATA
BR1339 — REV 3
4
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25
7
°
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009
7
°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–
–B–P 7 PL
G
C
K
SEATING
PLANE
D 14 PL
M
J
R
X 45°
1
7
814
0.25 (0.010) T B A
M
S S
B0.25 (0.010)
M M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
Z
D
HEE
1
14 8
7
b
A
1
A
e
L
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 1.42 --- 0.056
A
1
A
b
c
D
E
e
L
M
Z
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
c
M
_
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MA TERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)

MC74LVX86
LCX DATA
BR1339 — REV 3
5 MOTOROLA
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING
PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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MC74LVX86/D
◊
Mfax is a trademark of Motorola, Inc.
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