Datasheet MC74LCX540ML2, MC74LCX540MEL, MC74LCX540DWR2, MC74LCX540DTEL, MC74LCX540DTR2 Datasheet (MOTOROLA)


SEMICONDUCTOR TECHNICAL DATA
1
REV 1
Motorola, Inc. 1996
8/95
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The MC74LCX540 is a high performance, inverting octal buffer operating from a 2.7 to 3.6V supply . This device is similar in function to the MC74LCX240, while providing flow through architecture. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5V allows MC74LCX540 inputs to be safely driven from 5V devices. The MC74LCX540 is suitable for memory address driving and all TTL level bus oriented transceiver applications.
Current drive capability is 24mA at the outputs. The Output Enable (OE1
, OE2) inputs, when HIGH, disables the outputs by placing them in a
HIGH Z condition.
Designed for 2.7 to 3.6V V
CC
Operation
5V Tolerant — Interface Capability With 5V TTL Logic
Supports Live Insertion and Withdrawal
I
OFF
Specification Guarantees High Impedance When VCC = 0V
LVTTL Compatible
LVCMOS Compatible
24mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (10µA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500mA
ESD Performance: Human Body Model >2000V; Machine Model >200V
Pinout: 20–Lead (Top View)
1920 18 17 16 15 14
21 34567
V
CC
13
8
12
9
11
10
OE2
O0 O1 O2 O3 O4 O5 O6 O7
OE1 D0 D1 D2 D3 D4 D5 D6 D7 GND
PIN NAMES
Function
Output Enable Inputs Data Inputs 3–State Outputs
Pins
OEn Dn On

LOW–VOLTAGE CMOS
OCTAL BUFFER
DW SUFFIX
PLASTIC SOIC CASE 751D–04
DT SUFFIX
PLASTIC TSSOP
CASE 948E–02
20
1
20
1
M SUFFIX
PLASTIC SOIC EIAJ
CASE 967–01
20
1
SD SUFFIX
PLASTIC SSOP
CASE 940C–03
20
1
MC74LCX540
MOTOROLA LCX DATA
BR1339 — REV 3
2
LOGIC DIAGRAM
OE1
1
D0
2
O0
18
D1
3
O1
17
D2
4
O2
16
D3
5
O3
15
D4
6
O4
14
D5
7
O5
13
D6
8
O6
12
D7
9
O7
11
OE2
19
INPUTS OUTPUTS
OE1 OE2 Dn On
L L L H L L H L X H X Z H X X Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low V oltage Level and Transitions Are Acceptable, for ICC reasons, DO NOT FLOAT Inputs
MC74LCX540
LCX DATA BR1339 — REV 3
3 MOTOROLA
ABSOLUTE MAXIMUM RATINGS*
Symbol Parameter Value Condition Unit
V
CC
DC Supply Voltage –0.5 to +7.0 V
V
I
DC Input Voltage –0.5 VI +7.0 V
V
O
DC Output Voltage –0.5 VO +7.0 Output in 3–State V
–0.5 VO VCC + 0.5 Note 1. V
I
IK
DC Input Diode Current –50 VI < GND mA
I
OK
DC Output Diode Current –50 VO < GND mA
+50 VO > V
CC
mA
I
O
DC Output Source/Sink Current ±50 mA
I
CC
DC Supply Current Per Supply Pin ±100 mA
I
GND
DC Ground Current Per Ground Pin ±100 mA
T
STG
Storage Temperature Range –65 to +150 °C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur . Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V
CC
Supply Voltage Operating
Data Retention Only
2.0
1.5
3.3
3.3
3.6
3.6
V
V
I
Input Voltage 0 5.5 V
V
O
Output Voltage (HIGH or LOW State)
(3–State)
0 0
V
CC
5.5
V
I
OH
HIGH Level Output Current, VCC = 3.0V – 3.6V –24 mA
I
OL
LOW Level Output Current, VCC = 3.0V – 3.6V 24 mA
I
OH
HIGH Level Output Current, VCC = 2.7V – 3.0V –12 mA
I
OL
LOW Level Output Current, VCC = 2.7V – 3.0V 12 mA
T
A
Operating Free–Air Temperature –40 +85 °C
t/V Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V ,
VCC = 3.0V
0 10 ns/V
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol Characteristic Condition Min Max Unit
V
IH
HIGH Level Input Voltage (Note 2.) 2.7V VCC 3.6V 2.0 V
V
IL
LOW Level Input Voltage (Note 2.) 2.7V VCC 3.6V 0.8 V
V
OH
HIGH Level Output Voltage 2.7V VCC 3.6V; IOH = –100µA VCC– 0.2 V
VCC = 2.7V; IOH = –12mA 2.2 VCC = 3.0V; IOH = –18mA 2.4 VCC = 3.0V; IOH = –24mA 2.2
V
OL
LOW Level Output Voltage 2.7V VCC 3.6V; IOL = 100µA 0.2 V
VCC = 2.7V; IOL= 12mA 0.4 VCC = 3.0V; IOL = 16mA 0.4 VCC = 3.0V; IOL = 24mA 0.55
2. These values of VI are used to test DC electrical characteristics only.
MC74LCX540
MOTOROLA LCX DATA
BR1339 — REV 3
4
DC ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to +85°C
Symbol Characteristic Condition Min Max Unit
I
I
Input Leakage Current 2.7V VCC 3.6V; 0V VI 5.5V ±5.0 µA
I
OZ
3–State Output Current 2.7 VCC 3.6V; 0V VO 5.5V;
VI = VIH or V
IL
±5.0 µA
I
OFF
Power–Off Leakage Current VCC = 0V; VI or VO = 5.5V 10 µA
I
CC
Quiescent Supply Current
2.7 VCC 3.6V; VI = GND or V
CC
10 µA
2.7 VCC 3.6V; 3.6 VI or VO 5.5V ±10 µA
I
CC
Increase in ICC per Input 2.7 VCC 3.6V; VIH = VCC – 0.6V 500 µA
AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500)
Limits
TA = –40°C to +85°C
VCC = 3.0V to 3.6V VCC = 2.7V
Symbol Parameter Waveform Min Max Max Unit
t
PLH
t
PHL
Propagation Delay Input to Output
1 1.5
1.5
6.5
6.5
7.5
7.5
ns
t
PZH
t
PZL
Output Enable Time to High and Low Level
2 1.5
1.5
8.5
8.5
9.5
9.5
ns
t
PHZ
t
PLZ
Output Disable Time From High and Low Level
2 1.5
1.5
7.5
7.5
8.5
8.5
ns
t
OSHL
t
OSLH
Output–to–Output Skew (Note 3.)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
OSHL
) or LOW–to–HIGH (t
OSLH
); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol Characteristic Condition Min Typ Max Unit
V
OLP
Dynamic LOW Peak Voltage (Note 4.) VCC = 3.3V , CL = 50pF, VIH = 3.3V , VIL = 0V 0.8 V
V
OLV
Dynamic LOW Valley Voltage (Note 4.) VCC = 3.3V , CL = 50pF, VIH = 3.3V , VIL = 0V 0.8 V
4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
IN
Input Capacitance VCC = 3.3V , VI = 0V or V
CC
7 pF
C
OUT
Output Capacitance VCC = 3.3V , VI = 0V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10MHz, VCC = 3.3V , VI = 0V or V
CC
25 pF
MC74LCX540
LCX DATA BR1339 — REV 3
5 MOTOROLA
WAVEFORM 1 – PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
2.7V
0V
V
OH
V
OL
Dn
On
t
PLH
t
PHL
WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
2.7V
0V
0V
OEn
On
t
PZH
3.0V
t
PHZ
t
PZL
t
PLZ
On
1.5V
1.5V
1.5V1.5V
1.5V 1.5V
Figure 1. AC Waveforms
1.5V
V
CC
VOH – 0.3V
VOL + 0.3V GND
OPEN
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
R
1
C
L
6V GND
TEST SWITCH
t
PLH
, t
PHL
Open
t
PZL
, t
PLZ
6V
Open Collector/Drain t
PLH
and t
PHL
6V
t
PZH
, t
PHZ
GND
CL = 50pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = Z
OUT
of pulse generator (typically 50)
Figure 2. Test Circuit
MC74LCX540
MOTOROLA LCX DATA
BR1339 — REV 3
6
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
0.510
0.299
0.104
0.019
0.035
0.012
0.009 7
°
0.415
0.029
0.499
0.292
0.093
0.014
0.020
0.010
0.004 0
°
0.395
0.010
12.95
7.60
2.65
0.49
0.90
0.32
0.25 7
°
10.55
0.75
12.65
7.40
2.35
0.35
0.50
0.25
0.10 0
°
10.05
0.25
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1.27 BSC 0.050 BSC
–A
–B
P 10 PL
110
1120
–T
D
20 PL
K
C
SEATING PLANE
R X 45°
M
0.010 (0.25)
B
M M
0.010 (0.25) T A B
M
S S
G 18 PL
F
J
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
--- 0.81 --- 0.032
A
1
A
b c
D
E e
L
M
Z
H
E
Q
1
L
E
_
10
_
0
_
10
_
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MA TERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
Z
D
HEE
1
20 11
10
b
A
1
e
L
L
E
Q
1
M
_
VIEW P
DETAIL P
0.13 (0.005)
M
0.10 (0.004)
c
A
MC74LCX540
LCX DATA BR1339 — REV 3
7 MOTOROLA
OUTLINE DIMENSIONS
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
DIMAMIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177 C 1.20 0.047 D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
____
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 9 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
110
1120
PIN 1 IDENT
A
B
–T–
0.100 (0.004)
C
D
G
H
SECTION N–N
K
K1
JJ1
N
N
M
F
–W–
SEATING PLANE
–V–
–U–
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252 ––– –––
S
U0.15 (0.006) T
20 11
101
H
A
B
F
M
K20X REF
S
U
M
0.12 (0.005) V
S
T
L
L/2
PIN 1 IDENT
S
U
M
0.20 (0.008) T
–V–
–U–
D
C
0.076 (0.003)
G
–T–
SEATING PLANE
DETAIL E
N
N
0.25 (0.010)
K
J
J1
K1
SECTION N–N
DIMAMIN MAX MIN MAX
INCHES
7.07 7.33 0.278 0.288
MILLIMETERS
B 5.20 5.38 0.205 0.212 C 1.73 1.99 0.068 0.078 D 0.05 0.21 0.002 0.008 F 0.63 0.95 0.024 0.037 G 0.65 BSC 0.026 BSC H 0.59 0.75 0.023 0.030
J 0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K 0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
____
NOTES:
13 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 14 CONTROLLING DIMENSION: MILLIMETER. 15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 16 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 17 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION. 18 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 19 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
L 7.65 7.90 0.301 0.311 M 0 8 0 8
DETAIL E
–W–
MC74LCX540
MOTOROLA LCX DATA
BR1339 — REV 3
8
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MC74LCX540/D
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