Datasheet MC74HCT273ADW, MC74HCT273ADWR2, MC74HCT273AH, MC74HCT273AN, MC74HCT273ADTR2 Datasheet (MOTOROLA)

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SEMICONDUCTOR TECHNICAL DATA

REV 7

 Motorola, Inc. 1997

2/97

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High–Performance Silicon–Gate CMOS

The MC74HCT273A may be used as a level converter for interfacing TTL

or NMOS outputs to High–Speed CMOS inputs.

The HCT273A is identical in pinout to the LS273.

This device consists of eight D flip–flops with common Clock and Reset inputs. Each flip–flop is loaded with a low–to–high transition of the Clock input. Reset is asynchronous and active low.

• Output Drive Capability: 10 LSTTL Loads

• TTL/NMOS Compatible Input Levels

• Outputs Directly Interface to CMOS, NMOS and TTL

• Operating Voltage Range: 4.5 to 5.5 V

• Low Input Current: 1.0 µA

• In Compliance with the Requirements Defined by JEDEC Standard

No. 7A

• Chip Complexity: 284 FETs or 71 Equivalent Gates

LOGIC DIAGRAM

DATA

INPUTS

CLOCK

D1 D2 D3 D4 D5 D6 D7

RESET

Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7

PIN 20 = V

PIN 10 = GND

NONINVERTING

OUTPUTS



PIN ASSIGNMENT

RESET

GND

Q1 5

CLOCK

FUNCTION TABLE

Inputs Output

Reset Clock D Q

LXX L HHH HLL H L X No Change H X No Change

X = Don’t Care Z = High Impedance

DW SUFFIX

SOIC PACKAGE

CASE 751D–04

N SUFFIX

PLASTIC PACKAGE

CASE 738–03

ORDERING INFORMATION

MC74HCTXXXAN MC74HCTXXXADW

Plastic SOIC

MC74HCT273A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

out

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

DC Input Current, per Pin

± 20

out

DC Output Current, per Pin

± 25

DC Supply Current, VCC and GND Pins

± 50

ОООООООООООО

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

ÎÎÎÎ

750 500

stg

Storage Temperature

– 65 to + 150

ОООООООООООО

Lead Temperature, 1 mm from Case for 10 Seconds

(SOIC or Plastic DIP)

ÎÎÎÎ

260

*Maximum Ratings are those values beyond which damage to the device may occur .

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage (Referenced to GND)

4.5

5.5

Vin, V

out

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature, All Package Types

– 55

+ 125

tr, t

Input Rise and Fall Time (Figure 1)

500

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

Guaranteed Limit

ÎÎ

Symbol

ООООООО

Parameter

ООООООО

Test Conditions

ÎÎ

– 55 to

25_C

ÎÎ

85_C

ÎÎ

125_C

Unit

ÎÎ

ООООООО

Minimum High–Level Input Voltage

ООООООО

out

= 0.1 V or VCC – 0.1 V

out

| v 20 µA

ÎÎ

4.5

5.5

ÎÎ

2.0

ÎÎ

2.0

ÎÎ

2.0

Maximum Low–Level Input Voltage

out

= 0.1 V or VCC – 0.1 V

out

| v 20 µA

4.5

5.5

0.8

ÎÎ

ООООООО

Minimum High–Level Output Voltage

ООООООО

Vin = VIH or V

out

| v 20 µA

ÎÎ

4.5

5.5

ÎÎ

4.4

5.4

ÎÎ

4.4

5.4

ÎÎ

4.4

5.4

ÎÎÎОООООООÎООООООО

Vin = VIH or V

out

| v 4.0 mA

ÎÎ

4.5

ÎÎ

3.98

ÎÎ

3.84

ÎÎ

3.7

Maximum Low–Level Output Voltage

Vin = VIH or V

out

| v 20 µA

4.5

5.5

0.1

ÎÎÎОООООООÎООООООО

Vin = VIH or V

out

| v 4.0 mA

ÎÎ

4.5

ÎÎ

0.26

ÎÎ

0.33

ÎÎ

0.4

Maximum Input Leakage Current

Vin = VCC or GND

5.5

± 0.1

± 1.0

µA

ÎÎ

ООООООО

Maximum Quiescent Supply Current (per Package)

ООООООО

Vin = VCC or GND I

out

= 0 µA

ÎÎ

5.5

ÎÎ

4.0

ÎÎ

160

µA

∆I

Additional Quiescent Supply

Vin = 2.4 V, Any One Input

≥ –55_C

25_C to 125_C

Current

GND, Other Inputs

out

= 0 µA

5.5

2.9

2.4

NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and V

out

should be constrained to the

range GND v (Vin or V

out

) v VCC.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

MC74HCT273A

High–Speed CMOS Logic Data DL129 — Rev 6

3 MOTOROLA

AC ELECTRICAL CHARACTERISTICS (V

= 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)

Guaranteed Limit

ÎÎ

Symbol

ООООООООООООООО

Parameter

ÎÎ

Fig.

ÎÎ

– 55 to

25_C

ÎÎ

85_C

ÎÎ

125_C

Unit

max

Maximum Clock Frequency (50% Duty Cycle)

1, 4

MHz

ÎÎ

PLH

PHL

ООООООООООООООО

Maximum Propagation Delay, Clock to Q

ÎÎ

1, 4

ÎÎ25ÎÎ

ÎÎ

PHL

ООООООООООООООО

Maximum Propagation Delay, Reset to Q

ÎÎ

2, 4

ÎÎ25ÎÎ

ÎÎ

TLH

THL

ООООООООООООООО

Maximum Output Transition Time, Any Output

ÎÎ

1, 5

ÎÎ18ÎÎ

ÎÎ

NOTE:For propagation delays with loads other than 50 pF , and information on typical parametric values, see Chapter 2 of the Motorola High–

Speed CMOS Data Book (DL129/D).

Typical @ 25°C, VCC = 5.0 V

Power Dissipation Capacitance (Per Gate)*

*Used to determine the no–load dynamic power consumption: PD = CPD V

f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola High–Speed CMOS Data Book (DL129/D).

TIMING REQUIREMENTS (V

= 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)

Guaranteed Limit

– 55 to 25_C

85_C

ÎÎÎÎ

125_C

Symbol

Parameter

Fig.

Min

Max

Min

Max

ÎÎ

Min

Max

Unit

Minimum Setup Time, Data to Clock

ÎÎ

Minimum Hold Time, Clock to Data

3.0

ÎÎ

3.0

rec

Minimum Recovery Time, Set or Reset Inactive to Clock

5.0

ÎÎ

5.0

Minimum Pulse Width, Clock

ÎÎ

Minimum Pulse Width, Set or Reset

ÎÎ

tr, tfMaximum Input Rise and Fall Times

500

ÎÎ

500

MC74HCT273A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

Figure 1.

CLOCK

3.0 V GND

2.7 V

1.3 V

0.3 V

90%

1.3 V

10%

PLH

PHL

TLH

THL

1.3 V

DATA

CLOCK

3.0 V

Figure 2.

VALID

GND

*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE UNDER

TEST

OUTPUT

Figure 3.

1/f

max

3.0 V

GND

1.3 V

RESET

CLOCK

1.3 V

3.0 V

GND

3.0 V GND

PHL

Figure 4. Test Circuit

rec

EXPANDED LOGIC DIAGRAM

DATA

INPUTS

NONINVERTING

OUTPUTS

CLOCK

RESET

SWITCHING W AVEFORMS

MC74HCT273A

High–Speed CMOS Logic Data DL129 — Rev 6

5 MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC PACKAGE

CASE 738–03

ISSUE E

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D–04

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

J 20 PL

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 25.66 27.171.010 1.070 B 6.10 6.600.240 0.260 C 3.81 4.570.150 0.180 D 0.39 0.550.015 0.022

G 2.54 BSC0.100 BSC

J 0.21 0.380.008 0.015

K 2.80 3.550.110 0.140

L 7.62 BSC0.300 BSC M 0 15 0 15 N 0.51 1.010.020 0.040

____

1.27 1.770.050 0.070

–A–

SEATING PLANE

20 PL

–T–

0.25 (0.010) T

1.27 BSC0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.

–A–

–B–

0.010 (0.25) B

D20X

0.010 (0.25)

P10X

18X

–T–

SEATING PLANE

X 45

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

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MC74HCT273A/D

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Datasheet MC74HCT273ADW, MC74HCT273ADWR2, MC74HCT273AH, MC74HCT273AN, MC74HCT273ADTR2 Datasheet (MOTOROLA)

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