SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
!$# &!
%# # $#"
High–Performance Silicon–Gate CMOS
The MC74HCT138A is identical in pinout to the LS138. The HCT138A
may be used as a level converter for interfacing TTL or NMOS outputs to
High Speed CMOS inputs.
The HCT138A decodes a three–bit Address to one–of–eight active–lot
outputs. This device features three Chip Select inputs, two active–low and
one active–high to facilitate the demultiplexing, cascading, and chip–selecting functions. The demultiplexing function is accomplished by using the
Address inputs to select the desired device output; one of the Chip Selects is
used as a data input while the other Chip Selects are held in their active
states.
• Output Drive Capability: 10 LSTTL Loads
• TTL/NMOS Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 µA
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 122 FETs or 30.5 Equivalent Gates
LOGIC DIAGRAM
7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
Y7
9
10
11
12
13
14
15
3
2
1
CS1
CS2
A0
A1
A2
ACTIVE–LOW
OUTPUTS
ADDRESS
INPUTS
CS3
CHIP–
SELECT
INPUTS
5
4
6
PIN 16 = V
CC
PIN 8 = GND
Design Criteria
Value
Units
Internal Gate Count*
30.5
ea.
Internal Gate Propagation Delay
1.5
ns
Internal Gate Power Dissipation
5.0
µW
Speed Power Product
.0075
pJ
*Equivalent to a two–input NAND gate.
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
A0
CS2
A2
A1
Y7
CS1
CS3
GND
Y3
Y2
Y1
Y0
V
CC
Y5
Y4
Y6
D SUFFIX
SOIC PACKAGE
CASE 751B–05
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ORDERING INFORMATION
MC74HCTXXXAN
MC74HCTXXXAD
MC74HCTXXXADT
Plastic
SOIC
TSSOP
1
16
1
16
1
16
DT SUFFIX
TSSOP PACKAGE
CASE 948F–01
Inputs Outputs
CS1CS2 CS3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X X H X X X H H H H H H H H
X H X X X X H H H H H H H H
L X X X X X H H H H H H H H
H L L L L L L H H H H H H H
H L L L L H H L H H H H H H
H L L L H L H H L H H H H H
H L L L H H H H H L H H H H
H L L H L L H H H H L H H H
H L L H L H H H H H H L H H
H L L H H L H H H H H H L H
H L L H H H H H H H H H H L
FUNCTION TABLE
H = high level (steady state)
L = low level (steady state)
X = don’t care
MC74HCT138A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
P
D
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
TSSOP Package†
750
500
450
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, TSSOP or SOIC Package)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
4.5
5.5
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time (Figure 1)
0
500
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
V
IH
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
4.5
5.5
2.0
2.0
2.0
2.0
2.0
2.0
V
V
IL
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
4.5
5.5
0.8
0.8
0.8
0.8
0.8
0.8
V
Vin = VIH or V
IL
|I
out
| v 20 µA
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
Vin = VIH or V
IL
|I
out
| v 4.0 µA
4.5
3.98
3.84
3.7
Vin = VIH or V
IL
|I
out
| v 20 µA
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
Vin = VIH or V
IL
|I
out
| v 4.0 mA
4.5
0.26
0.33
0.4
I
in
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
I
CC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
5.5
4.0
40
160
µA
∆I
CC
≥ – 55_C
25_C to 125_C
Current
Vin = VCC or GND, Other Inputs
l
out
= 0 µA
2.9
2.4
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
V
OH
V
OL
Minimum High–Level Output
Voltage
Maximum Low–Level Output
Voltage
V
V
Additional Quiescent Supply
Vin = 2.4 V, Any One Input
5.5
mA
MC74HCT138A
High–Speed CMOS Logic Data
DL129 — Rev 6
3 MOTOROLA
AC ELECTRICAL CHARACTERISTICS (V
CC
= 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
Symbol
Parameter
– 55 to
25_C
v
85_C
v
125_C
Unit
t
PLH
,
t
PHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 4)
30
38
45
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, CS1 to Output Y
(Figures 2 and 4)
27
34
41
ns
t
PLH
,
t
PHL
Maximum Output Transition Time, CS2 or CS3 to Output Y
(Figures 3 and 4)
30
38
45
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 2 and 4)
15
19
22
ns
tr, t
f
Maximum Input Rise and Fall Time
500
500
500
ns
C
in
Maximum Input Capacitance
10
10
10
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
51
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
EXPANDED LOGIC DIAGRAM
A0
A1
A2
CS3
CS2
CS1
1
2
3
4
5
6
15
14
13
12
11
10
9
7
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y0
C
PD
Power Dissipation Capacitance (Per Enabled Output)*
pF
MC74HCT138A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
4
SWITCHING WAVEFORMS
Figure 1.
1.3 V
t
PHL
t
PLH
t
THL
t
TLH
3 V
GND
Figure 2.
VALID
OUTPUT Y
1.3 V
3 V
GND
t
f
t
f
t
PHL
t
PLH
OUTPUT Y
INPUT
CS2, CS3
90%
1.3 V
10%
t
r
3 V
GND
t
PLH
t
TLH
90%
10%
OUTPUT Y
INPUT CS1
t
PHL
2.7 V
1.3 V
0.3 V
t
THL
INPUT A
Figure 3.
t
r
*Includes all probe and jig capacitance
Figure 4.
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
VALID
1.3 V
2.7 V
1.3 V
0.3 V
TEST CIRCUIT
MC74HCT138A
High–Speed CMOS Logic Data
DL129 — Rev 6
5 MOTOROLA
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0
°
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74
10
°
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0
°
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
10
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
–
B
1 8
916
F
H
G
D
16 PL
S
C
–T
–
SEATING
PLANE
K
J
M
L
T A0.25 (0.010)
M M
0.25 (0.010) T B A
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
9.80
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25
7
°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009
7
°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
916
–A
–
–B
–
D 16 PL
K
C
G
–T
–
SEATING
PLANE
R X 45°
M
J
F
P 8 PL
0.25 (0.010) B
M M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
MC74HCT138A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
6
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
_ _ _ _
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
ÉÉ
ÉÉ
ÉÉ
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
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MC74HCT138A/D
*MC74HCT138A/D*
◊
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