Datasheet MC74HC4851ADT, MC74HC4851AD, MC74HC4851AN Datasheet (Motorola)



SEMICONDUCTOR TECHNICAL DATA

 $# &!" $# &!" %# # $!!# # #!

Automotive Customized

These devices are pin compatible to standard HC405x and MC1405xB analog mux/demux devices, but feature injection current effect control. This makes them especially suited for usage in automotive applications where voltages in excess of normal logic voltage are common.

The injection current effect control allows signals at disabled analog input channels to exceed the supply voltage range without affecting the signal of the enabled analog channel. This eliminates the need for external diode/ resistor networks typically used to keep the analog channel signals within the supply voltage range.

The devices utilize low power silicon gate CMOS technology . The Channel Select and Enable inputs are compatible with standard CMOS outputs.

• Injection Current Cross–Coupling Less than 1mV/mA (See Figure 9)

• Pin Compatible to HC405X and MC1405XB Devices

• Power Supply Range (VCC – GND) = 2.0 to 6.0 V

• In Compliance With the Requirements of JEDEC Standard No. 7A

• Chip Complexity: 154 FETs or 36 Equivalent Gates

 

N SUFFIX

16–LEAD PLASTIC DIP PACKAGE

CASE 648–08

D SUFFIX

16–LEAD PLASTIC SOIC PACKAGE

CASE 751B–05

DW SUFFIX

16–LEAD PLASTIC WIDE SOIC PACKAGE

CASE 751G–02

13

X0

14

X1

15

ANALOG

INPUTS/

OUTPUTS

CHANNEL

SELECT

INPUTS

X2 X3 X4 X5 X6 X7

A B C

ENABLE

12

1 5 2

4 11 10

9 6

PIN 16 = V PIN 8 = GND

MULTIPLEXER/

DEMUL TIPLEXER

CC

3

X

COMMON OUTPUT/ INPUT

Figure 1. MC74HC4851A Logic Diagram

Single–Pole, 8–Position Plus Common Off

X2 X1 X0 X3 A B C

V

CC

1516 14 13 12 11 10

21 34567

X4 X6 X X7 X5 Enable NC GND

9

8

Figure 2. MC74HC4851A 16–Lead Pinout (Top View)

16–LEAD PLASTIC TSSOP PACKAGE

MC74HCXXXXAN MC74HCXXXXAD MC74HCXXXXADW MC74HCXXXXADT

DT SUFFIX

CASE 948F–01

ORDERING INFORMATION

Plastic SOIC SOIC Wide TSSOP

FUNCTION TABLE – MC74HC4851A

Control Inputs

Enable

L L L L L L L L

H

Select

CBA

L

H

L

H

L

H

L

H

X

L

H

L

H

L

H

L H X

ON Channels

X0 X1 X2 X3 X4 X5 X6 X7

NONE

11/97

 Motorola, Inc. 1997

1

REV 3

MC74HC4851A MC74HC4852A

12

X0

14

ANALOG

INPUTS/OUTPUTS

CHANNEL-SELECT

INPUTS

ENABLE

Figure 3. MC74HC4852A Logic Diagram

Double–Pole, 4–Position Plus Common Off

X1 X2 X3

Y0 Y1 Y2 Y3

15 11

1 5 2 4

10

A

9

B

6

X SWITCH

Y SWITCH

13

X

COMMON OUTPUTS/INPUTS

3

Y

PIN 16 = V PIN 8 = GND

CC

FUNCTION TABLE – MC74HC4852A

Control Inputs

Select

Enable

L L L L

H

BA

L

H H H X

L H X

ON Channels

Y0 Y1 Y2 Y3

X0 X1 X2 X3

NONE

X = Don’t Care

V

X2 X1 X X0 X3 A B

CC

1516 14 13 12 11 10

21 34567

9

8

Y0 Y2 Y Y3 Y1 Enable NC GND

Figure 4. MC74HC4852A 16–Lead Pinout (Top View)

MOTOROLA High–Speed CMOS Logic Data

2

DL129 — Rev 6

MC74HC4851A MC74HC4852A

Î

V

CC

MAXIMUM RATINGS*

Symbol

V

Î

T

Î

Positive DC Supply Voltage (Referenced to GND)

CC

V

DC Input Voltage (Any Pin) (Referenced to GND)

in I

DC Current, Into or Out of Any Pin

P

Power Dissipation in Still Air, Plastic DIP†

D

ОООООООООООО

Storage Temperature Range

stg

ОООООООООООО

T

Lead Temperature, 1 mm from Case for 10 Seconds

L

ОООООООООООО

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

V

VIO*

T

tr, t

ÎÎ

*For voltage drops across switch greater than 1.2V (switch on), excessive VCC current may be

drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.

Positive DC Supply Voltage (Referenced to GND)

CC

DC Input Voltage (Any Pin) (Referenced to GND)

in

Static or Dynamic Voltage Across Switch Operating Temperature Range, All Package Types

A

Input Rise/Fall Time VCC = 2.0 V

f

(Channel Select or Enable Inputs) VCC = 4.5 V

ОООООООООООО

Parameter

SOIC Package†

TSSOP Package†

Plastic DIP, SOIC or TSSOP Package

Parameter

VCC = 6.0 V

Value

– 0.5 to + 7.0

– 0.5 to VCC + 0.5

± 25

750 500

ÎÎÎÎ

450

ÎÎÎÎ

– 65 to + 150

ÎÎÎÎ

260

Min

Max

2.0

6.0

GND

V

CC

0.0

1.2

– 55

+ 125

0

1000

0

500

Î

0

400

Unit

V V

mA

mW

Î

_

C

Î

_

C

Î

Unit

V V V

_

C

ns

Î

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and V

should be constrained to the

out

range GND v (Vin or V

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

) v VCC.

out

DC CHARACTERISTICS — Digital Section (V oltages Referenced to GND) V

Symbol Parameter Condition

V

I

V

I

CC

Minimum High–Level Input Voltage,

IH

Channel–Select or Enable Inputs

Maximum Low–Level Input Voltage,

IL

Channel–Select or Enable Inputs

Maximum Input Leakage Current on

in

Digital Pins (Enable/A/B/C) Maximum Quiescent Supply

Current (per Package)

Ron = Per Spec 2.0

Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 µA

V

in(digital)

V

in(analog)

= VCC or GND

= GND

= GND, Except Where Noted

EE

V

3.0

4.5

6.0

3.0

4.5

6.0

Guaranteed Limit

–55 to 25°C ≤85°C ≤125°C

1.50

2.10

3.15

4.20

0.50

0.90

1.35

1.80

1.50

2.10

3.15

4.20

0.50

0.90

1.35

1.80

6.0 2 20 40 µA

1.50

2.10

3.15

4.20

0.50

0.90

1.35

1.80

Unit

V

NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

High–Speed CMOS Logic Data DL129 — Rev 6

3 MOTOROLA

MC74HC4851A MC74HC4852A

DC CHARACTERISTICS — Analog Section

Symbol Parameter Condition V

R

∆R

I

Maximum “ON” Resistance Vin = VIL or VIH;VIS = VCC to

on

Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2

on

Maximum Off–Channel Leakage Current,

off

Maximum On–Channel Leakage

on

Any One Channel

Common Channel

Channel–to–Channel

GND; IS ≤ 2.0 mA

IS ≤ 2.0 mA

Vin = VCC or GND

Guaranteed Limit

–55 to 25°C ≤85°C ≤125°C

CC

2.0

3.0

4.5

6.0

2.0

3.0

4.5

6.0

6.0 ±0.1

6.0 ±0.2 ±2.0 ±4.0

1700 1100

550 400

300 160

80 60

±0.2

1750 1200

650 500

400 200 100

80

±0.5 ±2.0

1800 1300

750 600

500 240 120 100

±1.0 ±4.0

Unit

Ω

µA

AC CHARACTERISTICS (C

Symbol Parameter V

t

PHL t

PLH

PHL

t

PLH

, t

PHZ,PZH

, t

PLZ,PZL

C

in

C

PD

,

Maximum Propagation Delay , Analog Input to Analog Output 2.0

Maximum Propagation Delay , Enable or Channel–Select to Analog Output

Maximum Input Capacitance Digital Pins (All Switches Off) Any Single Analog Pin (All Switches Off) Common Analog Pin

Power Dissipation Capacitance Typical 5.0 20 pF

INJECTION CURRENT COUPLING SPECIFICATIONS (V

Symbol

V∆

* Iin = T otal current injected into all disabled channels.

Maximum Shift of Output Voltage of Enabled Analog

out

Channel

= 50 pF, Input tr = tf = 6 ns)

L

= 5V, TA = –55°C to +125°C)

CC

Parameter Typ Max Unit Condition

0.1

1.0

0.5

5.0

–55 to 25°C ≤85°C ≤125°C Unit

CC

3.0

4.5

6.0

2.0

3.0

4.5

6.0

0.5

5.0

2.0 20

160

80 40 30

260 160

80 60

10 35

130

mV Iin* ≤ 1mA, RS ≤ 3,9kΩ

180

90 45 35

280 180

90 70

10 35

130

Iin* ≤ 10mA, RS ≤ 3,9kΩ Iin* ≤ 1mA, RS ≤ 20kΩ Iin* ≤ 10mA, RS ≤ 20kΩ

200 100

50 40

300 200 100

80 10

35

130

ns

pF

MOTOROLA High–Speed CMOS Logic Data

4

DL129 — Rev 6

MC74HC4851A MC74HC4852A

1100 1000

900 800

700 600 500 400

, ON RESISTANCE (OHMS)

300

on

R

200 100

0

0.0 0.4 0.8 1.2 1.6 2.0 0.0 0.6 1.2 1.8 2.4 3.0 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND

–55°C +25°C +125

°

C

1100 1000

900 800

700 600 500 400

, ON RESISTANCE (OHMS)

300

on

R

200 100

0

Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND

Figure 5. T ypical On Resistance VCC = 2V Figure 6. T ypical On Resistance VCC = 3V

660 600 540 480 420 360 300 240

, ON RESISTANCE (OHMS)

180

on

R

120

60

0

0.0 0.9 1.8 2.7 3.6 4.5 0.0 1.2 2.4 3.6 4.8 6.0

–55°C +25

°

+125

C

°

C

440 400 360 320 280 240 200 160

, ON RESISTANCE (OHMS)

120

on

R

80 40

0

–55°C +25

°

C

+125°C

–55°C

°

C

+25 +125°C

Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND

Figure 7. T ypical On Resistance VCC = 4.5V Figure 8. T ypical On Resistance VCC = 6V

High–Speed CMOS Logic Data DL129 — Rev 6

Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND

5 MOTOROLA

MC74HC4851A MC74HC4852A

Vin2 < VSS or VCC < Vin2

Any Disabled Channel

R

Figure 9. Injection Current Coupling Specification

Sensor

(8x Identical Circuitry)

I

in

VSS < Vin1 < V

Enabled Channel

S

Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8

VCC = 5V

CC

6V5V

V

HC4051 Microcontroller

Common Out

CC

5V

V

= Vin1 ±V

out

V

CC

A/D – Input

∆

out

Figure 10. Actual T echnology

Requires 32 passive components and one extra 6V regulator

to suppress injection current into a standard HC4051 multiplexer

V

CC

A/D – Input

Sensor

(8x Identical Circuitry)

5V

V

HC4851A Microcontroller

Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8

Common Out

CC

Figure 11. MC74HC4851A Solution

Solution by applying the HC4851A multiplexer

MOTOROLA High–Speed CMOS Logic Data

6

DL129 — Rev 6

MC74HC4851A MC74HC4852A

PROGRAMMABLE

POWER SUPPLY

+–

ANALOG IN COMMON OUT

Figure 12. On Resistance T est

V

CC

V

EE

V

CC

MINI COMPUTER

GND

ANALOG I/O

PLOTTER

DEVICE

UNDER TEST

Set–Up

OFF OFF

V

CC

V

16

COMMON O/I

DC ANALYZER

CC

V

CC

V

CC

OFF OFF

16

COMMON O/I

V

EE

V

CC

A

NC

V

IH

6 8

Figure 13. Maximum Off Channel Leakage Current,

Any One Channel, T est Set–Up

V

CC

V

EE

V

CC

A

ON

OFF

ANALOG I/O

V

16

COMMON O/I

CC

N/C

V

IH

6 8

Figure 14. Maximum Off Channel Leakage Current,

Common Channel, T est Set–Up

CHANNEL

SELECT

t

PLH

ANALOG

OUT

50%

t

PHL

Figure 16. Propagation Delays, Channel Select

to Analog Out

V

CC

GND

V

IL

6 8

Figure 15. Maximum On Channel Leakage Current,

Channel to Channel, T est Set–Up

V

CC

ANALOG I/O

*Includes all probe and jig capacitance

ON/OFF OFF/ON

6 8

CHANNEL SELECT

CC

16

COMMON O/I

TEST POINT

CL*

Figure 17. Propagation Delay , Test Set–Up Channel

Select to Analog Out

High–Speed CMOS Logic Data DL129 — Rev 6

7 MOTOROLA

MC74HC4851A MC74HC4852A

ANALOG

IN

ANALOG

OUT

t

PLH

50%

t

PHL

V

CC

GND

ANALOG I/O

*Includes all probe and jig capacitance

V

CC

16

ON

COMMON O/I

6 8

TEST POINT

CL*

Figure 18. Propagation Delays, Analog In

to Analog Out

t

f

ENABLE

ANALOG

OUT

ANALOG

OUT

50%

t

PZL

t

PZH

t

r

t

PLZ

t

PHZ

Figure 20. Propagation Delays, Enable to

Analog Out

90% 50% 10%

10%

90%

V

CC

GND HIGH

IMPEDANCE

V

OL

V

OH

HIGH IMPEDANCE

Figure 19. Propagation Delay , Test Set–Up

Analog In to Analog Out

POSITION 1 WHEN TESTING t

1 2

V

CC

1 2

POSITION 2 WHEN TESTING t

V

CC

16

ANALOG I/O

ENABLE

ON/OFF

6 8

Figure 21. Propagation Delay , Test Set–Up

Enable to Analog Out

PHZ PLZ

AND t

10k

CL*

PZH

PZL

Ω

TEST POINT

V

CC

V

CC

ANALOG I/O

ON/OFF OFF/ON

6 8

CHANNEL SELECT

A

16

COMMON O/I

11

NC

V

CC

Figure 22. Power Dissipation Capacitance,

T est Set–Up

MOTOROLA High–Speed CMOS Logic Data

8

DL129 — Rev 6

MC74HC4851A MC74HC4852A

Gate = V

CC

Disabled Analog Mux Input

(Disabled)

Vin > VCC + 0.7V

P+ P+

+

N – Substrate (on VCC potential)

Figure 23. Diagram of Bipolar Coupling Mechanism

Appears if Vin exceeds VCC, driving injection current into the substrate

Common Analog Output V

> V

out

CC

A

B

C

ENABLE

11

10

9

6

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

13

14

15

12

X0

X1

X2

X3

1

X4

5

X5

2

X6

4

X7

3

X

High–Speed CMOS Logic Data DL129 — Rev 6

Figure 24. Function Diagram, HC4851A

9 MOTOROLA

MC74HC4851A MC74HC4852A

A

B

ENABLE

10

9

6

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

INJECTION

CURRENT CONTROL

13

14

15

12

13

X0

X1

X2

X3

X

1

Y0

5

Y1

2

Y2

4

Y3

Figure 25. Function Diagram, HC4852A

INJECTION

CURRENT CONTROL

3

Y

MOTOROLA High–Speed CMOS Logic Data

10

DL129 — Rev 6

OUTLINE DIMENSIONS

MC74HC4851A MC74HC4852A

–A

–

916

B

18

F

C

S

H

G

1

–A

D

16 PL

–

K

M M

916

–B

–

8

G

K

–T

SEATING

–

PLANE

D 16 PL

0.25 (0.010) T B A

M

N SUFFIX

PLASTIC PACKAGE

CASE 648–08

ISSUE R

SEATING

–T

PLANE

–

J

TA0.25 (0.010)

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

P 8 PL

0.25 (0.010) B

C

M

S S

L

M M

R X 45°

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

INCHES MILLIMETERS

MIN MINMAX MAX

DIM

A

0.740

B

0.250

C

0.145

D

0.015

F

0.040

G

M

F

J

H

J

0.008

K

0.110

L

0.295

M

0

°

S

0.020

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

DIM

A B C D F G J K M P R

18.80

6.35

3.69

0.39

1.02

0.21

2.80

7.50

0.51

10.00

4.00

1.75

0.49

1.25

0.25

0.25 7

6.20

0.50

2.54 BSC

1.27 BSC

0

°

19.55

6.85

4.44

0.53

1.77

0.38

3.30

7.74 10

1.01

0.386

0.150

0.054

0.014

0.016

0.008

0.004 0

0.229

0.010

°

0.770

0.270

0.175

0.021

0.070

0.100 BSC

0.050 BSC

0.015

0.130

0.305 10

°

0.040

MILLIMETERS INCHES

MIN MINMAX MAX

9.80

3.80

1.35

0.35

0.40

1.27 BSC 0.050 BSC

0.19

0.10

0

°

5.80

0.25

°

0.393

0.157

0.068

0.019

0.049

0.009

0.009 7

°

0.244

0.019

–A–

16 9

0.010 (0.25) B

High–Speed CMOS Logic Data DL129 — Rev 6

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751G–02

ISSUE A

–B– P8X

M

0.010 (0.25)

81

D16X

M

S

A

T

S

J

C

–T–

G14X

K

SEATING PLANE

B

F

R

X 45

M

11 MOTOROLA

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.

DIM MIN MAX MIN MAX

A 10.15 10.45 0.400 0.411 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104

_

D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7

____

P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029

INCHESMILLIMETERS

MC74HC4851A MC74HC4852A

ÇÇ

16X REFK

0.10 (0.004) V

S

U0.15 (0.006) T

16

1

A

–V–

C

0.10 (0.004)

SEATING

–T–

PLANE

L

PIN 1 IDENT.

U0.15 (0.006) T

D

2X L/2

S

OUTLINE DIMENSIONS

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948F–01

ISSUE O

T

U

B

–U–

S

H

S

J1

J

N

F

DETAIL E

M

9

8

G

K

K1

SECTION N–N

0.25 (0.010)

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.

INCHESMILLIMETERS

–W–

DIM MIN MAX MIN MAX

A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC

M 0 8 0 8

____

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

Mfax is a trademark of Motorola, Inc.

How to reach us: USA/EUROPE /Locations Not Listed: Motorola Literature Distribution; JAP AN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,

P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, T ai Po, N.T., Hong Kong. 852–26629298

INTERNET: http://motorola.com/sps

MOTOROLA High–Speed CMOS Logic Data

12

◊

MC74HC4851A/D

DL129 — Rev 6

Datasheet MC74HC4851ADT, MC74HC4851AD, MC74HC4851AN Datasheet (Motorola)

Specifications and Main Features

Frequently Asked Questions

User Manual