SEMICONDUCTOR TECHNICAL DATA
1
REV 0
Motorola, Inc. 1995
10/95
High–Performance Silicon–Gate CMOS
The MC54/74HC393A is identical in pinout to the LS393. The device
inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.
This device consists of two independent 4–bit binary ripple counters with
parallel outputs from each counter stage. A ÷ 256 counter can be obtained
by cascading the two binary counters.
Internal flip–flops are triggered by high–to–low transitions of the clock
input. R eset for the c ounters is a synchronous and active–high. State
changes of the Q outputs do not occur simultaneously because of internal
ripple delays. Therefore, decoded output signals are subject to decoding
spikes and should not be used as clocks or as strobes except when gated
with the Clock of the HC393A.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 236 FETs or 59 Equivalent Gates
LOGIC DIAGRAM
Q1
Q2
Q3
Q4
CLOCK
RESET
1, 13
2, 12
3, 11
4, 10
5, 9
6, 8
PIN 14 = V
CC
PIN 7 = GND
BINARY
COUNTER
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
PIN ASSIGNMENT
FUNCTION TABLE
Inputs
Clock Reset Outputs
X H L
H L No Change
L L No Change
L No Change
L Advance to
Next State
11
12
13
14
8
9
105
4
3
2
1
7
6
Q2
b
Q1
b
RESET b
CLOCK b
V
CC
Q4
b
Q3
b
Q2
a
Q1
a
RESET a
CLOCK a
GND
Q3
a
Q4
a
D SUFFIX
SOIC PACKAGE
CASE 751A–03
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ORDERING INFORMATION
MC54HCXXXAJ
MC74HCXXXAN
MC74HCXXXAD
MC74HCXXXADT
Ceramic
Plastic
SOIC
TSSOP
1
14
1
14
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
1
14
1
14
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
MC54/74HC393A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
P
D
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
TSSOP Package†
750
500
450
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
(Ceramic DIP)
260
300
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time VCC = 2.0 V
VCC = 3.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
0
0
0
0
1000
600
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
V
IH
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
V
IL
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.80
0.5
0.9
1.35
1.80
0.5
0.9
1.35
1.80
V
V
OH
Minimum High–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC54/74HC393A
High–Speed CMOS Logic Data
DL129 — Rev 6
3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Unit
Guaranteed Limit
V
CC
V
Test Conditions
Parameter
Symbol
Unit
v
125_C
v
85_C
– 55 to
25_C
V
CC
V
Test Conditions
Parameter
Symbol
V
OL
Maximum Low–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
I
in
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
I
CC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
6.0
4
40
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
f
max
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 3)
2.0
3.0
4.5
6.0
10
15
30
50
9
14
28
45
8
12
25
40
MHz
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock to Q1
(Figures 1 and 3)
2.0
3.0
4.5
6.0
70
40
20
16
80
45
25
21
90
50
30
27
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock to Q2
(Figures 1 and 3)
2.0
3.0
4.5
6.0
90
56
32
25
105
70
38
31
180
100
45
40
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock to Q3
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
40
30
25
75
55
40
35
90
65
50
42
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock to Q4
(Figures 1 and 3)
2.0
3.0
4.5
6.0
200
160
35
30
250
185
45
40
300
210
60
50
ns
t
PHL
Maximum Propagation Delay, Reset to any Q
(Figures 2 and 3)
2.0
3.0
4.5
6.0
80
48
28
21
95
65
32
25
110
75
40
30
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
C
in
Maximum Input Capacitance
—
10
10
10
pF
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Counter)*
35
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
MC54/74HC393A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
4
TIMING REQUIREMENTS (Input t
r
= tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
t
rec
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
3.0
4.5
6.0
25
15
5
5
30
20
6
5
40
30
10
7
ns
t
w
Minimum Pulse Width, Clock
(Figure 1)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
t
w
Minimum Pulse Width, Reset
(Figure 2)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
tr, t
f
Maximum Input Rise and Fall Times
(Figure 1)
2.0
3.0
4.5
6.0
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MC54/74HC393A
High–Speed CMOS Logic Data
DL129 — Rev 6
5 MOTOROLA
PIN DESCRIPTIONS
INPUTS
Clock (Pins 1, 13)
Clock input. The internal flip–flops are toggled and the
counter state advances on high–to–low transitions of t he
clock input.
CONTROL INPUTS
Reset (Pins 2, 12)
Active–high, asynchronous reset. A separate reset is pro-
vided for each counter. A high at the Reset input prevents
counting and forces all four outputs low.
OUTPUTS
Q1, Q2, Q3, Q4 (Pins 3, 4, 5, 6, 8, 9, 10, 11)
Parallel binary outputs Q4 is the most significant bit.
SWITCHING WAVEFORMS
t
PHL
V
CC
GND
V
CC
GND
50%
50%
50%
t
rec
CLOCK
Q
RESET
Figure 1. Figure 2.
Figure 3. Test Circuit
Q1
Q2
Q3
Q4
CLOCK
RESET
1, 13
2, 12
3, 11
4, 10
5, 9
6, 8
EXPANDED LOGIC DIAGRAM
*Includes all probe and jig capacitance
CL*
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
CLOCK
Q
90%90%
50%
10%
t
f
t
r
V
CC
GND
t
w
1/f
max
t
PLH
t
PHL
90%
50%
10%
t
TLH
t
THL
C
D Q
t
w
Q
C
D Q
Q
C
D Q
Q
C
D Q
Q
MC54/74HC393A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
6
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0
CLOCK
RESET
Q1
Q2
Q3
Q4
TIMING DIAGRAM
COUNT SEQUENCE
Outputs
Count
Q4 Q3 Q2 Q1
0 L L L L
1 L L L H
2 L L H L
3 L L H H
4 L H L L
5 L H L H
6 L H H L
7 L H H H
8 H L L L
9 H L L H
10 H L H L
11 H L H H
12 H H L L
13 H H L H
14 H H H L
15 H H H H
MC54/74HC393A
High–Speed CMOS Logic Data
DL129 — Rev 6
7 MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A
B
C
D
F
G
J
K
L
M
N
0.785
0.280
0.200
0.020
0.065
0.015
0.170
15
°
0.040
0.750
0.245
0.155
0.015
0.055
0.008
0.125
0
°
0.020
19.94
7.11
5.08
0.50
1.65
0.38
4.31
15
°
1.01
19.05
6.23
3.94
0.39
1.40
0.21
3.18
0
°
0.51
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
14 8
1 7
-A-
-B-
-T-
SEATING
PLANE
F G
N
K
C
L
M
0.25 (0.010) T A
M
S
0.25 (0.010) T B
M
S
J 14 PL
D 14 PL
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1 7
14 8
B
A
F
H G D
K
C
N
L
J
M
SEATING
PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC 7.62 BSC
M 0 10 0 10
N 0.015 0.039 0.39 1.01
_ _ _ _
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25
7
°
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009
7°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P 7 PL
G
C
K
SEATING
PLANE
D 14 PL
M
J
R
X 45°
1
7
814
0.25 (0.010) T B A
M
S S
B0.25 (0.010)
M M
F
MC54/74HC393A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
8
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
_ _ _ _
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING
PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
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MC54/74HC393A/D
*MC54/74HC393A/D*
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