Datasheet MC74HC390AFR1, MC74HC390AFL1, MC74HC390ADTEL, MC74HC390ADTR2, MC74HC390AF Datasheet (MOTOROLA)

...
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 2
1 Publication Order Number:
MC74HC390A/D
MC74HC390A
Dual 4-Stage Binary Ripple Counter with
÷
÷
5
Sections
High–Performance Silicon–Gate CMOS
The MC74HC390A is identical in pinout to the LS390. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
This device consists of two independent 4–bit counters, each composed of a divide–by–two and a divide–by–five section. The divide–by–two and divide–by–five counters have separate clock inputs, and can be cascaded to implement various combinations of ÷ 2 and/or ÷ 5 up to a ÷ 100 counter.
Flip–flops internal to the counters are triggered by high–to–low transitions of the clock input. A separate, asynchronous reset is provided for each 4–bit counter. State changes of the Q outputs do not occur simultaneously because of internal ripple delays. Therefore, decoded output signals are subject to decoding spikes and should not be used as clocks or strobes except when gated with the Clock of the HC390A.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No 7A
Chip Complexity: 244 FETs or 61 Equivalent Gates
LOGIC DIAGRAM
Q
A
Q
B
Q
C
Q
D
1, 15
4, 12
2, 14
3, 13
5, 11 6, 10
7, 9
PIN 16 = V
CC
PIN 8 = GND
CLOCK A
RESET
CLOCK B
÷ 2
COUNTER
÷ 5
COUNTER
FUNCTION TABLE
Clock
A B Reset Action
X X H Reset
÷ 2 and ÷ 5
X L Increment
÷ 2
X L Increment
÷ 5
SO–16
D SUFFIX
CASE 751B
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TSSOP–16 DT SUFFIX CASE 948F
1
16
PDIP–16 N SUFFIX CASE 648
1
16
1
16
MARKING
DIAGRAMS
1
16
MC74HC390AN
AWLYYWW
1
16
HC390A
AWLYWW
A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week
HC
390A
ALYW
1
16
Device Package Shipping
ORDERING INFORMATION
MC74HC390AN PDIP–16 2000 / Box MC74HC390AD SOIC–16
48 / Rail MC74HC390ADR2 SOIC–16 2500 / Reel MC74HC390ADT TSSOP–16 96 / Rail MC74HC390ADTR2 TSSOP–16
2500 / Reel
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
CLOCK B
b
Q
Ab
RESET b
CLOCK A
b
V
CC
Q
Db
Q
Cb
Q
Bb
CLOCK B
a
Q
Aa
RESET a
CLOCK A
a
GND
Q
Da
Q
Ca
Q
Ba
MC74HC390A
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2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
ÎÎ
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air, Plastic DIP†
SOIC Package†
TSSOP Package†
ÎÎÎ
Î
750 500 450
Î
Î
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
ÎÎ
Î
T
L
ОООООООООООО
Î
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
ÎÎÎ
Î
260
Î
Î
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
ÎÎ
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
ÎÎ
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
ÎÎ
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
ÎÎ
+ 125
_
C
ÎÎ
Î
ÎÎ
Î
tr, t
f
ООООООООООООО
Î
ООООООООООООО
Î
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 3.0 V
VCC = 4.5 V VCC = 6.0 V
Î
Î
Î
Î
0 0 0 0
ÎÎ
ÎÎ
ÎÎ
1000
600 500 400
Î
Î
Î
Î
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
ÎÎ
Î
Symbol
ООООООО
Î
Parameter
ООООООО
Î
Test Conditions
ÎÎ
Î
V
CC V
ÎÎ
Î
– 55 to
25_C
ÎÎÎ
Î
Î
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎ
Î
ÎÎ
Î
V
IH
ООООООО
Î
ООООООО
Î
Minimum High–Level Input Voltage
ООООООО
Î
ООООООО
Î
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
1.5
2.1
3.15
4.2
ÎÎÎ
Î
Î
Î
Î
Î
Î
1.5
2.1
3.15
4.2
ÎÎ
Î
ÎÎ
Î
1.5
2.1
3.15
4.2
Î
Î
Î
Î
V
ÎÎ
Î
V
IL
ООООООО
Î
Maximum Low–Level Input Voltage
ООООООО
Î
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
0.5
0.9
1.35
1.8
ÎÎÎ
Î
Î
Î
0.5
0.9
1.35
1.8
ÎÎ
Î
0.5
0.9
1.35
1.8
Î
Î
V
ÎÎ
Î
ÎÎ
Î
V
OH
ООООООО
Î
ООООООО
Î
Minimum High–Level Output Voltage
ООООООО
Î
ООООООО
Î
Vin = VIH or V
IL
|I
out
| v 20 µA
ÎÎ
Î
ÎÎ
Î
2.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
1.9
4.4
5.9
ÎÎÎ
Î
Î
Î
Î
Î
Î
1.9
4.4
5.9
ÎÎ
Î
ÎÎ
Î
1.9
4.4
5.9
Î
Î
Î
Î
V
ÎÎÎОООООООÎООООООО
Î
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
ÎÎ
Î
3.0
4.5
6.0
ÎÎ
Î
2.48
3.98
5.48
ÎÎÎ
Î
Î
Î
2.34
3.84
5.34
ÎÎ
Î
2.20
3.70
5.20
Î
Î
ÎÎ
Î
V
OL
ООООООО
Î
Maximum Low–Level Output Voltage
ООООООО
Î
Vin = VIH or V
IL
|I
out
| v 20 µA
ÎÎ
Î
2.0
4.5
6.0
ÎÎ
Î
0.1
0.1
0.1
ÎÎÎ
Î
Î
Î
0.1
0.1
0.1
ÎÎ
Î
0.1
0.1
0.1
Î
Î
V
ÎÎ
Î
ÎÎ
Î
ООООООО
Î
ООООООО
Î
ООООООО
Î
ООООООО
Î
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
ÎÎ
Î
ÎÎ
Î
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
0.26
0.26
0.26
ÎÎÎ
Î
Î
Î
Î
Î
Î
0.33
0.33
0.33
ÎÎ
Î
ÎÎ
Î
0.40
0.40
0.40
Î
Î
Î
Î
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
MC74HC390A
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3
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Unit
Guaranteed Limit
V
CC
V
Test Conditions
Parameter
Symbol
Unit
v
125_C
ÎÎÎ
v
85_C
– 55 to
25_C
V
CC
V
Test Conditions
Parameter
Symbol
ÎÎ
Î
I
in
ООООООО
Î
Maximum Input Leakage Current
ООООООО
Î
Vin = VCC or GND
ÎÎ
Î
6.0
ÎÎ
Î
± 0.1
ÎÎÎ
Î
Î
Î
± 1.0
ÎÎ
Î
± 1.0
Î
Î
µA
ÎÎ
Î
I
CC
ООООООО
Î
Maximum Quiescent Supply Current (per Package)
ООООООО
Î
Vin = VCC or GND I
out
= 0 µA
ÎÎ
Î
6.0
ÎÎ
Î
4
ÎÎÎ
Î
Î
Î
40
ÎÎ
Î
160
Î
Î
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tf = tf = 6 ns)
Guaranteed Limit
ÎÎÎ
Î
Symbol
ОООООООООООООО
Î
Parameter
ÎÎ
Î
V
CC V
ÎÎ
Î
– 55 to
25_C
ÎÎÎ
Î
Î
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎÎ
Î
ÎÎÎ
Î
f
max
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 3)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
10 15 30 50
ÎÎÎ
Î
Î
Î
Î
Î
Î
9 14 28 45
ÎÎ
Î
ÎÎ
Î
8 12 25 40
Î
Î
Î
Î
MHz
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
Maximum Propagation Delay, Clock A to QA
(Figures 1 and 3)
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
70 40 24 20
ÎÎÎ
Î
Î
Î
80 45 30 26
ÎÎ
Î
90 50 36 31
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Clock A to QC (QA connected to Clock B)
(Figures 1 and 3)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
200 160
58 49
ÎÎÎ
Î
Î
Î
Î
Î
Î
250 185
65 62
ÎÎ
Î
ÎÎ
Î
300 210
70 68
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Clock B to QB
(Figures 1 and 3)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
70 40 26 22
ÎÎÎ
Î
Î
Î
Î
Î
Î
80 45 33 28
ÎÎ
Î
ÎÎ
Î
90 50 39 33
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Clock B to QC
(Figures 1 and 3)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
90 56 37 31
ÎÎÎ
Î
Î
Î
Î
Î
Î
105
70 46 39
ÎÎ
Î
ÎÎ
Î
180 100
56 48
Î
Î
Î
Î
ns
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
Maximum Propagation Delay, Clock B to QD
(Figures 1 and 3)
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
70 40 26 22
ÎÎÎ
Î
Î
Î
80 45 33 28
ÎÎ
Î
90 50 39 33
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Reset to any Q
(Figures 2 and 3)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
80 48 30 26
ÎÎÎ
Î
Î
Î
Î
Î
Î
95 65 38 33
ÎÎ
Î
ÎÎ
Î
110
75 44 39
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
TLH
,
t
THL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 27 15 13
ÎÎÎ
Î
Î
Î
Î
Î
Î
95 32 19 15
ÎÎ
Î
ÎÎ
Î
110
36 22 19
Î
Î
Î
Î
ns
C
in
Maximum Input Capacitance
10
ÎÎÎ
10
10
pF
1. For propagation delays with loads other than 50 pF , see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Counter)*
35
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
MC74HC390A
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4
TIMING REQUIREMENTS (Input t
r
= tf = 6 ns)
Guaranteed Limit
ÎÎÎ
Î
Symbol
ОООООООООООООО
Î
Parameter
ÎÎ
Î
V
CC V
ÎÎ
Î
– 55 to
25_C
ÎÎÎ
Î
Î
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎÎ
Î
t
rec
ОООООООООООООО
Î
Minimum Recovery Time, Reset Inactive to Clock A or Clock B
(Figure 2)
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
25 15 10
9
ÎÎÎ
Î
Î
Î
30 20 13 11
ÎÎ
Î
40 30 15 13
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
w
ОООООООООООООО
Î
ОООООООООООООО
Î
Minimum Pulse Width, Clock A, Clock B
(Figure 1)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 27 15 13
ÎÎÎ
Î
Î
Î
Î
Î
Î
95 32 19 15
ÎÎ
Î
ÎÎ
Î
110
36 22 19
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
w
ОООООООООООООО
Î
ОООООООООООООО
Î
Minimum Pulse Width, Reset
(Figure 2)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 27 20 18
ÎÎÎ
Î
Î
Î
Î
Î
Î
95 32 24 22
ÎÎ
Î
ÎÎ
Î
110
36 30 28
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
tf, t
f
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Input Rise and Fall Times
(Figure 1)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
1000
800 500 400
ÎÎÎ
Î
Î
Î
Î
Î
Î
1000
800 500 400
ÎÎ
Î
ÎÎ
Î
1000
800 500 400
Î
Î
Î
Î
ns
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
PIN DESCRIPTIONS
INPUTS Clock A (Pins 1, 15) and Clock B (Pins 4, 15)
Clock A is the clock input to the ÷ 2 counter; Clock B is
the clock input to the ÷ 5 counter. The internal flip–flops are toggled by high–to–low transitions of the clock input.
CONTROL INPUTS Reset (Pins 2, 14)
Asynchronous reset. A high at the Reset input prevents
counting, resets the internal flip–flops, and forces Q
A
through QD low.
OUTPUTS QA (Pins 3, 13)
Output of the ÷ 2 counter.
QB, QC, QD (Pins 5, 6, 7, 9, 10, 11)
Outputs of the ÷ 5 counter. QD is the most significant bit.
QA is the least significant bit when the counter is connected for BCD output as in Figure 4. QB is the least significant bit when the counter is operating in the bi–quinary mode as in Figure 5.
SWITCHING W AVEFORMS
Q
t
r
t
f
t
PLH
t
PHL
t
TLH
t
THL
V
CC
GND
CLOCK
10%
50%
90%
1/f
max
t
w
t
rec
RESET
Figure 1. Figure 2.
V
CC
GND
V
CC
GND
10%
50%
90%
Q
CLOCK
50%
50%
50%
t
PHL
t
w
10%
MC74HC390A
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5
C
D
R
Q Q
0123456789
EXPANDED LOGIC DIAGRAM
TIMING DIAGRAM
(QA Connected to Clock B)
Q
A
Q
B
Q
C
Q
D
CLOCK A
RESET
Q
A
Q
B
Q
C
Q
D
CLOCK A
CLOCK B
RESET
3, 13
5, 11
6, 10
7, 9
1, 15
4, 12
2, 14
C
D
R
Q Q
C
D
R
Q Q
C
DRQ
0123456
TEST CIRCUIT
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE UNDER
TEST
OUTPUT
Figure 3.
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APPLICATIONS INFORMATION
Each half of the MC54/74HC390A has independent ÷ 2 and ÷ 5 sections (except for the Reset function). The ÷ 2 and ÷ 5 counters can be connected to give BCD or bi–quinary (2–5) count sequences. If Output QA is connected to the Clock B input (Figure 4), a decade divider with BCD output is obtained. The function table for the BCD count sequence is given in Table 1.
To obtain a bi–quinary count sequence, the input signals connected to the Clock B input, and output QD is connected to the Clock A input (Figure 5). QA provides a 50% duty cycle output. The bi–quinary count sequence function table is given in Table 2.
Table 1. BCD Count Sequence*
Output
Count
Q
D
Q
C
Q
B
Q
A
0 L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 5 L H L H 6 L H H L 7 L H H H 8 H L L L 9 H L L H
*QA connected to Clock B input.
Table 2. Bi–Quinary Count Sequence**
Output
Count
Q
A
Q
D
Q
C
Q
B
0 L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 8 H L L L
9 H L L H 10 H L H L 11 H L H H 12 H H L L
**QD connected to Clock A input.
CONNECTION DIAGRAMS
1, 15
÷ 2
COUNTER
CLOCK A
RESET
Figure 4. BCD Count Figure 5. Bi-Quinary Count
÷ 2
COUNTER
÷ 5
COUNTER
÷ 5
COUNTER
CLOCK B
CLOCK A
RESET
CLOCK B
1, 15
Q
A
Q
B
Q
C
Q
D
3, 13
5, 11
6, 10
7, 9
4, 12
2, 14
Q
A
Q
B
Q
C
Q
D
3, 13
5, 11 6, 10
7, 9
4, 12
2, 14
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7
P ACKAGE DIMENSIONS
PDIP–16
N SUFFIX
CASE 648–08
ISSUE R
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A B C D
F G H
J K
L M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50 0°
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74 10°
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295 0°
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305 10°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
B
18
916
F
H
G
D
16 PL
S
C
–T
SEATING PLANE
K
J
M
L
TA0.25 (0.010)
M M
0.25 (0.010) T B A
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
9.80
3.80
1.35
0.35
0.40
0.19
0.10 0°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25 7°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004 0°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009 7°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1
8
916
–A
–B
D
16 PL
K
C
G
–T
SEATING
PLANE
R X 45°
M
J
F
P 8 PL
0.25 (0.010) B
M M
SOIC–16
D SUFFIX
CASE 751B–05
ISSUE J
MC74HC390A
http://onsemi.com
8
P ACKAGE DIMENSIONS
TSSOP–16 DT SUFFIX
CASE 948F–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
____
SECTION N–N
SEATING PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
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