Motorola MC3334D, MC3334P, MCCF3334, MCC3334 Datasheet

Device

Operating

Temperature Range

Package







SEMICONDUCTOR

TECHNICAL DATA

HIGH ENERGY

IGNITION CIRCUIT

ORDERING INFORMATION

MC3334P
MC3334D

TA = – 40° to +125°C

Plastic DIP

SO–8

Order this document by MC3334/D

P SUFFIX

PLASTIC PACKAGE

CASE 626

8

1

D SUFFIX

PLASTIC PACKAGE

CASE 751

(SO–8)

MCC3334 Chip
MCCF3334 Flip–Chip

1

MOTOROLA ANALOG IC DEVICE DATA

   

This device is designed to use the signal from a reluctor type ignition
pickup to produce a well controlled output from a power Darlington output
transistor.

• Very Low Peripheral Component Count

• No Critical System Resistors

• Wide Supply Voltage Operating Range (4.0 V to 24 V)

• Overvoltage Shutdown (30 V)

• Dwell Automatically Adjusts to Produce Optimum Stored Energy

without Waste

• Externally Adjustable Peak Current

• Available in Chip and Flip–Chip Form

• Transient Protected Inputs and Outputs

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Supply Voltage–Steady State

Transient 300 ms or less

V

bat

24
90

V

Output Sink Current–Steady State

Transient 300 ms or less

I

O(Sink)

300

1.0

mA

A

Junction Temperature T

J(max)

150 °C

Operating Temperature Range T

A

–40 to +125 °C
Storage Temperature Range Tstg –65 to +150 °C
Power Dissipation, Plastic Package, Case 626

Derate above 25°C

P

D

1.25
10

W

mW/°C

Figure 1. Block Diagram and Typical Application

**A 350 V zener clamp is required when using the standard MJ10012.

**This clamp is not required if a selected version with V

CEO(sus)

w 550 V is used.

*Optional parts for extended transient protection

+

+

–

–

Reluctor
Pickup

1.35H

V

t

s

t

C1*
470

C2*

0.01

R

A

20k

R

L

10k

R

B

20k

5

S1

S2

4

C
3

C

Dwell

0.1

C

Filter

0.1

Rbat

300

4.0 V

bat–

24 Vdc

Ignition
Coil
Primary

8.0mH

**MJ10012

R

Gain

5.0k

R

Drive
100

RS

0.075

R

D1

35–350

1

Power Ground

Sense
Ground

MC3334

VCC6

7
I

O

8
I

L

R

D2

100

Power
Output
& OVP

Current

Limit

Sense

Dwell
Reference
Buffer

Input
Comparator

with
Hysteresis

+

2

 Motorola, Inc. 1996 Rev 0

MC3334 MCC3334 MCCF3334

2

MOTOROLA ANALOG IC DEVICE DATA

ELECTRICAL CHARACTERISTICS

(TA = –40° to +125°C, V

bat

= 13.2 Vdc, circuit of Figure 1, unless otherwise noted.)

Characteristics

Symbol Min Typ Max Unit

Internal Supply Voltage, Pin 6

V

bat

= 4.0 Vdc

V

bat

= 8.0 Vdc

V

bat

= 12.0

V

bat

= 14.0

V

CC

–
–
–
–

3.5

7.2

10.4

11.8

–
–
–
–

Vdc

Ignition Coil Current Peak, Cranking RPM 2.0 Hz to 27 Hz

V

bat

= 4.0 Vdc

V

bat

= 6.0

V

bat

= 8.0

V

bat

= 10.0

I

o(pk)

3.0

4.0

4.6

5.1

3.4

5.2

5.3

5.4

–
–
–
–

A pk

Ignition Coil Current Peak, Normal RPM

Frequency = 33 Hz

Frequency = 133 Hz
Frequency = 200 Hz
Frequency = 267 Hz
Frequency = 333 Hz

I

o(pk)

5.1

5.1

4.2

3.4

2.7

5.5

5.5

5.4

4.4

3.4

–
–
–
–

A pk

Ignition Coil On–Time, Normal RPM Range

Frequency = 33 Hz

Frequency = 133 Hz
Frequency = 200 Hz
Frequency = 267 Hz
Frequency = 333 Hz

t

on

–
–
–
–
–

7.5

5.0

4.0

3.0

2.3

14.0

5.9

4.6

3.6

2.8

ms

Shutdown Voltage V

bat

25 30 35 Vdc

Input Threshold (Static Test)

Turn–on
Turn–off

VS2–V

S1

–
–

360

90

–
–

mVdc

Input Threshold Hysteresis VS2–V

S1

75 – – mVdc

Input Threshold (Active Operation)

Turn–on
Turn–off

V

S2

–
–

1.8

1.5

–
–

Vdc

Total Circuit Lag from ts (Figure 1) until Ignition Coil Current Falls to 10% – 60 120 µs
Ignition Coil Current Fall Time (90% to 10%) – 4.0 – µs
Saturation Voltage IC Output (Pin 7) (R

DRIVE

= 100 Ω)

V

bat

= 10 Vdc

V

bat

= 30 Vdc

V

bat

= 50 Vdc

V

CE(sat)

–
–
–

120
280
540

–
–
–

mVdc

Current Limit Reference, Pin 8 V

ref

120 160 190 mVdc

Figure 2. Ignition Coil Current versus Frequency/Period

333 200 133 100 70 50 33

1.0

2.0

3.0

4.0

5.0

6.0

5.5

0 5 10 15 20 25 30 ms

V

bat

= 13.2 Vdc

Slope =

V

bat

– 1.5 V

8.0 mH

I (A)

f, FREQUENCY (Hz)

O

MC3334 MCC3334 MCCF3334

3

MOTOROLA ANALOG IC DEVICE DATA

CIRCUIT DESCRIPTION

The MC3334 high energy ignition circuit was designed to
serve aftermarket Delco five–terminal ignition applications.
This device, driving a high voltage Darlington transistor, offers
an ignition system which optimizes spark energy at minimum
power dissipation. The IC is pinned–out to permit thick film or
printed circuit module design without any crossovers.

The basic function of an ignition circuit is to permit build–up
of current in the primary of a spark coil, and then to interrupt
the flow at the proper firing time. The resulting flyback action
in the ignition coil induces the required high secondary
voltage needed for the spark. In the simplest systems, fixed
dwell angle produces a fixed duty cycle, which can result in
too little stored energy at high RPM, and/or wasted power at
low RPM. The MC3334 uses a variable DC voltage
reference, stored on C

Dwell

, and buffered to the bottom end of
the reluctor pickup (S1) to vary the duty cycle at the spark
coil. At high RPM, the MC3334 holds the output “off” for
approximately 1.0 ms to permit full energy discharge from the
previous spark; then it switches the output Darlington
transistor into full saturation. The current ramps up at a slope
dictated by V

bat

and the coil L. At very high RPM the peak
current may be less than desired, but it is limited by the
coil itself.

As the RPM decreases, the ignition coil current builds up
and would be limited only by series resistance losses. The
MC3334 provides adjustable peak current regulation sensed
by RS and set by RD1, in this case at 5.5 A, as shown in
Figure 2. As the RPM decreases further, the coil current is
held at 5.5 A for a short period. This provides a reserve for
sudden acceleration, when discharge may suddenly occur
earlier than expected. The peak hold period is about 20% at
medium RPM, decreasing to about 10% at very low RPM.
(Note: 333 Hz = 5000 RPM for an eight cylinder four stroke
engine.) At lower V

bat

, the “on” period automatically stretches

to accommodate the slower current build–up. At very low V

bat

and low RPM, a common condition during cold starting, the
“on” period is nearly the full cycle to permit as much coil
current as possible.

The output stage of the IC is designed with an OVP circuit
which turns it on at V

bat

≈ 30 V (VCC ≈ 22 V), holding the
output Darlington off. This protects the IC and the Darlington
from damage due to load dump or other causes of
excessive V

bat

.

Component Values

Pickup – series resistance = 800 Ω ± 10% @ 25°C

inductance = 1.35 H @ 1.0 kHz @ 15 Vrms

Coil – leakage L = 0.6 mH

primary R = 0.43 Ω ± 5% @ 25°C
primary L = 7.5 mH to 8.5 mH @ 5.0 A

R

L

– load resistor for pickup = 10 kΩ ± 20%

RA, RB– input buffer resistors provide additional

transient protection to the already clamped
inputs = 20 k ± 20%

C1, C2 – for reduction of high frequency noise and

spark transients induced in pick–up and
leads; optional and non–critical

R

bat

– provides load dump protection (but small

enough to allow operation at V

bat

= 4.0 V)

= 300 Ω ± 20%

C

Filter

– transient filter on VCC, non–critical

C

Dwell

– stores reference, circuit designed for 0.1 µF

± 20%

R

Gain

–R

Gain/RD1

sets the DC gain of the current

regulator = 5.0 k ± 20%

R

D2

–RD2/RD1 set up voltage feedback from R

S

R

S

– sense resistor (PdAg in thick film techniques)

= 0.075 Ω ± 30%

R

Drive

– low enough to supply drive to the output

Darlington, high enough to keep V

CE(sat)

of
the IC below Darlington turn–on during load
dump = 100 Ω ± 20%, 5.0 W

R

D1

– starting with 35 Ω assures less than 5.5 A,

increasing as required to set 5.5 A

RD1 =

– (≈ 100 Ω)

I

O(pk) RS–Vref

V

ref

R

D2RGain

1.4

–

General Layout Notes

The major concern in the substrate design should be to
reduce ground resistance problems. The first area of concern
is the metallization resistance in the power ground to module
ground and the output to the R

drive

resistor. This resistance

directly adds to the V

CE(sat)

of the IC power device and if not
minimized could cause failure in load dump. The second
concern is to reference the sense ground as close to the
ground end of the sense resistor as possible in order to
further remove the sensitivity of ignition coil current to ground
I.R. drops.

All versions were designed to provide the same pin–out
order viewed from the top (component side) of the board or
substrate. This was done to eliminate conductor
cross–overs. The standard MC3334 plastic device is
numbered in the industry convention, counter–clockwise
viewed from the top, or bonding pad side. The MCCF3334
“flip” or “bump” chip is made from reversed artwork, so it is
numbered clockwise viewed from its bump side. Since this
chip is mounted face down, the resulting assembly still has
the same counter–clockwise order viewed from above the
component surface. All chips have the same size and
bonding pad spacing. See Figure 4 for dimensions.

MC3334 MCC3334 MCCF3334

4

MOTOROLA ANALOG IC DEVICE DATA

Figure 3. Internal Schematic

Charge

Up

Charge

Down

Dwell
Reference
Buffer

X

V

CC

2.0

φ

2.0

φ

4

S1

3

C

5

S2

Input
Comparator
with
Hysteresis

5.2V

5.2V

5.2V

5.2V

6V

CC

14V

Simplified
Internal
Power
Supply

Output
Stage
with OVP
and
Current
Limiting

2

Sense
Ground

1

Power
Ground

8

I

L

7

Out

21V

X

V

CC

2.0

φ

2.0

φ

Figure 4. MCCF3334 Ignition Circuit Bump Side View

+

+

++

++++

S2

5

V

CC

6

Out

7

I

L

8

(8) Bumps 7 ± 1 Mil Dia.
raised minimum 0.5 Mils
above passivated chip surface

Sense

Ground

Power

Ground

20 Mils 20 Mils 20 Mils

50

Mils

66

±

2

Mils

76

±

2 Mils

1234

5.5

±

1

6

+1

S1

C

MC3334 MCC3334 MCCF3334

5

MOTOROLA ANALOG IC DEVICE DATA

P SUFFIX

PLASTIC PACKAGE

CASE 626–05

ISSUE K

D SUFFIX

PLASTIC PACKAGE

CASE 751–05

(SO–8)

ISSUE N

OUTLINE DIMENSIONS

14

58

F

NOTE 2

–A–

–B–

–T–

SEATING
PLANE

H

J

G

D

K

N

C

L

M

M

A

M

0.13 (0.005) B

M

T

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020

F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050

J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135

L 7.62 BSC 0.300 BSC
M ––– 10 ––– 10
N 0.76 1.01 0.030 0.040

__

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

SEATING
PLANE

14

58

C

K

4X P

A0.25 (0.010)MTB

SS

0.25 (0.010)MB

M

8X D

R

M

J

X 45

_

_

F

–A–

–B–

–T–

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 4.80 5.00 0.189 0.196
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019

F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.18 0.25 0.007 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

____

G

MC3334 MCC3334 MCCF3334

6

MOTOROLA ANALOG IC DEVICE DATA

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
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MC3334/D

*MC3334/D*

◊