Datasheet MC33275DT-3.0, MC33275DT-3.0RK, MC33275DT-3.3, MC33275DT-3.3RK, MC33275D-3.3R2 Datasheet (MOTOROLA)
...
MC33275
Low Dropout 300 mA
V oltage Regulator
The MC33275 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, DPAK, SOT–223, and SOP–8 surface mount packages.
These devices feature a very low quiescent current and are capable of
supplying output currents up to 300 mA. Internal current and thermal
limiting protection are provided by the presence of a short circuit at the
output and an internal thermal shutdown circuit.
The MC33275 is available as a MC33375 which includes an On/Off
control.
Due to the low input–to–output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
Features:
• Low Quiescent Current (125
• Low Input–to–Output Voltage Differential of 25 mV at I
and 260 mV at IO = 300 mA
• Extremely Tight Line and Load Regulation
• Stable with Output Capacitance of only 0.33
Voltage
• Internal Current and Thermal Limiting
m
A)
= 10 mA,
O
m
F for 2.5 V Output
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LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
Gnd
4
4
1
3
PLASTIC
DT SUFFIX
CASE 369A
MC33275
123
Gnd
V
Gnd
V
in
4
out
Simplified Block Diagram
V
in
Thermal &
Anti–sat
Protection
Rint
1.23 V
V. Ref.
54 K
This device contains 41 active transistors
Gnd
V
out
1
8
1
3
4
PLASTIC
ST SUFFIX
CASE 318E
Input
Gnd
Gnd
Gnd
PLASTIC
D SUFFIX
CASE 751
MC33375
123
V
in
1
2
3
MC33375
4
Pins 4 and 5 Not Connected
Gnd
V
out
8
Output
7
Gnd
6
Gnd
5
N/C
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 9 of this data sheet.
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev . 4
1 Publication Order Number:
MC33275/D
MC33275
MAXIMUM RATINGS (T
= 25°C, for min/max values TJ = –40°C to +125°C)
A
Rating
Input Voltage V
Power Dissipation and Thermal Characteristics
T
= 25°C
A
Maximum Power Dissipation
Case 751 (SOP–8) D Suffix
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
Case 369A (DPAK) DT Suffix
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
Case 318E (SOT–223) ST Suffix
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
Output Current I
Maximum Junction Temperature T
Operating Junction Temperature Range T
Storage Temperature Range T
ELECTRICAL CHARACTERISTICS (C
= 1.0µF, TA = 25°C, for min/max values TJ = –40°C to +125°C, Note 1)
L
Characteristic Symbol Min Typ Max Unit
Output Voltage IO = 0 mA to 250 mA
2.5 V Suffix T
= 25°C, Vin = [VO + 1] V
A
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Symbol Value Unit
CC
P
D
R
θ
JA
R
θ
JC
R
θ
JA
R
θ
JC
R
θ
JA
R
θ
JC
O
J
J
stg
13 Vdc
Internally Limited
160
25
92
6.0
245
15
300 mA
150 °C
– 40 to +125 °C
– 65 to +150 °C
V
O
W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
2.475
2.970
3.267
4.950
2.50
3.00
3.30
5.00
2.525
Vdc
3.030
3.333
5.05
2.5 V Suffix V
3.0 V Suffix 2% Tolerance from T
3.3 V Suffix
5.0 V Suffix
Line Regulation Vin = [VO + 1] V to 12 V, IO = 250 mA,
Load Regulation Vin = [VO + 1] V, IO = 0 mA to 250 mA,
Dropout Voltage
I
= 10 mA TJ = –40°C to +125°C
O
= 100 mA
I
O
I
= 250 mA
O
= 300 mA
I
O
Ripple Rejection (120 Hz) V
Output Noise Voltage
C
= 1 mFI
L
= 200 mF
C
L
= [VO + 1] V, 0 < IO < 100 mA
in
All Suffixes T
All Suffixes T
in(peak–peak)
= 50 mA (10 Hz to 100 kHz)
O
A
A
= [VO + 1.5] V to [VO + 5.5] V — 65 75 — dB
J
= 25°C
= 25°C
= –40 to +125°C
Reg
Reg
load
Vin – V
V
n
line
2.450
2.940
3.234
4.900
—
—
—
—
2.550
3.060
3.366
5.100
– 2.0 10 mV
– 5.0 25 mV
O
—
—
—
—
—
—
25
115
220
260
160
46
100
200
400
500
—
—
CURRENT PARAMETERS
Characteristic Symbol Min Typ Max Unit
Quiescent Current
On Mode V
On Mode SAT V
= [VO + 1] V, IO = 0 mA
in
= [VO – 0.5] V, IO = 0 mA, Note 2
in
Current Limit Vin = [VO + 1], VO shorted I
I
Q
LIMIT
—
—
125
1100
200
1500
— 450 — mA
THERMAL SHUTDOWN
Characteristic Symbol Min Typ Max Unit
Thermal Shutdown — — 150 — °C
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. V
= [VO – 0.5] V guarantees this condition.
in
m
mV
Vrm
s
m
A
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MC33275
DEFINITIONS
Load Regulation – The change in output voltage for a
change in load current at constant chip temperature.
Dropout V oltage – The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage – The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation – The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current – Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation – The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation – The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
difference between the input power (V
output power (V
out
X I
) is increasing.
out
X ICC) and the
CC
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
TJ–T
Pd
+
A
R
q
JA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
P
I
out
+
D
VCC–V
out
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33275) and ambient
temperature.
TJ–T
R
+
q
JA
A
P
D
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MC33275
OUTPUT
VO
TAG
V
OUTPUT
VO
TAG
C
ANG
mV
V
INPUT
VO
TAG
V
Figure 1. Line Transient Response Figure 2. Line Transient Response
7
TA = 25° C
6
= 0.47 mF
C
)
E (
L
,
in
IL = 10 mA
V
5
4
3
2
L
= 3.3 V
out
V
in
V
out
1
0
0
20 40 60 80 100 120 140 160 180 200
TIME (mS)
Figure 3. Load Transient Response
300
–100
–200
–300
–400
LOAD CURRENT (mA)
–500
–600
–700
200
100
0
CL = 1.0 mF
V
= 3.3 V
out
TA = 25° C
Vin = 4.3 V
0
50 100 150 200 250 400
LOAD CURRENT
V
CHANGE
out
TIME (mS)
300 350
200
OUTPUT VOLTAGE CHANGE (mV)
150
100
50
0
–50
–100
1.0
0.8
OUTPUT VOLTAGE CHANGE (V)
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
7
TA = 25° C
6
C
= 33 mF
5
L
IL = 10 mA
V
= 3.3 V
out
V
in
4
3
, INPUT VOLTAGE (V)
2
in
V
1
V
out
0
0
50 100 150 200
TIME (mS)
Figure 4. Load Transient Response
350
250
150
50
–50
–150
–250
–350
–450
LOAD CURRENT (mA)
–550
–650
–750
0 250 300
LOAD CURRENT
V
CHANGE
out
50 100 150
TIME (mS)
200
CL = 33.0mF
V
out
T
= 25° C
A
Vin = 4.3 V
= 3.3 V
70
60
50
40
L
30
E
H
20
10
E (
0
)
–10
–20
0.14
OUTPUT VOLTAGE CHANGE (V)
0.09
0.04
–0.01
–0.06
–0.11
–0.16
Figure 5. Output Voltage versus Input Voltage
3.5
)
E (
L
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5
0
1.0
IL = 1 mA
1.5 2.0
2.5
INPUT VOLTAGE (V)
IL = 250 mA
3.0 3.5 4.0
Figure 6. Dropout Voltage versus Output Current
300
250
200
150
100
DROPOUT VOLTAGE (mV)
50
0
5.0
4.5
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4
1
10 100 1000
IO, OUTPUT CURRENT (mA)
MC33275
Figure 7. Dropout V oltage versus Temperature
300
DROPOUT VOLTAGE (mV)
250
200
150
100
50
0
–40
IL = 300 mA
IL = 250 mA
IL = 100 mA
IL = 10 mA
02585
TEMPERATURE (°C)
Figure 9. Ground Pin Current versus
Ambient Temperature
8
7
6
5
(mA)
4
gnd
I
3
2
1
0
–40
–20
20
0
60 80 100
40
TA (°C)
IL = 250 mA
IL = 100 mA
IL = 50 mA
120
140
gnd
I (mA)
(VOLTS)
out
V
12
10
2.5
2.495
2.49
2.485
2.48
2.475
2.47
Figure 8. Ground Pin Current versus
Input Voltage
8
6
4
2
0
0
1
IL = 300 mA
IL = 100 mA
= 50 mA
I
L
23 8
4567
(VOLTS)
V
in
Figure 10. Output V oltage versus Ambient
–40
T emperature (V
02585
TEMPERATURE (°C)
= V
in
IO = 0
IO = 250 mA
out1
+1V)
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5
MC33275
Figure 11. Output Voltage versus Ambient
2.5
2.495
2.49
T emperature (V
IO = 0
= 12 V)
in
dB
–40
IO = 250 mA
02585
TEMPERATURE (°C)
(VOLTS)
out
V
2.485
2.48
2.475
2.47
2.465
Figure 12. Ripple Rejection Figure 13. Ripple Rejection
dB
70
60
50
40
30
20
10
0
0.1
IL = 250 mA
1 10 100
FREQUENCY (kHz)
IL = 100 mA
70
60
50
40
30
20
10
0
0.1
1 10 100
IL = 1 mA
FREQUENCY (kHz)
IL = 10 mA
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6
MC33275
APPLICATIONS INFORMATION
Figure 14. T ypical Application Circuit
V
V
in
MC33275–XX
out
C
in
The MC33275 regulators are designed with internal
current limiting and thermal shutdown making them
user–friendly . Figure 14 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
EXTERNAL CAPACITORS
These regulators require only a 0.33 mF (or greater)
capacitance between the output and ground for stability for
2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 mF for stability.
The output capacitor must be mounted as close as possible
to the MC33275. If the output capacitor must be mounted
further than two centimeters away from the MC33275, then
a larger value of output capacitor may be required for
stability . A value of 0.68 mF or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 15
shows the ESR that allows the LDO to remain stable for
various load currents.
LOADC
out
= 3.0V
V
C
C
GND
Figure 15. ESR for V
100
10
ESR (ohm)
1.0
0.1
0
Applications should be tested over all operating
conditions to insure stability .
THERMAL PROTECTION
50 150 250
out
Stable Region
100 200 300
LOAD CURRENT (mA)
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
Thermal limit is not a substitute for proper
heatsinking.
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33275.
= 3.0 V
out
= 1.0mF
out
= 1.0mF
in
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MC33275
Figure 16. SOT–223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
280
240
200
160
Free Air
Mounted
Vertically
Minimum
Size Pad
P
D(max)
for TA = 50°C
2.0 oz. Copper
L
L
2.50
1.25
0.83
0.63
JAθ
R , THERMAL RESISTANCE
120
JUNCTION-TO-AIR ( C/W)°
80
R
θ
JA
40
010203025155.0
L, LENGTH OF COPPER (mm)
Figure 17. DP AK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
90
80
JUNCTION-TO-AIR ( C/W)°
70
60
50
40
JAθ
R , THERMAL RESISTANCE,
Free Air
Mounted
Vertically
010203025155.0
Minimum
Size Pad
L, LENGTH OF COPPER (mm)
P
D(max)
R
θ
JA
for TA = 50°C
2.0 oz. Copper
L
0.50
0.42
, MAXIMUM POWER DISSIPATION (W)
D
P
0.35
2.4
2.0
L
1.6
1.2
0.8
0.4
, MAXIMUM POWER DISSIPATION (W)
D
P
0
Figure 18. SOP–8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
170
150
P
D(max)
for TA = 50°C
130
JUNCTION-TO-AIR ( C/W)°
110
90
70
R
θ
Graph Represents Symmetrical Layout
2.0 oz.
L
Copper
JA
L
3.0 mm
50
30
02040503010
JAθ
R , THERMAL RESISTANCE,
L, LENGTH OF COPPER (mm)
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8
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
Device Type
(
)
(Fixed Voltage)
(
)
(Fixed Voltage)
at T
A
25 C
(
)
(Fixed Voltage)
T
J
from 40 to +125 C
5.0 V
(
)
(g)
MC33275DT–2.5RK
MC33275ST–2.5T3
MC33275D–2.5R2
MC33275DT–3.0RK
MC33275ST–3.0T3
MC33275D–3.0R2
MC33275DT–3.3RK
MC33275ST–3.3T3
MC33275D–3.3R2
MC33275DT–5.0RK
MC33275ST–5.0T3
MC33275D–5.0R2
DEVICE MARKING
Device Version Marking (1st line)
MC33275 2.5V 27525
MC33275 3.0V 27530
MC33275 3.3V 27533
MC33275 5.0V 27550
ORDERING INFORMATION
2.5 V
Fixed Voltage
3.0 V
Fixed Voltage
3.3 V
Fixed Voltage
Fixed Voltage
MC33275
Operating
Temperature Range,
Tolerance
1% Tolerance
= 25°C
at T
2% Tolerance at
from –40 to +125°C
T
Case Package
369A DPAK
318E SOT–223
751–5 SOP–8
369A DPAK
318E SOT–223
751–5 SOP–8
369A DPAK
318E SOT–223
751–5 SOP–8
369A DPAK
318E SOT–223
751–5 SOP–8
TAPE AND REEL SPECIFICATIONS
Device Reel Size Tape Width Quantity
MC33275DT 13” 16mm embossed tape 2500 units
MC33275D 13” 12mm embossed tape 2500 units
MC33275S 13” 8mm embossed tape 4000 units
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0.08 (0003)
S
L
H
A
F
4
123
G
MC33275
P ACKAGE DIMENSIONS
ST SUFFIX
PLASTIC PACKAGE
CASE 318E–04
(SOT–223)
ISSUE J
B
D
C
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIMAMIN MAX MIN MAX
0.249 0.263 6.30 6.70
B 0.130 0.145 3.30 3.70
C 0.060 0.068 1.50 1.75
D 0.024 0.035 0.60 0.89
F 0.115 0.126 2.90 3.20
G 0.087 0.094 2.20 2.40
H 0.0008 0.0040 0.020 0.100
J
J 0.009 0.014 0.24 0.35
K 0.060 0.078 1.50 2.00
L 0.033 0.041 0.85 1.05
M 0 10 0 10
____
S 0.264 0.287 6.70 7.30
MILLIMETERS
K
A
C
A1
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SOP–8)
ISSUE T
D
58
0.25MB
E
1
B
e
H
4
M
h
X 45
_
q
C
A
SEATING
PLANE
0.10
L
B
SS
A0.25MCB
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E
3.80 4.00
1.27 BSCe
H 5.80 6.20
h
0.25 0.50
L 0.40 1.25
0 7
q
__
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MC33275
P ACKAGE DIMENSIONS
DT SUFFIX
PLASTIC PACKAGE
CASE 369A–13
(DPAK)
ISSUE Z
NOTES:
SEATING
–T–
PLANE
B
V
S
R
4
A
123
K
F
L
D
2 PL
G
0.13 (0.005) T
C
E
Z
U
J
H
M
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
A 0.235 0.250 5.97 6.35
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.027 0.035 0.69 0.88
E 0.033 0.040 0.84 1.01
F 0.037 0.047 0.94 1.19
G 0.180 BSC 4.58 BSC
H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.090 BSC 2.29 BSC
R 0.175 0.215 4.45 5.46
S 0.020 0.050 0.51 1.27
U 0.020 ––– 0.51 –––
V 0.030 0.050 0.77 1.27
Z 0.138 ––– 3.51 –––
MILLIMETERSINCHES
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MC33275
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