Motorola MC10H116D, MC10H116FN, MC10H116L, MC10H116P Datasheet



SEMICONDUCTOR TECHNICAL DATA

  

The MC10H1 16 is a functional/pinout duplication of the MC101 16, with 100%

improvement in propagation delay and no increase in power– supply current.

• Propagation Delay, 1.0 ns Typical

• Power Dissipation 85 mW Typ/Pkg (same as MECL 10K)

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current — Continuous

— Surge
Operating T emperature Range T
Storage T emperature Range — Plastic

— Ceramic

EE

I

I

out

A

T

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (2)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High I
Input Leakage Current I
Reference Voltage V
High Output Voltage V
Low Output Voltage V
High Input Voltage (1) V
Low Input Voltage (1) V
Common Mode

Range (3)

Input Sensitivity (4) V

V

E

inH

CBO

BB
OH
OL

IH

CMR

PP

— 23 — 21 — 23 mA
— 150 — 95 — 95 µA

— 1.5 — 1.0 — 1.0 µA
–1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

— — –2.85 to –0.8 — — Vdc

— — 150 typ — — mV

AC PARAMETERS

Propagation Delay t
Rise Time t
Fall Time t

NOTES:

1. When VBB is used as the reference voltage.

2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.

3. Differential input not to exceed 1.0 Vdc.

4. 150 mV

9/96

differential input required to obtain full logic swing on output.

p–p

pd

 Motorola, Inc. 1996

0.4 1.3 0.4 1.3 0.45 1.45 ns

0.5 1.5 0.5 1.6 0.5 1.7 ns

r

0.5 1.5 0.5 1.6 0.5 1.7 ns

f

2–219

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

Vdc

mA

°C
°C

PP



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

D SUFFIX

PLASTIC SOIC
CASE 751B–05

FN SUFFIX

PLCC

CASE 775–02

LOGIC DIAGRAM

4
5

9

10
12

13

VBB*

V

= Pin 1

CC1

V

= Pin 16

CC2

VEE = Pin 8

*VBB to be used to supply bias to the MC10H116 only

and bypassed (when used) with 0.01 µF to 0.1 µF
capacitor to ground (0 V). VBB can source < 1.0 mA.

The MC10H116 is designed to be used in sensing
differential signals over long lines. The bias supply
(VBB) is made available to make the device useful as a
Schmitt trigger, or in other applications where a stable
reference voltage is necessary.

Active current sources provide these receivers with
excellent common–mode noise rejection. If any amplifi­er in a package is not used, one input of that amplifier
must be connected to VBB to prevent unbalancing the
current–source bias network.

The MC10H116 does not have internal–input pull­down resistors. This provides high impedance to the
amplifier input and facilitates differential connections.

Applications:

• Low Level Receiver • Voltage Level

• Schmitt Trigger Interface

When input pin with
bubble goes positive
it’s respective output
pin with bubble goes
positive.

DIP PIN ASSIGNMENT

A

IN

A

IN

EE

Book (DL122/D).

1
2
3
4
5
6
7
8

V

CC1

A

OUT

A

OUT

B

OUT

B

OUT

V

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

REV 6

16
15
14
13
12
11
10

2
3

6
7

14
15

11

V
C
C
C
C
V
B

9

B

CC2
OUT
OUT
IN
IN
BB
IN
IN

MC10H116

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

MOTOROLA MECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

2–220

MILLIMETERSINCHES

DL122 — Rev 6