Motorola MC10H107FN, MC10H107L, MC10H107P Datasheet


SEMICONDUCTOR TECHNICAL DATA
        
Propagation Delay, 1.0 ns Typical
Power Dissipation 35 mW/Gate Typical (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V Input Voltage (VCC = 0) V Output Current— Continuous
— Surge Operating Temperature Range T Storage Temperature Range— Plastic
— Ceramic
T
I
EE
I
out
A
stg
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I Input Current High I Input Current Low I High Output Voltage V Low Output Voltage V High Input Voltage V Low Input Voltage V
E
inH
inL
OH
OL
IH
31 28 31 mA — 425 265 265 µA
0.5 0.5 0.3 µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
AC PARAMETERS
Propagation Delay t Rise Time t Fall Time t
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
pd
0.4 1.5 0.4 1.6 0.4 1.7 ns
0.5 1.5 0.5 1.6 0.5 1.7 ns
r
0.5 1.5 0.5 1.6 0.5 1.7 ns
f
–8.0 to 0 Vdc 0 to V
EE
50
100
0 to +75 °C
–55 to +150 –55 to +165
Vdc
mA
°C °C

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
LOGIC DIAGRAM
4 5
9 7
14 15
V
= PIN 1
CC1
V
= PIN 16
CC2
VEE = PIN 8
DIP
PIN ASSIGNMENT
V
A
OUT
A
OUT
CC1
A
IN
A
IN
*NC
B
IN
V
EE
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
2 3
11 10
12 13
V
CC2
C
IN
C
IN
C
OUT
C
OUT
B
OUT
B
OUT
B
IN
3/93
Motorola, Inc. 1996
2–207
*NC = No Connection
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
REV 5
MC10H107
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
MOTOROLA MECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
2–208
MILLIMETERSINCHES
DL122 — Rev 6
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