MOTOROLA MC10E107, MC100E107 Technical data

LOGIC DIAGRAM
D
3b
D
2a
D
2b
V
EE
D
1a
D
1b
D
0a
26
27
28
2
3
4
18
17
16
15
14
13
12
115 6 7 8 9 10
D3aD4bD4aNC V
CCO
F F
Q
4
Q
4
V
CC
Q
3
Q
3
Q
2
Q
2
D0bV
CCOQ0
Q
0
Q1Q1V
CCO
D
0a
D
0b
D
1a
D
1b
D
2a
D
2b
D
3a
D
3b
D
4a
D
4b
F F
Q
0
Q
0
Q
1
Q
1
Q
2
Q
2
Q
3
Q
3
Q
4
Q
4
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.

SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
   
The MC10E/100E107 is a quint 2-input XOR/XNOR gate. The function
output F is the OR of all five XOR outputs, while F
is the NOR. The Q
outputs need not be terminated if only the F outputs are to be used.
600ps Max. Propagation Delay
OR/NOR Function Outputs
Extended 100E V
EE
Range of – 4.2V to – 5.46V
75k Input Pulldown Resistors
PIN NAMES
Pin Function
D0a– D
4b
Data Inputs
Q0– Q
4
XOR Outputs
Q0– Q
4
XNOR Outputs F OR Output F NOR Output
FUNCTION OUTPUTS
F = (D0a D0b) + (D1a D1b) (D2a D2b) +
(D3a D3b) + (D4a D4b)


QUINT 2-INPUT
XOR/XNOR GATE
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
查询MC100E107供应商
MC10E107 MC100E107
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
I
IH
Input HIGH Current 200 200 200 µA
I
EE
Power Supply Current mA
10E 42 50 42 50 42 50 100E 42 50 42 50 48 58
AC CHARACTERISTICS (VEE =VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
D to Q 250 410 600 250 410 600 250 410 600 D to F 500 725 1000 500 725 100 500 725 1000
t
SKEW
Within-Device Skew ps
D to Q 75 75 75 1
t
r
Rise/Fall Times ps
t
f
20 - 80% Q 275 450 700 275 450 700 275 450 700
F 300 475 700 300 475 700 300 475 700
1. Within-device skew is defined as identical transitions on similar paths through a device.
MC10E107 MC100E107
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07 — 2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81 — —
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92 —
1.27 BSC
A B C E F G H J K R U V W X Y
Z G1 K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042 — 2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032 — —
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430 —
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E107 MC100E107
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
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MC10E107/D
*MC10E107/D*
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