MOTOROLA MC10E416, MC100E416 Technical data

LOGIC DIAGRAM
D
3
D
2
D
2
V
EE
V
BB D
0
D
0
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
D3D
4
D4V
CCO
Q4Q4V
CCO
Q
3
Q
3
V
CC
Q
2
Q
2
V
CCO
Q
1
D1D1V
CCOQ0
Q0V
CCOQ1
D
0
D
0
D
1
D
1
D
2
D
2
D
3
D
3
D
4
D
4
Q
0
Q
0
Q
1
Q
1
Q
2
Q
2
Q
3
Q
3
Q
4
Q
4
V
BB
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.

SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
   
The MC10E416/100E416 is a 5-bit differential line receiving device. The 2.0GHz of bandwidth provided by the high frequency outputs makes the device ideal for buffering of very high speed oscillators.
A VBB pin is available to AC couple an input signal to the device. More information on AC coupling can be found in the design handbook section of this data book.
The design incorporates two stages of gain, internal to the device, making it an excellent choice for use in high bandwidth amplifier applications.
The differential inputs have internal clamp structures which will force the Q output of a gate in an open input condition to go to a LOW state. Thus, inputs of unused gates can be left open and will not affect the operation of the rest of the device. Note that the input clamp will take affect only if both inputs fall 2.5V below VCC.
Differential D and Q; V
BB
available
600ps Max. Propagation Delay
High Frequency Outputs
2 Stages of Gain
Extended 100E V
EE
Range of – 4.2V to – 5.46V
Internal 75k Input Pulldown Resistors
PIN NAMES
Pin Function
D[0:4], D[0:4] Differential Data Inputs Q[0:4], Q[0:4] Differential Data Outputs


QUINT DIFFERENTIAL
LINE RECEIVER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
MC10E416 MC100E416
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
V
BB
Output Reference Voltage V
10E –1.38 –1.27 –1.35 –1.25 –1.31 –1.19 100E –1.38 –1.26 –1.38 –1.26 –1.38 –1.26
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current mA
10E 135 162 135 162 135 162
100E 135 162 135 162 155 186 VPP(DC) Input Sensitivity 50 50 50 mV 1 V
CMR
Common Mode Range –1.5 0 –1.5 0 –1.5 0 V 2
1. Differential input voltage required to obtain a full ECL swing on the outputs.
2. V
CMR
is referenced to the most positive side of the differential input signal. Normal operation is obtained when the input signal are within the
V
CMR
range and the input swing is greater than VPP
MIN
and < 1.0V
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
d(Diff) 250 350 500 250 350 500 250 350 500
D(SE) 200 350 550 200 350 550 200 350 550 t
SKEW
Within-Device Skew 50 50 50 ps 1
t
SKEW
Duty Cycle Skew
t
PLH-tPHL
±10 ±10 ±10 ps 2 VPP(AC) Minimum Input Swing 150 150 150 mV 3 t
r
Rise/Fall Time
t
f
20 - 80% 100 200 350 100 200 350 100 200 350 ps
1. Within-device skew is defined as identical transitions on similar paths through a device.
2. Duty cycle skew defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs.
3. Minimum input swing for which AC parameters are guaranteed.
MC10E416 MC100E416
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07 — 2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81 — —
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92 —
1.27 BSC
A B C E F G H J K R U V W X Y
Z G1 K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042 — 2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032 — —
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430 —
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E416 MC100E416
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
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MC10E416/D
*MC10E416/D*
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