Motorola MC10E164FNR2, MC100E164FN, MC100E164FNR2, MC10E164FN Datasheet


SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
 
Special attention to the design layout results in a typical skew between the 16 inputs of only 50ps.
850ps Data Input to Output
Differential Output
Extended 100E V
EE
Range of – 4.2V to – 5.46V
Internal 75k Input Pulldown Resistors
PIN NAMES
Pin Function
A0– A
15
Data Inputs SEL[0:3] Select Inputs Q, Q Output


16:1 MULTIPLEXER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
LOGIC DIAGRAM
A
9
A
8
SEL3
V
EE
SEL2
SEL0
SEL1
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
115 6 7 8 9 10
A10A11A12A13A14A15V
CCO
NC
NC
V
CC
Q
Q
V
CCO
A
0
A7A6A5A4A3A2A
1
A
0
A
1
A
14
A
15
SEL0 SEL1 SEL2 SEL3
Q
Q
16:1
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.
MC10E164 MC100E164
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current mA
10E 59 71 59 71 59 71 100E 59 71 59 71 68 81
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
A Input 350 600 850 350 600 850 350 600 850 SEL0 500 700 900 500 700 900 500 700 900 SEL1 400 675 900 400 675 900 400 675 900 SEL2 400 675 900 400 675 900 400 675 900
SEL3 400 550 700 400 550 700 400 550 700
t
SKEW
Within Device Skew 50 50 50 ps 1
t
r
Rise/Fall Times ps
t
f
20 - 80% 275 400 550 275 400 550 275 400 550
1. Within Device skew is defined as the difference in the A to Q delay between the 16 different A inputs.
FUNCTION TABLE
SEL3 SEL2 SEL1 SEL0 Data
L L L L A0 L L L H A1 L L H L A2 L L H H A3 L H L L A4 L H L H A5 L H H L A6
L H H H A7 H L L L A8 H L L H A9 H L H L A10 H L H H A11 H H L L A12 H H L H A13 H H H L A14 H H H H A15
MC10E164 MC100E164
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07 — 2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81 — —
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92 —
1.27 BSC
A B C E F G H J K R U V W X Y
Z G1 K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042 — 2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032 — —
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430 —
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E164 MC100E164
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
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MC10E164/D
*MC10E164/D*
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