
SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
The MC10E/100E164 is a 16:1 multiplexer with a differential output.
The select inputs (SEL0, 1, 2, 3 ) control which one of the sixteen data
inputs (A0 – A15) is propagated to the output.
Special attention to the design layout results in a typical skew between
the 16 inputs of only 50ps.
• 850ps Data Input to Output
• Differential Output
• Extended 100E V
EE
Range of – 4.2V to – 5.46V
• Internal 75kΩ Input Pulldown Resistors
PIN NAMES
Pin Function
A0– A
15
Data Inputs
SEL[0:3] Select Inputs
Q, Q Output
16:1 MULTIPLEXER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
LOGIC DIAGRAM
A
9
A
8
SEL3
V
EE
SEL2
SEL0
SEL1
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
115 6 7 8 9 10
A10A11A12A13A14A15V
CCO
NC
NC
V
CC
Q
Q
V
CCO
A
0
A7A6A5A4A3A2A
1
A
0
A
1
A
14
A
15
SEL0
SEL1
SEL2
SEL3
Q
Q
16:1
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.

MC10E164 MC100E164
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current mA
10E 59 71 59 71 59 71
100E 59 71 59 71 68 81
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
A Input 350 600 850 350 600 850 350 600 850
SEL0 500 700 900 500 700 900 500 700 900
SEL1 400 675 900 400 675 900 400 675 900
SEL2 400 675 900 400 675 900 400 675 900
SEL3 400 550 700 400 550 700 400 550 700
t
SKEW
Within Device Skew 50 50 50 ps 1
t
r
Rise/Fall Times ps
t
f
20 - 80% 275 400 550 275 400 550 275 400 550
1. Within Device skew is defined as the difference in the A to Q delay between the 16 different A inputs.
FUNCTION TABLE
SEL3 SEL2 SEL1 SEL0 Data
L L L L A0
L L L H A1
L L H L A2
L L H H A3
L H L L A4
L H L H A5
L H H L A6
L H H H A7
H L L L A8
H L L H A9
H L H L A10
H L H H A11
H H L L A12
H H L H A13
H H H L A14
H H H H A15

MC10E164 MC100E164
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
—
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
—
—
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
—
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
—
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
—
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1

MC10E164 MC100E164
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
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MC10E164/D
*MC10E164/D*
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