MOTOROLA MC10E157, MC100E157 Technical data

NC V
CCO
Q
3
V
CCO
D3bD3aNCSEL3
LOGIC DIAGRAM
D2b
D2a
SEL2
V
EE
SEL1
D1a
D1b
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
115 6 7 8 9 10
Q
3
Q
2
Q
2
V
CC
Q
1
Q
1
Q
0
Q
0
SEL0 D0a D0b NC NC
D0a
D0b
SEL0 D1a
D1b
SEL1
D2a
D2b
SEL2 D3a
D3b
SEL3
Q
0
Q
0
Q
1
Q
1
Q
2
Q
2
Q
3
Q
3
MUX
MUX
MUX
MUX
1
0
1
0
1
0
1
0
1
Pinout: 28-Lead PLCC (Top View)
* All VCC and V
CCO
pins are tied together on the die.

SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
  
The MC10E/100E157 contains four 2:1 multiplexers with differential outputs. The output data are controlled by the individual Select (SEL) inputs. The individual select control makes the devices well suited for random logic designs.
Individual Select Controls
550ps Max. D to Output
800ps Max. SEL to Output
Extended 100E V
EE
Range of – 4.2V to – 5.46V
Internal 75k Input Pulldown Resistors
PIN NAMES
Pin Function
D0a – D3a Input Data a D0b – D3b Input Data b SEL0 – SEL3 Select Inputs Q0– Q
3
True Outputs
Q0– Q
3
Inverted Outputs
TRUTH TABLE
SEL Data
H
L
a b


QUAD 2:1
MULTIPLEXER
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
查询MC100E157FNR2供应商
MC10E157 MC100E157
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
I
IH
Input HIGH Current µA
D 200 200 200 SEL 150 150 150
I
EE
Power Supply Current mA
10E 32 38 32 38 32 38 100E 32 38 32 38 37 44
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
D 220 380 550 220 380 550 220 380 550 SEL 425 600 800 425 600 800 425 600 800
t
SKEW
Within-Device Skew 70 70 70 ps 1
t
r
Rise/Fall Times ps
t
f
20 - 80% 275 400 650 275 400 650 275 400 650
1. Within-device skew is defined as identical transitions on similar paths through a device.
MC10E157 MC100E157
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07 —
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81 — —
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92 —
1.27 BSC
A B C E F G H J K R U V W X Y
Z G1 K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042 — 2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032 — —
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430 —
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E157 MC100E157
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
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MC10E157/D
*MC10E157/D*
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