Mosel Vitelic V62C2162048LL-45B, V62C2162048LL-35T, V62C2162048LL-35B, V62C2162048LL-100B, V62C2162048LL-100T Datasheet
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V62C2162048L(L)
Ultra Low Power
128K x 16 CMOS SRAM
Features
•Low-power consumption
- Active: 65mA I
CC
at 35ns
- Stand-by: 10 µA (CMOS input/output)
2 µA (CMOS input/output, L version)
•35/45/55/70/85/100 ns access time
•Equal access and cycle time
• Single +2.2V to 2.7V Power Supply
•Tri-state output
•Automatic power-down when deselected
•Multiple center power and ground pins for
improved noise immunity
•Individual byte controls for both Read and
Write cycles
•Available in 44 pin TSOP II / 48-fpBGA
Logic Block Diagram
Functional Description
The V62C2162048L is a Low Power CMOS Static
RAM organized as 131,072 words by 16 bits. Easy
memory expansion is provided by an active LOW (CE
and (OE) pin.
This device has an automatic power-down mode feature
when deselected. Separate Byte Enable controls (BLE
and BHE) allow individual bytes to be accessed. BLE
controls the lower bits I/O1 - I/O8. BHE controls the
upper bits I/O9 - I/O16.
Writing to these devices is performed by taking Chip
Enable (CE
(BLE
) with Write Enable (WE) and Byte Enable
/BHE) LOW.
Reading from the device is performed by taking Chip
Enable (CE
(BLE
) with Output Enable (OE) and Byte Enable
/BHE) LOW while Write Enable (WE) is held
HIGH.
TSOPII / 48-fpBGA
)
BHE
BLE
WE
OE
CE
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
I/O1 - I/O8
I/O9 - I/O16
Row Select
Data
Cont
Data
Cont
Pre-Charge Circuit
Memory Array
1024 X 2048
I/O Circuit
Column Select
A10A11A12A13A14
A15 A16
1
Vcc
Vss
A3
A2
A1
A0
CE
I/O1
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A16
A15
A14
A13 A11
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
A12
44
A5A4
43
A6
42
A7
OE
41
BHE
40
BLE
39
I/O16
38
I/O15
37
I/O14
36
I/O13
35
Vss
34
Vcc
33
I/O12
32
I/O11
31
I/O10
30
I/O9
29
NC
28
27A9A8
26
A10
25
24
NC
2322
1
REV. 1.3 OCT 2001 V62C2162048L(L)
MOSEL VITELIC V62C2162048L(L)B
V62C2162048L(L)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
Top View
48 Ball - 9x12 fpBGA (Ultra Low Power)
1 2 3 4 5 6
BLE
I/O9
I/O10
VSS
VCC
I/O15
I/O16
NC
Note: NC means no Ball.
OE
BHE
I/O11
I/O12
I/O13
I/O14
NC
A8
A0
A3
A5
NC
NC
A14
A12
A9
A1
A4
A6
A7
A16
A15
A13
A10
A2
CE
I/O2
I/O4
I/O5
I/O6
WE
A11
Top View
PACKAGE OUTLINE DWG.
NC
I/O1
I/O3
VCC
VSS
I/O7
I/O8
NC
C
A1
A
6
e
5
4
3
2
1
A B C D E F G H
SIDE VIEW
D
D1
BOTTOM VIEW
aaa
b
SOLDER BALL
E
E1
SYMBOL UNIT:MM
A 1.05+0.15
A1 0.25+0.05
b
c
D
D1
E
E1
e
aaa
0.35+.05
0.30(TYP)
12.00+0.10
5.25
9.00+0.10
3.75
0.75TYP
0.10
REV. 1.3 OCT 2001 V62C2162048L(L)
2
V62C2162048L(L)
Absolute Maximum Ratings *
Parameter Symbol Minimum Maximum Unit
Voltage on Any Pin Relative to Gnd Vt -0.5 +4.6 V
Power Dissipation PT − 1.0 W
Storage Temperature (Plastic) Tstg -55 +150
Temperature Under Bias Tbias -40 +85
* Note: Stresses greater than those listed above Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and function operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
0
C
0
C
Truth Table
CE OE WE BLE BHE I/O1-I/O8I/O9-I/O16 Power Mode
H X X X X High-Z High-Z Standby Standby
L L H L H Data Out High-Z Active Low Byte Read
L L H H L High-Z Data Out Active High Byte Read
L L H L L Data Out Data Out Active Word Read
L X L L L Data In Data In Active Word Write
L X L L H Data In High-Z Active Low Byte Write
L X L H L High-Z Data In Active High Byte Write
L H H X X High-Z High-Z Active Output Disable
L X X H H High-Z High-Z Active Output Disable
* Key: X = Don’t Care, L = Low, H = High
Recommended Operating Conditions (T
Parameter Symbol Min Typ Max Unit
Supply Voltage
Input Voltage
* VIL min = -1.0V for pulse width less than tRC/2.
** For Industrial Temperature
REV. 1.3 OCT 2001 V62C2162048L(L)
= 00C to +700C / -400C to 850C**)
A
V
CC
2.2 2.5 2.7 V
Gnd 0.0 0.0 0.0 V
V
IH
V
IL
2.2 - VCC + 0.2 V
-0.5* - 0.8 V
3
DC Operating Characteristics (V
V62C2162048L(L)
= 2.2 to 2.7V, Gnd = 0V, TA = 00C to +700C / -400C to 850C)
cc
Parameter Sym Test Conditions
Input Leakage Current
Output Leakage
Current
Operating Power
Supply Current
Average Operating
Current
Standby Power Supply
Current (TTL Level)
Standby Power Supply
Current (CMOS
Level)
Vcc = Max,
IILII
V
= Gnd to V
in
CE = VIH or Vcc= Max,
IILOI
V
OUT
CE = VIL , VIN = V
I
CC
I
OUT
I
I
CC1
OUT
= 0mA,
= Gnd to V
= 0
cc
cc
or V
IH
,
IL
Min Cycle, 100% Duty
CE < 0.2V
I
CC2
I
= 0mA,
OUT
Cycle Time=1µs, Duty=100%
CE = VIH - 0.5 - 0.5 - 0.5 - 0.5 mA
I
SB
CE > Vcc - 0.2V
I
SB1
V
< 0.2V or
IN
> Vcc- 0.2V L
V
IN
-55 -85 -100
Min Max Min Max Min Max Min Max
-70
Unit
- 1 - 1 - 1 - 1 µA
- 1 - 1 - 1 - 1 µA
- 5 - 5 - 5 - 5 mA
- 50 - 45 - 40 - 40 mA
- 3 - 3 - 3 - 3 mA
-
10
-
10
-
2
-
-
10
2
-
-
102µA
2
-
µA
Output Low Voltage V
Output High Voltage V
Capacitance (f = 1MHz, T
IOL = 2 mA - 0.4 - 0.4 - 0.4 - 0.4 V
OL
IOH = -2 mA 2.4 - 2.4 - 2.4 - 2.4 - V
OH
= 25oC)
A
Parameter* Symbol Test Condition Max Unit
Input Capacitance
I/O Capacitance
* This parameter is guaranteed by device characterization and is not production tested.
AC Test Conditions
Input Pulse Level 0.6V to 2.2V
Input Rise and Fall Time5ns
Input and Output Timing
Reference Level 1.4V
Output Load Condition
55ns/70ns/85ns C
Load for 100ns C
= 30pf + 1TTL Load
L
L
= 100pf + 1TTL Load
C
in
C
I/O
V
Vin = 0V 7 pF
= V
in
= 0V 8 pF
out
C
*
L
Figure A. * Including Scope and Jig Capacitance
TTL
REV. 1.3 OCT 2001 V62C2162048L(L)
4
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