Mosel Vitelic V53C16258SHT35, V53C16258SHT30I, V53C16258SHT30, V53C16258SHT25I, V53C16258SHT50 Datasheet

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MOSEL VITELIC
1
V53C16258H HIGH PERFORMANCE 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH
PRELIMINARY
V53C16258H Rev. 3.8 November 1999
HIGH PERFORMANCE 25 30 35 40 45 50
Max. RAS
Access Time, (t
RAC
) 25 ns 30 ns 35 ns 40 ns 45 ns 50 ns
Max. Column Address Access Time, (t
CAA
) 13 ns 16 ns 18 ns 20 ns 22 ns 24 ns
Min. Extended Data Out Mode Cycle Time, (t
PC
) 10 ns 12 ns 14 ns 15 ns 17 ns 19 ns
Min. Read/Write Cycle Time, (t
RC
) 45 ns 60 ns 70 ns 75 ns 80 ns 90 ns
Features
256K x 16-bit organization
EDO Page Mode for a sustained data rate of 100 MHz
RAS
access time: 25, 30, 35, 40, 45, 50 ns
Dual CAS Inputs
Low power dissipation
Read-Modify-Write, RAS
-Only Refresh,
CAS-Before-RAS Refresh
Optional Self Refresh (V53C16258SH)
Refresh Interval: 512 cycles/8 ms
Available in 40-pin 400 mil SOJ and 40/44L-pin 400 mil TSOP-II packages
Single +5V ± 10% Power Supply
TTL Interface
Description
The V53C16258H is a high speed 262,144 x 16 bit high performance CMOS dynamic random access memory. The V53C16258H offers a combination of unique features including: EDO Page Mode operation for higher sustained bandwidth with Page Mode cycle times as short as 10ns. All inputs are TTL compatible. Input and output capicatance is significantly lowered to increase performance and minimize loading. These features make the V53C16258H ideally suited for a wide variety of high performance computer systems and peripheral applications.
Device Usage Chart
Operating
Temperature
Range
Package Outline Access Time (ns) Power
Temperature
Mark
K T 25 30 35 40 45 50 Std.
0 °
C to 70 ° C • • •••••• • Blank
–40 ° C to +85 ° C • • •••••• • I
2
V53C16258H Rev. 3.8 November 1999
MOSEL VITELIC
V53C16258H
FAMILY DEVICE PKG
(t
RAC
)
SPEED
PWR.
V 5 3 C 2 5 8
25 (25 ns) 30 (30 ns) 35 (35 ns) 40 (40 ns) 45 (45 ns) 50 (50 ns)
TEMP.
BLANK (0°C to 70°C) I (–40°C to +85°C)
BLANK (NORMAL)
K (SOJ)
H (5V)
T (TSOP-II)
H16
16258H-01
S (OPTIONAL STANDARD
SELF REFRESH)
S
Pin Names
A
0
–A
8
Address Inputs
RAS
Row Address Strobe
UCAS
Column Address Strobe/Upper Byte Control
LCAS
Column Address Strobe/Lower Byte Control
WE
Write Enable
OE
Output Enable
I/O
1
–I/O
16
Data Input, Output
V
CC
+5V Supply
V
SS
0V Supply
NC No Connect
40-Pin SOJ
PIN CONFIGURATION
Top View
5 6 7 8
9 10 11 12
Vcc I/O1 I/O2 I/O3 I/O4
Vcc I/O5 I/O6 I/O7 I/O8
NC NC
WE
RAS
NC
A0 A1 A2 A3
Vcc
1 2 3 4
16258H-02
39
40
38 37 36 35 34 33 32 31 30
29 13 14 15 16 17 18 19 20
28
27
26
25
24
23
22
21
Vss I/O16 I/O15 I/O14 I/O13 Vss I/O12 I/O11 I/O10 I/O9 NC LCAS UCAS OE A8 A7 A6 A5 A4 Vss
Part Name Self Refresh Supply Voltage Package Speed
V53C16258HKxx No Self Refresh 5V SOJ 25/30/35/40/45/50 V53C16258HTxx No Self Refresh 5V TSOP 25/30/35/40/45/50 V53C16258SHKxx Optional Standard Self Refresh (8ms) 5V SOJ 25/30/35/40/45/50 V53C16258SHTxx Optional Standard Self Refresh (8ms) 5V TSOP 25/30/35/40/45/50
40/44 Pin Plastic TSOP-II
PIN CONFIGURATION
Top View
5 6 7 8 9
10
Vcc I/O1 I/O2 I/O3 I/O4
Vcc I/O5 I/O6 I/O7 I/O8
NC NC
WE
RAS
NC
A0 A1 A2 A3
Vcc
1 2 3 4
16258H-03
43
44
42 41 40 39 38 37 36 35
13 14 15 16 17 18 19 20 21 22
32 31 30 29 28 27 26 25 24 23
Vss I/O16 I/O15 I/O14 I/O13 Vss I/O12 I/O11 I/O10 I/O9
NC LCAS UCAS OE A8 A7 A6 A5 A4 Vss
3
MOSEL VITELIC
V53C16258H
V53C16258H Rev. 3.8 November 1999
Absolute Maximum Ratings*
Ambient Temperature
Under Bias..................................... –10 ° C to +80 ° C
Storage Temperature (plastic)..... –55 ° C to +125 ° C
Voltage Relative to V
SS
.................–1.0 V to +7.0 V
Data Output Current .....................................50 mA
Power Dissipation..........................................1.0 W
*Note: Operation above Absolute Maximum Ratings can
adversely affect device reliability.
Capacitance*
T
A
= 25 ° C, V
CC
= 5 V ± 10%, V
SS
= 0 V
* Note: Capacitance is sampled and not 100% tested
Symbol Parameter Typ. Max. Unit
C
IN1
Address Input 3 4 pF
C
IN2
RAS
, CAS, WE, OE 4 5 pF
C
OUT
Data Input/Output 5 7 pF
Block Diagram
A
0
A
1
A
7
A
8
SENSE AMPLIFIERS
REFRESH
COUNTER
V
CC
V
SS
9
I/O
1
ADDRESS BUFFERS
AND PREDECODERS
X0-X
ROW
DECODERS
512
MEMORY
ARRAY
256K x 16
COLUMN DECODERS
DATA I/O BUS
Y
0
-Y
8
512 x 16
I/O
BUFFER
I/O
2
I/O
3
I/O
4
OE CLOCK
GENERATOR
WE CLOCK
GENERATOR
CAS CLOCK
GENERATOR
RAS CLOCK
GENERATOR
OE WE
LCAS
RAS
8
I/O
5
I/O
6
I/O
7
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
I/O
16
UCAS
256K x 16
16258H-04
4
V53C16258H Rev. 3.8 November 1999
MOSEL VITELIC
V53C16258H
DC and Operating Characteristics
(1-2)
T
A
= 0 ° C to 70 ° C, V
CC
= 5 V ± 10%, V
SS
= 0 V, unless otherwise specified.
Symbol Parameter
Access
Time
V53C16258H
Unit Test Conditions NotesMin. Typ. Max.
I
LI
Input Leakage Current (any input pin)
–10 10
µ
A V
SS
V
IN
V
CC
I
LO
Output Leakage Current (for High-Z State)
–10 10
µ
A V
SS
V
OUT
V
CC
RAS
, CAS at V
IH
I
CC1
V
CC
Supply Current,
Operating
25 260 mA t
RC
= t
RC
(min.) 1, 2 30 200 35 190 40 180 45 100 50 90
I
CC2
V
CC
Supply Current,
TTL Standby
2 mA RAS
, CAS at V
IH
other inputs V
SS
I
CC3
V
CC
Supply Current,
RAS
-Only Refresh
25 260 mA t
RC
= t
RC
(min.) 2 30 200 35 190 40 180 45 100 50 90
I
CC4
V
CC
Supply Current,
EDO Page Mode Operation
25 200 mA Minimum Cycle 1, 2 30 140 35 130 40 120 45 90 50 80
I
CC5
V
CC
Supply Current, Standby, Output Enabled other inputs V
SS
2 mA RAS
= V
IH
, CAS
= V
IL
1
I
CC6
V
CC
Supply Current, CMOS Standby
1 mA RAS V
CC
– 0.2 V,
CAS V
CC
– 0.2 V,
All other inputs V
SS
I
CC7
Self Refresh Current 400
µ
A CBR Cycle with t
RAS
t
RASS
(Min.) and CAS = V
IL
;
WE = V
CC
–0.2V; A
0
–A
8
and
D
IN
= V
CC
–0.2V
V
CC
Supply Voltage 4.5 5.0 5.5 V
V
IL
Input Low Voltage –1 0.8 V 3
V
IH
Input High Voltage 2.4 V
CC
+ 1 V 3
V
OL
Output Low Voltage 0.4 V I
OL
= 2 mA
V
OH
Output High Voltage 2.4 V I
OH
= –2 mA
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MOSEL VITELIC
V53C16258H
V53C16258H Rev. 3.8 November 1999
AC Characteristics
TA = 0°C to 70°C, VCC = 5 V ± 10%, VSS = 0V unless otherwise noted AC Test conditions, input pulse levels 0 to 3V
# Symbol Parameter
25
(100 MHz) 30 35 40 45 50
Unit NotesMin. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
1 t
RAS
RAS Pulse Width 25 75K 30 75K 35 75K 40 75K 45 75K 50 75K ns
2 t
RC
Read or Write Cycle Time 45 60 70 75 80 90 ns
3 t
RP
RAS Precharge Time 15
20
25 25 25 30 ns
4 t
CSH
CAS Hold Time 25 30 35 40 45 50 ns
5 t
CAS
CAS Pulse Width 4 5 6 7 8 9 ns
6 t
RCD
RAS to CAS Delay 10 17 12 20 13 24 15 28 18 32 19 36 ns 4
7 t
RCS
Read Command Setup Time 0 0 0 0 0 0 ns
8 t
ASR
Row Address Setup Time 0 0 0 0 0 0 ns
9 t
RAH
Row Address Hold Time 4 5 6 7 8 9 ns
10 t
ASC
Column Address Setup Time 0 0 0 0 0 0 ns
11 t
CAH
Column Address Hold Time 4 5 5 5 6 7 ns
12 t
RSH (R)
RAS Hold Time (Read Cycle) 7 9 10 10 10 10 ns
13 t
CRP
CAS to RAS Precharge Time 5 5 5 5 5 5 ns
14 t
RCH
Read Command Hold Time Referenced to CAS
0 0 0 0 0 0 ns 5
15 t
RRH
Read Command Hold Time Referenced to RAS
0 0 0 0 0 0 ns 5
16 t
ROH
RAS Hold Time Referenced to OE
4 6 7 8 9 10 ns
17 t
OAC
Access Time from OE 8 10 11 12 13 14 ns 12
18 t
CAC
Access Time from CAS 8 10 11 12 13 14 ns 6, 7, 14
19 t
RAC
Access Time from RAS 25 30 35 40 45 50 ns 6, 8, 9
20 t
CAA
Access Time from Column Address
13 16 18 20 22 24 ns 6, 7, 10
21 t
LZ
OE or CAS to Low-Z Output 0 0 0 0 0 0 ns 16
22 t
HZ
OE or CAS to High-Z Output 0 5 0 5 0 6 0 6 0 7 0 8 ns 16
23 t
AR
Column Address Hold Time from RAS
19 23 25 30 35 40 ns
24 t
RAD
RAS to Column Address Delay Time
8 13 9 14 10 17 12 20 13 23 14 26 ns 11
25 t
RSH (W)
RAS or CAS Hold Time in Write Cycle
7 9 10 10 10 10 ns
26 t
CWL
Write Command to CAS Lead Time
5 7 8 10 13 14 ns
27 t
WCS
Write Command Setup Time 0 0 0 0 0 0 ns 12, 13
28 t
WCH
Write Command Hold Time 4 5 5 5 6 7 ns
6
V53C16258H Rev. 3.8 November 1999
MOSEL VITELIC
V53C16258H
29 t
WP
Write Pulse Width 4 5 5 5 6 7 ns
30 t
WCR
Write Command Hold Time from RAS
19 23 25 30 35 40 ns
31 t
RWL
Write Command to RAS Lead Time
7 9 10 10 13 14 ns
32 t
DS
Data in Setup Time 0 0 0 0 0 0 ns 14
33 t
DH
Data in Hold Time 4 5 5 5 6 7 ns 14
34 t
WOH
Write to OE Hold Time 5 5 5 6 7 8 ns 14
35 t
OED
OE to Data Delay Time 5 5 5 6 7 8 ns 14
36 t
RWC
Read-Modify-Write Cycle Time 67 79 90 95 115 130 ns
37 t
RRW
Read-Modify-Write Cycle RAS Pulse Width
46 53 59 64 80 87 ns
38 t
CWD
CAS to WE Delay 19 21 23 25 32 34 ns 12
39 t
RWD
RAS to WE Delay in Read­Modify-Write Cycle
36 41 46 51 62 68 ns 12
40 t
CRW
CAS Pulse Width (RMW) 27 31 34 38 50 52 ns
41 t
AWD
Col. Address to WE Delay 24 27 29 31 41 42 ns 12
42 t
PC
EDO Fast Page Mode Read or Write Cycle Time
10 12 14 15 17 19 ns
43 t
CP
CAS Precharge Time 3 3 4 5 6 7 ns
44 t
CAR
Column Address to RAS Setup Time
13 16 18 20 22 24 ns
45 t
CAP
Access Time from Column Precharge
15 18 20 22 25 27 ns 7
46 t
DHR
Data in Hold Time Referenced to RAS
19 23 25 30 35 40 ns
47 t
CSR
CAS Setup Time CAS-before­RAS Refresh
5 7 8 10 10 10 ns
48 t
RPC
RAS to CAS Precharge Time 0 0 0 0 0 0 ns
49 t
CHR
CAS Hold Time CAS-before­RAS Refresh
6 7 8 8 10 10 ns
50 t
PCM
EDO Page Mode Read-Modify-Write Cycle Time
35 40 43 47 65 70 ns
51 t
COH
Output Hold After CAS Low 4 5 5 5 5 5 ns
52 t
OES
OE Low to CAS High Setup Time
3 3 3 3 5 5 ns
53 t
OEH
OE Hold Time from WE during Read-Modify Write Cycle
5 5 5 5 10 10 ns
# Symbol Parameter
25
(100 MHz) 30 35 40 45 50
Unit NotesMin. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
AC Characteristics
(Cont’d)
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