V29C51001T/V29C51001B
1 MEGABIT (131,072 x 8 BIT)
5 VOLT CMOS FLASH MEMORY
Features
128Kx8-bit Organization
Address Access Time: 45, 70, 90 ns
Single 5V ± 10% Power Supply
Sector Erase Mode Operation
8KB Boot Block (lockable)
512 bytes per Sector, 256 Sectors
– Sector-Erase Cycle Time: 10ms (Max)
– Byte-Program Cycle Time: 20 µ s (Max)
Minimum 10,000 Erase-Program Cycles
Low power dissipation
– Active Read Current: 20mA (Typ)
– Active Program Current: 30mA (Typ)
– Standby Current: 100 µ A (Max)
Hardware Data Protection
Low V
Self-timed program/erase operations with endof-cycle detection
– DATA Polling
– Toggle Bit
CMOS and TTL Interface
Available in two versions
– V29C51001T (Top Boot Block)
– V29C51001B (Bottom Boot Block)
Packages:
– 32-pin Plastic DIP
– 32-pin TSOP-I
– 32-pin PLCC
Program Inhibit Below 2.5V
CC
PRELIMINARY
Description
The V29C51001T/V29C51001B is a high speed
131,072 x 8 bit CMOS flash memory. Programming
or erasing the device is done with a single 5 Volt
power supply. The device has separate chip enable
CE, program enable WE, and output enable OE
controls to eliminate bus contention.
The V29C51001T/V29C51001B offers a combination of features: Boot Block with Sector Erase
Mode. The end of program/erase cycle is detected
by DATA
Polling of I/O
The V29C51001T/V29C51001B features a
sector erase operation which allows each sector to
be erased and reprogrammed without affecting
data stored in other sectors. The device also
supports full chip erase.
Boot block architecture enables the device to
boot from a protected sector loaded either at the
top (V29C51001T) or the bottom (V29C51001B)
sector. All inputs and outputs are CMOS and TTL
compatible.
The V29C51001T/V29C51001B is ideal for
applications that require updatable code and data
storage.
or by the Toggle Bit I/O
7
.
6
Device Usage Chart
Operating
Temperature
Range
C to 70 ° C•••••• •Blank
V29C51001T/V29C51001B Rev. 0.8 October 2000
Package OutlineAccess Time (ns)Power
Std.
1
Temperature
MarkP T J 457090
MOSEL VITELIC
V 29C00151
OPERATING VOLTAGE
Pin Configurations
N/C
1
A16
2
A15
3
A12
4
A7
5
A6
6
A5
7
A4
8
9
A3
10
A2
A1
11
12
A0
13
I/O0
14
I/O1
I/O2
15
16
GND
51: 5V
31: 3V
BOOT BLOCK LOCATION
32-Pin PDIP
Top View
B: BOTTOM
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
51001-02
T–
DEVICESPEED
45: 45ns
70: 70ns
T: TOP
V
CC
WE
NC
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
Input CapacitanceV
Output CapacitanceV
Control Pin CapacitanceV
= 5V ± 10%, f = 1 MHz.
CC
(1)
= 068pF
IN
= 0812pF
OUT
= 0810pF
IN
1,048,576 Bit
Memory Cell Array
Y-Decoder
I/O Buffer & Data Latches
–I/O
I/O
0
7
51001-05
Parameter Min.Max.Unit
Input Voltage with Respect to GND on A
Input Voltage with Respect to GND on I/O, address or control pins-1V
V
Current-100+100mA
CC
NOTE:
1.Includes all pins except V
. Test conditions: V
CC
, OE
9
= 5V, one pin at a time.
CC
-1+13V
+ 1V
CC
AC Test Load
+5.0 V
IN3064
Device Under
Test
CL = 100 pF
V29C51001T/V29C51001B Rev. 0.8 October 2000
or Equivalent
6.2 kΩ
3
2.7 kΩ
IN3064 or Equivalent
IN3064 or Equivalent
IN3064 or Equivalent
51001-06
°
°
± 1 µ
± 1 µ
MOSEL VITELIC
Absolute Maximum Ratings
(1)
V29C51001T/V29C51001B
SymbolParameterCommercialUnit
V
IN
V
IN
V
CC
T
STG
T
OPR
I
OUT
NOTE:
1.Stress greater than those listed unders “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2.No more than one output maybe shorted at a time and not exceeding one second long.
Input Voltage (input or I/O pins)-2 to +7V
Input Voltage (A
pin, OE
9
)-2 to +13V
Power Supply Voltage-0.5 to +5.5V
Storage Temperature (Plastic)-65 to +125
Operating Temperature0 to +70
Short Circuit Current
Input LOW VoltageV
Input HIGH VoltageV
Input Leakage CurrentV
Output Leakage CurrentV
Output LOW VoltageV
Output HIGH VoltageV
Read CurrentCE
Program CurrentCE
TTL Standby CurrentCE
= V
CC
CC
IN
OUT
CC
CC
Min.—0.8V
CC
= V
Max.2—V
CC
= GND to V
CC
= GND to V
= V
Min., I
CC
= V
Min, I
CC
= OE = V
IL
, WE
Address input = V
V
= V
CC
Max.
CC
= WE = VIL, OE = V
= OE = WE = V
, V
= V
CC
, V
CC
= 2.1mA—0.4V
OL
= -400 µ A2.4—V
OH
= V
/V
IL
IH
, V
IH
Max.—
CC
= V
CC
IH
, at f = 1/t
Max.—
CC
, all I/Os open,
Min.,
RC
, V
= V
IH
CC
CC
= V
Max.—50mA
CC
Max.—2mA
CC
—40mA
CMOS Standby CurrentCE = OE = WE = VCC – 0.3V, VCC = VCC Max.—150µA
Device ID Voltage for A
Device ID Current for A
CE = OE = VIL, WE = V
9
CE = OE = VIL, WE = VIH, A9 = VH Max.—50µA
9
IH
11.512.5V
A
A
V29C51001T/V29C51001B Rev. 0.8 October 2000
4
MOSEL VITELICV29C51001T/V29C51001B
AC Electrical Characteristics
(over all temperature ranges)
Read Cycle
Parameter
NameParameter
t
RC
t
AA
t
CE
t
OE
t
CLZ
t
OLZ
t
DF
t
OH
Read Cycle Time45—70—90—ns
Address Access Time—45—70—90ns
Chip Enable Access Time—45—70—90ns
Output Enable Access Time—25—35—45ns
CE Low to Output Active0—0—0—ns
OE Low to Output Active0—0—0—ns
Output Enable or Chip Disable to Output
in High Z
Output Hold from Address Change0—0—0—ns
Program (Erase/Program) Cycle
Parameter
NameParameter
t
WC
t
AS
t
AH
t
CS
t
CH
t
OES
t
OEH
t
WP
t
WPH
t
DS
t
DH
t
WHWH1
t
WHWH2
t
WHWH3
Program Cycle Time45——70——90——ns
Address Setup Time0—— 0—— 0——ns
Address Hold Time35——45——45——ns
CE Setup Time0—— 0—— 0——ns
CE Hold Time0—— 0—— 0——ns
OE Setup Time0—— 0—— 0——ns
OE High Hold Time0—— 0—— 0——ns
WE Pulse Width25——35——45——ns
WE Pulse Width High20——35——38——ns
Data Setup Time20——25——30——ns
Data Hold Time0—— 0—— 0——ns
Programming Cycle——20——20——20µs
Sector Erase Cycle——10——10——10ms
Chip Erase Cycle—2—— 2—— 2—sec
-45-70-90
UnitMin.Max.Min.Max.Min.Max.
015020030ns
-45-70-90
UnitMin. Typ. Max. Min. Typ. Max. Min. Typ. Max.
V29C51001T/V29C51001B Rev. 0.8 October 2000
5
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