MMB Research MMBPA10 Users Manual

RapidSE ZigBee Smart Energy Module

RSE.ESP.MMB-PA.1.0, RSE.DVC.MMB-PA.1.0

The RapidSE Module is a drop-in ZigBee Smart Energy solution. Preloaded with MMB Research’s RapidSE ZigBee Smart Energy application, it oﬀers hardware vendors an easy way to integrate a fully-implemented ZigBee Smart Energy platform into their existing devices.

MMB Research oﬀers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbresearch.com

Contents 1 | General Information 2

2 | Module Pinout 2

Rev 1.2

3 | Electrical Specications 3

3.1 | Absolute Maximum Ratings 3

3.2 | Recommended Operating Conditions 3

3.3 | DC Electrical Characteristics 3

4 | RF Specications 4

4.1 | Receive Speciﬁcations 4

4.2 | Transmit Speciﬁcations 5

4.3 | Synthesizer 5

5 | Functional Specications 6

5.1 | Serial Ports 6

5.2 | GPIO 7

5.3 | Analog to Digital Converter (ADC) 8

6 | Mechanical Specications 9

6.1 | Physical Dimensions 9

6.2 | Recommended Land Pattern (Surface Mount) 10

6.3 | Connector Speciﬁcations 11

6.4 | Labelling 11

7 | Regulatory Approvals 11

7.1 | FCC 11

1 | General Information

Note that some of the speciﬁcations refer to either EM250 or Module. Please note speciﬁcations cited as EM250 are taken from the EM250 datasheet (this should also be noted where referred to). Module means measurements taken with our production module.

2 | Module Pinout

Numbers in parentheses are the EM250 pin number.

Module Pad Function EM250 GPIO

1 GND 2 GPIO10 (33) 3 GPIO9 (32) 4 GPIO6 (29) 5 GPIO7 (30) 6 GPIO5 (27) 7 GPIO4 (26) 8 GPIO12 (20) 9 GPIO11 (19) 10 VCC 11 GND 12 GPIO3 (25) 13 GPIO8 (31) 14 GPIO2 (24) 15 GPIO0 (21) 16 GPIO1 (22) 17 nReset (13) 18 VCC 19 GND 20 n.c. 21 n.c. 22 GND 23 nReset (13) 24 SIF CLK (34) 25 SIF MISO (35) 26 SIF MOSI (36) 27 nSIF LOAD (37) 28 GPIO16 (40) 29 GPIO15 (41) 30 GPIO14 (42) 31 GPIO13 (43) 32 GND

3 | Electrical Specications

3.1 | Absolute Maximum Ratings

Parameter Minimum Maximum Units

Supply Voltage (VCC) -0.3 3.6 V Voltage on any GPIO[0:16], SIF CLK, SIF MISO, SIF MOSI, nSIE LOAD, nReset -0.3 VCC +0.3 V Ambient Operating Temperature -40 +75 °C Storage Temperature -40 +125 °C

3.2 | Recommended Operating Conditions

Parameter Minimum Typical Maximum Units

Supply Voltage (VCC) 2.7 3.3 3.6 V Temperature Range -40 +75 °C

3.3 | DC Electrical Characteristics

Parameter Test Condition Minimum Typical Maximum Units

Operating current (VCC = 3.3v)

Deep sleep current At 25 °C, VCC = 3.3v,

Idle current At 25 °C, VCC = 3.3v, sleep

RX current At 25 °C, VCC = 3.3v 36 mA TX current At 25 °C, VCC = 3.3v, high

Average usage with radio in TX mode 27% of the time and RX mode 73% of the time

shutdown mode

mode

power mode

61.4 mA

10.5 µA

7.8 mA

130 mA

4 | RF Specications

4.1 | Receive Speciﬁcations

Table 4.1 | Module Receive Characteristics

Parameter Test Condition Min Typical Max Units

Receive sensitivity Max gain -97.56 dBm Receive sensitivity (Boost) Max gain -99.53 dBm Input 1dB Compression CW +26 dBm Input IP3 Two -7 dBm CW tones spaced 1 MHz apart +36 dBm

Table 4.2 | Receive Strength Signal Indicator (RSSI) Accuracy

Channel Actual Level Measured RSSI

18 -40 -40.0 18 -50 -50.0 18 -60 -60.0 18 -70 -70.0 18 -80 -79.0 18 -90 -89.2

Table 4.3 | EM250 Receive Characteristics

Table 4.3 lists the key parameters of the integrated IEEE 802.15.4 receiver on the EM250. This information is taken from the Ember EM250 Datasheet. Link to this document can be found in the References section.

Note: Receive Measurements were collected with Ember’s EM250 Lattice Balun Reference Design (Version B1) at 2440MHz and using the EmberZNet software stack Version 3.0.1. The Typical number indicates one standard deviation above the mean, measured at room temperature (25C). The Min and Max numbers were measured over process corners at room temperature.

Parameter Test Condition Minimum Typical Maximum Units

Frequency range 2400 2500 MHz Sensitivity (Boost mode) 1% PER, 20 byte packet

-100 -95 dBm

deﬁned by IEEE 802.15.4

Sensitivity 1% PER, 20 byte packet

-99 -94 dBm

deﬁned by IEEE 802.15.4 High-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 35 dB Low-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 35 dB 2nd high-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 43 dB 2nd low-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 43 dB Channel rejection for all other channels IEEE 802.15.4 signal at -82dBm 40 dB

802.11g rejection centered at +12MHz or

IEEE 802.15.4 signal at -82dBm 35 dB

-13MHz Maximum input signal level for correct

0 dBm

operation (low gain) Image suppression 30 dB Co-channel rejection IEEE 802.15.4 signal at -82dBm -6 dBc

Table 4.3 | Continued

Parameter Test Condition Minimum Typical Maximum Units

Relative frequency error (2x40 ppm required by IEEE 802.15.4)

Relative timing error (2x40 ppm required by IEEE 802.15.4)

Linear RSSI range 40 dB RSSI Range -90 -30 dB

-120 +120 ppm

4.2 | Transmit Speciﬁcations

Table 4.4 | Module Transmitter Parameters

Parameter Test Condition Min Typical Max Units

Maximum output power (Boost mode)

Output power (low power PA mode)

Carrier frequency error -40 -10 +40 ppm PSD mask relative 3.5 MHz away -20 dB PSD mask absolute 3.5 MHz away -30 dBm

At highest power setting 20.45 dBm

At lower power PA setting ???

4.3 | Synthesizer

Table 4.5 | EM250 Synthesizer Parameters

Table 4.5 lists the key parameters of the integrated synthesizer on the EM250. Taken from the EM250 datasheet.

Parameter Test Condition Min Typical Max Units

Frequency range 2400 2500 MHz Frequency resolution 11.7 kHz Lock time From oﬀ, with correct VCO DAC setting 100 us Relock time Channel change or Rx/Tx turnaround (IEEE

802.15.4 deﬁnes 192μs turnaround time) Phase noise at 100kHz -71 dBc/Hz Phase noise at 1MHz -91 dBc/Hz Phase noise at 4MHz -103 dBc/Hz Phase noise at 10MHz -111 dBc/Hz

100 us

5 | Functional Specications

5.1 | Serial Ports

Refer to the EM250 data sheet for functionality and associated GPIO pin outs.

Note: The module pin out table in section 2 of this document provides a cross reference between the MMB PA module pins and the EM250 GPIO.

5.1.1 | SC1 (UART, SPI, I2C)

The SC1 module provides asynchronous (UART) or synchronous (SPI or I2C) serial communications.

The UART mode contains the following features:

• Baud rate (300bps up to 921kbps)

• Data bits (7 or 8)

• Parity bits (none, odd, or even)

• Stop bits (1 or 2)

• GPIO signals: ʳ TXD ʳ RXD ʳ nRTS (optional) ʳ nCTS (optional)

The SPI mode has the following features:

• Full duplex operation

• Programmable clock frequency (12MHz max.)

• Programmable clock polarity and clock phase

• Selectable data shift direction (either LSB or MSB ﬁrst)

• Master mode only

• Fixed 8 bit word length

• The following signals can be made available on the GPIO pins: ʳ MO (master out) ʳ MI (master in) ʳ MCLK (serial clock)

The SC1 I2C mode has the following features:

• Programmable clock frequency (400kHz max.)

• Supports both 7-bit and 10-bit addressing

• The SC1 I2C controller is only available in master mode.

• The I2C Master controller supports Standard (100kbps) and Fast (400kbps) I2C modes.

• Multiple master applications are not supported.

• The I2C signals are open-collector and external pull-up resistors are required.

• The following signals can be made available on the GPIO pins: ʳ MSDA (serial data) ʳ MSCL (serial clock)

5.1.2 | SC2 (SPI, I2C)

The SC2 module provides synchronous (SPI or I2C) serial communications.

The SC2 SPI mode has the following features:

• The SPI mode of the SC2 supports both master and slave modes.

• It has a ﬁxed word length of 8 bits.

• Master and slave modes

• Full duplex operation

• Programmable master mode clock frequency (12MHz max.)

• Slave mode up to 5MHz bit rate

• Programmable clock polarity and clock phase

• Selectable data shift direction (either LSB or MSB ﬁrst)

• Optional slave select input

• The following signals can be made available on the GPIO pins: ʳ MOSI (master out/slave in) ʳ MISO (master in/slave out) ʳ MSCLK (serial clock) ʳ nSSEL (slave select—only in slave mode)

The SC2 I2C mode has the following features:

• The SC2 I2C controller is only available in master mode.

• The I2C Master controller supports Standard (100kbps) and Fast (400kbps) I2C modes.

• Multiple master applications are not supported.

• The I2C signals are open-collector, and external pull-up resistors are required.

• Programmable clock frequency (400kHz max.)

• 7- and 10-bit addressing

• The following signals can be made available on the GPIO pins: ʳ SDA (serial data) ʳ SCL (serial clock)

5.2 | GPIO

The EM250 has 17 multi-purpose GPIO pins that can be conﬁgured in a variety of ways. All pins have the following programmable features:

• Selectable as input, output, or bi-directional.

• Output can be totem-pole, used as open drain or open source output for wired-OR applications.

• Can have internal pull-up or pull-down.

5.3 | Analog to Digital Converter (ADC)

The ADC is a ﬁrst-order sigma-delta converter sampling at 1MHz with programmable resolution and conversion rate. the ADC Module supports both single-ended and diﬀerential inputs.

Parameter Minimum Typical Maximum Units

Conversion time 32 4096 µ S VREF 1.19 1.2 1.21 V VREF output current 1 mA VREF load capacitance 10 nF Minimum input voltage 0 V Maximum input voltage VCC V Single-ended signal range 0 VREF V Diﬀerential signal range - VREF + VREF V Common mode range 0 VREF V Input referred ADC oﬀset -10 10 mV Input impedance When taking a sample 1 M Ohm When not taking a sample 10 M Ohm INL -0.5 0.5 LSB DNL -0.5 0.5 LSB

6 | Mechanical Specications

6.1 | Physical Dimensions

R1 R4

A N T E N N A

0.6 mm

0.8 mm

2.6 mm

32 22

1 11

Symbol Description Distance

L Length of the module 34.73 mm W Width of the module 28.43 mm H Height of the module TBD A1 Pitch 2 mm A2 Distance centre of pad to PCB edge 2.59 mm A3 Distance center of pad to PCB edge 5.22 mm A4 Distance pad edge to PCB edge 0.29 mm A5 Distance center of via to PCB edge 0.84 mm R1 Keep-out zone from corner of PCB TBD R2 Keep-out zone from corner of PCB TBD R3 Width of keep-out zone TBD R4 Length of keep-out zone TBD

6.2 | Recommended Land Pattern (Surface Mount)

32 22

1 11

module outline

F4 F3

0.854 mm

d = 0.8 mm

1.51 mm

Symbol Description Distance

F1 Distance pad edge to pad edge 21.9 mm F2 Distance pad edge to pad edge 1.523 mm F3 Distance pad center to pad center 1.3 mm F4 Pitch 2 mm

3.94 mm

Note: It is advised that for surface mount applications, through holes / vias should not be designed into the carrier board.

6.3 | Connector Speciﬁcations

6.3.1 | Edge Mount (USNAP) Connector

10 pin 2mm pitch right angle female header

6.3.2 | SIP Header / Socket

11 + 11 + 10 (if no USNAP populated) pin 2mm pitch 0.8mm diameter through hole footprint

6.4 | Labelling

0.75”

7 | Regulatory Approvals

7.1 | FCC

7.1.1 | FCC Notice

0.75”

This device (ZGB.MMB-PA.1.0/ZGB.MMB-PA-LNA.1.0) complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and

(2) This device must accept any interference received, including interference that may cause undesired operation.

To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or conﬁgured to operate with a separation distance of 20cm or more from all persons.

7.1.2 | Modular Approval

This device (ZGB.MMB-PA.1.0/ZGB.MMB-PA-LNA.1.0) meets the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407.

It should be noted that:

“While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).”

-- FCC Public Notice DA 00-1407

Caution: Changes or modiﬁcations not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

7.1.3 | Labeling Requirements

The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFFMMBPA10” and the FCC Notice above (section 7.1.1).

Devices intended for sale in the Canadian market should also include the Industry Canada (IC) ID “8365A-MMBPA10”

35 Prince Arthur Ave. Toronto, Ontario, Canada M5R1B2

416.636.3145 info@mmbresearch.com www.mmbresearch.com

Rev 1.0 | 22.12.08

MMB Research MMBPA10 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual