1
MLINK X2 BGA Repair
Workbench Introduction Manual
Catalogue
1.
Rework Station Installing
2.
Rework Station Safety Precautions
3.
Introduction of Structure and Specification
4.
Operating Steps
5.
Touch Screen
6.
Rework Station Handling Precautions
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1.
Rework Station Installing
a. Installation Location
In order to ensure the service life of rework station, the installation must meet the following
conditions:
1. Away from flammable, explosive materials
2. Don’t spilled by water and other liquid
3. Well-ventilated and Dry Place
4. Stable, Smooth, less vibrate place
5. Little dusty place
6. Don’t put anything on control box
7. Away from the place affected by the direct flow of air condition, heater and fan
8. For upper part easy move and turn, More than 30cm Match at the back of rework station
b. Power supply requirements: use small fluctuant voltage power supply.
Voltage: 220V±10 Frequency: 50Hz±3
2. Rework Station Safety Precautions
1. Don’t blow the rework station directly when it work, or will lead the negative differential of the
surface of the heating plate, burned the parts
2.
After starting up, high temperature heat area cannot contact anything directly, or may cause fire
or explosion, PCB board should be put on the PCB board support
3.
Don’t shake rework station, move lightly.
4.
After starting up, do not use flammable spray, liquid gas.
5.
Don’t try to redo the rework station, or will cause fire or electric shock.
6.
There are high-voltage parts in electric box, don’t take part or remove without permission
7.
If there is metallic object or liquid fall into rework station, shut off the power immediately,
unplug power line, completely remove the object and dirt after the station get cooling. If having
residue, will emit odor after rework.
8.
when rework station abnormal heating-up or smoke, shut off the power immediately, notify the
technician repair, partly shut off power when move electric box or machine, hold the plug when
unplug the wire, otherwise will cause poor contact, cannot work.
9.
Shut off the power when stop use.
11. Rework station do not press or run over line or communication cable of other equipments power
otherwise may cause equipment malfunction or cause fire or electric shock
12. Before operating the rework station, must read this introduction manual carefully.
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3. Main Specification:
Total Power: 4400W
Top heating: 800W
Bottom heating: 800W
Bottom infrared preheat: 2400w
Current: AC220V 50/60HZ
Outer Dimension: Ｌ600mmⅹW600mmⅹH610mm
Min PCB Dimension: 40mmⅹ40mm
MAX: PCB Dimension: 450mmⅹ500mm
Description:
1.
This product adopt 7” HD touch screen Human–Machine Interaction(HMI), PLC Control,
real-time display Five temperature curve, temperature precision be controlled in ± degree.
2.
6 section temperature controls, can further refine the temperature of each solder segment, to
better ensure the welding effect.
3.
Can save 0-49 group of temperature curve setting, analyze the curve and change the setting
on touch screen anytime.
4.
There are 3 THERMATICS to heating separately, can control multi-group, multi-section
temperature in the 3 THERMATICS at same time, ensure achieve the best welding effect in
different THERMATICS. Heating temperature, time, slope, cooling, vacuum, all can be set
on HMI
5.
Select high-precision K-Type thermocouple closed-loop control, detect temperature
precisely through the external temperature testing interface
6.
Have alarm function after finish unsolder, have over-temperature protection circuit around
the whole machine, stop heating and alarm when abnormal over-temperature
7.
Use High Cross-flow Fan cool PCB board promptly, incase the deformation of PCB board,
ensure the welding effect.
8.
Use V Shape groove address the PCB, Flexible removable have the function of protect PCB
9.
For large thermal capacity PCB and other high temperature requirements, Both lead-free
BGA/CSP and column BGA can deal with easily.
10.
Hot air nozzles can 360 degree rotation, easy to replace. With a variety size of hot air
nozzle, special requirements can be customized
5. Operate Steps
1. Pre-heating:
Pre-heat PCB and BGA before rework, in case of bursting while rework, temperature of constant
temperature oven is generally set at 80 ℃ -100 ℃, time often be 12-24hours.
2. Disassembly
Put PCB on the position support of rework station, select the appropriate hot air reflow nozzle, set
proper welding temperature curve, pull the start switch, when procedure run over, move the hot air
manually, use vacuum suction pen remove BGA.
3. Clean the welding
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Cleaning of PCB and BGA welding pad, one is use the suction tin line tow to same level, another is
use soldering iron drag smooth directly. It is best remove soldering tin in a short time after remove
BGA, while BGA not cooling totally, less damage of temperature difference to welding pad；Use
soldering flux in the process of removing solder, can improve the solder activity, conducive to the
removal of solder. Especially pay attention to do not damage the welding pad of PCB, for ensuring
reliability of BGA welding, try to use some strong volatile solvent, washer, industrial alcohol during
clean the remain solder paste on solder pad.
4. BGA REBALLING
Evenly coated solder paste on BGA pad with a brush, select the corresponding REBALLING steel
mesh, use REBALLING STATION plant BGA tin sweat on corresponding BGA pad.
5. BGA Tin Sweat Welding
Heating the bottom of Tin sweat station and rework station heating zone, solder the tin sweat on
BGA pad
6 Spread soldering flux
Spread a layer of solder flux on PCB pad with a brush, too much will cause soldering together, on
the other hand, too less will cause missing soldering, thus for clean the dirt on BGA tin sweat,
enhance soldering effect, solder paste must be spread appropriately,
7 Mount
Mount BGA on PCB, when counterpoint by hand, use silk screen print frame line helps
counterpoint, confirming whether mount BGA in counterpoint by hand touch feeling of surface of
Tim Sweat and soldering pad.
8 Welding
Put PCB on the position support of rework station, select the appropriate hot air reflow nozzle, set
proper welding temperature curve, start heating inching switch, run soldering procedure, stop
running, front BGA cooling fan start cool BGA, improve hot air point, make hot air nozzle above on
surface of BGA 8-10mm. and keep cooling 30-40 seconds, or after the start switch light power off,
move hot air head, and then take away the PCB board from bottom heating area position stably.
a.
Missing Solder; because of manually counterpoint will make deviation between chips and
solder pad, Tension of tin sweat surface will make a process of correct the place between
BGA chips and pad automatically. Because of uneven heating, leading the chip fall
unevenly, if stopping reflowing now, the chip will not fall normally, resulting in noncoplanarity phenomenon and then cause missing solder and cold solder, so need extend the
time of temperature of third and forth section THERMATICS, our enhance the pre-heating
temperature at bottom, melt tin sweat and fall evenly.
b. Short Circuit: The tin sweat is liquid when get melting point, the extension and support
function of tin sweat support will be damaged when suffer over-time, over heat temperature
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or over press, and then lead short circuit because of chip fall on the PCB pad completely
while reflowing, Hence, we need decrease temperature and time of the third and forth
heating section, or decrease the preheating temperature at bottom.
Note: Will appear small quantity ozone when reword station using, in order to ensure a
comfortable, healthy and safe operating environment, please keep good air circulation.
6. Touch Screen
Operation Introduction:
a. Open the control power supply, rework station be powered. Home page Chinese- English select
interface appears on the touch screen, select the language interface you want.
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b.If selecting ENGLISH, enter into the main work interface, following image will appear:
And then will appear top target temperature, top actual temperate, bottom actual temperature, actual
thermostatic temperature of the third THERMATIC (preheating temperature at bottom), outer actual
temperature from up to down at the right side of the touch screen.
Curves on image are: Tope target temperature (blue), top target actual temperature (red), bottom
actual temperature (green), infrared actual temperature (purple), out tested actual temperature
1. Click
enter into each asked specification of running after start heating
These specifications are the target temperature, holding temperature time, heating-up speed
Second is the unit of heating-up speed, three THERMATIC of Top, infrared can set 6 section
heating-up, 6section temperature-holding curve model, at this interface, also can modify the
specifications, but this specification will not be saved in inner of procedure, only be used in the
heating curve after start at this specification. To save, please read formula setting content!
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Click , return to curve interface
Click , the whole machine get into start heating, the running heating curve is
specification as above described specification, meantime clean out last curve show on screen.
Under normal operation, when top target temperature and heating speed is zero, the whole process
finished, machine stop work, hear Roar sound., if have set cooling and vacuum state in cooling
vacuum interface, the output of cooling and vacuum will run. Click
，
when
running, the whole machine will stop.
is the current state
Click
，
when running, this button will shine, notify that the whole machine go into
temperature-holding state, the three group of heating temperature output will remain at present
temperature, running in constant temperature, till to re-click
, return to normal heating state.
Click
popup function select interface
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1.
Click return to Chinese-English interface
2.
Clock popup “enter code “ window
The default pass word is 123456, after enter the code, enter into PID specification setting;
All specifications have been set before leave factory, no need change
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3
.
Click
will appear follow image:
Modify and save temperature curve often used
Set the heating temperature, constant temperature time, heating speed required by production craft,
this product can store the temperature curve up to 50 groups. Save various production craft
specifications in system, call it directly when meet different production craft.
Means the Formula stored in system, because the heating temperature is different while different
products using. We could save different specification in different formula. When change the
product, do not modify the specification much, just click call the corresponding formula
Click data
pop up the entry key of data
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Click the Enter key numerical value at the pop-up
Enter the modified data, press , Finished setting Temperature specification of
Three THERMATICS, click
then all specification set just now have stored under
the name(serial number) of present formula. Click
Popup dialog box
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name this curve, select Chinese or other name convenient for remembering. Also can get the asked
temperature curve directly through
two buttons. (the formula noted)
(0-49) enter corresponding serial NO. Click
restart the running
temperature curve of heating
Or save the modified temperature specification in present interface through
.
4.
Click
op following interface:
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Heating finished, System will run cooling and vacuum as
(counting by second), or manually control cooling
and vacuum state by
, after went into manual, whether heating or not, vacuum suction always worked, click cooling
manual button, only stop heating, then output, heating start, output stop, for having enough time
take away the suction pen, suggest that when remove chip, set the cooling to zero,
This machine can real-time monitor the rotating speed of cooling fan of up-down hot air, also can
set the min rotating speed. Fan stop work or rotating speed less than set data during heating, and updown hot air data high than 300 degree, system will stop heating immediately, alarm at same time,
whole machine turn to cooling state, will show where is the trouble on main interface, can help
worker find the trouble in a short time.
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Caution!
While alarm due to trouble, all functional button will be locked! It cannot work still after deal
with the trouble, power off.
New Type Mlink X1 top wind speed modifies has been optimized to show on status bar on touch
screen, more easily show the current speed through the column image!
Modify top wind speed by accelerating and decelerating! Avoid over-slow
Temperature specification often used ad following:
Lead solder temperature curve
41*41 BGA Solder temperature setting
：
Preheating
section
Temperatureholding section
Heating-up
section
Solder
section
1
Solder
section
2
Temperature-drop
section
Top Heating 160 185 210 220 225 0
Constant
Temperature
Time
30 30 35 40 20 0
Bottom
Heating
165 190 215 225 230 0
Constant
Temperature
Time
30 30 35 40 70 0
Infrared
Time
110 120 130 140 150 0
Constant
Temperature
Time
30 30 35 40 70 0
Slope 2 2 2 2 2 0
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38*38 BGA Solder Temperature Setting
31*31 BGA Solder Temperature Setting
Preheating
section
Temperature-holding
section
Heating-up
section
Solder
section
1
Solder
section
2
Temperature-drop
section
Top Heating 160 185 210 215 220 0
Constant
Temperature
Time
30 30 35 40 20 0
Bottom
Heating
160 185 215 220 225 0
Constant
Temperature
Time
30 30 35 40 40 0
Infrared
Time
110 120 130 140 150 0
Constant
Temperature
Time
30 30 35 40 70 0
Slope 2 2 2 2 2 0
Preheating
section
Temperature-holding
section
Heating-up
section
Solder
section
1
Solder
section
2
Temperature-drop
section
Top Heating 160 180 200 210 215 0
Constant
Temperature
Time
30 30 35 45 20 0
Bottom
Heating
160 180 200 215 225 0
Constant
Temperature
Time
30 30 35 45 60 0
Infrared
Time
110 120 130 140 150 0
Constant
Temperature
Time
30 30 35 40 70 0
Slope 2 2 2 2 2 0
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Above is reference for lead BGA temperature Curve
Lead-free temperature curve solder
41*41 BGA Solder temperature setting
：
38*38 BGA Solder temperature setting
：
Preheating
section
Temperature-holding
section
Heating-up
section
Solder
section
1
Solder
section
2
Temperature-drop
section
Top Heating 165 190 225 245 255 240
Constant
Temperature
Time
30 30 35 55 25 15
Bottom
Heating
165 190 225 245 255 240
Constant
Temperature
Time
30 30 35 55 25 15
Infrared
Time
110 120 130 140 150 160
Constant
Temperature
Time
30 30 35 40 40 70
Slope 2 2 2 2 2 2
Preheating
section
Temperature-holding
section
Heating-up
section
Solder
section
1
Solder
section
2
Temperaturedrop section
Top Heating 165 190 225 245 250 235
Constant
Temperature
Time
30 30 35 45 25 15
Bottom
Heating
165 190 225 245 250 235
Constant
Temperature
Time
30 30 35 45 25 15
Infrared
Time
110 120 130 140 150 160
Constant
Temperature
Time
30 30 35 40 40 70
Slope 2 2 2 2 2 2
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31*31 BGA Solder Temperature Setting
Above is reference for lead-free BGA temperature Curve
If you want to dismantle BGA, it is enough to set the value of temperature-drop section as 0.
7.
Rework Station Handling Precautions
1. Open repair station power switch, first check whether there is cold wind blowing in the upper hot
lips and lower hot lips. If no wind blowing out, don’t use the start switch, otherwise it will burn the
up and bottom main heater; the bottom of the all infrared heating area is controlled with the switch.
You can choose the bottom of the infrared heating area according to the size of PCB board.
2. Rework different BGA, it needs to set different temperature curve, the maximum temperature of
each segment setting cannot exceed 300 ℃. When rework with lead-free, one can set according to
welding temperature curve reference of BGA solder beads.
3. When dismantle BGA, first transfer cooling fan and vacuum gear to the automatic gear, when the
temperature curve operation is end, the buzzer alarms automatically, at this time quickly suck away
BGA from the PCB board with vacuum suction pen, and then remove PCB board holder from the
location grid.
4. While soldering the BGA, first transfer cooling fan is to the manual gear, turn off the vacuum.
When the temperature curve operation is end, buzzer alarms automatically, the cooling fan starts to
cool the heating area BGA and the down heating zone. Hot air chills cold wind at the same time.
Then upgrade the main heater at the top, so that the bottom of hot air nozzle is 3 ~ 5MM up to the
upper surface of BGA, and keep cool for 30 to 40 seconds, or remove the main heater after turning
off the start switch lights, , then remove the PCB board from the rack pan.
5. Before BGA installation, you must check whether the PCB board by chip and BGA solder ball
pad is good; BGA chip must be carried out by visual inspection after soldering. If something is
Preheatin
g section
Temperatureholding section
Heating-up
section
Solder
section 1
Solder
section 2
Temperaturedrop section
Top Heating 165 190 220 240 245 235
Constant
Temperature
Time
30 30 35 40 20 15
Bottom
Heating
165 190 220 240 245 235
Constant
Temperature
Time
30 30 35 40 20 15
Infrared Time 110 120 130 140 150 160
Constant
Temperature
Time
30 30 35 40 40 70
Slope 2 2 2 2 2 2
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unusual, one should stop the installation of BGA and test the temperature, one cannot weld it before
it is adjusted properly, otherwise it may damage the BGA or the PCB board.
6. The surface of the machine should be cleaned regularly; in particular, keep the clean of Infrared
heating board to prevent dirt accumulating in the top which will affect the normal heat radiation,
resulting in poor welding quality, and shortening the life of infrared heater.
If the heating unit is burned due to this reason, the Company will not be responsible for free
replacement!
Concluding Remarks
In production areas of electronic products, especially computer and communications electronics
products, the component is developing to the miniaturization, multi-function, green orientation,
various packaging technologies continue to emerge, BGA / CSP is the mainstream of packaging
technology nowadays.
To meet the rapidly growing demand of circuit assembly of BGA devices, manufacturers need to
choose safer, more convenient and more efficient assembly and rework equipment technology.
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Enclose Packing List
：
No. N ame Spe cif icatio
n and
Mod el
Qua nti tyUnit p ric e Rem ark
1 Main en gine of B GA
rew ork station
Mli nk X1 1
3 vac uum nozzle 1 /
4 Vac uum su cker 3 /
5 Man ual Ml ink X1 1 /
6 Hot air nozzle 4+1
7 heterosexual Clamp 6 /
8 plum knob sticks 6 /
9 supporting screws 8 /
10 Infrared bottom big 1
11 Infrared bottom small 1
12 Hot air element 1
13 Delta fan 1
14 Extra nut 1
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