mlink X2 Workbench Introduction Manual

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MLINK X2 BGA Repair
Workbench Introduction Manual
Catalogue
Rework Station Installing
Rework Station Safety Precautions
Introduction of Structure and Specification
Operating Steps
Touch Screen
Rework Station Handling Precautions
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Rework Station Installing
a. Installation Location In order to ensure the service life of rework station, the installation must meet the following conditions:
1. Away from flammable, explosive materials
2. Don’t spilled by water and other liquid
3. Well-ventilated and Dry Place
4. Stable, Smooth, less vibrate place
5. Little dusty place
6. Don’t put anything on control box
7. Away from the place affected by the direct flow of air condition, heater and fan
8. For upper part easy move and turn, More than 30cm Match at the back of rework station
b. Power supply requirements: use small fluctuant voltage power supply. Voltage: 220V±10 Frequency: 50Hz±3
2. Rework Station Safety Precautions
1. Don’t blow the rework station directly when it work, or will lead the negative differential of the surface of the heating plate, burned the parts
After starting up, high temperature heat area cannot contact anything directly, or may cause fire or explosion, PCB board should be put on the PCB board support
Don’t shake rework station, move lightly.
After starting up, do not use flammable spray, liquid gas.
Don’t try to redo the rework station, or will cause fire or electric shock.
There are high-voltage parts in electric box, don’t take part or remove without permission
If there is metallic object or liquid fall into rework station, shut off the power immediately, unplug power line, completely remove the object and dirt after the station get cooling. If having residue, will emit odor after rework.
when rework station abnormal heating-up or smoke, shut off the power immediately, notify the technician repair, partly shut off power when move electric box or machine, hold the plug when unplug the wire, otherwise will cause poor contact, cannot work.
Shut off the power when stop use.
11. Rework station do not press or run over line or communication cable of other equipments power otherwise may cause equipment malfunction or cause fire or electric shock
12. Before operating the rework station, must read this introduction manual carefully.
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3. Main Specification:
Total Power: 4400W Top heating: 800W Bottom heating: 800W Bottom infrared preheat: 2400w Current: AC220V 50/60HZ Outer Dimension: L600mmW600mmH610mm Min PCB Dimension: 40mm40mm MAX: PCB Dimension: 450mm500mm
Description:
This product adopt 7” HD touch screen Human–Machine Interaction(HMI), PLC Control, real-time display Five temperature curve, temperature precision be controlled in ± degree.
6 section temperature controls, can further refine the temperature of each solder segment, to better ensure the welding effect.
Can save 0-49 group of temperature curve setting, analyze the curve and change the setting on touch screen anytime.
There are 3 THERMATICS to heating separately, can control multi-group, multi-section temperature in the 3 THERMATICS at same time, ensure achieve the best welding effect in different THERMATICS. Heating temperature, time, slope, cooling, vacuum, all can be set on HMI
Select high-precision K-Type thermocouple closed-loop control, detect temperature precisely through the external temperature testing interface
Have alarm function after finish unsolder, have over-temperature protection circuit around the whole machine, stop heating and alarm when abnormal over-temperature
Use High Cross-flow Fan cool PCB board promptly, incase the deformation of PCB board, ensure the welding effect.
Use V Shape groove address the PCB, Flexible removable have the function of protect PCB
For large thermal capacity PCB and other high temperature requirements, Both lead-free BGA/CSP and column BGA can deal with easily.
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Hot air nozzles can 360 degree rotation, easy to replace. With a variety size of hot air nozzle, special requirements can be customized
5. Operate Steps
1. Pre-heating: Pre-heat PCB and BGA before rework, in case of bursting while rework, temperature of constant temperature oven is generally set at 80 -100 , time often be 12-24hours.
2. Disassembly Put PCB on the position support of rework station, select the appropriate hot air reflow nozzle, set proper welding temperature curve, pull the start switch, when procedure run over, move the hot air manually, use vacuum suction pen remove BGA.
3. Clean the welding
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Cleaning of PCB and BGA welding pad, one is use the suction tin line tow to same level, another is use soldering iron drag smooth directly. It is best remove soldering tin in a short time after remove BGA, while BGA not cooling totally, less damage of temperature difference to welding pad;Use soldering flux in the process of removing solder, can improve the solder activity, conducive to the removal of solder. Especially pay attention to do not damage the welding pad of PCB, for ensuring reliability of BGA welding, try to use some strong volatile solvent, washer, industrial alcohol during clean the remain solder paste on solder pad.
4. BGA REBALLING
Evenly coated solder paste on BGA pad with a brush, select the corresponding REBALLING steel mesh, use REBALLING STATION plant BGA tin sweat on corresponding BGA pad.
5. BGA Tin Sweat Welding
Heating the bottom of Tin sweat station and rework station heating zone, solder the tin sweat on BGA pad
6 Spread soldering flux
Spread a layer of solder flux on PCB pad with a brush, too much will cause soldering together, on the other hand, too less will cause missing soldering, thus for clean the dirt on BGA tin sweat, enhance soldering effect, solder paste must be spread appropriately,
7 Mount
Mount BGA on PCB, when counterpoint by hand, use silk screen print frame line helps counterpoint, confirming whether mount BGA in counterpoint by hand touch feeling of surface of Tim Sweat and soldering pad.
8 Welding
Put PCB on the position support of rework station, select the appropriate hot air reflow nozzle, set proper welding temperature curve, start heating inching switch, run soldering procedure, stop running, front BGA cooling fan start cool BGA, improve hot air point, make hot air nozzle above on surface of BGA 8-10mm. and keep cooling 30-40 seconds, or after the start switch light power off, move hot air head, and then take away the PCB board from bottom heating area position stably.
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Missing Solder; because of manually counterpoint will make deviation between chips and solder pad, Tension of tin sweat surface will make a process of correct the place between BGA chips and pad automatically. Because of uneven heating, leading the chip fall unevenly, if stopping reflowing now, the chip will not fall normally, resulting in non­coplanarity phenomenon and then cause missing solder and cold solder, so need extend the time of temperature of third and forth section THERMATICS, our enhance the pre-heating temperature at bottom, melt tin sweat and fall evenly.
b. Short Circuit: The tin sweat is liquid when get melting point, the extension and support
function of tin sweat support will be damaged when suffer over-time, over heat temperature
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or over press, and then lead short circuit because of chip fall on the PCB pad completely while reflowing, Hence, we need decrease temperature and time of the third and forth heating section, or decrease the preheating temperature at bottom.
Note: Will appear small quantity ozone when reword station using, in order to ensure a comfortable, healthy and safe operating environment, please keep good air circulation.
6. Touch Screen
Operation Introduction:
a. Open the control power supply, rework station be powered. Home page Chinese- English select interface appears on the touch screen, select the language interface you want.
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