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OUTLINE DRAWING & INTERNAL CONNECTION
Tolerance otherwise specified
CM300EXS-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
APPLICATION
Brake
Collector current IC .............…..........................…
Collector-emitter voltage V
Maximum junction temperature T
..........................… 1 2 0 0 V
CES
..................... 1 7 5 °C
jmax
A
●Flat base Type
●Copper base plate (non-plating)
●Tin plating pin terminals
●RoHS Directive compliant
●Recognized under UL1557, File E323585
Publication Date : February 2014
t=0.8
over 3 to 6 ±0.3
The tolerance of size between
terminals is assumed to be ±0.4.
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< IGBT MODULES >
CM300EXS
-24S
Pulse, Repetitive
(Note2)
Repetitive peak reverse voltage
Pulse, Repetitive
(Note2)
Terminals to base plate, RMS, f=60 Hz, AC 1 min
Operating junction temperature
Continuous operation (under switching)
Gate-emitter leakage current
VGE=V
GES
, C-E short-circuited
Gate-emitter threshold voltage
Reverse transfer capacitance
Turn-on s witching energy per pulse
Turn-off switching energy per pulse
VGE=±15 V, RG=0 Ω, Tj=150 °C,
Main terminals-chip, per switch,
HIGH POWER SWITCHING USE
INSULATED TYPE
MAXIMUM RATINGS (Tj=25 °C, unless otherwise specified)
IGBT PART
V
Collector-emitter voltage G-E short-circuited 1200 V
CES
GES
Collector current
P
Total power dissipation TC=25 °C
tot
2270 W
A
DIODE PART
Symbol Item Conditions Rating Unit
FRM
Forward current
A
MODULE
T
Maximum junction temperature Instantaneous event (overload) 175
jmax
Cmax
°C
°C
ELECTRICAL CHARACTERISTICS (Tj=25 °C, unless otherwise specified)
IGBT PART
Symbol Item Conditions
I
Collector-emitter cut-off current VCE=V
CES
GES
V
CE sat
(Terminal)
Refer to the figure of test circuit Tj=125 °C - 2.00 -
, G-E short-circuited - - 1.0 mA
Collector-emitter saturation voltage
V
CE sat
(Chip)
ies
Tj=150 °C - 1.95 -
VCE=10 V, G-E short-circuited
res
QG Gate charge VCC=600 V, IC=300 A, VGE=15 V - 700 - nC
d(on)
d(off)
tf Fall time - - 300
VCC=600 V, IC=300 A, VGE=±15 V,
RG=0 Ω, Inductive load
Unit
V
V
nF
ns
R
Internal lead resistance
CC'+EE'
Publication Date : February 2014
mJ
- - 2.0 mΩ
2
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< IGBT MODULES >
CM300EXS
-24S
Refer to the figure of test circuit
VCC=600 V, IF=300 A, VGE=±15 V,
Approximate by equation
(Note5)
Case to heat sink, per 1 module,
HIGH POWER SWITCHING USE
INSULATED TYPE
ELECTRICAL CHARACTERISTICS (cont.; Tj=25 °C, unless otherwise specified)
DIODE PART
Symbol Item Conditions
RRM
V
F
(Terminal)
V
F
(Chip)
Forward voltage
Tj=150 °C - 1.8 -
(Note4)
Min. Typ. Max.
Unit
V
V
trr Reverse recovery time VCC=600 V, IF=300 A, VGE=±15 V, - - 300 ns
Err Reverse recovery energy per pulse
RG=0 Ω, Tj=150 °C, Inductive load
- 22 - mJ
NTC THERMISTOR PART
Symbol Item Conditions
(25/50)
P25 Power dissipation TC=25 °C
- - 10 mW
Min. Typ. Max.
(Note3)
Unit
THERMAL RESISTANCE CHARACTERISTICS
Symbol Item Conditions
R
th(j- c)D
R
th(c- s )
Thermal resistance
Junction to case, DIODE
Contact thermal resistance
Thermal grease applied
(Note3)
- - 0.12
- 25 - K/kW
Unit
K/W
MECHANICAL CHARACTERISTICS
Symbol Item Conditions
Ms Mounting torque Mounting to heat sink M 5 screw 2.5 3.0 3.5 N·m
ds Creepage distance
da Clearance
Terminal to base plate 10.6 - -
(Note7)
Unit
mm
mm
Publication Date : February 2014
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