Mitsubishi Electric US, Inc CM1200HCB-34N Data Sheet

CM2400HCB-34N
I
C ··························································
1200 A
V
CES ····················································
1700 V
1-element in pack Insulated type CSTBTTM / Soft recovery diode  AlSiC baseplate
APPLICATION
Traction drives, High Reliability Converters / Inverters, DC choppers
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
<High Voltage Insulated Gate Bipolar TransistorHVIGBT >
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Publication Date : December 2015
(HVM-1053-B)
1
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
ELECTRICAL CHARACTERISTICS
Symbol
Item
Conditions
Limits
Unit Min
Typ
Max
I
CES
Collector cutoff current
VCE = V
CES
, VGE = 0 V
Tj = 25 °C
5
mA
Tj = 125 °C
4.0
10
V
GE(th)
Gate-emitter threshold voltage
VCE = 10 V, IC = 120 mA, Tj = 25 °C
5.5
6.5
7.5
V
I
GES
Gate leakage current
VGE = V
GES
, VCE = 0V, Tj = 25°C
-0.5 — 0.5
µA
C
ies
Input capacitance
VCE = 10 V, VGE = 0 V, f = 100 kHz Tj = 25 °C
220 — nF
C
oes
Output capacitance
12 — nF
C
res
Reverse transfer capacitance
3.5 — nF
QG
Total gate charge
VCC = 900 V, IC = 1200 A, VGE = ±15 V
15.2 — µC
V
CEsat
Collector-emitter saturation voltage
IC = 1200 A
(Note 4)
VGE = 15 V
Tj = 25 °C
2.05
2.70
V
Tj = 125 °C
2.30
t
d(on)
Turn-on delay time
VCC = 900 V, IC = 1200 A VGE = ±15 V, R
G(on)
= 1.1 Ω Tj = 125 °C, Ls = 100 nH Inductive load
1.50
µs
tr
Turn-on rise time
0.60
µs
E
on(10%)
Turn-on switching energy
(Note 5)
0.43 — J
t
d(off)
Turn-off delay time
VCC = 900 V, IC = 1200 A VGE = ±15 V, R
G(off)
= 2.0 Ω Tj = 125 °C, Ls = 100 nH Inductive load
3.00
µs
tf
Turn-off fall time
0.60
µs
E
off(10%)
Turn-off switching energy
(Note 5)
0.32 — J
VEC Emitter-collector voltage
(Note 2)
IE = 1200 A
(Note 4)
VGE = 0 V
Tj = 25 °C
2.20
3.00
V
Tj = 125 °C
1.85
trr
Reverse recovery time
(Note 2)
VCC = 900 V, IE = 1200 A VGE = ±15 V, R
G(on)
= 1.1 Ω Tj = 125 °C, Ls = 100 nH Inductive load
1.50
µs
Qrr
Reverse recovery charge
(Note 2)
410 — µC
E
rec(10%)
Reverse recovery energy
(Note 2)
(Note 5)
0.29 — J
THERMAL CHARACTERISTICS
Symbol
Item
Conditions
Limits
Unit Min
Typ
Max
R
th(j-c)Q
Thermal resistance Junction to Case, IGBT part
14.0
K/kW
R
th(j-c)D
Junction to Case, FWDi part
21.0
K/kW
R
th(c-s)
Contact thermal resistance
Case to heat sink,
grease
= 1W/m·k, D
(c-s)
= 100m
10.0 — K/kW
MAXIMUM RATINGS
Symbol
Item
Conditions
Ratings
Unit
V
CES
Collector-emitter voltage
VGE = 0V, Tj = 25 °C
1700
V
V
GES
Gate-emitter voltage
VCE = 0V, Tj = 25 °C
± 20
V
IC
Collector current DC, Tc = 80 °C
1200
A
I
CRM
Pulse
(Note 1)
2400
A
IE
Emitter current
(Note 2)
DC
1200
A
I
ERM
Pulse
(Note 1)
2400
A
P
tot
Maximum power dissipation
(Note 3)
Tc = 25 °C, IGBT part
8600
W
V
iso
Isolation voltage
RMS, sinusoidal, f = 60Hz, t = 1min.
4000
V
Tj
Junction temperature
40 ~ +150
°C
T
jop
Operating temperature
40 ~ +125
°C
T
stg
Storage temperature
40 ~ +125
°C
t
pSC
Maximum short circuit pulse width
VCC =1000V, VCE ≤ V
CES
, VGE =15V, Tj =125°C
10
µs
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Publication Date : December 2015
2
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
MECHANICAL CHARACTERISTICS
Symbol
Item
Conditions
Limits
Unit
Min
Typ
Max
Mt
Mounting torque M8 : Main terminals screw
7.0 — 13.0
N·m
Ms
M6 : Mounting screw
3.0 — 6.0
N·m
Mt
M4 : Auxiliary terminals screw
1.0 — 2.0
N·m
m
Mass —
1.5 — kg
CTI
Comparative tracking index
600 — —
da
Clearance
19.5 — —
mm
ds
Creepage distance
32.0 — —
mm
L
P CE
Parasitic stray inductance
— 15.0 — nH
R
CC’+EE’
Internal lead resistance
TC = 25 °C
0.21 — m
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Note1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed T
2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
3. Junction temperature (Tj) should not exceed T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
5. E
on(10%)
/ E
off(10%)
/ E
are the integral of 0.1VCE x 0.1IC x dt.
rec(10%)
rating (150°C).
jmax
jopmax
rating.
Publication Date : December 2015
3
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
OUTPUT CHARACTERISTICS
(TYPICAL)
TRANSFER CHARACTERISTICS
(TYPICAL)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS (TYPICAL)
FREE-WHEEL DIODE FORWARD
CHARACTERISTICS (TYPICAL)
0
400
800
1200
1600
2000
2400
0 1 2 3 4 5 6
Collector Current [A]
Collector - Emitter Voltage [V]
VGE = 8V
Tj = 125°C
VGE = 20V
VGE = 15V
VGE = 10V
VGE = 12V
0
400
800
1200
1600
2000
2400
0 2 4 6 8 10 12
Collector Current [A]
Gate - Emitter Voltage [V]
Tj = 25°C
Tj =125°C
VCE = 20V
0
400
800
1200
1600
2000
2400
0 1 2 3 4
Collector Current [A]
Collector-Emitter Saturation Voltage [V]
Tj = 25°C
VGE = 15V
Tj = 125°C
0
400
800
1200
1600
2000
2400
0 1 2 3 4
Emitter Current [A]
Emitter-Collector Voltage [V]
Tj = 125°C
Tj = 25°C
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
Publication Date : December 2015
4
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
CAPACITANCE CHARACTERISTICS
(TYPICAL)
GATE CHARGE CHARACTERISTICS
(TYPICAL)
HALF-BRIDGE SWITCHING ENERGY
CHARACTERISTICS (TYPICAL)
HALF-BRIDGE SWITCHING ENERGY
CHARACTERISTICS (TYPICAL)
1
10
100
1000
0.1 1 10 100
Capacitance [nF]
Collector-Emitter Voltage [V]
Cies
VGE = 0V, Tj = 25°C f = 100kHz
Coes
Cres
-15
-10
-5
0
5
10
15
20
0 5 10 15 20
Gate-Emitter Voltage [V]
Gate Charge [µC]
VCE = 900V, IC = 1200A Tj = 25°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0 500 1000 1500 2000 2500
Switching Energies [J/P]
Collector Current [A]
Erec
VCC = 900V, VGE = ±15V RG(on) = 1.1 Ω, R
G(off)
= 2.0 Ω
Tj = 125°C, Inductive load
Eoff
Eon
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 2 4 6 8 10 12
Switching Energies [J/P]
Gate Resistance [Ω]
Erec
VCC = 900V, IC = 1200A VGE = ±15V, Tj = 125°C Inductive load
Eoff
Eon
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
Publication Date : December 2015
5
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
HALF-BRIDGE SWITCHING ENERGY
CHARACTERISTICS (TYPICAL)
FREE-WHEEL DIODE REVERSE RECOVERY
CHARACTERISTICS (TYPICAL)
TRANSIENT THERMAL IMPEDANCE
CHARACTERISTICS
 
 
 
 
 
 
exp1
RZ
i
t
n
1i
i)cj(th
)t(
0.01
0.1
1
10
100 1000 10000
Switching Times [µs]
Collector Current [A]
tf
VCC = 900V, VGE = ±15V R
G(on)
= 1.1 Ω, R
G(off)
= 2.0 Ω
Tj = 125°C, Inductive load
tr
td(on)
td(off)
10
100
1000
10000
0
1
10
100
100 1000 10000
Reverse Recovery Current [A]
Reverse Recovery Time [µs]
Emitter Current [A]
trr
VCC = 900V, VGE = ±15V R
G(on)
= 1.1 Ω
Tj = 125°C, Inductive load
Irr
0
0.2
0.4
0.6
0.8
1
1.2
0.001 0.01 0.1 1 10
Normalized Transient Thermal impedance
Time [s]
Rth(j-c)Q = 14.0K/kW Rth(j-c)R = 21.0K/kW
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
Publication Date : December 2015
6
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
REVERSE BIAS SAFE OPERATING AREA
(RBSOA)
SHORT CIRCUIT
SAFE OPERATING AREA (SCSOA)
FREE-WHEEL DIODE REVERSE RECOVERY
SAFE OPERATING AREA (RRSOA)
0
1000
2000
3000
0 500 1000 1500 2000
Collector Current [A]
Collector-Emitter Voltage [V]
VCC 1200V, VGE = ±15V Tj = 125°C, RG(off) 2.0 Ω
0
5000
10000
15000
20000
0 500 1000 1500 2000
Collector Current [A]
Collector-Emitter Voltage [V]
VCC 1000V, VGE = ±15V R
G(on)
1.1Ω, R
G(off)
2.0Ω
Tj = 125°C, tpsc 10µs
0
200
400
600
800
1000
1200
1400
1600
0 500 1000 1500 2000
Reverse Recovery Current [A]
Collector-Emitter Voltage [V]
VCC 1200V, di/dt 6500A/µs Tj = 125°C
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
Publication Date : December 2015
7
< High Voltage Insulated Gate Bipolar TransistorHVIGBT >
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
© 2014 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
CM1200HCB-34N
HIGH POWER SWITHCHING USE INSULATED TYPE 4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Publication Date : December 2015
8
Loading...