R25 Zero-power resistance TC=25 °C
∆R/R Deviation of resistance R
B
B-constant Approximate by equation
(25/50)
P25 Power dissipation TC=25 °C
THERMAL RESISTANCE CHARACTERISTICS
Symbol Item Conditions
R
R
R
R
R
Junction to case, per Inverter IGBT - - 0.20
th(j-c)Q
Junction to case, per Inverter DIODE - - 0.29
th(j-c)D
Junction to case, per Brake IGBT - - 0.35
th(j-c)Q
th(j-c)D
Contact thermal resistance
th(c-s)
Thermal resistance
(Note4)
=25 °C, unless otherwise specified)
j
(Note4)
4.85 5.00 5.15 kΩ
=493 Ω, TC=100 °C
100
(Note4)
- - 10 mW
(Note4)
-7.3 - +7.8 %
(Note7)
- 3375 - K
Junction to case, per Brake DIODE - - 0.63
(Note4)
Case to heat sink, per 1 module,
(Note7)
Thermal grease applied
Limits
Min. Typ. Max.
Limits
Min. Typ. Max.
- 15 - K/kW
Unit
Unit
K/W
K/W
MECHANICAL CHARACTERISTICS
Symbol Item Conditions
Mt Mounting torque Main terminals M 5 screw 2.5 3.0 3.5 N·m
Ms Mounting torque Mounting to heat sink M 5 screw 2.5 3.0 3.5 N·m
ds Creepage distance
da Clearance
Terminal to terminal 10.25 - Terminal to base plate 12.32 - Terminal to terminal 10.28 - Terminal to base plate 10.85 - -
m mass - - 370 - g
ec Flatness of base plate On the centerline X, Y
(Note8)
±0 - +100 μm
Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (DIODE).
2. Junction temperature (T
3. Pulse width and repetition rate should be such that the device junction temperature (T
4. Case temperature (T
) should not increase beyond T
j
) and heat sink temperature (Ts) are defined on the each surface (mounting side) of base plate and heat sink
C
jmax
rating.
) dose not exceed T
j
just under the chips. Refer to the figure of chip location.
5. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Refer to the figure of test circuit.
R
6.
5025
: resistance at absolute temperature T25 [K]; T25=25 [°C]+273.15=298.15 [K]
R
25
: resistance at absolute temperature T50 [K]; T50=50 [°C]+273.15=323.15 [K]
R
50
25
ln(B
)/(
/()
R
11
,
)
TT
502550
7. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K).
8. The base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure.
Limits
Min. Typ. Max.
rating.
jmax
Unit
mm
mm
Y
mounting side
-:Concave
+:Convex
mounting side
+:Convex
mounting side
-:Concave
X
9. Use the following screws when mounting the printed circuit board (PCB) on the stand offs.
"φ2.6×10 or φ2.6×12 self tapping screw"
The length of the screw depends on the thickness (t1.6~t2.0) of the PCB.
Publication Date : August 2013
4
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
RECOMMENDED OPERATING CONDITIONS
Symbol Item Conditions
VCC (DC) Supply voltage Applied across P-N terminals - 600 850 V
V
COLLECTOR-EMITTER VOLTAGE VCE (V) COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION VOLTAGE
CHARACTERISTICS
(TYPICAL)
FREE WHEELING DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
=150 °C
j
(Chip)
10
Tj=25 °C
(Chip)
G-E short-circuited
1000
Tj=125 °C
8
(V)
CEsat
6
4
IC=200 A
=100 A
I
C
IC=40 A
100
(A)
E
Tj=150 °C
Tj=25 °C
10
COLLECTOR-EMITTER
2
EMITTER CURRENT I
SATURATION VOLTAGE V
0
68101214161820
1
00.511.522.53
GATE-EMITTER VOLTAGE VGE (V) EMITTER-COLLECTOR VOLTAGE VEC (V)
(Chip)
Publication Date : August 2013
7
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
INVERTER PART
VCC=600 V, VGE=±15 V, RG=6.2 Ω, INDUCTIVE LOAD
1000
100
SWITCHING CHARACTERISTICS
---------------: T
HALF-BRIDGE
(TYPICAL)
=150 °C, - - - - -: Tj=125 °C
j
t
d(off)
t
f
t
d(on)
SWITCHING CHARACTERISTICS
HALF-BRIDGE
(TYPICAL)
VCC=600 V, VGE=±15 V, IC=100 A, INDUCTIVE LOAD
1000
---------------: T
100
=150 °C, - - - - -: Tj=125 °C
j
tf
t
d(off)
10
SWITCHING TIME (ns)
t
r
1
110100
SWITCHING TIME (ns)
10
110100
t
d(on)
tr
COLLECTOR CURRENT IC (A) EXTERNAL GATE RESISTANCE RG (Ω)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
VCC=600 V, VGE=±15 V, RG=6.2 Ω,
INDUCTIVE LOAD, PER PULSE
100
10
---------------: T
=150 °C, - - - - -: Tj=125 °C
j
100
SWITCHING CHARACTERISTICS
VCC=600 V, VGE=±15 V, IC/IE=100 A,
INDUCTIVE LOAD, PER PULSE
---------------: T
HALF-BRIDGE
(TYPICAL)
=150 °C, - - - - -: Tj=125 °C
j
E
on
E
rr
E
off
1
E
on
SWITCHING ENERGY (mJ)
REVERSE RECOVERY ENERGY (mJ)
0.1
110100
COLLECTOR CURRENT IC (A)
EMITTER CURRENT I
Publication Date : August 2013
E
(A)
10
SWITCHING ENERGY (mJ)
REVERSE RECOVERY ENERGY (mJ)
1
110100
EXTERNAL GATE RESISTANCE R
8
G
(Ω)
E
off
E
rr
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
INVERTER PART
100
10
1
CAPACITANCE (nF)
0.1
CAPACITANCE CHARACTERISTICS
(TYPICAL)
G-E short-circuited, Tj=25 °C
REVERSE RECOVERY CHARACTERISTICS
FREE WHEELING DIODE
(TYPICAL)
VCC=600 V, VGE=±15 V, RG=6.2 Ω, INDUCTIVE LOAD
1000
C
ies
(A)
rr
C
oes
C
res
(ns), I
rr
t
---------------: T
100
=150 °C, - - - - -: Tj=125 °C
j
Irr
trr
0.01
0.1110100
10
110100
COLLECTOR-EMITTER VOLTAGE VCE (V) EMITTER CURRENT IE (A)
GATE CHARGE CHARACTERISTICS
20
15
(V)
GE
10
5
VCC=600 V, IC=100 A, Tj=25 °C
(TYPICAL)
GATE-EMITTER VOLTAGE V
TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS
(MAXIMUM)
Single pulse, TC=25 °C
R
1
0.1
th(j-c)Q
=0.20 K/W, R
th(j-c)D
th(j-c)
Z
0.01
=0.29 K/W
NORMALIZED TRANSIENT THERMAL RESISTANCE
0
0100200300400
0.001
0.00001 0.00010.0010.010.1110
GATE CHARGE QG (nC) TIME (S)
Publication Date : August 2013
9
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
BRAKE PART
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
FORWARD CHARACTERISTICS
CLAMP DIODE
(TYPICAL)
3.5
3
(V)
2.5
CEsat
2
1.5
1
COLLECTOR-EMITTER
VGE=15 V
T
Tj=125 °C
=150 °C
j
Tj=25 °C
(Chip)
G-E short-circuited
100
(V)
F
10
Tj=150 °C
Tj=25 °C
FORWARD VOLTAGE V
SATURATION VOLTAGE V
0.5
0
0 20406080100
1
00.511.522.5
COLLECTOR CURRENT IC (A) FORWARD CURRENT IF (A)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
VCC=600 V, VGE=±15 V, RG=13 Ω, INDUCTIVE LOAD
1000
---------------: T
=150 °C, - - - - -: Tj=125 °C
j
t
d(off)
1000
SWITCHING CHARACTERISTICS
VCC=600 V, IC=50 A, VGE=±15 V, INDUCTIVE LOAD
---------------: T
HALF-BRIDGE
(TYPICAL)
=150 °C, - - - - -: Tj=125 °C
j
(Chip)
Tj=125 °C
3
100
10
SWITCHING TIME (ns)
tf
t
d(on)
tr
1
110100
SWITCHING TIME (ns)
t
f
t
d(off)
100
t
d(on)
t
r
10
101001000
COLLECTOR CURRENT IC (A) EXTERNAL GATE RESISTANCE RG (Ω)
Publication Date : August 2013
10
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
BRAKE PART
10
1
SWITCHING CHARACTERISTICS
VCC=600 V, VGE=±15 V, RG=13 Ω,
INDUCTIVE LOAD, PER PULSE
---------------: T
HALF-BRIDGE
(TYPICAL)
=150 °C, - - - - -: Tj=125 °C
j
E
off
SWITCHING CHARACTERISTICS
HALF-BRIDGE
(TYPICAL)
VCC=600 V, IC/IF=50 A, VGE=±15 V,
INDUCTIVE LOAD, PER PULSE
100
E
rr
---------------: T
10
=150 °C, - - - - -: Tj=125 °C
j
Eon
Eon
SWITCHING ENERGY (mJ)
REVERSE RECOVERY ENERGY (mJ)
0.1
110100
COLLECTOR CURRENT IC (A)
FORWARD CURRENT I
REVERSE RECOVERY CHARACTERISTICS
VCC=600 V, VGE=±15 V, RG=13 Ω, INDUCTIVE LOAD
1000
---------------: T
CLAMP DIODE
(TYPICAL)
=150 °C, - - - - -: Tj=125 °C
j
F
(A)
E
off
SWITCHING ENERGY (mJ)
Err
REVERSE RECOVERY ENERGY (mJ)
1
101001000
EXTERNAL GATE RESISTANCE R
G
TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS
(MAXIMUM)
Single pulse, TC=25 °C
th(j-c)Q
=0.35 K/W, R
R
1
0.1
th(j-c)D
=0.63 K/W
(Ω)
(A)
rr
(ns), I
rr
t
100
10
110100
trr
Irr
th(j-c)
Z
NORMALIZED TRANSIENT THERMAL RESISTANCE
0.01
0.001
0.00001 0.00010.0010.010.1110
FORWARD CURRENT IF (A) TIME (S)
Publication Date : August 2013
11
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
PERFORMANCE CURVES
NTC thermistor part
TEMPERATURE CHARACTERISTICS
(TYPICAL)
100
10
1
RESISTANCE R (kΩ)
0.1
-50-250255075100125
TEMPERATURE T (°C)
Publication Date : August 2013
12
< IGBT MODULES >
CM100RX-24S
HIGH POWER SWITCHING USE
INSULA TED TYPE
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