Mitsubishi Electronics Q25HCPU, Q06HCPU, Q02CPU, Q02HCPU, Q12HCPU User Manual

C

MIT

SUBIS

C

HI ELECTRI

MELSEC System Q

Programmable Logic Controllers

User’s Manual

High Performance Model QCPU

Art. no.: 130000 01 10 2002 SH (NA)-080037-F

Q02CPU, Q02HCPU,

Q06HCPU, Q12HCPU,

Q25HCPU

MITSUBISHI ELECTRI

INDUSTRIAL AUTOMATION

SAFETY PRECAUTIONS

(Read these precautions before using.)

When using Mitsubishi equipment, thoroughly read this manual and the associated manuals introduced in this manual. Also pay careful attention to safety and handle the module properly . These SAFETY PRECAUTIONS classify the safety precautions int o two cat egories: "DANG ER" and "CAUTION".

DANGER

!

CAUTION

!

Depending on circumstances, procedures indicated by ! CAUTION may also be linked to serious results. In any case, it is important to follow the directions for usage.

Store this manual in a safe place so that you can take it out and read it whenever necessary . Alw ay s forward it to the end user.

Indicates that incorrect handling may cause hazardous conditions, resulting in death or severe injury.

Indicates that incorrect handling may cause hazardous conditions, resulting in medium or slight personal injury or physical damage.

[DESIGN PRECAUTIONS]

!

DANGER

Install a safety circuit external to the PLC that keeps the ent ire syst em safe even when t here

are problems with the external power supply or the PLC module. Otherwise, t rouble could result from erroneous output or erroneous operation. (1) Outside the PLC, construct mechanical damage preventing interlock circuits such as

emergency stop, protective circuits, positioning upper and low er limits switches and interlocking forward/reverse operations.

(2) When the PLC detects the following problems, it will stop calculation and turn off all out put

in the case of (a). In the case of (b), it will st op calculation and hold or t urn off all out put according to the parameter setting. Note that the AnS series module will turn off the out put in eit her of cases (a) and (b).

(a) The power supply module has over current protection equipment and over voltage

protection equipment.

(b) The PLC CPUs self-diagnosis functions, such as the watch dog timer error, detect

problems. In addition, all output will be turned on when t here are pr oblems that t he PLC CPU cannot detect, such as in the I/O controller. Build a fail safe circuit exterior to the PLC that will make sure the equipment operates safely at such times. See section 9.1 of this manual for example fail safe circuits.

(3) Output could be left on or off when there is trouble in the outputs module relay or transist or.

So build an external monitoring circuit that will monit or any single output s that could cause serious trouble.

A - 1 A - 1

[DESIGN PRECAUTIONS]

!

DANGER

When overcurrent which exceeds the rating or caused by short-circuited load flows in the output

module for a long time, it may cause smoke or fire. To prevent this, configure an external safety circuit, such as fuse.

Build a circuit that turns on the external power supply w hen the PLC main module power is

turned on. If the external power supply is turned on first, it could result in erroneous out put or erroneous operation.

When there are communication problems with the data link, refer to the corresponding data link

manual for the operating status of each station. Not doing so could result in erroneous output or erroneous operation.

When connecting a peripheral device to the CPU module or connecting a personal computer or

the like to the intelligent function module to exercise control (data change) on the running PLC, configure up an interlock circuit in the sequence program to ensure that t he whole sy stem w ill always operate safely. Also before exercising other control (program change, operating status change (status control)) on the running PLC, read the manual carefully and fully confirm safety. Especially for the above control on the remote PLC from an external device, an immediate action may not be taken for PLC trouble due to a data communication fault. In addition to configuring up the interlock circuit in the sequence program, corrective and other actions to be taken as a system for the occurrence of a data communication fault should be predetermined between the external device and PLC CPU.

!

CAUTION

Do not bunch the control wires or communication cables with the main circuit or power wires, or

install them close to each other. They should be installed 100 mm (3.94 inch) or more from each other. Not doing so could result in noise that would cause erroneous operation.

When controlling items like lamp load, heater or solenoid valve using an output module, large

current (approximately ten times greater than that present in normal circumstances) may flow when the output is turned OFF to ON. Take measures such as replacing the module with one having sufficient rated current.

A - 2 A - 2

[INSTALLATION PRECAUTIONS]

!

CAUTION

Use the PLC in an environment that meets the general specifications contained in this manual.

Using this PLC in an environment outside the range of the general specifications could result in electric shock, fire, erroneous operation, and damage to or deterioration of the product.

Hold down the module loading lever at the module bottom, and securely insert the module

fixing latch into the fixing hole in the base unit. Incorrect loading of the module can cause a malfunction, failure or drop. When using the PLC in the environment of much vibration, tighten the module with a screw. Tighten the screw in the specified torque range. Undertightening can cause a drop, short circuit or malfunction. Overtightening can cause a drop, short circuit or malfunction due to damage to the screw or module.

When installing extension cables, be sure that the connectors of base unit are installed

correctly. After installation, check them for looseness. Poor connections could cause an input or output failure.

Securely load the memory card into the memory card loading connector. After loading, check

for lifting. Lifting can cause a malfunction due to a contact fault.

Completely turn off the external power supply before loading or unloading the module. Not

doing so could result in electric shock or damage to the product.

Do not directly touch the module's conductive parts or electronic components. Touching the

conductive parts could cause an operation failure or give damage to the module.

[WIRING PRECAUTIONS]

!

DANGER

Completely turn off the external pow er supply when inst alling or placing w iring. Not completely

turning off all power could result in electric shock or damage to the product.

When turning on the power supply or operating the module after installation or wiring work, be

sure that the module's terminal covers are correctly attached. Not at taching the t erminal cover could result in electric shock.

A - 3 A - 3

[WIRING PRECAUTIONS]

!

CAUTION

Be sure to ground the FG terminals and LG terminals to the protective ground conductor. Not

doing so could result in electric shock or erroneous operation.

When wiring in the PLC, be sure that it is done correctly by checking the product's rated voltage

and the terminal layout. Connecting a power supply that is different from the rating or incorrectly wiring the product could result in fire or damage.

External connections shall be crimped or pressure welded with the specified tools, or correctly

soldered. Imperfect connections could result in short circuit, fires, or erroneous operation.

Tighten the terminal screws with the specified torque. If the terminal screws are loose, it could

result in short circuits, fire, or erroneous operation. Tightening the terminal screws too far may cause damages to the screws and/or the module, resulting in fallout, short circuits, or malfunction.

Be sure there are no foreign substances such as sawdust or wiring debris inside the module.

Such debris could cause fires, damage, or erroneous operation.

The module has an ingress prevention label on its top to prevent foreign matter, such as wire

offcuts, from entering the module during wiring. Do not peel this label during wiring. Before starting system operation, be sure to peel this label because of heat dissipation.

[STARTUP AND MAINTENANCE PRECAUTIONS]

!

DANGER

Do not touch the terminals while power is on.

Doing so could cause shock or erroneous operation.

Correctly connect the battery.

Also, do not charge, disassemble, heat, place in fire, short circuit, or solder the battery . Mishandling of battery can cause overheating or cracks which could result in injury and fires.

Switch all phases of the external power supply off when cleaning the module or retightening the

terminal or module mounting screws. Not doing so could result in electric shock. Undertightening of terminal screws can cause a short circuit or malfunction. Overtightening of screws can cause damages to the screws and/or the module, resulting in fallout, short circuits, or malfunction.

A - 4 A - 4

[STARTUP AND MAINTENANCE PRECAUTIONS]

!

DANGER

The online operations conducted for the CPU module being operated, connecting the peripheral

device (especially, when changing data or operation status), shall be conducted after the manual has been carefully read and a sufficient check of safety has been conducted. Operation mistakes could cause damage or problems with of the module.

Do not disassemble or modify the modules.

Doing so could cause trouble, erroneous operation, injury, or fire.

Use any radio communication device such as a cellular phone or a PHS phone more than 25cm

(9.85 inch) away from the PLC. Not doing so can cause a malfunction.

Switch all phases of the external power supply off before mounting or removing the module.

If you do not switch off the external pow er supply , it will cause failur e or malfunction of t he module.

Do not drop or give an impact to the battery installed in t he module.

Otherwise the battery w ill be broken, possibly causing inter nal leakage of electrolyt e. Do not use but dispose of the battery if it has fallen or an impact is given to it .

[DISPOSAL PRECAUTIONS]

!

CAUTION

When disposing of this product, treat it as industrial waste.

A - 5 A - 5

REVISIONS

The manual number is given on the bottom left of the back cover.

Print Date Manual Number Revision Dec., 1999 SH(NA)-080037-A First edition Sep., 2000 SH(NA)-080037-B

Addition model Q33B, Q63B, Q63P

Addition Section 2.3, 4.5, 11.2.3, 11.2.10, 11.2.11

Partial correction Section 1.2, 2.2, 4.1, 4.2, 5.1.1, 5.2, 8.1.5, 11.2.1, 11.3.2, 11.5.1, 11.6,

11.7

Jun., 2001 SH(NA)-080037-C

Addition model Q62P, Q52B, Q55B, QC05B

Addition Section 6.6

Partial correction Section 2.1, 2.2, 4.1, 4.2, 5.1.5, 6.1, 6.2, 6.3, 8.1.5, 11.2.4, 11.7

Sep., 2001 SH(NA)-080037-D

Addition model Q64P Partial correction CONTENTS, Section 4.1, 5.1.1, 5.1.2, 5.2, 6.1, 6.2, 8.1.5, 11.5.1,

Appendix1.2, 2.2

Apr., 2002 SH(NA)-080037-E

Partial correction Chapter 1, Section 1.1, 2.1, 2.2, 2.3, 4.1, 5.1.1, 7.1, 7.2, 7.3, 10.3.1,

10.3.2

Oct., 2002 SH(NA)-080037-F

Complete review Addition model Q32SB, Q33SB, Q35SB, Q61SP

Japanese Manual Version SH-080019-I

This manual confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses. Mitsubishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may occur as a result of using the contents noted in this manual.

1999 MITSUBISHI ELECTRIC CORPORATION



A - 6 A - 6

INTRODUCTION

Thank you for choosing the Mitsubishi MELSEC-Q Series of General Purpose Programmable Controllers. Please read this manual carefully so that equipment is used to its optimum.

About Manuals

The following manuals are related to this product. Referring to this list, please request the necessary manuals.

Related Manuals

Manual Name

High Performance model QCPU (Q Mode) User's M anual (Function Explanation, Program Fundamentals)

This manual explains the functions, programming methods, devices and so on necessary to create programs with the High Performance model QCPU. (sold separately)

Manual Number

(Model Code)

SH-080038

(13JL98)

QCPU (Q Mode)/QnACPU Programming Manual (Common Instructions)

This manual describes how to use the sequence instructions, basic instructions and application instructions. (sold separately)

QCPU (Q Mode)/QnACPU Programming Manual (PID Control Instructions)

This manual describes the dedicated instructions used to exercise PID control. (sold separately)

QCPU (Q Mode)/QnACPU Programming Manual (SFC)

This manual explains the system configuration, performance specifications, functions, programming, debugging, error codes and others of MELSAP3. (sold separately)

QCPU (Q Mode) Programming Manual (MELSAP-L)

This manual describes the programming methods, specifications, functions, and so on that are necessary to create the MELSAP-L type SFC programs. (sold separately)

SH-080039

(13JF58)

SH-080040

(13JF59)

SH-080041

(13JF60)

SH-080076

(13JF61)

A - 17 A - 17

How to Use This Manual

This manual is prepared for users to understand the hardware specifications of those modules such as the CPU modules, power supply modules, and base units, maintenance and inspections of the system, and troubleshooting required when you use MELSEC-Q series PLCs.

The manual is classified roughly into three sections as shown below.

1) Chapters 1 and 2 Describe the outline of the CPU module and the system configuration. The basics of the system configuration of CPU module are described.

2) Chapters 3 to 7 Describe the general specifications indicating the operating environments of the CPU module, power supply module, and base units, and the performance specifications of these modules.

3) Chapters 8 to 10 Describe the overall maintenance such as the installation of the CPU module, daily inspections, and troubleshooting.

REMARK

This manual does not explain the functions of the CPU module. For these functions, refer to the manual shown below.

• High Performance model QCPU (Q Mode) User's Manual (Function Explanation, Program Fundamentals)

A - 18 A - 18

About the Generic Terms and Abbreviations

This manual uses the following general names and abbreviations in the descriptions of the High Performance model QCPU unless otherwise specified.

Generic Term/Abbreviation Description

High Performance model QCPU

Q Series Abbreviation for Mitsubishi MELSEC-Q Series Programmable Logic Controller. AnS Series GX Developer General name for GX Developer Version 4 or later.

Q3 B

Q3 SB

Q5 B Q6 B QA1S6 B

Main base unit

Slim type main base unit

Extension base unit General name for Q5 B, Q6 B and QA1S6 B. SRAM card Abbreviation for Q2MEM-1MBS, Q2MEM-2MBS type SRAM card. Flash card General name for Q2MEM-2MBF and Q2MEM-4MBF types Flash card.

ATA card Memory card General name for SRAM card, Flash card and ATA card. Power supply module Slim type power supply module General name for Q61SP slim type power supply module Battery

Extension cable

General name for Q02CPU, Q02HCPU, Q06HCPU, Q12HCPU, and Q25HCPU modules.

Abbreviation for small types of Mitsubishi MELSEC-A Series Programmable Logic Controller.

General name for Q33B, Q35B, Q38B, Q312B type main base unit with High Performance model QCPU and Q Series power supply module, I/O module and intelligent function module attachable. General name for Q32SB, Q33SB, Q35SB slim type main base unit with High Performance model QCPU and slim type power supply module, I/O module and intelligent function module attachable. General name for Q52B and Q55B type extension base unit with Q Series I/O module and intelligent function module attachable. General name for Q63B, Q65B, Q68B and Q612B type extension base unit with Q Series power supply module, I/O module and intelligent function module attachable. General name for QA1S65B and QA1S68B type extension base unit with AnS Series power supply module, I/O module and special function module attachable. General name for Q33B, Q35B, Q38B, Q312B type main base unit with High Performance model QCPU and Q Series power supply module, I/O module and intelligent function module attachable. General name for Q32SB, Q33SB, Q35SB slim type main base unit with High Performance model QCPU and slim type power supply module, I/O module and intelligent function module attachable.

General name for Q2MEM-8MBA, Q2MEM-16MBA and Q2MEM-32MBA types ATA card.

General name for Q61P-A1, Q61P-A2, Q62P, Q63P, Q64P, A1S61PN, A1S62P and A1S63P types power supply module.

General name for battery for Q6BAT type CPU module and Q2MEM-BAT type SRAM card. General name for QC05B, QC06B, QC12B, QC30B, QC50B, QC100B type extension cable.

A - 19 A - 19

1 OVERVIEW

MELSEC-Q

1

This Manual describes the hardware specifications and handling methods of the High Performance model QCPU. The Manual also describes those items related to the specifications of the power supply module, main base unit, extension base unit, extension cable, memory card and battery.

Functions are added when the High Performance model QCPU is updated. The added functions can be discriminated by the function version/serial number of the CPU module. Table 1.1 gives the added functions and the corresponding GX Developer versions. When using the added function, confirm the function version/serial number and the GX Developer version.

Table 1.1 List of Functions Added to High Performance Model QCPU and Function

Versions/Serial Numbers

Function

version

A

B

Update Details of High Performance Model QCPU

Serial No. Added functions

• Automatic write to standard ROM

• Enforced ON/OFF for external I/O

• Remote password setting

02092" or later

"

— • Compatibility with the multiple CPU system Version 6 or later

03051" or later

"

04012" or later

"

• Increased standard RAM capacity of Q12HCPU, Q25HCPU

• Compatibility with MELSECN ET /H remote I/O network

• Interrupt module (QI60) compatibility

• Installation of PC CPU module into the multiple CPU system

• High speed interrupt function

• Compatibility with index modification for module designation of dedicated instruction

• Selection of refresh item for COM instruction

• Extended life battery of SRAM card

• Compatibility with 2Mbyte SR AM card

• Increased standard RAM capacity of Q02HCPU, Q06HCPU

Corresponding

GX Developer

Version 6 or later

Version 7 or later

Version 7.10L or later

POINT

(1) For the details of the added functions in Table 1.1, refer to the High

Performance model QCPU (Q mode) User's Manual (Function Explanation, Program Fundamentals).

(2) Refer to Section 2.3 for the serial No. and function version of the High

Performance model QCPU.

1 - 1 1 - 1

1 OVERVIEW

MELSEC-Q

1.1 Features

High Performance model QCPU has the following new features:

(1) Controllable multiple I/O points

All High Performance model QCPUs support 4096 points (X/Y0 to FFF) as the number of actual I/O points capable of getting access to the I/O module installed on the base unit. They also support 8192 points max. (X/YO to 1FFF) as the number of I/O devices which can be used in the remote I/O stations such as MELSECNET/H remote I/O NET, CC-Link data link and MELSECNET/MINI-S3 data link.

(2) Lineup according to progr am capaci ty

The optimum CPU module for the program capacity to be used can be selected. Q02CPU, Q02HCPU : 28k step Q06HCPU : 60k step Q12HCPU : 124k step Q25HCPU : 252k step

(3) Realised high speed processing

Depending on the type of the sequencer, high speed processing has been realized.(Example: when LD instruction is used) Q02CPU : 0.079 Q02HCPU, Q06HCPU, Q12HCPU, Q25HCPU : 0.034

In addition, an access to the intelligent function module or an increase in speed of the link refresh of the network have been realized by the connection system (System bus connection) of the newly developed base unit. Access to the intelligent function module : 20 MELSECNET/H link refresh processing : 4.6ms/8k word (approx. 4.3 times)

1: Where Q02HCPU is compared with Q2ASHCPU-S1.

s /word (approx. 7 times) 1

s s

(4) Increase in debugging efficiency thr oug h high speed

communication with GX Dev el oper

In the High Performance model QCPU, a time required for writing/reading of a program or monitoring has been reduced through the high speed communication at a speed of 115.2kbps max. by the RS-232, and a communication time efficiency at the time of debugging has been increased. In the Q02HCPU, Q06HCPU, Q12HCPU, and Q25HCPU, a high speed communication at a speed of 12Mbps is allowed through the USB.

26k step program transfer time

1

Q25HCPU(USB)

Q25HCPU(RS-232)

Q2ASHCPU

A2USHCPU-S1

12

30

0 1020304050607080

86

94

90 100

(Unit:s)

(5) AnS series I/O module or special function module are available.

For Q series, if an appropriate module is not available, the AnS series I/O module or special function module can also be used for the High Performance model QCPU through the use of the QA1S65B/QA1S68B extension base unit.

1 - 2 1 - 2

1 OVERVIEW

Comparison of installation space

98mm

(3.86 inch)

(6) Saved space by a reduction in si z e

The installation space for Q series has been reduced by approx. 60 % of the space for AnS series.

1SX10 1SY50 1SX41 1SY41 1SX81 1SY81 1SX42 1SY42

PULL

MELSEC-Q

5 Slot Main Base Unit 245mm(9.65inch)

8 Slot Main Base Unit 328mm(12.92inch)

12 Slot Main Base Unit 439mm(17.30inch)

(depth:98mm(3.86inch))

(7) Connection of up to seven extension base units.

(a) The High Performance model QCPU can connect to seven extension base

units (eight base units including the main) and accept up to 64 modules.

(b) The overall distance of the extension cables is up to 13.2m to ensure high

degree of extension base unit arrangement.

(8) Memory extension by memory card

The High Performance model QCPU is provided with a memory card installation connector to which a memory card of 32 Mbyte max. can be connected (32 Mbyte is available when a ATA card is used). When a memory card of large capacity is installed, a large capacity of file can be controlled, comments to all data devices can be set up, and the programs in the past can be stored in the memory as they are in the form of the corrected histories. If a memory card is not installed, a program can be stored onto the standard ROM built in the CPU module, and file registers can be handled by the standard RAM.

REMARK

• The number of file registers that can be handled changes depending on the function version/serial number of the CPU module used.

CPU Module Type Number of File Registers

Q02CPU 32k points

First 5 digits of serial number are "04011" or earlier 32k points Q02HCPU

Q06HCPU

Q25HCPU

First 5 digits of serial number are "04012" or later 64k points First 5 digits of serial number are "02091" or earlier 32k points Q12HCPU First 5 digits of serial number are "02092" or later 128k points

Refer to Section 2.3 to confirm the function version and serial number of the High Performance model QCPU.

1 - 3 1 - 3

1 OVERVIEW

MELSEC-Q

(9) Data can be written automatical ly to standard ROM

You need not use GX Developer to write parameters/programs on a memory card to the standard ROM of the High Performance model QCPU. When the standard ROM is used to perform ROM operation, you can load a memory card into the High Performance model QCPU and write parameters/programs on the memory card to the standard ROM. Hence, you need not carry GX Developer (personal computer) to rewrite the parameters/programs.

(10) External I/O can be turned ON/OFF forcibly

If the High Performance model QCPU is in the RUN mode, you can operate GX Developer to turn external inputs/outputs ON/OFF forcibly, independently of the program execution status. You need not put the High Performance model QCPU in the STOP mode to perform wiring/operation tests by forced ON/OFF of outputs.

(11) Remote password can be set

When access to an Ethernet module or serial communication module is made externally, whether access to the High Performance model QCPU can be made or not can be selected with a remote password.

(12) Remote I/O network of MELSECNET/H can be configured

You can load the remote master station of the MELSECNET/H to configure an MELSECNET/H remote I/O system.

REMARK

• Features (9) to (12) are functions added to the High Performance model QCPU whose serial number is "02092" or later in its upper 5 digits.

• The remote password facility can be executed when the Ethernet module or serial

communication module of function version B and GX Developer Version 6 or later are used.

• In addition to the remote password, there are the following protection facilities for

the High Performance model QCPU. (a) Protection of the whole CPU module by making system protection settings of

the High Performance model QCPU

(b) Protection of the memory card by setting the write protect switch of the memory

card

(c) File-by-file protection using password

• The MELSECNET/H remote I/O network facility can be executed when the

MELSECNET/H network module of function version B and GX Developer (Version 6 or later) are used.

1 - 4 1 - 4

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

MELSEC-Q

2.1 System Configuration

2

Memory card

(Q2MEM-1MBS,Q2MEM-2MBS,

Q2MEM-2MBF,Q2MEM-4MBF,

Q2MEM-8MBA,Q2MEM-16MBA,

Q2MEM-32MBA)

This section describes the system configuration of the High Performance model QCPU, cautions on use of the system, and configured equipment.

The outline of the equipment configuration, configuration with peripheral devices, and system configuration in the High Performance model QCPU system is described below.

(1) Equipment configuration

(a) If the main base unit (Q3B) is used

MITSUBISHI

LITHIUM BAT TERY

1

High Performance model QCPU

(Q02CPU,Q02HCPU,Q06HCPU,

Q12HCPU,Q25HCPU)

Main base unit

(Q33B, Q35B,Q38B,Q312B)

Battery

(Q6BAT)

Power supply module ,

I/O module , Inte l l igent function

module of the Q Series

Extension of the AnS Series module Extension of the Q Series module

2

QA1S6 extension base unit

(QA1S65B,QA1S68B)

Extension cable

(QC05B,QC06B,QC12B,

QC30B, QC50B,QC100B)

Q5 B extension base unit

(Q52B, Q55B)

Q6 B extension base unit

(Q63B, Q65B,Q68B,Q612B)

Power supply module ,

I/O module , Intelligent function

module of the AnS Series

POINTS

1: The number of memory cards to be installed is one sheet.

The memory card must be selected from SRAM card, Flash card, and ATA

Power supply module ,

I/O module , Inte l l igent function

module of the Q Series

3

4

card according to the application and capacity. With commercial memory cards, the Operation is not assured.

2: QA1S65B and QA1S68B extension base units are used for the power supply

module, I/O module, and special function module of the AnS series.

3: The Q series power supply module is not required for the Q5 B type

extension base unit.

4: Q61SP cannot be used for the power supply module.

Use Q61P-A1, Q61P-A2, Q62P, or Q64P for the power supply module.

2 - 1 2 - 1

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

(b) If the slim type main base unit (Q3SB) is used

MITSUBISHI

(Q2MEM-1MBS,Q2MEM-2MBS,

Memory card

Q2MEM-2MBF,Q2MEM-4MBF,

Q2MEM-8MBA,Q2MEM-16MBA,

Q2MEM-32MBA)

*1

High Performance model QCPU

(Q02CPU,Q02HCPU,Q06HCPU,

Q12HCPU,Q25HCPU)

MELSEC-Q

MITSUBISHI

LITHIUM BATTERY

Battery

(Q6BAT)

Slim type main base unit (Q32SB,Q33SB,Q35SB)

*2

Slim type power supply module,

I/O module ,

Intelligent function module

POINTS

*3

1: The number of memory cards to be installed is one sheet.

The memory card must be selected from SRAM card, Flash card, and ATA card according to the application and capacity. With commercial memory cards, the Operation is not assured.

2: The slim type main base unit does not have an extension cable connector. The

extension base unit and GOT cannot be connected.

3: Q61P-A1, Q61P-A2, Q62P, or Q64P cannot be used for the power supply

module. Use Q61SP for the power supply module.

2 - 2 2 - 2

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

(2) Configuration of peripheral devices

MITSUBISHI

MELSEC-Q

Memory card 1

(Q2MEM-1MBS,Q2MEM-2MBS,

Q2MEM-2MBF,Q2MEM-4MBF,

Q2MEM-8MBA,Q2MEM-16MBA,

Q2MEM-32MBA)

PC card adapter

(Q2MEM-ADP)

High Performance model QCPU

(Q02CPU,Q02HCPU,Q06HCPU,

Q12HCPU,Q25HCPU)

RS-232 cable

(QC30R2)

Personal Computer

GX Developer Version 4 or later

(SW4D5C-GPPW-E or later)

USB cable 1

(To be procured yourself)

Only Q02HCPU, Q06HCPU Q12HCPU and Q25HCPU can be used.

1: For how to write data to the memory card and the details of the USB cable, refer to

the GX Developer Operating Manual.

2 - 3 2 - 3

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

(3) Outline of system configuration

(a) If the main base unit (Q3B) is used

Main base unit(Q312B)

Power supply module

01234567891011

Extension cable

O U T

001F203F405F607F809FA0BFC0DFE0FF100

CPU module

11F

120

13F

140

15F

Extension base unit(Q612B)

1st extension stage

Power supply module

1E0

1C0

180

1A0

O

I

U

N

T

19F

1BF

1DF

1FF

200

21F

220

23F

240

25F

260

27F

280

29F

2A0

2BF

2221201918171615141312

2C0

2DF

23

2E0

2FF

Extension base unit(Q68B)

Power supply module

320

300

O

I

U

N

T

33F

31F

340

35F

360

37F

380

39F

3A0

3BF

3C0

3DF

3130292827262524

3E0

3FF

5th extension stage

System configuration

2nd extension stage

Extension base unit(Q68B)

3rd extension stage

Power supply module

420

400

O

I

U

N

T

43F

41F

440

45F

460

47F

480

49F

4A0

4BF

4C0

4DF

3938373635343332

4E0

4FF

6th extension stage

Extension base unit(Q65B)

Maximum number of Extension Stages

4th extension stage

Power supply module

520

500

O

I

U

N

T

53F

51F

540

55F

4443424140

580

560

59F

57F

Seven Extension Stages

7th extension stage

Maximum number of I/O modules to be

64 modules installed Maximum number of occupied I/O points

4096

Main base unit Q33B, Q35B, Q38B, Q312B Extension base unit Q52B, Q55B, Q63B, Q65B, Q68B, Q612B, QA1S65B, QA1S68B Extension cable QC05B, QC06B, QC12B, QC30B, QC50B, QC100B

(1) Extension bases unit of up to seven stages can be used. (2) Do not use extension cable longer than an overall extension length of 13.2m(43.31ft.). (3) When using an extension cable, do not bind it together with the main circuit (high voltage and

heavy current) line or do not lay down them closely to each other.

(4) When setting the No. of the expansion stages, set it in the ascending order so that the same

No. is not set simultaneously by two extension base units.

(5) When Q5

B, Q6 B and QA1S6 B types of extension base units are mix ed, first connect the Q5 B, Q6 B type and then connect the QA1S6 B type. When setting the No. of the extension stages, set it from Q5

Notes

Although there are no particular restrictions in the order of the installation of the Q5 Q6 B, refer to Section 6.6 for usability.

(6) Connect the extension cable from OUT of the ex tension cable connector of the base unit to IN

of the extension base unit on the next stage.

(7) If 65 or more modules are installed, an error will occur. (8) When the GOT is bus-connected, it occupies one extension stage and one slot. (9) The High Performance model QCPU processes the GOT as a 16-point intelligent function

module. Hence, connecting one GOT decreases 16 points available for the base unit.

(10) Q61SP cannot be used for the power supply module.

Use Q61P-A1, Q61P-A2, Q62P, or Q64P for the power supply module.

160

17F

Slot No.

The figure shows the configuration when 32-I/O modules are loaded to each slot.

Extension base unit(QA1S68B)

Power supply module

600

5E0

5C0

5A0

O

I

U

N

T

5BF

5DF

5FF

61F

Extension base unit(QA1S68B)

Power supply module

700

6E0

6C0

6A0

O

I

U

N

T

6BF

6DF

6FF

71F

Extension base unit(QA1S65B)

Power supply module

636261

7E0

7C0

7A0

O

I

U

N

T

7FF

7DF

7BF

When module is installed, an error occurs.

B/Q6 B in order.

MELSEC-Q

5251504948474645

680

660

640

620

69F

67F

65F

63F

6059585756555453

780

760

740

720

79F

77F

75F

73F

Prohibit

B and

2 - 4 2 - 4

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

(b) If the slim type main base unit (Q3SB) is used

Slim type main base unit (Q35SB)

01234

001F203F405F607F80

Slot No.

MELSEC-Q

System configuration

The above system assumes that each slot is loading with a 32-point module.

Maximum number of Extension Stages

CPU module

Power supply

module

No extension allowed

9F

Maximum number of I/O modules to be

5 modules installed Maximum number of occupied I/O points

4096

Main base unit Q32SB, Q33SB, Q35SB Extension base unit Cannot be connected. Extension cable C annot be connected.

(1) Q61P-A1, Q61P-A2, Q62P, or Q64P cannot be used for the power supply module.

Notes

Use Q61SP for the power supply module.

(2) The slim type main base unit does not have an extension cable connector.

The extension base unit and GOT cannot be connected.

2 - 5 2 - 5

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

MELSEC-Q

2.2 Precaution on System Configuration

This section describes hardware and software packages compatible with QCPU.

(1) Hardware

(a) The number of modules to be installed and functions are limited depending on

the type of the modules.

Applicable Module Type

• QJ71LP21

Q Series MELSECNET/H network module

Q series Ethernet interface module

Q series CC-Link system master local module

MELSECNET/MIN I-S3 data link module

AnS series special function module shown on the right

Interrupt module

• QJ71BR11

• QJ71LP21-25

• QJ71LP21G

• QJ71LP21GE

• QJ71E71

• QJ71E71-B2

• QJ71E71-100

• QJ61BT11 No limit

• A1SJ71PT32-S3

• A1SJ71T32-S3

• A1SD51S

• A1SD21-S1

• A1SJ71J92-S3 (When GET/PUT service is used)

• A1SI61

• QI60

1: A maximum of 4 modules if the network parameters for CC-Link are set and

controlled by the GX Developer. There is no restriction in the number of modules when the parameters are set by the special-purpose instructions for the CC-Link. For details on the CC-Link System Master Local Unit that can set parameters with the special-purpose instructions, refer to the user's manual for the CC-Link Master Local module.

(b) When the AnS series special-function modules shown below are used, a

limitation is given to an accessible device range.

• A1SJ71J92-S3 type JEMANET interface module

• A1SD51S type intelligent communication

Device Accessible device range Input (X), Output (Y) X/Y0 to 7FF Internal relay (M), Latch relay (L) M0 to 8191 Link relay (B) B0 to FFF Timer (T) T0 to 2047 Counter (C) C0 to 1023 Data register (D) D0 to 6143 Link register (W) W0 to FFF Annunciator (F) F0 to 2047

(c) A graphic operation terminal can be used only for the GOT900 series (Basic

OS matching Q mode and communication driver must be installed). The GOT800 series, A77GOT, and A64GOT cannot be used.

2 - 6 2 - 6

Limit of number of modules

to be installed

Up to 4 in total of inter-PLC network and remote I/O network modules

Up to 4 units

1

No limit (setting of automatic refresh function not allowed)

Total of 6 units

One unit only

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

(d) The modules shown below cannot be used.

Module Name Type

MELSECNET/10 network module MELSECNET (II), /B data link module

Ethernet interface module Serial communication module,

computer link module CC-Link master-local module A1SJ61QBT11, A1SJ61BT11 Modem interface module A1SJ71CMO-S3 ME-NET interface module A1SJ71ME81

A1SJ71LP21, A1SJ71BR11, A1SJ71QLP21, A1SJ71QLP21S, A1SJ71QLP21GE, A1SJ71QBR11

A1SJ71AP21, A1SJ71AR21, A1SJ71AT21B A1SJ71QE71-B2-S3(-B5-S3),

A1SJ71E71-B2-S3(-B5-S3) A1SJ71QC24(N), A1SJ71UC24-R2(-R4/-PRF)

(e) A dedicated instruction for the next module which was present in the QnA/A

series program instruction cannot be used for the High Performance model QCPU. Re-writing using FROM/TO instruction is required.

Module Name Type High speed counter module A1SD61, A1SD62, A1SD62D(-S1), A1SD62E MELSECNET/MINI-S3 A1SJ71PT32-S3, A1SJ71T32-S3 Positioning module A1SD75P1-S3(P2-S3/P3-S3) ID module A1SJ71ID1-R4, A1SJ71ID2-R4

(f) Some system configurations and functions are restricted when writing the

parameter of the "High speed interrupt fixed scan interval" setting. Refer to the following manual for the restrictions when the parameter of the "High speed interrupt fixed scan interval" setting has been written.

•

High Performance model QCPU (Q mode) User's Manual

(Function Explanation, Program Fundamentals) Note that the above restrictions do not apply to the High Performance model QCPU of serial number "04011" or earlier since it ignores the "High speed interrupt fixed scan interval" setting.

(2) Software package

GX Developer that can use the functions added to the High Performance model QCPU changes depending on the function version/serial number of the CPU module.

Function Version Serial Number GX Dev eloper

A — Version 4 (SW4D5C-GPPW-E) or later

— Functions added to "02092"

B —

— Functions added to "03052" Version 7 (SW7D5C-GPPW-E) or later — Functions added to "04012"

Refer to Section 2.3 to confirm the function version and serial number of the High Performance model QCPU.

MELSEC-Q

Version 6 (SW6D5C-GPPW-E) or later

Version 7.10L (SW7D5C-GPPW-E) or later

2 - 7 2 - 7

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

2.3 Confirming the Serial Number and Functi on Ver si on

The CPU module serial No. can be confirmed on the rated plate and GX Developer's system monitor.

(1) Confirming the serial N o. on the r ated plate

The serial No. and function version can be confirmed on the rating plate.

MELSEC-Q

MODEL

SERIAL 020920000000000-B

LISTED 80M1

IND. CONT. EQ.

MADE IN JAPAN

Serial No. (First five digits) Function version

(2) Confirming the serial N o. on the sy stem moni tor ( li st of product

information)

The CPU module serial No. and function version can be confirmed with the list of product information on the GX Developer (Version 6 or later) system monitor. Serial Nos. and function versions of the intelligent function module and CPU module can also be confirmed.

Serial number Function version

2 - 8 2 - 8

3 GENERAL SPECIFICATIONS

MELSEC-Q

Item Specifications

Operating ambient temperature Storage ambient temperature

3

Operating ambient humidity Storage ambient humidity

Vibration resistance

Shock resistance Operating ambience No corrosive gases Operating altitude 2000m (6562ft.) max. Installation location Inside control panel Overvoltage category Pollution level 2 2 max.

1

Performance specification of PLC is as follows:

0 to 55°C

-25 to 75°C

5 to 95%RH

Frequency Acceleration Amplitude Sweep count

Conforming

to

JIS B 3502,

IEC 61131-2

Conforming to JIS B 3502, IEC 61131-2 (147 m/s

Under

intermittent

vibration

Under

continuous

vibration

10 to 57Hz ———

57 to 150Hz

10 to 57Hz ———

57 to 150Hz

4, non-condensing

II max.

3

0.075mm

(0.003inch)

———

0.035mm

(0.001inch)

———

2

9.8m/s

2

4.9m/s

2

, 3 times in each of 3 directions X, Y, Z)

10 times each in

X, Y, Z directions

(for 80 min.)

1 : This indicates the section of the power supply to which the equipment is assumed to be connected

between the public electrical power distribution network and the machinery within premises. Category II applies to equipment for which electrical power is supplied from fixed facilities. The surge voltage withstand level for up to the rated voltage of 300 V is 2500 V.

2 : This index indicates the degree to which conductive material is generated in terms of the environment in

which the equipment is used. Pollution level 2 is when only non-conductive pollution occurs. A temporary conductivity caused by

condensing must be expected occasionally. 3 : The storage ambient temperature is -20 to 75°C if the system includes the AnS series modules. 4 : The operating ambient humidity and storage ambient humidity are 10 to 90%RH if the system includes the

AnS series modules. 5 : Do not use or store the PLC under pressure higher than the atmospheric pressure of altitude 0m.

Doing so can cause a malfunction.

When using the PLC under pressure, please contact your sales representative.

3 - 1 3 - 1

3 GENERAL SPECIFICATIONS

MELSEC-Q

MEMO

3

3 - 2 3 - 2

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4.1 Performance Specification

MELSEC-Q

The table below shows the performance specifications of the CPU module.

Performance Specifications

Item

Control method Repetitive operation of stored program

I/O control mode Refresh mode

Q02CPU Q02HCPU Q06HCPU Q12HCPU Q25HCPU

Programming language (Sequence control dedicated language)

(Sequence instruction)

4

Total number of instructions Constant scan

(Function for setting the scan timer to fixed settings) Program 2 capacity

Memory capacity

Maximum number of stored files

Program memory (Drive 0) Program memory (Drive 0) Memory card (RAM) (Drive 1) Memory card (ROM) (Drive 2) Standard RAM (Drive 3) Standard ROM (Drive 4) CPU shared memory

4 Program memory 28 60 124 252 1 Memory card (RAM) 256

card (ROM)

LD X0 0.079 s 0.034 s MOV D0 D1 0.237

Flash card 288 ATA card 512

Relay symbol language, logic symbolic language,

MELSAP3 (SFC), MEL SAP- L , Fu n ction b lo ck

s 0.102 s

(excluding intelligent function module dedicated instructions)

0.5 to 2000 ms (configurable in increments of 0.5 ms)

28k step 60k step 124k step 252k step

112 kbyte 240 kbyte 496 kbyte 1008 kbyte

Capacity of loading memory cards(2Mbyte max.)

Installed memory card capacity

(Flash card: 4 Mbyte max., ATA card: 32 Mbyte max.)

64kbyte 128kbyte

112 kbyte 240 kbyte 496 kbyte 1008 kbyte

Standard RAM 2

Standard ROM number of writings Max. 100000 times Number of I/O device points 8192 points (X/Y0 to 1FFF)

Number of occupied I/O points 4096 points (X/Y0 to FFF)

1:124 is the maximum number of programs that can be executed on High Performance model QCPU. 2: The maximum number of sequence steps that can be executed for one program by the High Performance model QCPU with the

parameters stored in another drive is calculated with the following expression. (Program size) - (File header size (default: 34 steps)) Refer to the High Performance model QCPU User's Manual (Function Explanation, Program Fundamentals) for details on the program size and file.

3: The memory capacity of the Q12HCPU or Q25HCPU whose first five digits of serial No. are "02091" or earlier is 64K bytes.

(Refer to Section 2.3 for the way to confirm the serial No.)

4:The CPU shared memory is not latched. The CPU shared memory is cleared when the power is turned on to the PLC or when the CPU

module is reset.

5:The memory capacity of the Q02HCPU or Q06HCPU whose first five digits of serial No. are "04011" or earlier is 64K bytes.

(Refer to Section 2.3 for the way to confirm the serial No.)

Standard ROM 28 60 124 252

Model

360

5 256kbyte 3

8 kbyte

Remark

Direct I/O is possible by direct I/O specification (DX

, DY )

——

Processing speed

—— ——

——

Set parameter values to

specify

——

For memory capacity, refer to Section 7.1.

——

—— ——

——

Memory

—— ——

Only one file register and one local device

—— ——

Number of devices usable on program Number of points accesible to actual I/O modules

4 - 1 4 - 1

4 HARDWARE SPECIFICATION OF THE CPU MODULE

Performance Specifications (continued)

MELSEC-Q

Internal relay [M] Latch relay [L] Link relay [B]

Timer [T]

Retentive timer [ST]

Counter [C]

Data register [D ] Link register [W] Annunciator [F] Edge relay [V]

Number of device points

File register

Item

[R]

[ZR]

Model

Q02CPU Q02HCPU Q06HCPU Q12HCPU Q25HCPU

Default 8192 points (M0 to 8191)

Default 8192 points (L0 to 8191)

Default 8192points (B0 to 1FFF)

Default 2048 points (T0 to 2047) (for low / high speed timer) Select between low / high speed timer by instructions. The measurement unit of the low / high speed timer is set with parameters. (Low speed timer : 1 to 1000ms, 1ms (High speed timer : 0.1 to 100ms, 0.1ms Default 0 point(for low / high speed retentive timer) Switchover between the low / high speed retentive timer is set by instructions. The measurement unit of the low /high speed retentive timer is set with parameters. (Low speed retentive timer : 1 to 1000ms, 1ms (High speed retentive timer : 0.1 to 100ms, 0.1ms

• Normal counter default 1024 points (C0 to 1023)

• Interrupt counter maximum 256 points (default 0 point, set with parameters)

Default 12288 points (D0 to 12287)

Default 8192 points (W0 to 1FFF)

Default 2048 points (F0 to 2047)

Default 2048 points (V0 to 2047)

• When a standard RAM is used:

Q02CPU..........................32768 points (R0 to 32767)

Q02HCPU, Q06HCPU.....The number of points of up to 65536 points

can be used by block conversion in increments of 32768 points (R0 to 32767)

Q12HCPU, Q25HCPU.....The number of points of up to 131072

points can be used by block conversion in increments of 32768 points (R0 to 32767)

• When a SRAM card (1Mbyte) is used:

The number of points of up to 517120 points can be used by block conversion in increments of 32768 points (R0 to 32767).

• When a SRAM card (2Mbyte) is used: The number of points of up to 1041408 points can be used by block conversion in increments of 32768 points (R0 to 32767).

• When a Flash card (2Mbyte) is used: The number of points of up to 1041408 points can be used by block conversion in increments of 32768 points (R0 to 32767).

• When a Flash card (4Mbyte) is used: The number of points of up to 1042432 points can be used by block conversion in increments of 32768 points (R0 to 32767).

• When a standard RAM is used:

Q02CPU..........................32768 points (ZR0 to 32767)

Q02HCPU, Q06HCPU.....65536 points (ZR0 to 65535), No block

conversion necessary.

Q12HCPU, Q25HCPU.....131072 points (ZR0 to 131071), No block

conversion necessary.

• When a SRAM card (1Mbyte) is used: 517120 points (ZR0 to 517119) , No block conversion necessary.

• When a SRAM card (2Mbyte) is used: 1041408 points (ZR0 to 1041407), No block conversion necessary.

• When a Flash card (2Mbyte) is used: 1041408 points (ZR0 to 1041407), No block conversion necessary.

• When a Flash card (4Mbyte) is used: 1042432 points (ZR0 to 1042431), No block conversion necessary.

, default 100ms)

/unit

, default 10ms)

/uni t

, default 100ms)

/unit

, default 10ms)

/unit

Remark

Number of use points is set with parameters.

When a Flash card is used, read only is possible. The ATA card cannot be used.

4

4 - 2 4 - 2

4 HARDWARE SPECIFICATION OF THE CPU MODULE

Performance Specifications (continued)

MELSEC-Q

Item

Link special relay [SB] 2048 points (SB0 to 7FF) Link special register [SW] 2048 points (SW0 to 7FF) Step relay [S] 8192 points (S0 to 8191) Index register [Z] 16 points (Z0 to 15)

Pointer [P]

Interrupt poin ter [ I ]

Number of device points

Special relay [SM] 2048 points (SM0 to 2047) Special register [SD] 2048 points (SD0 to 2047) Function input [FX] 16 points (FX0 to F) Function output [FY] 16 points (FY0 to F) Function register[FD] 5 points (FD0 to 4)

Link direct device

Intelligent function module device

Latch (power failure compensation) range

Remote RUN/PAUSE contact

Clock function

Allowable momentary power failure period Varies according to the type of power supply module. 5VDC internal current consumption 0.60A 0.64A 0.64A 0.64A 0.64A

External dimensions

Weight 0.20kg 0.20kg 0.20kg 0.20kg 0.20kg

Q02CPU Q02HCPU Q06HCPU Q12HCPU Q25HCPU

4096 points (P0 to 4095), set parameter values to select usable range

of in-file pointer / shared pointers.

The specified intervals of the system interrupt pointers I28 to I31 can

be set with parameters.(0.5 to 1000ms, 0.5 ms

Default I28 : 100ms I29 : 40ms I30 : 20ms I31 : 10ms

Device having a direct access to link device. MELSECNET/10(H) use only. Specified form : J

Device having a direct access to the buffer memory of the intelligent function module. Specified form : U

(Latch range can be set for B, F, V, T, ST, C, D, and W.) RUN and PAUSE contacts can be set from among X0 to 1FFF, respectively. Year, month, day, hour, minute, second, day of the week (leap year automatic distinction) Accuracy -3.18 to +5.25s (TYP. +2.12s) /d at 0° C Accuracy -3.93 to +5.25s(TYP. +1.90s)/d at 25°C Accuracy -14.69 to +3.53s(TYP. -3.67s)/d at 55°C

H 98mm (3.86inch)

W 27.4mm (1.08inch)

D 89.3mm (3.52inch)

\X

J

B

\

Model

256 points (I0 to 255)

, J

L0 to 8191 (default)

\

SW

\

, J

Y

, J

G

\

)

/unit

,

W

\

SB

\

Remark

The number of device points is fixed.

——

Set parameter values to specify

——

—— —— —— —— —— ——

4 - 3 4 - 3

W

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4.2 Part Names and Settings

MELSEC-Q

Q02HCPU

PULL

hen opening the front cover, put your finger here.

This section explains the part names and settings of the module.

Front face

MODE

RUN ERR.

USER

BAT.

BOOT

USB

RS-232

1)

2)

9)

3)

4)

5)

6)

10)

7)

11) 1

12)

8)

With front cover open

MODE

BOOT

STOP RUN

RESET L CLR

RUN ERR.

USER

BAT.

ON SW

1 2 3 4 5

13)

14)

15)

Side face

16)

17)

19)

18)

1: Not provided for Q02CPU.

4 - 4 4 - 4

4 HARDWARE SPECIFICATION OF THE CPU MODULE

No. Name Application

1) Module fixing hook Hook used to fix the module to the base unit. (Single-motion installation) Indicates the mode of the CPU module.

2) "Mode" LED

3) "RUN" LED

4) "ERR." LED

5) "USER" LED

6) "BAT." LED

7) "BOOT" LED

8) Module loading lever Used to load the module to the base unit.

ON (green) : Q mode ON (orange) : A mode Flicker (green) : Enforced ON/OFF for external I/O registered Indicates the operating status of the CPU module. ON : During operation in "RUN" status. OFF : During a stop in "STOP" status or detection of error whose occurrence stops

operation.

Flicker : When parameter/program is written at STOP and RUN/STOP switch is

changed from "STOP" to "RUN". To turn ON the RUN LED after writing the program, carry out the following steps.

Set the RUN/STOP switch from "RUN" → "STOP" → "RUN".

y

Reset with the RESET/L.CLR switch.

y

Restart the PLC power.

y

To turn ON the RUN LED after writing the parameters, carry out the following steps.

Reset with the RESET/L.CLR switch.

y

Restart the PLC power.

y

(If the RUN/STOP switch is set from "RUN" → "STOP" → "RUN" after changing the parameters, the parameters related to the intelligent function module, such as the network parameters, will not be reflected.)

ON : Detection of self-diagnosis error which will not stop operation, except battery

error.

(When operation continued at error detection is set in the parameter.) OFF : Normal Flicker : Detection of error whose occurrence stops operation.

When automatic write to standard ROM is completed normally. ("BOOT" LED

also flickers.) ON : Error detected by CHK instruction or annunciator ON OFF : Normal Flicker : Execution of latch clear ON : Occurrence of battery error due to reduction in battery voltages of CPU module

or memory card. OFF : Normal ON : Start of boot operation OFF : Non-execution of boot operation Flicker : When automatic write to standard ROM is completed normally. ("ERR." LED

also flickers.)

MELSEC-Q

4 - 5 4 - 5

4 HARDWARE SPECIFICATION OF THE CPU MODULE

MELSEC-Q

No. Name Application

9) Memory card EJECT button Used to eject the memory card from the CPU module. Memory card loading

10) connector

11) USB connector 1

12) RS-232 connector 1

DIP switches

ON SW

1

13)

2 3 4 5

14) RUN/STOP switch

15) RESET/L.CLR switch

16) Module fixing screw hole Hole for the screw used to fix to the base unit. (M3 12 screw)

17) Module fixing latch Hook used to fix to the base unit.

18) Battery connector pin

19) Battery

1 : When normally connecting a cable to the USB connector or RS-232 connector, clamp the cable to prevent it from

coming off due to the dangling, moving or carelessly pulling of the cable. Q6HLD-R2 type RS-232 Connector Disconnection Prevention H older is available as a clamp for R S-232 connector.

Connector used to load the memory card to the CPU module. Connector for connection with USB-compatible peripheral device. (Connector type B)

Can be connected by USB-dedicated cable. Not available for Q02CPU. Connector for RS-232 connection Can be connected by RS-232 connection cable (QC30R2). Used to set the items for operation of the CPU module. For system protection and parameter-valid drive functions, refer to the High Performance model QCPU (Q mode) User's Manual (Function Ex planation, Program Fundamentals). SW1 : Used to set system protection. Batch-inhibits write and control directives to the

CPU module. (Shipped in OFF position) OFF : No protection ON : Protection SW2, SW3: Used to specify parameter-valid drive.

(Both SW2 and SW3 are shipped in OFF position) SW2 SW3 Parameter Drive OFF OFF Program memory (Drive 0)

ON OFF SRAM card (Drive 1)

OFF ON Flash card/ATA card (Drive 2)

ON ON Standard ROM (Drive 4)

Note: Parameters cannot be stored in standard RAM (Drive 3). SW4 : Must not be used. Normally OFF. (Shipped in OFF position) SW5 : Must not be used. Normally OFF. (Shipped in OFF position) RUN : Executes sequence program operation. STOP : Stops sequence program operation. RESET : Used to perform hardware reset, operation fault rest, operation initialization,

etc. If this switch is left in the RESET position, the whole system w ill be reset and the system will not operate properly. After performing reset, always return this switch to the neutral position.

L.CLR : Used to turn "OFF" or "zero" all data in the parameter-set latch area.

Used to clear the sampling trace and status latch registration.

For connection of battery lead wires. (When shipped from the factory, the lead wires are disconnected from the connector to prevent the battery from consuming.) Backup battery for use of program memory, standard RAM and power failure compensation function.

CPU module

Q6HLD-R2

RS-232 cable

4 - 6 4 - 6

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4.3 Switch Operation After Writing in Program

When writing a program into the CPU module, do not turn off the system protect set switch SW1 in advance (When the switch is turned off, the system will not be protected).

(1) When a program is written whil e CPU modul e i s stopped:

When a program is written while the CPU module is stopped, operate the switch in the order shown below.

1) RUN / STOP switch : STOP "RUN" LED: Turns off CPU module in stop status

2) RESET / L.CLR switch : Tilt this switch to RESET once, and return it to the

original center position.

3) RUN / STOP switch : STOP "RUN" LED: Turns on CPU module in running status

RUN

(2) When a program is written whil e C PU modul e is r unni ng :

When a program is written while the CPU module is running, the switch need not be operated.

POINTS

(1) Even if the RUN/STOP switch is set to RUN immediately after a program is

written when the CPU module is in the stop status, CPU module will not come into RUN status. When the CPU module is reset with the RESET / L.CLR switch and the RUN/STOP switch is set to RUN after a program has been written, the CPU module can be brought into RUN status.

(2) If the CPU module is desired to be brought into RUN status without resetting it,

operate the RUN/STOP switch from STOP to RUN, RUN to STOP, and STOP to RUN in that order. After the seconds STOP to RUN switch operation, the CPU module is brought into RUN status.

(3) When a program is written while the CPU module is running in boot operation,

the program written during the running is written into the program memory. After a program has been written while the CPU module is running, write the program also into the boot original memory. Failure to write a program into the boot original memory will run an old program at the time of the next boot operation. (For details of the boot operation, refer to the High Performance model QCPU (Q mode) User's Manual (Function Explanation, Program Fundamentals) ).

MELSEC-Q

Write a program.

4 - 7 4 - 7

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4.4 Latch Clear Operation

To perform latch clear, operate the RESET/L.CLR switch in the following procedure.

1) RUN/STOP switch : STOP

2) RESET/L.CLR switch : Move the switch to L.CLR several times until the

USER LED flickers.

"USER" LED: Flicker Ready for latch clear.

3) RESET/L.CLR switch : Move the switch to L.CLR once more. "USER" LED: OFF Latch clear complete.

POINTS

(1) The ineffective range for latch clear can be set for each device by the device

setting parameter.

(2) In addition to the way of using the RESET/L.CLR switch for latch clear, remote

latch clear may be performed from GX Developer. For details of the remote latch clear operation using GX Developer, refer to the High Performance model QCPU (Q mode) User's Manual (Function Explanation, Program Fundamentals).

4.5 Executing Automatic Write to Standard ROM.

MELSEC-Q

(1) Order of execution for automatic write to standard ROM

Automatic write to the standard ROM is carried out with the following procedures. (a) Operation with GX Developer (setting automatic write to standard ROM)

1) Check the ROM Set the parameter and program to be booted at the "Boot file setting" section. (Set the "Transfer from" to "Standard ROM".)

"

Auto Download all Data from Memory card to Standard

"

item in the PLC parameter boot file setting.

Check "Auto Download all Data from Memory card to Standard ROM ".

Set the "Transfer from" to "Standard ROM".

2) Store the set parameters and programs to be booted in the memory

4 - 8 4 - 8

card.

4 HARDWARE SPECIFICATION OF THE CPU MODULE

(b) Operations with CPU module (automatic write to standard ROM)

1) Switch OFF the power supply to the PLC.

2) Mount the memory card that contains the parameters and programs to be booted onto the CPU module.

3) Set the parameter's valid drive in the mounted memory card with the CPU module's dip switches.

• When a SRAM card is mounted: SW2 : ON, SW3 : OFF

• When a Flash card/ATA card is mounted: SW2 : OFF, SW3 : ON

4) Switch on the power supply to the PLC.

5) "BOOT" LED will flicker when automatic write to standard ROM has been completed, and the CPU module will assume a suspension error status.

6) Switch OFF the power supply to the PLC.

7) Remove the memory card, and then set the parameter's valid drive in the standard ROM with the CPU module's dip switches.

• Standard ROM: SW2 : ON, SW3 : ON

(c) The parameters and programs will be booted from the standard ROM to the

program memory when the PLC is switched on to enable actual operations.

MELSEC-Q

4 - 9 4 - 9

5 POWER SUPPLY MODULE

MELSEC-Q

5 POWER SUPPLY MODULE

5.1 Specification

5.1.1 Power supply module specifications

Item Base loading position Power supply module loading slot

Applicable base unit Q3B, Q6B

Input power supply

Input frequency 50/60Hz ±5% —— Input voltage distortion factor Within 5% (refer to section 5.1.3) —— Max. input apparent power 105VA —— Max. input power —— 45W Inrush current 20A within 8ms 100A within 1ms

current External output voltage —— 24VDC ±10% ——

protection

protection Efficiency 70% or more 65% or more 70% or more Allowable momentary power failure

period Dielectric withstand voltage

Insulation resistance

Noise durability

Operation indication LED indication (lit at 5VDC output) Fuse Built-in (Unchangeable by user)

Contact output section

Terminal screw size M3.5 × 7 Applicable wire size 0.75 to 2mm2 Applicable solderless terminal RAV1.25 to 3.5, RAV2 to 3.5 Applicable tightening torque 66 to 89N•cm

External dimensions

Weight 0.31kg 0.39kg 0.33kg

1

2

3

Application Rated switching voltage,

current Minimum switching load 5VDC, 1mA Response time OFF to ON: 10ms max. ON to OFF: 12ms max.

Life Surge suppressor No

Fuse No

This section gives the specifications of the power supply modules.

Performance Specifications

Q61P-A1 Q61P-A2 Q62P Q63P

100 to 120VAC

(85 to 132VAC) (170 to 264VAC) (85 to 264VAC) (15.6 to 31.2VDC)

5VDC 6A 3A 6A Rated output 24VDC —— 0.6A ——

5VDC 6.6A or more 3.3A or more 6.6A or more Overcurrent 24VDC —— 0.66A or more —— 5VDC 5.5 to 6.5V Overvoltage 24VDC ——

Across inputs/LG and outputs/FG 2830VAC rms/3 cycles (2000 m (6562 ft.)) Across inputs and outputs (LG and FG separated), across inputs and LG/FG, across outputs and FG/LG 10M or more by insulation resistance tester

• By noise simulator of 1500Vp-p noise voltage, 1 to 60Hz noise frequency

• Noise voltage IEC61000-4-4, 2kV

ERR contact (contact switched off (opened: normally closed contact) at an error stop of CPU module), for CPU module operating status output

Mechanical : More than 2 million times Electrical : More than 100 thousand times at rated switching voltage, current

H 98mm (3.86inch) W 55.2mm (2.33inch) D 90mm (3.55inch)

+10%

-15%

200 to 240VAC

Within 20ms

+10%

100 to 240VAC

-15%

s noise width and 25

24VDC, 0.5A

+10%

-15%

24VDC

Within 10ms

(at 24VDC input)

500VAC across

primary and 5VDC

10M

insulation resistance

By noise simulator of 500Vp-p noise voltage, 1

s noise width and 25 to 60Hz noise frequency

+30%

-35%

or more by

tester

5

5 - 1 5 - 1

5 POWER SUPPLY MODULE

Item

Base loading position Power supply module loading slot Applicable base unit Q3B, Q6B

Input power supply

Input frequency 50/60Hz ±5% Input voltage distortion factor Within 5% (refer to section 5.1.3) Max. input apparent power 160VA Inrush current 20A within 8ms

current

protection*1

protection*2 Efficiency 70% or more Allowable momentary power failure

period*3

5

Dielectric withstand voltage

Insulation resistance

Noise durability

Operation indication LED indication (lit at 5VDC output) Fuse Built-in (Unchangeable by user)

Contact output section

Terminal screw size M3.5 × 7 Applicable wire size 0.75 to 2mm2 Applicable solderless terminal RAV1.25 to 3.5, RAV2 to 3.5 Applicable tightening torque 66 to 89N•cm

External dimensions

Weight 0.40kg

Application Rated switching voltage,

current Minimum switching load 5VDC, 1mA Response time OFF to ON: 10ms max. ON to OFF: 12ms max.

Life Surge suppressor No

Fuse No

H 98mm (3.86inch) W 55.2mm (2.33inch) D 115mm (4.53inch)

Power Supply Module Specifications (Continued)

Performance Specifications

Q64P

100 to 120VAC/200 to 240VAC

(85V to 132VAC/170 to 264VAC)

5VDC 8.5A Rated output 24VDC —— 5VDC 9.9A or more Overcurrent 24VDC —— 5VDC 5.5 to 6.5V Overvoltage 24VDC ——

Within 20ms

Across inputs/LG and outputs/FG 2830VAC rms/3 cycles (2000 m (6562 ft.)) Across inputs and outputs (LG and FG separated), across inputs and LG/FG, across outputs and FG/LG 10M

• By noise simulator of 1500Vp-p noise voltage, 1 frequency

• Noise voltage IEC61000-4-4, 2kV

ERR contact (contact switched off (opened: normally closed contact) at an error stop of CPU

Mechanical : More than 2 million times Electrical : More than 100 thousand times at rated switching voltage, current

or more by insulation resistance tester

module), for CPU module operating status output

24VDC, 0.5A

MELSEC-Q

+10%

-15%

s noise width and 25 to 60Hz noise

5 - 2 5 - 2

5 POWER SUPPLY MODULE

Item

Base loading position Slim type power supply module loading slot Applicable base unit Q3SB

Input power supply

Input frequency 50/60Hz ±5% Input voltage distortion factor Within 5% (refer to section 4.3.1) Max. input apparent power 40VA Inrush current 20A within 8ms

5VDC 2A Rated output

current

protection*1

protection*2 Efficiency 70% or more Allowable momentary power failure

period*3 Dielectric withstand voltage

Insulation resistance

Noise durability

Operation indication LED indication (lit at 5VDC output) Fuse Built-in (Unchangeable by user)

Contact output section

Terminal screw size M3.5 × 7 Applicable wire size 0.75 to 2mm2 Applicable solderless terminal RAV1.25 to 3.5, RAV2 to 3.5 Applicable tightening torque 66 to 89N•cm

External dimensions

Weight 0.18kg

24VDC —— 5VDC 2.2A or more Overcurrent 24VDC —— 5VDC 5.5 to 6.5V Overvoltage 24VDC ——

Across inputs/LG and outputs/FG 2830VAC rms/3 cycles (2000 m (6562 ft.)) Across inputs and outputs (LG and FG separated), across inputs and LG/FG, across outputs and FG/LG 10M

• By noise simulator of 1500Vp-p noise voltage, 1

frequency

• Noise voltage IEC61000-4-4, 2kV

Application Rated switching voltage,

current Minimum switching load 5VDC, 1mA Response time OFF to ON: 10ms max. ON to OFF: 12ms max.

Life Surge suppressor No

Fuse No

H 98mm (3.86inch) W 27.4mm (1.08inch) D 104mm (4.09inch)

ERR contact (contact switched off (opened: normally closed contact) at an error stop of CPU

Mechanical : More than 20 million times Electrical : More than 100 thousand times at rated switching voltage, current

or more by insulation resistance tester

module), for CPU module operating status output

Performance Specifications

Q61SP

100 to 240VAC

(85 to 264VAC)

+10%

-15%

Within 20ms

s noise width and 25 to 60Hz noise

24VDC, 0.5A

MELSEC-Q

5 - 3 5 - 3

5 POWER SUPPLY MODULE

MELSEC-Q

Item

Base loading position Power supply module loading slot Applicable base unit QA1S65B, QA1S68B

Input power supply

Input frequency 50/60Hz ±5% —— Input voltage distortion factor Within 5% Max. input apparent power 105VA —— Max. input power —— 41W Inrush current 20A within 8ms 81A within 1ms

5VDC 5A 3A 5A Rated output

current

protection

protection Efficiency 65% or more Allowable momentary power failure

period Dielectric withstand voltage

Insulation resistance

Noise durability

Operation indication LED indication (lit at 5VDC output) Fuse Built-in (Unchangeable by user) Contact output section No Terminal screw size M3.5 × 7 Applicable wire size 0.75 to 2mm2 Applicable solderless terminal RAV1.25 to 3.5, RAV2 to 3.5 Applicable tightening torque 66 to 89N•cm

External dimensions

Weight 0.60kg 0.50kg

3

24VDC —— 0.6A —— 5VDC 5.5A or more 3.3A or more 5.5A or more Overcurrent

1

24VDC —— 0.66A or more —— 5VDC 5.5 to 6.5V Overvoltage

2

24VDC ——

H 130mm (5.12inch) W 55mm (2.17inch) D 93.6mm (3.69inch)

Power Supply Module Specifications (Continued)

Performance Specifications

A1S61PN A1S62PN A1S63P

100 to 240VAC

(85 to 264VAC) (15.6 to 31.2VDC)

Within 20ms

Across inputs/LG and outputs/FG 2830VAC rms/3 cycles (2000 m (6562 ft.)) Across inputs and outputs (LG and FG separated), across inputs and LG/FG, across outputs and FG/LG 10M or more by insulation resistance tester

• By noise simulator of 1500Vp-p noise voltage, 1 and 25 to 60Hz noise frequency

• Noise voltage IEC61000-4-4, 2kV

+10%

-15%

s noise width

+30%

24VDC

-35%

Within 10ms

(at 24VDC input)

500VAC across primary and

5VDC

5M

or more by insulation

resistance tester

By noise simulator of 500Vp-p noise voltage, 1 and 25 to 60Hz noise frequency

s noise width

5 - 4 5 - 4

5 POWER SUPPLY MODULE

POINTS

1 : Overcurrent protection

The overcurrent protection device shuts off the 5 V, 24 VDC circuit and stops the system if the current flowing in the circuit exceeds the specified value. The LED of the power supply module is unlit or lit dimly upon a voltage drop. If this device is activated, switch the input power supply off and eliminate the cause such as insufficient current capacity or short. Then, a few minutes later, switch it o n t o re sta rt th e system. The initial start for the system takes place when the current value becomes normal.

2 : Overvoltage protection

The overvoltage protection device shuts off the 5 VDC circuit and stops the system if a voltage of 5.5 VDC is applied to the circuit. When this device is activated, the power supply module LED is switched OFF. If this happens, switch the input power OFF, then a few minutes later ON. This causes the initial start for the system to take place. The power supply module must be changed if the system is not booted and the LED remains OFF.

3 : Allowable momentary power failure period

(1) For AC input power supply

y An instantaneous power failure lasting less than 20ms will cause AC

down to be detected, but operation will continue.

y An instantaneous power failure lasting more than 20ms may cause the

operation to continue or initial start to take place depending on the power supply load. Furthermore, by using the same AC power supply for the AC input module and the power supply module, it is possible to prevent the sensor, to which the AC input module is connected, from turning OFF when it is ON when the power is turned OFF. However, if only the AC input module is connected to the AC line, which is connected to the power suppludetection of the AC down for the power supply module may be delayed by the capacitor in the AC input module. Thus, connect a load of approx. 30mA per QX10 unit to the AC line.

(2) For DC input power supply

y An instantaneous power failure lasting less than 10ms (*4) will cause

24VDC down to be detected, but operation will continue.

y An instantaneous power failure lasting more than 10ms (*4) may cause

the operation to continue or initial start to take place depending on the power supply load.

(

4: This is for a 24VDC input. This is 10ms or less for 24VDC or less.)

MELSEC-Q

5 - 5 5 - 5

5 POWER SUPPLY MODULE

5.1.2 Selecting the power supply modul e

The power supply module is selected according to the total of current consumption of the base units, I/O modules, intelligent function module, special function module, and peripheral devices supplied by its power supply module. For the internal current consumption of 5 VDC of the base unit, refer to Chapter 6. For the internal current consumption of 5 VDC of the I/O modules, intelligent function module, special function module, and peripheral devices, refer to the Manuals of their respective modules. For the devices obtained by a user, see the manual for the respective device.

(1) When the base unit is of Q3B or Q6B:

MELSEC-Q

Power supply module Q61P-A1, Q61P-A2, etc.

Base unit Q35B, Q65B, etc.

CPU module Q02CPU, Q06HCPU, etc.

I/O module QX10, QY10, etc.

Intelligent function module Q64AD, QJ71LP21-25, etc.

1

Peripheral devices, converter, cables, etc. (for connection between CPU module and PC)

1: The CPU module is loaded on the Q3 B main base

unit.

(a) Selection of power supply module for use of Q52B or Q55B extension base

unit Using the Q52B or Q55B supplies 5VDC power from the power supply module of the main base unit through the extension cable. Therefore, note the following when using the Q52B or Q55B.

1) The power supply module to be loaded on the main base unit should be selected to cover also the 5VDC used on the Q52B or Q55B. For example, either of the following power supply modules must be mounted on the main base unit, when the current consumption on the main base unit is 3A and that on the Q52B or Q55B is 1A.

5VDC Rated output current Type

6A Q61P-A1, Q61P-A2, Q63P

8.5A Q64P

2) Since 5VDC is supplied to the Q52B or Q55B through the extension cable, a voltage drop occurs at the extension cable. You must select the power supply module and extension cable length to ensure that the "IN" connector voltage of the Q52B or Q55B is 4.75VDC or more. For details of a voltage drop, refer to Section 6.6.

5 - 6 5 - 6

5 POWER SUPPLY MODULE

(b) Ideas for reducing voltage drops

The following methods are effective to reduce voltage drops at the extension cables.

1) Changing the module loading positions

2) Using short extension cables

(2) When the base unit is of Q3SB:

MELSEC-Q

Load large current consumption modules on the main base unit. Load small current consumption modules on the extension base unit.

The shorter the extension cable is, the smaller the resistance and voltage drops are. Use the shortest possible extension cables.

Slim type power supply module Q61SP

Slim type main base unit Q32SB, Q33SB, Q35SB

CPU module Q02(H)CPU, Q06HCPU, etc.

I/O module QX10, QY10, etc.

Intelligent function module Q64AD, QJ71LP21-25, etc.

1

Peripheral devices, converter, cables, etc. (for connection between CPU module and PC)

1: The CPU module is loaded on the Q3

B slim type

S

main base unit.

(a) To use the slim type main base unit and slim type power supply module, pay

attention to the capacity of the 5VDC power supply.

1) The capacity of the 5VDC power supply of the power supply module (Q61SP) installed to the slim type main base unit is 2A. Choose modules with total capacity of 2A or less.

5VDC Rated output current Type

2.0A Q61SP

5 - 7 5 - 7

5 POWER SUPPLY MODULE

(3) When the base unit is of QA1S6B:

MELSEC-Q

Power supply module A1S61PN, A1S62PN, A1S63P

Base unit QA1S65B and QA1S68B

I/O module A1SX10, A1SY1 0, etc.

Special function module A1SD61, A1SD75P1-S3, etc.

2: Select the power supply module also in

consideration of the current consumption of the peripheral devices connected to the special function module. For example, when the AD75TU is connected to the A1SD75P1-S3, the current consumption of the AD75TU must also be taken into account.

5.1.3 Precaution when connecting the uninterr upti v e power supply

peripheral devices AD75TU

2

Be sure of the following terms when connecting the High Performance model QCPU system to the uninterruptive power supply (abbreviated as UPS hereafter):

Use a UPS which employs the constant inverter power supply method with 5 % or less voltage fluctuation. Do not use a UPS with the constant commercial power supply method.

5 - 8 5 - 8

)

5 POWER SUPPLY MODULE

5.2 Names of Parts and Settings

MELSEC-Q

The names of the parts of each power supply module are described below.

(1) Q61P-A1, Q61P-A2, Q62P, Q63P, Q64P, Q61SP

8)

POWER

INPUT

100-120VAC

50/60Hz 105VA OUTPUT 5VDC 6A

ERR.

+

L

+-

24VDC 0.5A

INPUT

100-120VAC

9)

(FG)

(LG)

+ + +

N

+

L

+

Q61P-A1

6)

8)

Q62P

INPUT

100-240VAC

50/60Hz 105VA OUTPUT 5VDC 3A 24VDC 0.6A

Q62P

+ +

INPUT

100-240VAC

ERR.

+24V

24G

24VDC 0.5A

(FG)

(LG)

L

5)

9)

8)

+-

N

L

POWER

+ + + + + +

6)

Q62P

1)

7)

2)

3)

4) 10

1)

7)

2)

3)

4)

12)

1)

8)

Q61P-A2

INPUT

200-240VAC

50/60Hz 105VA OUTPUT 5VDC 6A

ERR.

24VDC 0.5A

(FG)

(LG)

INPUT

200-240VAC

Q61P-A2

9)

12)

Q63P

INPUT

24VDC

MAX 45W OUTPUT 5VDC 6A

ERR.

24VDC 0.5A

(FG)

(LG)

+24V

INPUT

24VDC

24G

Q63P

9)

L

+-

N

L

+

-

POWER

+ + + + + +

6)

Q61P-A2

POWER

6)

Q63P

8)

1)

7)

2)

3)

4)

11)

1)

7)

2)

3)

4)

13)

1)

Q64P

INPUT

100-120/200-240VAC

50/60Hz 160VA OUTPUT 5VDC 8.5A

ERR.

L

24VDC 0.5A

(FG)

(LG)

INPUT

100-120/200-240VAC

Q64P

9)

POWER

+-

N

L

Q64P

7)

2)

3)

4)

14)

6)

Q61SP

POWER

Q61SP

INPUT

100-240VAC 50/60Hz 40VA OUTPUT 5VDC 2A

ERR.

24VDC

0.5A

(FG)

(LG)

N

L

INPUT

100-

240V

AC

MITSUBISHI

9)

Q61SP

2)

3)

4)

12)

6)

5 - 9 5 - 9

5 POWER SUPPLY MODULE

MELSEC-Q

No. Name Application

1) POWER LED 5VDC power indicator LED

1) Turned ON when the whole sy stem operates normally .

2) Turned OFF (opened) when a stop error occurs in the CPU module.

2) ERR

3) FG terminal Ground terminal connected to the shield pattern of the printed circuit board.

4) LG terminal

5) +24V, 24G terminals Used to supply 24VDC power to inside the output module (using external w iring).

6) Terminal screw M3.5 × 7 screw

7) Terminal cover Protective cover of the terminal block

8) Module fixing screw hole

9) Module loading lever Used to load the module into the base unit.

10) Power input terminals Used to connect a 100VAC power supply.

11) Power input terminals Used to connect a 200VAC power supply.

12) Power input terminals Used to connect a 100VAC to 200VAC power supply.

13) Power input terminals Used to connect a 24VAC power supply.

14) Power input terminals Used to connect a 100VAC/200VAC power supply.

terminals

3) In a multiple CPU system configuration, turned OFF when a stop error occurs in any of the CPU modules. Normally off when loaded in an extension base unit.

Grounding for the power supply filter. The potential of Q61P-A1, Q61P-A2, Q62P, Q64P and Q61SP terminal is 1/2 of the input voltage

Used to fix the module to the base unit. M3 × 12 screw (user-prepared) (Tightening torque : 36 to 48N•cm)

POINTS

(1) The Q61P-A1 is dedicated for inputting a voltage of 100 VAC.

Do not input a voltage of 200 VAC into it or trouble may occur on the Q61P-A1.

module type

100VAC 200VAC

Q61P-A1 Operates normally.

Supply power voltage Power

Power supply module causes trouble.

Power supply module does

Q61P-A2

not cause trouble. CPU module cannot be

Operates normally.

operated.

(2) Q64P automatically switches the input range 100/200VAC.

Therefore, it is not compatible with the intermediate voltage (133 to 169VAC). The CPU module may not work normally if the above intermediate voltage is applied.

(3) Ensure that the earth terminals LG and FG are grounded.

5 - 10 5 - 10

5 POWER SUPPLY MODULE

(2) A1S61PN, A1S62PN and A1S63P

MELSEC-Q

9)

MELSECA

INPUT 100-240VAC 105VA 50 / 60Hz

1S61PN

POWER

MITSUBISHI

OUTPUT 5VDC 5A

3) 4) 5) 7)

A1S61PN

1)

NC

(FG)

(LG)

INPUT

100-240VAC

A1S61PN

MELSECA

8)

INPUT 100-240VAC 105VA 50 / 60Hz

3) 4) 5) 7)

2)

9)

1S62PN

POWER

MITSUBISHI

OUTPUT 5VDC 3A 24VDC 0.6A

A1S62PN

1)

+24V

24G

(FG)

(LG)

INPUT

100-240VAC

A1S62PN

9)

MELSECA

8)

INPUT DC15.6 31.2V

1S63P

POWER

MITSUBISHI

OUTPUT DC 5V 5A

NC

FG

NC

LG

+24V INPUT 24G

3) 4) 6) 7)

A1S63P

No. Name Application

1) POWER LED 5VDC power indicator LED

2) +24V, 24G terminals Used to supply 24VDC pow er to inside the output module (using external wiring).

3) FG terminals Ground terminal connected to the shield pattern of the printed circuit board.

4) LG terminals

Grounding for the power supply filter. The potential of A1S61PN or A1S62PN terminal is 1/2 of the input voltage.

5) Power input terminals Used to connect a 100VAC to 200VAC power supply.

6) Power input terminals Used to connect a 24 VDC power supply.

7) Terminal screw M3.5 7 screw

8) Terminal cover Protective cover of the terminal block

9) Module fixing screw

Used to fix the module to the base unit. (M4 screw, tightening torque : 66 to 89N•cm)

POINTS

(1) Do not wire to those terminals for which NC is stamped on the terminal block. (2) Ensure that the earth terminals LG and FG are grounded.

1)

8)

5 - 11 5 - 11

6 BASE UNIT AND EXTENSION CABLE

MELSEC-Q

This section describes the specifications of the extension cables for the base units (main, slim type and extension base unit) used in the PLC system and the specification standards of the extension base unit.

6.1 Base Unit Specification Table (1) Main base unit specifications

Item Number of I/O modules

installed Possibility of extension Extendable Applicable module Q series modules 5 VDC internal current consumption Mounting hole size M4 screw hole or 4.5 hole (for M4 screw)

External dimensions

Weight 0.21kg 0.25 kg 0.35 kg 0.45 kg Attachment Mounting screw M4 14 4 pieces (DIN rail mounting adapter to be sold separately)

6

DIN rail mounting Adapter type

Type

H 98mm (3.86inch)

W 189mm (7.44inch) 245mm (9.65inch) 328mm (12.92inch) 439mm (17.30inch)

D 44.1mm (1.74inch)

Q33B Q35B Q38B Q312B

3 5 8 12

0.105A 0.110A 0.114A 0.121A

Q6DIN3 Q6DIN2 Q6DIN1

(2) Slim type main base unit specifications

Type Item Number of I/O modules

installed Possibility of extension Cannot connect extension modules. Applicable module Q series modules 5 VDC internal current consumption Mounting hole size M4 screw hole or 4.5 hole (for M4 screw)

H 98mm (3.86inch)

External dimensions

Weight 0.12kg 0.15 kg 0.21 kg Attachment Mounting screw M4 12 4 pieces (DIN rail mounting adapter to be sold separately) DIN rail mounting Adapter type

W 114mm (4.49inch) 142mm (5.59inch) 198mm (7.80inch)

D 18.5mm (0.73inch)

Q32SB Q33SB Q35SB

2 3 5

0.086A 0.086A 0.091A

Q6DIN3

6 - 1 6 - 1

6 BASE UNIT AND EXTENSION CABLE

MELSEC-Q

(3) Extension base unit specifications (Type not r eq ui ri ng power supply

module)

Type Item

Number of I/O modules installed Possibility of extension

Applicable module 5 VDC internal current

consumption Mounting hole size

External dimensions

Weight Attachment DIN rail mounting

Adapter type

H

W

D

Mounting screw M4

Q52B Q55B

2 5

Extendable

Q series modules

0.080A 0.100A M4 screw hole or 4.5 hole (for M4 screw)

98mm (3.86inch)

106mm (4.17inch) 189mm (7.44inch)

44.1mm (1.74inch)

0.14kg 0.23kg 14 4 pieces (DIN rail mounting adapter to be sold separately)

Q6DIN3

(4) Extension base unit specifications (Power supply loaded type)

Type Item Number of I/O

modules installed Possibility of extension Applicable module Q series modules AnS series modules 5 VDC internal current consumption

Mounting hole size

H

External dimensions

Weight 0.23kg 0.25 kg 0.35 kg 0.45 kg 0.75 kg Attachment DIN rail mounting

Adapter type

W

D

Q63B Q65B Q68B Q612B QA1S65B QA1S68B

3 5 8 12 5

Extendable

0.105A 0.110A 0.114A 0.121A 0.117A M4 screw hole or

(for M4 screw)

98mm (3.86inch) 130mm (5.12inch)

189mm

(7.44inch)

(DIN rail mounting adapter sold separately)

Q6DIN3 Q6DIN2 Q6DIN1 ———

245mm

(9.65inch)

44.1mm (1.74inch) 51.2mm (2.02inch)

Mounting screw M4

4.5 hole

328mm

(12.92inch)

14 , 4 pieces

439mm

(17.30inch)

M5 screw hole or 5.5 hole

(for M5 screw)

315mm

(12.41inch)

Mounting screw M5 25

4 pieces

0.118A

420mm

(16.55inch)

1.00 kg

———

6

8

6 - 2 6 - 2

6 BASE UNIT AND EXTENSION CABLE

MELSEC-Q

6.2 Extension Cable Specification Table

The list below shows the specifications of the extension cables which can be used for the High Performance model QCPU system.

Type

Item Cable length 0.45m (1.48ft.) 0.6m (1.97ft.) 1.2m (3.93ft.) 3.0m (9.84ft.) 5.0m (16.39ft.) 10.0m (32.79ft.) Application Connection across the main base unit and extension base unit or across the extension base units. Weight 0.15 kg 0.16 kg 0.22 kg 0.40 kg 0.60 kg 1.11 kg

QC05B QC06B QC12B QC30B QC50B QC100B

POINT

When the extension cables are used in combination, limit the overall distance of the combined cable to 13.2 m(43.28 ft.).

6.3 Parts Names of Base Unit

The names of the parts of the base unit are described below.

(1) Main base unit(Q33B, Q35B, Q38B, Q312B)

5)

1)

5V

56

2)

POWER F6

No. Name Application

Extension cable

1) connector

2) Base cover

3) Module connector

4) Module fixing screw hole Screw hole for fixing the module to the base unit. Screw size:M3 12

5) Base mounting hole Hole for mounting this base unit onto the panel of the control panel (for M4 screw) DIN rail adapter

6) mounting hole

4)

CPU

3) 6)

I/11I/10I/09I/08I/07I/06I/05I/04I/03I/02I/01I/00

Connector for sending and receiving signals from the extension base unit, to which the extension cables are connected. Protective cover of extension cable connector. Before an extension cable is connected, the area of the base cover surrounded by the groove under the word "OUT " on the base cover must be removed with a tool such as nippers. Connector for installing the power supply module, CPU module, I/O modules, and intelligent function module. To the connectors located in the spare space where these modules are not installed, attach the supplied connector cover or the blank cover module (QG60) to prevent entry of dirt.

Hole for mounting DIN rail adapter

6 - 3 6 - 3

6 BASE UNIT AND EXTENSION CABLE

(2) Slim type main base unit(Q32SB, Q33SB, Q35SB)

3)

POWER

2)

5V

56

CPU

MELSEC-Q

5V

I/O1

SG

I/O3I/O2 I/O4I/O0

4)

1)

No. Name Application

Connector for installing the power supply module, CPU module, I/O modules, and

1) Module connector

intelligent function module. To the connectors located in the spare space where these modules are not installed, attach the supplied connector cover or the blank cover module (QG60) to prevent entry of dirt.

2) Module fixing screw hole Screw hole for fixing the module to the base unit. Screw size:M3 12

3) Base mounting hole Hole for mounting this base unit onto the panel of the control panel (for M4 screw) DIN rail adapter

4) mounting hole

Hole for mounting DIN rail adapter

6 - 4 6 - 4

6 BASE UNIT AND EXTENSION CABLE

Q52B, Q55B

(3) Extension base unit (Q5 B, Q6 B, QA1S6 B)

6)

OUTIN

3)

MELSEC-Q

5)

Q63B,Q65B, Q68B, Q612B

6)

3)

OUTIN

2)

1)

QA1S65B, QA1S68B

6)

IN OUT

3)

2)

1)

5V

56

POWER

2)

1)

POWER

I/O2I/O1I/O0 I/O3 I/O4

7) 4)

5)

I/11I/10I/09I/08I/07I/06I/05I/04I/03I/02I/01I/00

4) 7)

5)

5V SG FG

I/O0 I/O7I/O6I/O5I/O4I/O3I/O2I/O1

QA1S68B

4)

No. Name Application

Extension cable

1)

connector

Connectors for sending and receiving signals from the main base unit or the other extension base units, to which the extension cables are connected. Do not remove the supplied connector cover.

2) Base cover Protective cover of extension cable connector. Stage No. setting

3)

connector

Connector for setting the number of stages of the extension base unit. For setting method, refer to Section 6.4. Connectors for installing the power supply module, I/O modules, and intelligent function module/ special function module.

4) Module connector

To those connectors located in the spare space where these modules are not installed, apply the supplied connector cover or the blank cover module to prevent entry of dirt. Blank cover module applicable to Q52B, Q55B, Q63B,Q65B, Q68B and Q612B :QG60 Blank cover module applicable to QA1S65B and QA1S68B :A1SG60 Screw hole for fixing the module to the base unit.

5) Module fixing screw hole

Q52B, Q55B, Q63B,Q65B,Q68B and Q612B.............Screw size: M3 12

QA1S65B and QA1S68B.............................................Screw size: M4 12

Hole for mounting this base unit on the panel of the control panel.

6) Base mounting hole

Q52B, Q55B, Q65B,Q68B and Q612B..........For M4 screw

QA1S65B and QA1S68B................................For M5 screw

DIN rail adapter

7)

mounting hole

DIN rail adapter mounting hole.

6 - 5 6 - 5

6 BASE UNIT AND EXTENSION CABLE

6.4 Setting the Extension Base Unit

The number of stages setting method of each extension base unit to be used when extension base units are installed is described below.

MELSEC-Q

PIN1

1 2 3 4 5 6 7

OUT

IN

Stage No. setting connector

Setting of Stage Number for Extension Base Units

Setting of stage No. setting connector

1st stage 2nd stage 3rd stage 4th stage 5th stage 6th stage 7th stage

Number Setting for Extension Stages

POINTS

To set the stages No. setting connector, set a number from 1 to 7 according to the number of extension stages. Do not set the same stage number at two or more positions or do not fail to set a number. A miss-input or miss-output may occur.

6 - 6 6 - 6

6 BASE UNIT AND EXTENSION CABLE

6.5 I/O Number Allocation

The I/O numbers are automatically allocated in the system loading status.

O U T

Power supply

module

X/Y

1st extension stage

2nd extension stage

3rd extension stage

For the I/O number setting method using GX Developer, refer to the Operating Manual of GX Developer. For details of I/O number allocation, refer to the following manual.

• High Performance Model QCPU (Q mode) User's Manual (Function Explanation, Program Fundamentals)

POINT

For the extension using the Q5 B, Q6B B and QA1S6 B, allocate the I/O numbers on the modules starting from the Q series module installed on the Q5 Q6

B base unit.

<Example> Where 32 modules are installed in all slots with the configuration

I

N

A0

O U T

Power supply

module

X/Y

I

N

1A0

O U T

Power supply

module

X/Y

I

N

2A0

O U T

Power supply

module

shown below.

MELSEC-Q

01234

X/Y0X/Y20X/Y40X/Y60X/Y

80

CPU

module

6 7 8 9 10 11 125

X/YC0X/YE0X/Y

100

X/Y

120

X/Y 140

X/Y

160

X/Y 180

14 15 16 17 18 19 2013

X/Y

1C0

1E0

200

220

240

260

280

22 23 24 2521

X/Y

2C0

2E0

300

320

In this system, 32-point modules are loaded on slots 0 to 25.

B,

Q38B main base unit

Q68B extension base unit

QA1S68B extension base unit

00 to FF

100 to 1FF

200 to 2FF

300 to 3FF

6 - 7 6 - 7

6 BASE UNIT AND EXTENSION CABLE

6.6 Guideline for Use of Extension Base Units (Q5B)

Since the Q5B is supplied with 5VDC from the power supply module on the main base unit, a voltage drop occurs at extension cables. Improper I/O may be provided if the specified voltage (4.75VDC or higher) is not supplied to the "IN" connector of the Q5B. When using the Q5B, make sure that the "IN" connector of the Q5B is supplied with 4.75VDC or higher.

And it is recommend to connect it with the shortest possible extension cable right after connecting the main base unit, so as to minimize the effects of voltage drop.

(1) When only the Q5B is connected to the extension base unit

(a) Selection condition

4.75VDC or higher should be supplied to the "IN" connector of the Q5B in the final extension stage.

(b) How to calculate v oltage to "IN" connector

The 5VDC output voltage of the power supply module on the main base unit is set to at least 4.90VDC. Therefore, the Q5B can be used if the voltage drop is 0.15VDC or lower (4.9VDC - 4.75VDC = 0.15VDC).

Main base unit (Q3 B)

Power supply module

V1

V2

R1

R2

Extension base unit (Q5 B)

l1

Extension base unit (Q5 B)

l2

Extension stage 1

Extension stage 2

MELSEC-Q

Extension Cable

Type

QC05B 0.044 QC06B 0.051 QC12B 0.082 QC30B 0.172 QC50B 0.273

QC100B 0.530

Extension Cable

Conductor

Resistance (

)

R7

Symbol Description

V1 Voltage drop at the extension cable between the main base unit and extension base unit

Vn R1 Cable resistance between the main base unit and extension base unit Rn

l1 to l7 5VDC current consumption among extension stage 1 to 7 1

1: Sum total of current consumed by Q5B and currents consumed by the I/O, intelligent function modules loaded on the

Voltage drop at the extension cable between the extension base unit (extension stage n-1) and extension base unit (extension stage n)

Cable resistance between the extension base unit (ext ension stage n-1) and extension base unit (extension stage n)

Q5B. The symbols including "I" (I1 to I7) vary with the modules loaded on the extension base unit. For details of the symbol, refer to the user's manuals of the module used.

Extension base unit (Q5 B)

l7

Extension stage 7

6 - 8 6 - 8

6 BASE UNIT AND EXTENSION CABLE

MELSEC-Q

List for Calculating Voltage Drops Occurring at Extension Cables in System Consisting of Extensions 1 to 7

Q5B Loading Position

Extension stage 1 Extension stage 2 Extension stage 3 Extension stage 4 Extension stage 5 Extension stage 6 Extension stage 7

Voltage Drop at Extension Cable on Corresponding Extension Unit

V1 V2 V3 V4 V5 V6 V7 R1 • I1 ---- ---- ---- ---- ---- ---- V=V1 R1(I1+I2) R2 • I2 ---- ---- ---- ---- ---- V=V1+V2 R1(I1+I2+I3) R2(I2+I3) R3 • I3 ---- ---- ---- ---- V=V1+V2+V3 R1(I1+I2+I3+I4) R2(I2+I3+I4) R3(I3+I4) R4 • I4 ---- ---- ---- V=V1+V2+V3+V4

R1(I1+I2+I3+I4

+I5)

R1(I1+I2+I3+I4

+I5+I6)

R1(I1+I2+I3+I4

+I5+I6+I7)

R2(I2+I3+I4+I5) R3(I3+I4+I5) R4(I4+I5) R5 • I5 ---- ---- V=V1+V2+V3+V4+V5 R2(I2+I3+I4+I5

+I6)

R2(I2+I3+I4+I5

+I6+I7)

R3(I3+I4+I5+I6) R4(I4+I5+I6) R5(I5+I6) R6 • I6 ---R3(I3+I4+I5+I6

+I7)

R4(I4+I5+I6+I7) R5(I5+I6+I7) R6(I6+I7) R7 • I7

Sum Total of Voltage

Drops to "IN" Connector

of Q5B (V)

V=V1+V2+V3+V4+V5+

V6

V=V1+V2+V3+V4+V5+

V6+V7

The voltage supplied to "IN" connector of the Q5B in the final extension reaches 4.75 VDC or higher on the condition that the sum total of voltage drop to "IN" connector of Q5B (V) is 0.15V or lower.

(2) When the Q6 B is connected between the Q3 B and the Q5 B

(a) Selection condition

4.75VDC or higher should be supplied to the "IN" connector of the Q5B in the final extension.

(b) How to calculate v oltage to "IN" connector

The 5VDC output voltage of the power supply module on the main base unit is set to at least 4.90VDC. Therefore, the Q5B can be used if the voltage drop is 0.15VDC or lower

[When the Q5 B is connected to Extension stage 2.]

Main base unit (Q3 B)

Power supply

module

R1

V

Extension base unit (Q6 B)

Power supply

module

Extension base unit (Q5 B)

I1

Symbol Description

V

In

Rn

Rn+1

Voltage drop at the extension cable between the main base unit and extension base unit (Q 5 5VDC current consumption when the Q5B is used as Extension n+1, n = 1 to 6, n: Extension No. of Q6B connected (Sum total of current consumed by Q5 loaded on the Q5B.) Extension cable resistance between the main base unit or the extension base unit (Q 6B) and the extension base unit (Q6



B)

Extension cable resistance between the extension base unit (Q 6

(4.9VDC - 4.75VDC = 0.15VDC).

Extension stage 1

Extension stage 2

B and currents consumed by the I/O, intelligent function modules



Extension Cable

Type

Extension Cable

Conductor

Resistance (

)

QC05B 0.044 QC06B 0.051 QC12B 0.082 QC30B 0.172 QC50B 0.273

QC100B 0.530

B)



B) and extension base unit (Q5B)



6 - 9 6 - 9

s

6 BASE UNIT AND EXTENSION CABLE

List for Calculating Voltage Drops Occurring at Extension Cables when connecting Q6B between Q3B and Q5B

Position of extension base unit

Q6B Q5B

Extension stage 1 Extension stage 2 V=(R1+R2)I1

Extension stage 1,

Extension stage 2 Extension stage 1 to 3 Extension stage 4 V=(R1+R2+R3+R4)I1 Extension stage 1 to 4 Extension stage 5 V=(R1+R2+R3+R4+R5)I1 Extension stage 1 to 5 Extension stage 6 V=(R1+R2+R3+R4+R5+R6)I1 Extension stage 1 to 6 Extension stage 7 V=(R1+R2+R3+R4+R5+R6+R7)I1

The voltage supplied to the "IN" connector of the Q5B reaches 4.75 VDC or higher on the condition that the voltage drop (V) at the extension cable between the main base unit and Q5B is 0.15 VDC or lower.

(3) When the GOT is bus-connected

(a) Selection condition

4.75VDC or higher should be supplied to the "IN" connector of the Q5B.

(b) How to calculate v oltage to "IN" connector

The 5VDC output voltage of the power supply module on the main base unit is set to at least 4.90VDC. Therefore, the Q5B can be used if the voltage drop is 0.15VDC or lower

Main base unit (Q3 B)

Power supply

module

R1

I2

Extensi on base uni t (Q5 B)

I1

GOT

Num ber of G OTs connected : M ax. 5 uni t

(4.9VDC - 4.75VDC = 0.15VDC).

Voltage drop caused by extension

cable from the main base unit to the

B IN connector (V)

Q5



Extension stage 3 V=(R1+R2+R3)I1

Extension Cable

Type

QC05B 0.044 QC06B 0.051 QC12B 0.082 QC30B 0.172 QC50B 0.273

QC100B 0.530

MELSEC-Q

Extension Cable

Conductor

Resistance (

)

Symbol Description

V Voltage drop at the extension cable between the main base unit and extension base unit (Q5B)

5VDC current consumption when the Q5B is used as Extension n+1, n = 1 to 5, n: Extension No. of the

In

Im

Rn

Rn+1 Extension cable resistance between the ex tension base unit (Q 6B) and extension base unit (Q5B)

Q6B connected (Sum total of current consumed by Q5B and currents consumed by I/O, intelligent function modules loaded on the Q5B) 5VDC current consumption of the GOT (current consumption per GOT is 254mA)

• Im = 254 Extension cable resistance between the main base unit or the extension base unit (Q 6B) and ex tension base unit (Q6B)

c (c: Number of GOTs connected (c: 1 to 5))

6 - 10 6 - 10

6 BASE UNIT AND EXTENSION CABLE

POINT

When connecting GOT by extension cable that is 13.2 m (43.31ft) or longer, the bus extension connector box A9GT-QCNB is required. Since the A9GT-QCNB is supplied with 5VDC from the power supply module loaded on the main base unit, 29mA must be added to "Im" as the current consumption of the A9GT-QCNB. For details of the GOT-bus connection, refer to the GOT-A900 Series User's Manual (Connection).

MELSEC-Q

6 - 11 6 - 11

7 MEMORY CARD AND BATTERY

MELSEC-Q

7 MEMORY CARD AND BATTERY

This section describes the specifications and handling of the memory card and battery which can be used on the High Performance model QCPU. The memory card is necessary for sampling tracing. The memory card is also used to handle file registers of more than the number of points that can be stored in the standard RAM. (Refer to Section 4.1)

7.1 Memory Card Specifications

The specifications of the memory card which can be used on the High Performance model QCPU adheres to the PCMCIA small PC card. On the High Performance model QCPU, only one memory card can be installed.

(1) SRAM card

Item Memory capacity after format 1011.5 kbyte 2034 kbyte Storable number of files 256 288 Number of insertions and extractions 5000 times

External dimensions

Weight 15g

(2) Flash card

Item Memory capacity after format 2035 kbyte 4079 kbyte Storable number of files 288 Number of insertions and extractions 5000 times Number of writings 100000 times

External dimensions

Weight 15g

(3) ATA card

Item Memory capacity after format 7940 kbyte 15932 kbyte 31854 kbyte Storable number of files 512 Number of insertions and extractions 5000 times Number of writings 1000000 times

External dimensions

Weight 15g

Type

H 45mm (1.77inch)

W 42.8mm (1.69inch)

D 3.3mm (0.13inch)

Type

H 45mm (1.77inch)

W 42.8mm (1.69inch)

D 3.3mm (0.13inch)

Type

H 45mm (1.77inch)

W 42.8mm (1.69inch)

D 3.3mm (0.13inch)

Q2MEM-1MBS Q2MEM-2MBS

Q2MEM-2MBF Q2MEM-4MBF

Q2MEM-8MBA Q2MEM-16MBA Q2MEM-32MBA

7

7 - 1 7 - 1

7 MEMORY CARD AND BATTERY

7.2 Battery Specifications (For CPU Modul e and SR AM C ar d)

MELSEC-Q

(1) For CPU module

Type

Item

Classification Initial voltage 3.0V

Nominal current 1800mAh Storage life 10 years (room temperature) Total power failure time Refer to Section 10.3.1.

Application

Manganese dioxide lithium primary battery

Power failure backup for program memory, standard RAM and latch devices

Q6BAT

(2) For SRAM card

Type

Item Classification Graphite fluoride primary battery

Initial voltage 3.0V Nominal current 48mAh Storage life 5 years (room temperature) Total power failure time Refer to Section 10.3.1. Application Power failure backup for SRAM card

Q2MEM-BAT

7

REMARK

Refer to Section 10.3.1 for the battery life.

7 - 2 7 - 2

7 MEMORY CARD AND BATTERY

7.3 Handling the Memory C ar d (1) Formatting of memory card

Any SRAM or ATA card must have been formatted to use on the High Performance model QCPU. Since the SRAM or ATA card purchased is not yet formatted, format it using GX Developer before use. (The Flash card need not be formatted.) For the formatting procedure, refer to the Operating Manual of the GX Developer.

(2) Installation of SRAM card battery

A power interrupt hold-on battery is furnished with the SRAM card you purchased. Before using the SRAM card, install the battery.

POINTS

Even if the battery is installed on the CPU module, if a battery is not installed on the SRAM card, the memory of the SRAM card will not be backed up. Ensure to install the battery on the SRAM card. Also, if the battery is installed on the SRAM card but the CPU module has no battery, the program memory, standard RAM and latch devices of the CPU module are not backed up. Similarly ensure to install the battery on the CPU module.

(3) Kind of file which can be stored on memory car d

Please refer to the High Performance model QCPU (Q mode) User's Manual (Function Explanation, Program Fundamentals) of section 6.1 for the kind of the file which can be stored on each memory card.

MELSEC-Q

7 - 3 7 - 3

7 MEMORY CARD AND BATTERY

7.4 The Names of The Parts of The Memory Card

The names of the parts of the memory card are described below.

1)

3)

"RELEASE" direction

Write-protected ON

"LOCK" direction

MELSEC-Q

4)

2)

No. Name Descriptions

1) Connector area Connector area connected to the CPU module

2) Battery holder

Battery holder fixing

3) switch

4) Write protect switch

Used to set the lithium battery for data backup of the SRAM memory (SRAM card only) Switch for fixing the battery holder to the memory card main module Locked at LOCK position (write protect switch side) LOCK: Locked, RELEASE: Unlocked (SRAM card only) Used to set write inhibit in the memory. At the time of shipping, it is set at OFF. (SRAM card and Flash card only) ON: Data write inhibited OFF: Data write enabled

: The battery holder fixing switch is returned automatically from RELEASE to LOCK

when the battery holder is disconnected.

7 - 4 7 - 4

7 MEMORY CARD AND BATTERY

7.5 Memory Card Loading/U nl oading Pr ocedur es (1) To install the memory card

Install the memory card into the CPU module, while paying attention to the orientation of the memory card. Insert the memory card securely into the connector until the height of the memory card reaches that of the memory card EJECT button.

Memory card EJE CT button

MELSEC-Q

CPU module

Insert it in this direction.

"Precautions" on this side

Memory card

(2) To remove the memory card

To remove the memory card from the CPU module, press the memory card EJECT button to push out the card.

Memory card EJECT button

Push

CPU module

Memory card

Remove the card in this direction.

(3) To extract the memory card while the power is turned on

Before removing the memory card, make sure that the special relays "SM604", "SM605" are OFF.

• When "SM604" is ON, the memory card cannot be removed since the CPU module is using the memory card.

• When "SM605" is ON, turn it OFF. When "SM604" and "SM605" are OFF, remove the memory card in the following procedure.

1) Turn on the special relay "SM609" using the sequence program or by the

device test of GX Developer etc.

2) By monitoring GX Developer etc., check that the special relays "SM600" is

turned off.

3) Extract the memory card.

SM600 (Memory card usable flag) : The system is turned on when memory

card is ready for use by user.

SM604 (memory card use flag) : The system is turned on when the CPU

module uses a memory card.

SM605 (memory card detach inhibit flag) :

This is turned on by the user to disable

the memory card from being detached.

(4) To install the memory card w hi l e the pow er i s tur ned on

1) Install the memory card.\

2) By monitoring GX Developer etc., check that the special relays "SM600" is

turned on.

POINTS

Install and remove the memory card while the power is turned on, paying attention to the following. (1) If the procedures specified above are not followed, the data stored in the

memory card may be destroyed. When the CPU module operation at the time of occurrence of a parameter error is set to STOP, the CPU module operation is stopped by the occurrence of "ICM.OPE.ERROR."

(2) When the memory card is installed, its mount processing is performed again.

As a result, the scanning time is increased by several 10 ms max.

7 - 5 7 - 5

7 MEMORY CARD AND BATTERY

7.6 Installation of Battery (for CPU Module and M emor y C ar d)

(1) The battery for the CPU module is shipped with its connector disconnected.

Connect the connector as follows. Refer to Section 10.3 for the service life of the battery and how to replace the battery.

Open the cover at the CPU module's bottom.

Confirm that the battery is loaded correctly.

Insert the battery connector into the connector pin on the case. Be sure that the insertion direction is correct.

Side of the CPU module

MELSEC-Q

Front

Completion

(2) The battery for the SRAM card is shipped separately from the battery holder.

Before installing the SRAM card into the CPU module, set the battery holder in the following procedure.

Set the battery holder's locking switch to the "RELEASE" position.

Remove the battery holder from the SRAM card.

Set the battery onto the battery holder with the "plus" face up.

Insert the battery holder with which the battery is installed firmly, into the SRAM card.

Bottom

"Model name" on this side

Connector

Battery

Battery holder's locking switch

"RELEASE" position

'+' sign

Battery holder

Confirm that the battery holder's locking switch is set to th e "L O C K" position.

"LOCK" position

The battery holder's locking switch is set

Completion

automatically to the "LOCK" position when the battery holder is removed. In its position, insert the battery holder firmly.

7 - 6 7 - 6

8 EMC AND LOW VOLTAGE DIRECTIVE

MELSEC-Q

8 EMC AND LOW VOLTAGE DIRECTIVE

For the products sold in European countries, the conformance to the EMC Directive, which is one of the European Directive, has been a legal obligation since 1996. Also, conformance to the Low Voltage Directive, another European Directive, has been a legal obligation since 1997. Manufacturers who recognize their products must conform to the EMC and Low Voltage Directive required to declare that their products conform to these Directives and put a "CE mark" on their products.

8.1 Requirements for Conformance to EMC Directi ve

The EMC Directive specifies that products placed on the market must "be so constructed that they do not cause excessive electromagnetic interference (emissions) and are not unduly affected by electromagnetic interference (immunity)". The applicable products are requested to meet these requirements. The sections 8.1.1 through 8.1.6 summarize the precautions on conformance to the EMC Directive of the machinery constructed using the MELSEC-Q series PLCs. The details of these precautions has been prepared based on the control requirements and the applicable standards control. However, we will not assure that the overall machinery manufactured according to these details conforms to the above-mentioned directives. The method of conformance to the EMC Directive and the judgment on whether or not the machinery conforms to the EMC Directive must be determined finally by the manufacturer of the machinery.

8.1.1 Standards applicable to the EMC Directi ve

Specification Test item Test details Standard value

EN55011

EN50081-2 : 1995

EN61131-2 : 1996

( 1) QP : Quasi-peak value, Mean : Average value (

2) The PLC is an open type device (device installed to another device) and must be installed in a conductive control panel. The tests for the corresponding items were performed while the PLC was installed inside a control panel.

Radiated noise

EN55011 Conducted noise

EN61000-4-2 Electrostatic immunity

EN61000-4-4 Fast transient burst noise

EN61000-4-3 Radiated field AM modulation EN61000-4-12 Damped oscillatory wave immunity

The standards applicable to the EMC Directive are listed below.

30 M-230 MHz QP : 30 dB

2

Electromagnetic emissions from the product are measured.

Electromagnetic emissions from the product to the power line is measured. Immunity test in which static electricity is applied to the cabinet of

2

the equipment. Immunity test in which burst noise is

applied to the power line and signal

2

lines.

Immunity test in which field is irradiated to the product.

Immunity test in which a damped oscillatory wave is superimposed on the power line.

(30 m in measurement range) 230 M-1000 MHz QP : 37 dB (30 m in measurement range)

150 k-500 kHz QP : 79 dB, Mean : 66 dB 500 k-30 MHz QP : 73 dB, Mean : 60 dB

15 k V Aerial discharge

Power line : 2 kV Digital I/O (24 V or higher) : 1 kV (Digital I/O (24 V or less)) > 250 V (Analog I/O, signal lines) > 250 V

10 V/m, 26-1000 MHz, 80%AM modulation@1 kHz

Power line : 1 kV Digital I/O (24 V or higher) : 1 kV

V/m

1

V/m

8

1

8 - 1 8 - 1

8 EMC AND LOW VOLTAGE DIRECTIVE

8.1.2 Installation instructions for EMC Directiv e

MELSEC-Q

8

The PLC is open equipment and must be installed within a control cabinet for use. This not only ensures safety but also ensures effective shielding of PLC-generated electromagnetic noise.

(1) Control cabinet

(a) Use a conductive control cabinet. (b) When attaching the control cabinet's top plate or base plate, mask painting

and weld so that good surface contact can be made between the cabinet and plate.

(c) To ensure good electrical contact with the control cabinet, mask the paint on

the installation bolts of the inner plate in the control cabinet so that contact between surfaces can be ensured over the widest possible area.

(d) Earth the control cabinet with a thick wire so that a low impedance

connection to ground can be ensured even at high frequencies.

(e) Holes made in the control cabinet must be 10 cm (3.94 inch) diameter or

less. If the holes are 10 cm (3.94 inch) or larger, radio frequency noise may be emitted. In addition, because radio waves leak through a clearance between the control panel door and the main unit, reduce the clearance as much as practicable. The leakage of radio waves can be suppressed by the direct application of an EMI gasket on the paint surface. Our tests have been carried out on a panel having the damping characteristics of 37 dB max. and 30 dB mean (measured by 3 m method with 30 to 300 MHz).

(2) Connection of power and earth w ir es

Earthing and power supply wires for the PLC system must be connected as described below. (a) Provide an earthing point near the power supply module. Earth the power

supply's LG and FG terminals (LG : Line Ground, FG : Frame Ground) with the thickest and shortest wire possible. (The wire length must be 30 cm (11.81 inch) or shorter.) The LG and FG terminals function is to pass the noise generated in the PLC system to the ground, so an impedance that is as low as possible must be ensured. As the wires are used to relieve the noise, the wire itself carries a large noise content and thus short wiring means that the wire is prevented from acting as an antenna.

(b) The earth wire led from the earthing point must be twisted with the power

supply wires. By twisting with the earthing wire, noise flowing from the power supply wires can be relieved to the earthing. However, if a filter is installed on the power supply wires, the wires and the earthing wire may not need to be twisted.

8 - 2 8 - 2

g

8 EMC AND LOW VOLTAGE DIRECTIVE

8.1.3 Cables

The cables extracted from the control panel contain a high frequency noise component. On the outside of the control panel, therefore, they serve as antennas to emit noise. To prevent noise emission, use shielded cable for the cables which are connected to the I/O modules and intelligent function modules and may be extracted to the outside of the control panel. The use of a shielded cable also increases noise resistance. The signal lines connected to the PLC I/O modules and intelligent function modules use shielded cables to assure noise resistance under the conditions where the shield is earthed. If a shielded cable is not used or not earthed correctly, the noise resistance will not meet the specified requirements.

When the shield of a shielded cable is earthed to the cabinet body, please ensure that the shield contact with the body is over a large surface area. If the cabinet body is painted it will be necessary to remove paint from the contact area. All fastenings must be metallic and the shield and earthing contact must be made over the largest available surface area. If the contact surfaces are too uneven for optimal contact to be made either use washers to correct for surface inconsistencies or use an abrasive to level the surfaces. The following diagrams show examples of how to provide good surface contact of shield earthing by use of a cable clamp.

(1) Earthing of shielded of shield cable

(a) Earth the shield of the shielded cable as near the module as possible taking

care so that the earthed cables are not induced electromagnetically by the cable to be earthed.

(b) Take an appropriate measures so that the shield section of the shielded

cable from which the outer cover was partly removed for exposure is earthed to the control panel on an increased contact surface. A clamp may also be used as shown in the figure below. In this case, however, apply a cover to the painted inner wall surface of the control panel which comes in contact with the clamp.

MELSEC-Q

Screw

Shield section

Paint mask

Shielded cable

Note) The method of earthing by soldering a wire onto the shield section of the

shielded cable as shown below is not recommended. The high frequency impedance will increase and the shield will be ineffective.

Shielded cable

Wire

Crimp terminal

8 - 3 8 - 3

Clamp fittin

8 EMC AND LOW VOLTAGE DIRECTIVE

(2) MELSECNET/H module

Always use a double-shielded coaxial cable (MITSUBISHI CABLE INDUSTRIES, LTD.: 5C-2V-CCY) for the coaxial cables MELSECNET/H module. Radiated noise in the range of 30MHz or higher can be suppressed by use of the doubleshielded coaxial cables. Earth the double-shielded coaxial cable by connecting its outer shield to the ground.

MELSEC-Q

Earth hereShield

Refer to (1) for the earthing of the shield.

(3) Ethernet module, Web server module

Precautions for using AUI cables, twisted pair cables and coaxial cables are described below. (a) Always earth the AUI cables connected to the 10BASE5 connectors.

Because the AUI cable is of the shielded type, strip part of the outer cover and earth the exposed shield section to the ground on the widest contact surface as shown below.

AUI cable Shield

Refer to (1) for the earthing of the shield.

(b) Use shielded twisted pair cables as the twisted pair cables connected to the

10BASE-T/100BASE-TX connectors. For the shielded twisted pair cables, strip part of the outer cover and earth the exposed shield section to the ground on the widest contact surface as shown below.

Shielded twisted pair cables Shield

Refer to (1) for the earthing of the shield.

(c) Always use double-shielded coaxial cables as the coaxial cables connected

to the 10BASE2 connectors. Earth the double-shielded coaxial cable by connecting its outer shield to the ground.

Earth hereShield

Refer to (1) for the earthing of the shield.

Ethernet is the registered trademark of XEROX, Co., LTD.

(4) I/O signal lines and other communicati on cables

For the I/O signal lines and other communication cables lines (RS-232, RS-422, CCLink, etc.), if extracted to the outside of the control panel, also ensure to earth the

8 - 4 8 - 4

shield section of these lines and cables in the same manner as in item (1) above.

g

8 EMC AND LOW VOLTAGE DIRECTIVE

8.1.4 Power supply module

Always ground the LG and FG terminals after short-circuiting them.

8.1.5 When using QA1S6 B type base unit

MELSEC-Q

(1) Cable

(a) Earthing of shielded cable

• Earth the shield of the shielded cable as near the unit as possible taking care so that the earthed cables are not induced electromagnetically by the cable to be earthed.

• Take appropriate measures so the shield that was partly removed for exposure is earthed to the control panel over a large contact surface area. A clamp may also be used as shown in the figure below. In this case, however, apply a cover to the painted inner wall surface of the control panel which comes in contact with the clamp.

Screw

Shield section

Paint mask

Note) The method of earthing by soldering a wire onto the shield section of the

shielded cable as shown below is not recommended. The high frequency impedance will increase and the shield will be ineffective.

Clamp fittin

Shielded cable

Shielded cable Wire

Crimp terminal

8 - 5 8 - 5

8 EMC AND LOW VOLTAGE DIRECTIVE

(b) Positioning modules

Precautions to be followed when the machinery conforming to the EMC Directive is configured using the A1SD75P1-S3/A1SD75P2-S3/A1SD75P3S3 (hereafter referred to as the A1SD75) are described below.

1) When wiring with a 2 m (6.56 ft.) or less cable

• Ground the shield section of the external wiring cable with the cable clamp. (Ground the shield at the closest location to the A1SD75 external wiring connector.)

• Wire the external wiring cable to the drive unit and external device with the shortest practicable length of cable.

• Install the drive unit in the same panel.

MELSEC-Q

Extern al wiring c onnector

module

A1SD75

module

Power supply

Cable clamp

External wiring cable (within 2 m (6.56 ft.))

Drive unit

2) When wiring with cable that exceeds 2 m (6.56 ft.), but is 10 m (32.79 ft.) or less

• Ground the shield section of the external wiring cable with the cable

clamp. (Ground the shield at the closest location to the A1SD75 external wiring connector.)

• Install a ferrite core.

• Wire the external wiring cable to the drive unit and external device with

the shortest practicable length of cable.

External wiring connector

module

A1SD75

module

Power supply

Ferrite core

Cable clamp

External wiring cable (2 m to 10 m (6.56 ft. to 32.79 ft.))

3) Ferrite core and cable clamp types and required quantities

• Cable clamp

Type : AD75CK (Mitsubishi Electric)

• Ferrite core

Type : ZCAT3035-1330 (TDK ferrite core)

• Required quantity

Cable length Prepared part

Within 2 m (6.56 ft.) AD75CK 1 1 1

(32.79ft.)

AD75CK 1 1 1 2 m (6.56 ft.) to 10m

ZCAT3035-1330 1 2 3

1 axis 2 axes 3 axes

Required Qty

8 - 6 8 - 6

Drive unit

T

r

8 EMC AND LOW VOLTAGE DIRECTIVE

(c) CC-Link module

1) Be sure to ground the cable shield that is connected to the CC-Link module close to the exit of control panel or to any of the CC-Link stations within 30 cm (11.81 inch) from the module or stations.

The CC-Link dedicated cable is a shielded cable. As shown in the illustration below, remove a portion of the outer covering and ground as large a surface area of the exposed shield part as possible.

2) Always use the specified CC-Link dedicated cable.

3) Do not use a ferrite core for the CC-Link module or CC-Link stations.

4) The CC-Link module, the CC-Link stations and the FG line inside the control panel should be connected at both the FG terminal and the SLD terminal as shown in the diagram below.

[Simplified diagram]

CC-Link dedicated cable Shield

MELSEC-Q

Local stat ion

DA DB DG

SLD

FG

Terminal resisto

erminal resistor

Master station

DA

(White)

DB

(Yellow)

DG

SLD

FG

(Blue)

CC-Link

dedicated

cable

Remote I/O station

DA DB DG

SLD

CC-Link

FG

dedicated

cable

(d) I/O signal lines

For the I/O signal lines, if extracted to the outside of the control panel, also ensure to earth the shield section of these lines and cables in the same manner as in item (1) above.

(2) Power supply modul e

The precautions required for each power supply module are described below. Always observe the items noted as precautions.

Model Precautions

A1S61P A1S62P A1S63P ( 1) Use the C E marked 24VDC panel power equipment. A1S61PEU A1S62PEU A1S61PN A1S62PN

( 1) If sufficient filter circuitry is built into the 24VDC external power supply module, the noise

generated by A1S63P will be absorbed by that filter circuit, so a line filter may not be required. Filtering circuitry of version F or later of A1S63P is improved so that a external line filter is not required.

Not usable

Always ground the LG and FG terminals after short-circuiting them.

8 - 7 8 - 7

8 EMC AND LOW VOLTAGE DIRECTIVE

8.1.6 Others (1) Ferrite core

A ferrite core has the effect of reducing radiated noise in the 30MHz to 100MHz band. It is not required to fit ferrite cores to cables, but it is recommended to fit ferrite cores if shield cables pulled out of the enclosure do not provide sufficient shielding e ffects. It should be noted that the ferrite cores should be fitted to the cables in the position immediately before they are pulled out of the enclosure. If the fitting position is improper, the ferrite will not produce any effect. In the CC-Link system, however, ferrite cores cannot be fitted to cables.

(2) Noise filter (pow er supply line filter)

A noise filter is a component which has an effect on conducted noise. It is not required to fit the noise filter to the power supply line, but fitting it can further suppress noise. (The noise filter has the effect of reducing conducted noise of 10 MHz or less.)

The precautions required when installing a noise filter are described below.

(a) Do not bundle the wires on the input side and output side of the noise filter.

When bundled, the output side noise will be induced into the input side wires from which the noise was filtered.

(power supply side)

Input side

(power supply side)

MELSEC-Q

Introduction

Filter

Output side

(device side)

1) The noise will be included when the input and output wires are bundled.

2) Separate and lay the input

Filter

and output wires.

(b) Earth the noise filter earthing terminal to the control cabinet with the shortest

wire possible (approx. 10 cm (3.94 inch)).

Reference

Noise Filter

Model Name

Manufacturer SCHAFFNER SCHAFFNER TDK Rated current 3 A 6 A 3 A Rated voltage 250 V

FN343-3/01 FN660-6/06 ZHC2203-11

8 - 8 8 - 8

Output side

(device side)

8 EMC AND LOW VOLTAGE DIRECTIVE

8.2 Requirement to Conform to the Low Voltag e D i r ective

The Low Voltage Directive requires each device that operates with the power supply ranging from 50 to 1000VAC and 75 to 1500VDC to satisfy the safety requirements. In Sections 8.2.1 to 8.2.6, cautions on installation and wiring of the MELSEC-Q series PLC to conform to the Low Voltage Directive are described. We have put the maximum effort to develop this material based on the requirements and standards of the regulation that we have collected. However, compatibility of the devices which are fabricated according to the contents of this manual to the above regulation is not guaranteed. Each manufacturer who fabricates such device should make the final judgement about the application method of the Low Voltage Directive and the product compatibility.

8.2.1 Standard applied for MELSEC-Q series PLC

The standard applied for MELSEC-Q series PLC is EN61010-1 safety of devices used in measurement rooms, control rooms, or laboratories.

The MELSEC-Q series PLC modules which operate at the rated voltage of 50VAC/75VDC or above are also developed to conform to the above standard. The modules which operate at the rated voltage of less than 50VAC/75VDC are out of the Low Voltage Directive application range.

8.2.2 MELSEC-Q series PLC selection

MELSEC-Q

(1) Power supply modul e

There are dangerous voltages (voltages higher than 42.4V peak) inside the power supply modules of the 100/200VAC rated I/O voltages. Therefore, the CE marked models are enhanced in insulation internally between the primary and secondary.

(2) I/O module

There are dangerous voltages (voltages higher than 42.4V peak) inside the I/O modules of the 100/200VAC rated I/O voltages. Therefore, the CE marked models are enhanced in insulation internally between the primary and secondary. The I/O modules of 24VDC or less rating are out of the Low Voltage Directive application range.

(3) CPU module, memory car d, base unit

Using 5VDC circuits inside, the above modules are out of the Low Voltage Directive application range.

(4) Intelligent function modules (special function modules)

The intelligent function modules (special function modules) such as the analog, network and positioning modules are 24VDC or less in rated voltage and are therefore out of the Low Voltage Directive application range.

(5) Display dev i ce

Use the CE marked display device.

8 - 9 8 - 9

8 EMC AND LOW VOLTAGE DIRECTIVE

8.2.3 Power supply

The insulation specification of the power supply module was designed assuming installation category II. Be sure to use the installation category II power supply to the PLC. The installation category indicates the durability level against surge voltage generated by a thunderbolt. Category I has the lowest durability; category IV has the highest durability.

MELSEC-Q

Category III Category II Category ICategory IV

Category II indicates a power supply whose voltage has been reduced by two or more levels of isolating transformers from the public power distribution.

Figure 8.1: Installation Category

8.2.4 Control box

Because the PLC is an open device (a device designed to be stored within another module), be sure to use it after storing in the control box.

(1) Electrical shock preventi on

In order to prevent persons who are not familiar with the electric facility such as the operators from electric shocks, the control box must have the following functions : (a) The control box must be equipped with a lock so that only the personnel who

has studied about the electric facility and have enough knowledge can open it.

(b) The control box must have a structure which automatically stops the power

supply when the box is opened.

(2) Dustproof and waterproof features

The control box also has the dustproof and waterproof functions. Insufficient dustproof and waterproof features lower the insulation withstand voltage, resulting in insulation destruction. The insulation in our PLC is designed to cope with the pollution level 2, so use in an environment with pollustion level 2 or below.

Pollution level 1 : An environment where the air is dry and conductive

dust does not exist.

Pollution level 2 : An environment where conductive dust

does not usually exist, but occasional temporary conductivity occurs due to the accumulated dust. Generally, this is the level for inside the control box equivalent to IP54 in a control room or on the floor of a typical factory.

Pollution level 3 : An environment where conductive dust exits and conductivity

may be generated due to the accumulated dust. An environment for a typical factory floor.

Pollution level 4 : Continuous conductivity may occur due to rain, snow,

etc. An outdoor environment. As shown above, the PLC can realize the pollution level 2 when stored in a control box equivalent to IP54.

8 - 10 8 - 10

8 EMC AND LOW VOLTAGE DIRECTIVE

MELSEC-Q

8.2.5 Grounding

8.2.6 External wiri ng

There are the following two different grounding terminals. Use either grounding terminal in an earthed status.

Protective grounding

Functional grounding

: Maintains the safety of the PLC and improves the

noise resistance.

: Improves the noise resistance.

(1) 24VDC external power supply

For the MELSEC-Q series PLC 24VDC I/O modules and the intelligent function modules (special function modules) which require external supply power, use a model whose 24VDC circuit is intensively insulated from the hazardous voltage circuit.

(2) External devic es

When a device with a hazardous voltage circuit is externally connected to the PLC, use a model whose circuit section of the interface to the PLC is intensively insulated from the hazardous voltage circuit.

(3) Intensive insulation

Intensive insulation refers to the insulation with the dielectric withstand voltage shown in Table 8.1.

Table 8.1 : Intensive Insulation Withstand Voltage

(Installation Category II, source : IEC664)

Rated voltage of hazardous voltage area Surge withstand voltage (1.2/50 s)

150VAC or below 2500 V 300VAC or below 4000 V

8 - 11 8 - 11

9 LOADING AND INSTALLATION

MELSEC-Q

9.1 General Safety Requirements

9

In order to increase the reliability of the system and exploit the maximum performance of its functions, this section describes the methods and precautions for the mounting and installation of the system.

!

DANGER

Install a safety circuit external to the PLC that keeps the entire

system safe even when there are problems with the external power supply or the PLC module. Otherwise, trouble could result from erroneous output or erroneous operation. (1) Outside the PLC, construct mechanical damage preventing

interlock circuits such as emergency stop, protective circuits, positioning upper and lower limits switches and interlocking forward/reverse operations.

(2) When the PLC detects the following problems, it will stop

calculation and turn off all output in the case of (a). In the case of (b), it will stop calculation and hold or turn off all output according to the parameter setting. Note that the A1S series module will turn off the output in either of cases (a) and (b). All outputs of AnS Series Module will be switched off in the followin g ca se s:

(a) The power supply module has over current protection

equipment and over voltage protection equipment.

(b) The PLC CPUs self-diagnosis functions, such as the watch

dog timer error, detect problems. In addition, all output will be turned on when there are problems that the PLC CPU cannot detect, such as in the I/O controller.

(3) Output could be left on or off when there is trouble in the outputs

module relay or transistor. So build an external monitoring circuit that will monitor any single outputs that could cause serious trouble.

When overcurrent which exceeds the rating or caused by short-

circuited load flows in the output module for a long time, it may cause smoke or fire. To prevent this, configure an external safety circuit, such as fu se.

Build a circuit that turns on the external power supply when the PLC

main module power is turned on. If the external power supply is turned on first, it could result in erroneous output or erroneous operation.

When there are communication problems with the data link, refer to

the corresponding data link manual for the operating status of each station. Not doing so could result in erroneous output or erroneous operation.operating status of each station. Not doing so could result in erroneous output or erroneous operation.

9 - 1 9 - 1

9 LOADING AND INSTALLATION

MELSEC-Q

!

DANGER

!

CAUTION

When the PLC power supply is switched ON-OFF, correct control output may not be performed temporarily due to differences in delay time and starting time between the PLC power supply and the external power supply for the controlled object (especially DC). For example, if the external power supply for the controlled object is switched on in a DC output module and then the PLC power supply is switched on, the DC output module may provide false output instantaneously at power-on of the PLC. Therefore, it is necessary to make up a circuit that can switch on the PLC power supply first. Also, an abnormal operation may be performed if an external power supply fault or PLC failure takes place. To prevent any of these abnormal operations from leading to the abnormal operation of the whole system and in a fail-safe viewpoint, areas which can result in machine breakdown and accidents due to abnormal operations (e.g. emergency stop, protective and interlock circuits) should be constructed outside the PLC. The following page gives examples of system designing in the above viewpoint.

When connecting a peripheral device to the CPU module or connecting

a personal computer or the like to the special function module to exercise control (data change) on the running PLC, configure up an interlock circuit in the sequence program to ensure that the whole system will always operate safely. Also before exercising other control (program change, operating status change (status control)) on the running PLC, read the manual carefully and fully confirm safety. Especially for the above control on the remote PLC from an external device, an immediate action may not be taken for PLC trouble due to a data communication fault. In addition to configuring up the interlock circuit in the sequence program, corrective and other actions to be taken as a system for the occurrence of a data communication fault should be predetermined between the external device and PLC CPU.

Do not bunch the control wires or communication cables with the main

circuit or power wires, or install them close to each other. They should be installed 100 mm (3.94 inch) or more from each other. Not doing so could result in noise that would cause erroneous operation.

When controlling items like lamp load, heater or solenoid valve using an

output module, large current (approximately ten times greater than that present in normal circumstances) may flow when the output is turned OFF to ON. Take measures such as replacing the module with one having sufficient rated current.

9

9 - 2 9 - 2

9 LOADING AND INSTALLATION

(1) System design circui t ex ampl e ( when not using ERR contact of

power supply module)

POWER SUPPLY

TRANSFORMER

FUSE

CPU MODULE

SM52

START SW

MC

OUTPUT MODULE

MC

STOP SW

Ym

Yn

Ym

SM403

Yn

PROGRAM

RA1

MC

INPUT MODULE

L

RA1

MC2

MC1

MC2

RUN/STOP circuit interlocked with RA1 (run monitor relay)

Low battery alarm (Lamp or buzzer)

RA1 switched ON by SM403 (run monitor relay)

MC

Power to output equipment switched OFF when the

STOP signal is given. In the case of an emergency stop or a stop caused by a limit switch.

Interlock circuits as necessary.Provide external interlock circuits for conflicting operations, such as forward rotation and reverse rotation, and for parts that could damage the machine or cause accidents if no interlock were used.

Input switched when power supply established.

POWER SUPPLY

TRANSFORMER

NO

START SW

STOP

MC

SW

RA2

OUTPUT MODULE

Ym

Yn

OUTPUT MODULE

FOR AC/DCFOR AC

FUSE FUSE

CPU MODULE

SM52

Ym

SM403

Yn

XM

TM

MC1 NO M10

M10

PROGRAM

RA1

MC

XM

L

RA1

MC2

MC1

MC2

DC

POWER

SUPPLY

(-) (+)

RA2

MC

MELSEC-Q

TRANSFORMER

FUSE

Set time for DC power supply to be established.

Voltage relay is recommended

Low battery alarm (Lamp or buzzer)

ON when run by SM403

MC

Power to output equipment switched OFF when the STOP signal is given.

In the case of an emergency stop or a stop caused by a limit switch.

The power-ON procedure is as follows:

For AC/DC

For AC

1) Switch power ON.

2) Set CPU to RUN.

3) Turn ON the start switch.

4) When the magnetic contactor (MC) comes on, the output equipment is powered and may be driven by the program.

1) Switch power ON.

2) Set CPU to RUN.

3) When DC power is established, RA2 goes ON.

4) Timer (TM) times out after the DC pow er reaches 100%. (The TM set value should be the period of time from w hen RA2 goes ON to the establishment of 100% DC voltage. Set this value to approximately 0.5 seconds.)

5) Turn ON the start switch.

6) When the magnetic contactor (MC) comes on, the output equipment is powered and may be driven by the program. (If a voltage relay is used at RA2, no timer (TM) is required in the program.)

9 - 3 9 - 3

9 LOADING AND INSTALLATION

(2) System design circui t ex ampl e ( when using ERR contact of power

supply module)

POWER SUPPLY

FOR AC/DC

MELSEC-Q

Input switched when power supply established.

RUN/STOP circuit interlocked with RA1 (run monitor relay)

TRANSFORMER

FUSE

NO

STRAT SW

MC

RA1

STOP SW

RA2

OUTPUT MODULE

Ym

Yn

CPU MODULE

SM52

Ym

SM403

Yn

XM

TM

MC1 NO M10

M10

PROGRAM

RA3

MC

L

RA1

FUSE

XM

DC

POWER

SUPPLY

(+)

(-)

RA2

TRANSFORMER

FUSE

Set time for DC power supply to be established.

Voltage relay is recommended

Low battery alarm (Lamp or buzzer)

MC

OFF at stop error from ERR

Power to output equipment switched OFF when ERR contact turns OFF.

In the case of an emergency stop or a stop caused by a limit switch.

POWER SUPPLY MODULE

Interlock circuits asnecessary. Provide external interlock circuits for conflicting operations, such as forward rotation and reverse rotation, and for parts that could damage the machine or cause accidents if no interlock were used.

ERR

OUTPUT MODULE

MC2

MC1

RA3

MC1

MC2

The power-ON procedure is as follows: For AC/DC

1) Switch power ON.

2) Set CPU to RUN.

3) When DC power is established, RA2 goes ON.

4) Timer (TM) times out after the DC pow er reaches 100%. (The TM set value should be the period of time from when RA2 goes ON to the establishment of 100% DC voltage. Set this value to approximately 0.5s.)

5) Turn ON the start switch.

6) When the magnetic contactor (MC) comes on, the output equipment is powered and may be driven by the program. (If a voltage relay is used at RA2, no timer (TM) is required in the program.)

9 - 4 9 - 4

9 LOADING AND INSTALLATION

(3) Fail-safe measures against failure of the PLC

Failure of a CPU module or memory can be detected by the self-diagnosis function. However, failure of I/O control area may not be detected by the CPU module. In such cases, all I/O points turn ON or OFF depending on a condition of problem, and normal operating conditions and operating safety cannot sometimes be maintained. Though Mitsubishi PLCs are manufactured under strict quality control, they may cause failure or abnormal operations due to unspecific reasons. To prevent the abnormal operation of the whole system, machine breakdown, and accidents, fail-safe circuitry against failure of the PLC must be constructed outside the PLC. Examples of a system and its fail-safe circuitry are described below: <System example>

CPU module

Power supply

module

Input 16 points

MELSEC-Q

Vacant

Power supply

Input 16 points

Output 16 poi nts

module

Output 16 poi nts

Y80 to Y8F

Output 16 poi nts

Output module for fail-safe purpose 1

1: The output module for fail-safe purpose should be loaded in the last slot of

the system. (Y80 to Y8F in the above system.)

<Fail-safe circuit example>

Internal program

SM412

Y80

0.5s0.5s

CPU module

Y80

Y81

Y8F

24V

0V

Output module

2

ON delay timer

OFF delay timer

External load

L

T1

T2

T2T1

-

1s

MC

+

24V DC

MC

2: Y80 repeats turning ON and then OFF at 0.5s intervals.

Use a no-contact output module (transistor in the example shown above).

9 - 5 9 - 5

9 LOADING AND INSTALLATION

9.2 Calculating Heat Generation by PLC

The ambient temperature inside the board storing the PLC must be suppressed to a PLC usable ambient temperature of 55°C. For the design of radiation from the storing board, it is necessary to know the average power consumption (heating value) of the devices and instruments stored in the board. Here the method of obtaining the average power consumption of the PLC system is described. From the power consumption, calculate a rise in ambient temperature inside the board.

How to calculate average power consumption

The power consuming parts of the PLC are roughly classified into six blocks as shown below.

(1) Power consumption of power suppl y module

The power conversion efficiency of the power supply module is approx. 70 %, i.e., 30 % of the output power is consumed by heating. As a result, 3/7 of the output power becomes the power consumption. Therefore the calculation formula is as follows.

3

Wpw = (I

5V

I

: Current consumption of logic 5 VDC circuit of each module

7

5

v 5) (W)

(2) Power consumption of a total of 5 VDC logic secti on of each

module

The power consumption of the 5 VDC output circuit section of the power supply module is the power consumption of each module (including the current consumption of the base unit).

5V

W

= I5V 5 (W)

A total of 24 VDC average power consumption of the output module

(3)

(power consumption for simultaneous ON points)

The average power of the external 24 VDC power is the total power consumption of each module.

24V

= I

24V

24 (W)

W

(4) Average pow er consumption due to voltage drop in the output

section of the output module (Power consumption for simultaneous ON points)

OUT

W

OUT

I Vdrop : Voltage drop in each output module (V)

OUT

= I

Vdrop Number of outputs Simultaneous ON rate (W)

: Output current (Current in actual use) (A)

(5) Average pow er consumpti on of the input section of the input

module(Power consumption for simultaneous ON poi nts)

IN

= IIN E Number of input points Simultaneous ON rate (W)

W

IN

I E : Input voltage (Voltage in actual use) (V)

: Input current (Effective value for AC) (A)

MELSEC-Q

9 - 6 9 - 6

9 LOADING AND INSTALLATION

(6) Power consumption of the power supply section of the intelligent

function module

S

= I5V 5 + I

W The total of the power consumption values calculated for each block becomes

the power consumption of the overall sequencer system. W = W

From this overall power consumption (W), calculate the heating value and a rise in ambient temperature inside the board. The outline of the calculation formula for a rise in ambient temperature inside the board is shown below.

T =

POINT

When a rise in ambient temperature inside the board exceeds the specified limit, it is recommended that you install a heat exchanger in the board to lower the ambient temperature inside the board. If a normal ventilating fan is used, dust will be sucked into the PLC together with the external air, and it may affect the performance of the PLC.

PW

+ W5V + W

W

(°C)

UA

W : Power consumption of overall sequencer system (value obtained above) A : Surface area inside the board

When the ambient temperature inside the board is uniformed by a fan

U :

When air inside the board is not circulated..............................................4

(7) Example of calculation of average power consumption

(a) System configuration

24V

24 + I

24V

+ W

100V

100 (W)

OUT

+ WIN + WS (W)

MELSEC-Q

.........6

Q35B

QX40

Q61P-A1

Q02HCPU

QY10

QJ71LP21-25

Vacant

(b) 5 VDC current consumption of each module

Q02HCPU : 0.64 (A) QX40 : 0.05 (A) QY10 : 0.43 (A) QJ71LP21-25 : 0.55 (A) Q35B : 0.074 (A)

(c) Power consumption of power supply module

PW

W

= 3/7 (0.64+0.05+0.05+0.43+0.55+0.074) 5) = 3.84 (W)

(d) Power consumption of a total of 5 VDC logic section of each module

5V

W

= (0.64+0.05+0.05+0.43+0.55+0.074) 5) = 8.97 (W)

(e) A total of 24 VDC average power consumption of the output module

24V

W

= 0 (W)

9 - 7 9 - 7

9 LOADING AND INSTALLATION

(f) Average power consumption due to voltage drop in the output section of the

output module

OUT

W

= 0 (W)

(g) Average power consumption of the input section of the input module

IN

W

= 0.004 24 32 1 = 3.07 (W)

(h) Power consumption of the power supply section of the intelligent function

module

S

W

= 0 (W)

(i) Power consumption of overall system.

W = 3.84 + 8.97 + 0 + 0 + 3.07 + 0 = 15.88 (W)

MELSEC-Q

9 - 8 9 - 8

9 LOADING AND INSTALLATION

9.3 Module Installation

9.3.1 Precaution on installation

!

CAUTION

This section gives instructions for handling the CPU, I/O, intelligent function and power supply modules, base units and so on.

(1) Module enclosure, terminal block connectors and pin connectors are made of resin;

do not drop them or subject them to strong impact.

(2) Do not remove modules' printed circuit boards from the enclosure in order to avoid

changes in operation.

(3) Tighten the module fixing screws and terminal block screws within the tightening

torque range specified below.

Module fixing screw (M3 12 screw) 36 to 48 N • cm I/O module terminal block screw (M3 screw) 42 to 58 N • cm I/O module terminal block fixing screw (M3.5 screw) 66 to 89 N • cm Power supply module terminal screw (M3.5 screw) 66 to 89 N • cm

(4) Be sure to install the power supply module in the Q3

Even if the power supply module is not installed, when the I/O modules and intelligent function module installed on the base units are of light load type, the modules may be operated. In this case, because a voltage becomes unstable, we cannot guarantee the operation.

(5) When an extension cable is used, do not bind the cable together with the main

circuit (high voltage, heavy current) line or lay them close to each other.

Use the PLC in an environment that meets the general specifications

Hold down the module loading lever at the module bottom, and

When installing more cables, be sure that the base unit and the module

Securely load the memory card by pushing it into the memory card

Completely turn off the external power supply before loading or

Do not directly touch the module's conductive parts or electronic

MELSEC-Q

contained in this manual. Using this PLC in an environment outside the range of the general specifications could result in electric shock, fire, erroneous operation, and damage to or deterioration of the product.

securely insert the module fixing latch into the fixing hole in the base unit. Incorrect loading of the module can cause a malfunction, failure or drop.When using the PLC in the environment of much vibration, tighten the module with a screw. Tighten the screw in the specified torque range. Undertightening can cause a drop, short circuit or malfunction. Overtightening can cause a drop, short circuit or malfunction due to damage to the screw or module.

connectors are installed correctly. After installation, check them for looseness. Poor connections could cause an input or output failure.

loading slot. Check for insecure loading after loading the memory card. Not doing so can cause a malfunction due to a contact fault.

unloading the module. Not doing so could result in electric shock or damage to the product.

components. Touching the conductive parts could cause an operation failure or give damage to the module.

Location of Screw Tightening Torque Range

B, Q6 B and QA1S6 B.

9 - 9 9 - 9

9 LOADING AND INSTALLATION

(6) Install the main base unit (by screwing) in the following procedure.

1) Fit the two base unit top mounting screws into the enclosure.

MELSEC-Q

2) Place the right-hand side notch of the base unit onto the right-hand side screw.

3) Place the left-hand side pear-shaped hole onto the left-hand side screw.

4) Fit the mounting screws into the mounting screw holes in the base unit bottom and retighten the four mounting screws.

Note1 : Install the main base unit to a panel, with no module loaded in the right-end

slot. Remove the base unit after unloading the module from the right-end slot.

Note2 : The mounting screws that included with the slim type main base unit differ

from those included with other types of the base unit. When ordering mounting screws for the slim type main base unit, specify "cross recessed head bind screw M4 x 12 (black)."

Panel

9 - 10 9 - 10

g

ess

9 LOADING AND INSTALLATION

(7) Note the following points when mounting a DIN rail.

Mounting a DIN rail needs special adaptors (optional), which are to be userprepared. (a) Applicable adaptor types

For Q38B, Q312B, Q68B, Q612B : Q6DIN1 For Q35B, Q65B : Q6DIN2 For Q33B, Q52B, Q55B, Q63B, Q32SB, Q33SB, Q35SB : Q6DIN3

(b) Adaptor installation method

The way to install the adaptors for mounting a DIN rail to the base unit is given below.

Base unit rear

MELSEC-Q

Insert the adaptor (large) into the grooves of the base unit from below.

Place the hook of the adaptor (small) in the lower hole.

Push the bottom of the adaptor (large) far

h until it "clicks".

enou

Push the top of the adaptor (small) far enough until it "clicks".

(c) Applicable DIN rail types (JIS C 2812)

TH35-7.5Fe TH35-7.5Al TH35-15Fe

(d) DIN rail mounting screw intervals

When using a TH35-7.5Fe or TH35-7.5Al DIN rail, rail mounting screws should be tightened at a pitch of 200 mm (7.88 inch) or less in order to ensure that the rail has sufficient strength.

DIN rail

DIN rail mounting screw

35mm (1.38 inch)

PPP

P=200mm (7.88 inch) or l

9 - 11 9 - 11

9 LOADING AND INSTALLATION

9.3.2 Instructions for mounting the base unit

When mounting the PLC to an enclosure or similar, fully consider its operability, maintainability and environmental resistance.

(1) Module mounting position

For enhanced ventilation and ease of module replacement, leave the following clearances between the module top/bottom and structure/parts. (a) In case of main base unit or extension base unit

Indicates the panel top, wiring duct or any part position.

30mm (1.18 inch) or more 1

PLC

MELSEC-Q

DoorPanel

5mm (0.20 inch) or more 2

30mm (1.18 inch) or more

5mm (0.20 inch) or more

20mm (0.79 inch) or more 3

1 : For wiring duct with 50mm (1.97 inch) or less height.

40mm (1.58 inch) or more for other cases.

2 : 20mm (0.79 inch) or more when the adjacent module is not removed and the

extension cable is connected.

3 : 80mm (3.15 inch) or more for the connector type.

9 - 12 9 - 12

9 LOADING AND INSTALLATION

(b) In case of slim type main base unit

Indicates the panel top, wiring duct or any part position.

30 mm (1.18 inch) or more 1

PLC

MELSEC-Q

Door

3

17 mm (0.67 inch) or more 2

30 mm (1.18 inch) or more

5 mm (0.20 inch) or more

Panel

20 mm (0.79 inch) or more

1 : For wiring duct with 50 (1.97 inch) mm or less height.

40 mm (1.58 inch) or more for other cases.

2 : The cable of the power supply module of the slim type main base unit protrudes

out of the left end of the module. Install the module while reserving 17 mm (0.67 inch) or more wiring space. If the cable sheath is susceptible to damage caused by a structural object or part on the left side of the module, take a protective measure with spiral tube or a similar insulator.

3 : 80 mm (3.15 inch) mm or more for the connector type.

9 - 13 9 - 13

9 LOADING AND INSTALLATION

(2) Module mounting orientati on

(a) Since the PLC generates heat, it should be mounted on a well ventilated

location in the orientation shown below.

(b) Do not mount it in either of the orientations shown below.

MELSEC-Q

Vertical Flat

(3) Installation surface

Mount the base unit on a flat surface. If the mounting surface is not even, this may strain the printed circuit boards and cause malfunctions.

(4) Installation of unit in an area where the other devices are installed

Avoid mounting base unit in proximity to vibration sources such as large magnetic contractors and no-fuse circuit breakers; mount these on a separate panel or at a distance.

(5) Distances from the other devices

In order to avoid the effects of radiated noise and heat, provide the clearances indicated below between the PLC and devices that generate noise or heat (contactors and relays).

• Required clearance in front of PLC : at least 100 mm (3.94 inch)

• Required clearance on the right and left of PLC : at least 50 mm (1.97 inch)

At least 50mm (1.97 inch)

At least 100mm (3.94 inch)

Conta ctor, r elay, etc.

At least 50mm (1.97 inch)

9 - 14 9 - 14

9 LOADING AND INSTALLATION

9.3.3 Installation and removal of module

This section explains how to install and remove a power supply, CPU, I/O, intelligent function or another module to and from the base unit.

(1) Installation and removal of the module from Q3 B, ,Q5 B and

Q6 B

The installation and removal of the module from Q3 B/Q6 B base unit are described below. (a) Installation of module on Q3

B, Q5 B and Q6 B

MELSEC-Q

Base unit

Insert the module fixing latch into the module fixing hole of the base unit.

Push the module in the direction of arrow to load it into the base unit.

Make sure that the module is inserted in the base unit securely.

Completion

Module

Module loading lever

Module fixing latch

Module fixing hole

Module connector

POINTS

Base unit

Module fixing hole

Module fixing latch

(1) Always insert the module fixing latch of the module into the module fixing hole.

Forcing the hook into the hole will damage the module connector and module.

(2) When using the PLC in a place where there is large vibration or impact, screw

the CPU module to the base unit. Module fixing screw : M3

12 (user-prepared)

9 - 15 9 - 15

9 LOADING AND INSTALLATION

(b) Removal from Q3

Hold the module with both hands, and push the unit fixing hook on the top of the module with a finger until it stops.

While pushing the unit fixing hook, and using the bottom of the module as a support, pull the module toward you.

Lift the module upwards and remove the module fixing latch from the module fixing hole.

B, Q5 B and Q6 B

Base unit

Module connector

Module fixing hole

Module

MELSEC-Q

Completion

POINT

When the module fixing screw is used, always remove the module by removing the module fixing screw and then taking the module fixing latch off the module fixing hole of the base unit. Do not try to remove the module forcibly since this may damage the module.

9 - 16 9 - 16

9 LOADING AND INSTALLATION

(2) Installation and removal of the module from QA1S6 B

The procedure for installing and removing the module from the QA1S6 B base unit is described below. (a) Installation of module on QA1S6

Insert the module fixing projections into the module fixing hole in the base unit.

Base unit

Module connector

B

MELSEC-Q

Module

Install the module onto the base unit by pushing the top forward.

Make sure that the module is firmly inserted in the base unit. Then, secure it with the module mounting screw.

Completion

Module fixing hole

Base unit

Module fixing projections

Module mounting screw

Module

POINT

Make sure to install the module, with the module fixing projection inserted into the module fixing hole, using the module fixing screws. Do not try to forcibly install the module without inserting the projection into the hole, since this may damage the module connector and the module.

9 - 17 9 - 17

9 LOADING AND INSTALLATION

(b) Removal from QA1S6

Remove the module mounting screw, and using the bottom of the module as a support, pull the top of the module toward you.

Lift the module upwards and remove the module fixing projections from the module fixing hole.

Completion

Base unit

Module connector

Module fixing hole

B

Module

MELSEC-Q

POINT

To remove the module, make sure to remove the module fixing screws, and then disengage the module fixing projection from the module fixing hole. Do not try to remove the module forcibly since this may damage the module fixing projection.

9 - 18 9 - 18

Mitsubishi Electronics Q25HCPU, Q06HCPU, Q02CPU, Q02HCPU, Q12HCPU User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

SAFETY PRECAUTIONS

REVISIONS

INTRODUCTION

CONTENTS

About Manuals

How to Use This Manual

About the Generic Terms and Abbreviations

1 OVERVIEW

1.1 Features

2 SYSTEM CONFIGURATION FOR SINGLE CPU SYSTEM

2.1 System Configuration

2.2 Precaution on System Configuration

2.3 Confirming the Serial Number and Functi on Ver si on

3 GENERAL SPECIFICATIONS

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4.1 Performance Specification

4.2 Part Names and Settings

4.3 Switch Operation After Writing in Program

4.4 Latch Clear Operation

4.5 Executing Automatic Write to Standard ROM.

5 POWER SUPPLY MODULE

5.1 Specification

5.1.1 Power supply module specifications

5.1.2 Selecting the power supply modul e

5.1.3 Precaution when connecting the uninterr upti v e power supply

5.2 Names of Parts and Settings

6 BASE UNIT AND EXTENSION CABLE

6.1 Base Unit Specification Table (1) Main base unit specifications

6.2 Extension Cable Specification Table

6.3 Parts Names of Base Unit

6.4 Setting the Extension Base Unit

6.5 I/O Number Allocation

7 MEMORY CARD AND BATTERY

7.1 Memory Card Specifications

7.2 Battery Specifications (For CPU Modul e and SR AM C ar d)

7.3 Handling the Memory C ar d (1) Formatting of memory card

7.4 The Names of The Parts of The Memory Card

7.5 Memory Card Loading/U nl oading Pr ocedur es (1) To install the memory card

7.6 Installation of Battery (for CPU Module and M emor y C ar d)

8 EMC AND LOW VOLTAGE DIRECTIVE

8.1 Requirements for Conformance to EMC Directi ve

8.1.1 Standards applicable to the EMC Directi ve

8.1.2 Installation instructions for EMC Directiv e

8.1.3 Cables

8.1.4 Power supply module

8.1.6 Others (1) Ferrite core

8.2 Requirement to Conform to the Low Voltag e D i r ective

8.2.1 Standard applied for MELSEC-Q series PLC

8.2.2 MELSEC-Q series PLC selection

8.2.3 Power supply

8.2.4 Control box

8.2.5 Grounding

8.2.6 External wiri ng

9 LOADING AND INSTALLATION

9.1 General Safety Requirements

9.2 Calculating Heat Generation by PLC

9.3 Module Installation

9.3.1 Precaution on installation

9.3.2 Instructions for mounting the base unit

9.3.3 Installation and removal of module