Mitsubishi MH8S72BBFD-7, MH8S72BBFD-8 Datasheet

Preliminary
Preliminary
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Spec.
Spec.
PRELIMINARY
Some of contents are subject to change without notice.
DESCRIPTION
The MH8S72BBFD is 8388608 - word x 72-bit Synchronous DRAM module. This consist of nine industry standard 8M x 8 Synchronous DRAMs in TSOP. The mounting of TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. This is a socket-type memory module ,suitable for easy interchange or addition of module.
MITSUBISHI LSIs
MH8S72BBFD-7, -8
85pin
1pin
FEATURES
Type name
Utilizes industry standard 8M X 8 Synchronous DRAMs in TSOP package , industry standard Resistered buffer in TSSOP package and industry standard PLL in TSSOP package Single 3.3V +/- 0.3V supply LVTTL Interface Burst length 1/2/4/8/Full Page(programmable) Burst Write / Single Write(programmable) Auto precharge / All bank precharge controlled by A10 Auto refresh and Self refresh 4096 refresh cycles every 64ms
Discrete IC and module design conform to PC/100 specification. (module Spec. Rev. 1.1 and SPD 1.2A)
Max. Frequency
100MHz
CLK Access Time [component level]
6ns (CL = 2, 3)MH8S72BBFD-7
6ns (CL = 3)MH8S72BBFD-8 100MHz
94pin 95pin
124pin
125pin
Back side
10pin 11pin
Front side
40pin
41pin
APPLICATION
Main memory unit for computers, Microcomputer memory.
MITSUBISHI ELECTRIC
168pin
84pin
29/Oct. /1998
1
Preliminary
Preliminary
Spec.
Spec.
PIN NO. PIN NAME PIN NO. PIN NAME PIN NO. PIN NAME PIN NO. PIN NAME
1 2 DQ0 44 NC 3 DQ1 45 /S2 4 DQ2 46 DQMB2 5 DQ3 47 DQMB3 6 VDD 48 NC 7 DQ4 49 VDD 8 DQ5 50 NC
9 DQ6 51 NC 10 DQ7 52 11 DQ8 53 12 13 DQ9 55 DQ16 14 DQ10 56 DQ17 15 DQ11 57 DQ18 16 DQ12 58 DQ19 17 DQ13 59 VDD 18 VDD 60 DQ20 19 DQ14 61 NC 20 DQ15 62 NC 21 22 23 VSS 65 DQ21 24 NC 66 DQ22 25 NC 67 DQ23 26 VDD 68 27 28 DQMB0 70 DQ25 29 DQMB1 71 DQ26 30 /S0 72 DQ27 31 NC 73 VDD 32 VSS 74 DQ28 33 A0 75 DQ29 34 A2 76 DQ30 35 A4 77 DQ31 36 A6 78 VSS 37 A8 79 38 39 40 VDD 82 SDA 41 VDD 83 SCL
42 CK0 84 VDD
MITSUBISHI LSIs
MH8S72BBFD-7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
VSS
VSS
CB0 CB1
/WE0
A10 BA1
43
54 VSS
63 64 VSS
69 DQ24
80 NC 81
VSS 85
CB2 CB3
100 101 102 103 104
CKE1
VSS 110
CK2
TEST
105 106 107 108 109
111 112 113 114 115 116 117 118 119 120 121 122 123 124 125
126
86 87 88 89 90 91 92 93 94 95 96 97 98 99
VSS 127 DQ32 128 DQ33 129 DQ34 130 DQMB6 DQ35 131 DQMB7
VDD 132 DQ36 133 VDD DQ37 134 NC DQ38 135 NC DQ39 136 DQ40 137
VSS 138 VSS DQ41 139 DQ48 DQ42 140 DQ49 DQ43 141 DQ50 DQ44 142 DQ51 DQ45 143 VDD
VDD 144 DQ52 DQ46 145 NC DQ47 146 NC
CB4
CB5
VSS 149 DQ53
NC 150 DQ54 NC 151 DQ55
VDD 152 VSS
/CAS 153 DQ56 DQMB4 154 DQ57 DQMB5 155 DQ58
NC
/RAS 157 VDD
VSS 158 DQ60
A1 159 DQ61 A3 160 DQ62 A5 161 DQ63 A7 162 VSS
A9 163 BA0 A11
VDD 166 SA1 CK1 167 SA2
NC
147 148 VSS
156 DQ59
164 NC 165 SA0
168 VDD
VSS
CKE0
NC
NC
CB6 CB7
REGE
CK3
NC = No Connection
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Spec.
Spec.
/RS0
RDQMB0
DQ0 DQ1
DQ2 DQ3 DQ4 DQ5
DQ6
RDQMB1
DQ7
DQ8 DQ9 DQ10
DQ11 DQ12 DQ13 DQ14 DQ15
CB0 CB1
CB2 CB3
CB4 CB5
CB6 CB7
/RS2
RDQMB2
DQ16 DQ17
DQ18 DQ19
DQ20 DQ21
DQ22 DQ23
RDQMB3
DQ24 DQ25
DQ26 DQ27 DQ28 DQ29
DQ30 DQ31
SERIAL PD
SCL
WP
47K
A0 A1 A2
SA0 SA1 SA2
MITSUBISHI LSIs
MH8S72BBFD-7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
RDQMB4
DQ32 DQ33
DQ34
D0
D1
D2
D3
D4
SDA
RDQMB5
RDQMB6
RDQMB7
/S0 , /S2 DQMB0 to DQMB7 BA0-BA1 A0-A11 /RAS /CAS CKE0 /WE
10K
VDD REGE
DQ35 DQ36 DQ37
DQ38 DQ39
DQ40 DQ41 DQ42
DQ43 DQ44 DQ45 DQ46 DQ47
DQ48 DQ49
DQ50 DQ51
DQ52 DQ53
DQ54 DQ55
DQ56 DQ57
DQ58 DQ59 DQ60 DQ61
DQ62 DQ63
D5
D6
D7
D8
/RS0 , /RS2
RDQMB0 to RDQMB7 RBA0-RBA1
RA0-RA11 R/RAS R/CAS
BA0-BAN:D0-D8
A0-A11:D0-D8
/RAS: D0-D8 /CAS: D0-D8
RCKE0 R/WE
/WE:D0-D8/WE:D0-D8
CK2
VDD
D0 to D8
CK0
PLL
CK1 - CK3
Terminated
MITSUBISHI ELECTRIC
VSS
29/Oct. /1998
D0 to D8
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Preliminary
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Spec.
Spec.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN FUNCTION
MITSUBISHI LSIs
MH8S72BBFD-7, -8
CK0
CKE0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising edge of CK
Clock Enable:CKE controls internal clock.When CKE is low,internal clock for the following cycle is ceased. CKE is also used to select auto / self refresh. After self refresh mode is started, CKE E becomes asynchronous input.Self refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means No Operation.
Combination of /RAS,/CAS,/W defines basic commands.
A0-11 specify the Row/Column Address in conjunction with BA.The Row Address is specified by A0-11.The Column Address is specified by A0-8.A10 is also used to indicate precharge option.When A10 is high at a read / write command, an auto precharge is performed. When A10 is high at a precharge command, both banks are precharged.
BA0-1
DQ0-63 CB0-7
DQM0-7
Vdd,Vss
REGE
Bank Address:BA0,1 is not simply BA.BA0,1 specifies
Input
Input/Output
Input
Power Supply Power Supply for the memory mounted module.
Output
the bank to which a command is applied.BA must be set with ACT,PRE,READ,WRITE commands
Data In and Data out are referenced to the rising edge of CK
Din Mask/Output Disable:When DQMB is high in burst write.Din for the current cycle is masked.When DQMB is high in burst read,Dout is disabled at the next but one cycle.
Register enable:When REGE is low,All control signals and address are buffered. (Buffer mode) When REGE is high,All control and address are latched. (Latch mode)
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MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
Preliminary
Spec.
Spec.
BASIC FUNCTIONS
The MH8S72BBFD provides basic functions,bank(row)activate,burst read / write, bank(row)precharge,and auto / self refresh. Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge option,respectively. To know the detailed definition of commands please see the command truth table.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CK
/S /RAS /CAS /WE
CKE A10
Chip Select : L=select, H=deselect Command Command Command
Refresh Option @refresh command Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output data appears after /CAS latency. When A10 =H at this command,the bank is deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also terminates burst read / write operation. When A10 =H at this command, both banks are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically.
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Spec.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH8S72BBFD-7, -8
COMMAND MNEMONIC
Deselect DESEL H X H X X X X X X
No Operation NOP H X L H H H X X X
Row Adress Entry &
Bank Activate
Single Bank Precharge PRE H X L L H L V L X
Precharge All Bank PREA H X L L H L V H X
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
ACT H X L L H H V V V
WRITE H X L LH H L V L V
WRITEA H X L H L L V H V
READ H X L H L H V L V
READA H X L H L H V H V
CK
n-1CKn
/RAS /CAS /WE BA A10 A0-9
/S
Auto-Refresh REFA H H L HL L H X X X
Self-Refresh Entry REFS H L L L L H X X X
Self-Refresh Exit REFSX L H H LX X X X X X
L H L H H H X X X
Burst Terminate TERM H X L H H L X X X
Mode Register Set MRS H X L L L L L L V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
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MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
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Spec.
Spec.
FUNCTION TRUTH TABLE
Current State /S /RAS /CAS /WE Address Command Action
IDLE H X X X X DESEL NOP
ROW ACTIVE H X X X X DESEL NOP
READ H X X X X DESEL NOP(Continue Burst to END)
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
L H H H X NOP NOP L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2 L L H H BA,RA ACT Bank Active,Latch RA L L H L BA,A10 PRE/PREA NOP*4 L L L H X REFA Auto-Refresh*5
L L L L
L H H H X NOP NOP L H H L BA TBST NOP
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10 L L H H BA,RA ACT Bank Active/ILLEGAL*2
L L H L BA,A10 PRE/PREA Precharge/Precharge All L L L H X REFA ILLEGAL
L L L L
L H H H X NOP NOP(Continue Burst to END) L H H L BA TBST Terminate Burst
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10 WRITE/WRITEA
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Terminate Burst,Precharge L L L H X REFA ILLEGAL
L L L L
Op-Code, Mode-Add
Op-Code, Mode-Add
Op-Code, Mode-Add
MRS Mode Register Set*5
Begin Read,Latch CA, Determine Auto-Precharge
WRITE/
WRITEA
MRS ILLEGAL
MRS ILLEGAL
Begin Write,Latch CA, Determine Auto-Precharge
Terminate Burst,Latch CA, Begin New Read,Determine
Auto-Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3
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MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
Preliminary
Spec.
Spec.
FUNCTION TRUTH TABLE(continued)
Current State /S /RAS /CAS /WE Address Command Action
WRITE H X X X X DESEL NOP(Continue Burst to END)
READ with H X X X X DESEL NOP(Continue Burst to END)
AUTO L H H H X NOP NOP(Continue Burst to END)
PRECHARGE L H H L BA TBST ILLEGAL
WRITE with H X X X X DESEL NOP(Continue Burst to END)
AUTO L H H H X NOP NOP(Continue Burst to END)
PRECHARGE L H H L BA TBST ILLEGAL
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
L H H H X NOP NOP(Continue Burst to END) L H H L BA TBST Terminate Burst
Terminate Burst,Latch CA,
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Terminate Burst,Precharge
L L L H X REFA ILLEGAL L L L L
L H L H BA,CA,A10 READ/READA ILLEGAL L H L L BA,CA,A10
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2
L L L H X REFA ILLEGAL L L L L
L H L H BA,CA,A10 READ/READA ILLEGAL L H L L BA,CA,A10 L L H H BA,RA ACT Bank Active/ILLEGAL*2
L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code, Mode-Add
Op-Code, Mode-Add
Op-Code, Mode-Add
WRITE/
WRITEA
MRS ILLEGAL
WRITE/
WRITEA
MRS ILLEGAL
WRITE/
WRITEA
MRS ILLEGAL
Begin Read,Determine Auto­Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3
ILLEGAL
ILLEGAL
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29/Oct. /1998
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MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
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Spec.
Spec.
FUNCTION TRUTH TABLE(continued)
Current State /S /RAS /CAS /WE Address Command Action
PRE - H X X X X DESEL NOP(Idle after tRP)
CHARGING L H H H X NOP NOP(Idle after tRP)
ROW H X X X X DESEL NOP(Row Active after tRCD
ACTIVATING L H H H X NOP NOP(Row Active after tRCD
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2
L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA NOP*4(Idle after tRP)
L L L H X REFA ILLEGAL
L L L L
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2
L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2
L L L H X REFA ILLEGAL
L L L L
Op-Code,
MRS ILLEGAL
Mode-Add
Op-Code,
MRS ILLEGAL
Mode-Add
WRITE RE- H X X X X DESEL NOP
COVERING L H H H X NOP NOP
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2 L L H H BA,RA ACT ILLEGAL*2
L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code,
MRS ILLEGAL
Mode-Add
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MH8S72BBFD-7, -8
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Spec.
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FUNCTION TRUTH TABLE(continued)
Current State /S /RAS /CAS /WE Address Command Action
RE- H X X X X DESEL NOP(Idle after tRC)
FRESHING L H H H X NOP
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
NOP(Idle after tRC)
L H H L BA TBST ILLEGAL L H L X BA,CA,A10 READ/WRITE ILLEGAL
L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL
L L L L
MODE H X X X X DESEL NOP(Idle after tRSC)
REGISTER L H H H X NOP NOP(Idle after tRSC)
SETTING L H H L BA TBST ILLEGAL
L H L X BA,CA,A10 READ/WRITE ILLEGAL L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL
L L L L
Op-Code,
MRS ILLEGAL
Mode-Add
Op-Code,
MRS ILLEGAL
Mode-Add
ABBREVIATIONS: H = Hige Level, L = Low Level, X = Don't Care BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle. ILLEGAL = Device operation and / or date-integrity are not guaranteed.
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MH8S72BBFD-7, -8
Preliminary
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FUNCTION TRUTH TABLE FOR CKE
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
Current State
SELF - H X X X X X X INVALID
REFRESH*1 L H H X X X X Exit Self-Refresh(Idle after tRC)
POWER H X X X X X X INVALID
DOWN L H X X X X X Exit Power Down to Idle
ALL BANKS H H X X X X X Refer to Function Truth Table
IDLE*2 H L L L L H X Enter Self-Refresh
CK
CK
n-1
L H L H H H X Exit Self-Refresh(Idle after tRC) L H L H H L X ILLEGAL
L H L H L X X ILLEGAL L H L L X X X ILLEGAL L L X X X X X NOP(Maintain Self-Refresh)
L L X X X X X NOP(Maintain Self-Refresh)
H L H X X X X Enter Power Down H L L H H H X Enter Power Down
H L L H H L X ILLEGAL H L L H L X X ILLEGAL H L L L X X X ILLEGAL
n
/RAS /CAS /WE Add Action
/S
L X X X X X X Refer to Current State = Power Down
ANY STATE H H X X X X X Refer to Function Truth Table
other than H L X X X X X Begin CK0 Suspend at Next Cycle*3
listed above L H X X X X X Exit CK0 Suspend at Next Cycle*3
L L X X X X X Maintain CK0 Suspend
ABBREVIATIONS: H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
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MITSUBISHI LSIs
MH8S72BBFD-7, -8
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POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB high and NOP condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 500µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register. After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode register(MRS). The mode register stores these date until the next MRS command, which may be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is ready for new command.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
LATENCY
MODE
00
CL
0 0 0 0 0 1
0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0BA1BA0
0 0
/CAS LATENCY
WM
R R 2
3
R R R R
0 0
LTMODE BT BL
BURST
LENGTH
BURST
TYPE
BA0,1 A11-0
BL
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0
1 0 1 1 1 0 1 1 1
0
1
CK
/S /RAS /CAS /WE
BT= 0 BT= 1
1 2 4 8 R
R R
FP
SEQUENTIAL INTERLEAVED
V
1 2 4 8 R
R R R
WRITE
MODE
BURST
0
1
SINGLE BIT
R:Reserved for Future Use FP: Full Page
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CK
MITSUBISHI LSIs
MH8S72BBFD-7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Command
Address
DQ
Initial Address
A2 A1 A0
0 0 0 0 0 1 0 1 0
0 1 1 1 0 0
CL= 3 BL= 4
BL
8
Read
Y
Q0 Q1 Q2 Q3
/CAS Latency Burst Length Burst Length
Burst Type
Column Addressing
Sequential Interleaved
0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5
3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3
Write
Y
D0 D1 D2 D3
1 0 1 1 1 0
1 1 1
- 0 0
- 0 1
- 1 0
- 1 1
- - 0
- - 1
5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1
7 0 1 2 0 1 2 3
1 2 3 0
4
2 3 0 1 3 0
0 1
2
1 0
3 4 5 6 3 2 1 0
1 2
7 6 5 4 0 1 2 3
1 0 3 2 2 3 0 1 3 2
0 1 1 0
1 0
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Spec.
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Condition Ratings Unit
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Vdd
VI
VO
IO
Pd
Topr
Tstg
Supply Voltage
Input Voltage
Output Voltage Output Current
Power Dissipation
Operating Temperature
Storage Temperature
with respect to Vss with respect to Vss with respect to Vss
Ta=25°C
RECOMMENDED OPERATING CONDITION
(Ta=0 ~ 70°C, unless otherwise noted)
Symbol
Vdd Vss
Parameter
Supply Voltage Supply Voltage
-0.5 ~ 4.6
-0.5 ~ 4.6
-0.5 ~ 4.6 50
12
0 ~ 70
-45 ~ 100
Limits
Min. Typ. Max.
3.0 0
3.3 0
3.6 0
V V V
mA
W
°C °C
Unit
V V
VIH
VIL
High-Level Input Voltage all inputs
Low-Level Input Voltage all inputs
2.0
-0.3
CAPACITANCE
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
Symbol
CI(A) CI(C) CI(K)
CI/O
Input Capacitance, address pin
Input Capacitance, control pin
Input Capacitance, CK0 pin
Input Capacitance, I/O pin
Parameter
Test Condition Limits(max.) Unit
VI = Vss
f=1MHz
Vi=25mVrms
MITSUBISHI ELECTRIC
Vdd+0.3
0.8
20 20 20 22
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V
V
pF pF
pF pF
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Spec.
AVERAGE SUPPLY CURRENT from Vdd
(Ta=0 ~70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Parameter
operating current one bank active (discrete)
precharge stanby current in power-down mode
precharge stanby current in non power-down mode
active stanby current in power-down mode
active stanby current in non power-down mode
one bank active (discrete)
burst current auto-refresh current
self-refresh current
Note:Input signals are changed one time during 30ns.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Symbol
Icc1
Icc2P Icc2PS
Icc2N Icc2NS
Icc3P Icc3PS
Icc3N Icc3NS
Icc4 Icc5 Icc6
tRC=min.tCLK=min, BL=1, IOL=min CKE=VILmax,tCLK=15ns
CKE=CLK=VILmax(fixed)
CKE=/CS=VIHmin,tCLK=15ns(Note) CKE=VIHmin,CLK=VILmax(fixed)
CKE=VILmax,tCLK=15ns CKE=CLK=VILmax(fixed)
CKE=/CS=VIHmin,tCLK=15ns CKE=VIHmin,CLK=VILmax(fixed)
tCLK=min, BL=4, CL=3,IOL=0mAall banks active(discerte)
tRC=min, tCLK=min CKE <0.2V 34
Test Condition
MITSUBISHI LSIs
Limits (max)
-7, -8 1015
43 34 mA
223 205
61 43
520 385
1060 1375
Unit
mA
mA
mA mA
mA
mA mA
mA
mA mA mA
AC OPERATING CONDITIONS AND CHARACTERISTICS
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Symbol Parameter Test Condition
VOH(DC) High-Level Output Voltage(DC) IOH=-2mA 2.4 V VOL(DC) VOH(AC)High-Level Output Voltage(AC) CL=50pF,
IOZ Off-stare Output Current Q floating VO=0 ~ Vdd
VOL(AC) Low-Level Output Voltage(AC) CL=50pF, IOL=2mA 0.8 V
Low-Level Output Voltage(DC)
Input Current
Ii
IOL=2mA 0.4 V
IOH=-2mA
VIH=0 ~ Vdd+0.3V
Limits
Min. Max.
2 V
-5 5
-10
10
Unit
uA uA
MITSUBISHI ELECTRIC
29/Oct. /1998
15
MH8S72BBFD-7, -8
Preliminary
Preliminary
Spec.
Spec.
AC TIMING REQUIREMENTS
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted) Input Pulse Levels: 0.8V to 2.0V Input Timing Measurement Level: 1.4V
LATCH MODE
Symbol Parameter
tCLK CK cycle time
tCH CK High pulse width
tCL CK Low pilse width
tT Transition time of CK tIS Input Setup time(all inputs) tIH Input Hold time(all inputs)
tRC Row cycle time
tRCD Row to Column Delay
tRAS Row Active time
tRP Row Precharge time
tWR Write Recovery time
tRRD Act to Act Deley time
tCCD Col to Col Delay time
tRSC Mode Register Set Cycle time tSRX Self Refresh Exit time
tREF Refresh Interval time
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Limits
-7
CL=3
Min.
10 10CL=4 10
3 3 1 2 0
70 20 50 20 10 20 10 20
10
Max.
10 ns
100000 ns
64 ms
MITSUBISHI LSIs
Unit
Min.
13
4 4 1 2 0
70 20 50 20 10 20 10 20
10
-8 Max.
10
100000
64
ns ns
ns ns
ns ns
ns ns
ns ns ns ns ns
ns
Note:1 The timing requirements are assumed tT=1ns. If tT is longer than 1ns, (tT-1)ns should be added to the parameter.
CK
1.4V
Any AC timing is referenced to the input signal crossing through
1.4V.
Signal
1.4V
29/Oct. /1998
MITSUBISHI ELECTRIC
16
Preliminary
Preliminary
Spec.
Spec.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Symbol Parameter
tCLK CK cycle time
tCH CK High pulse width
tCL CK Low pilse width
tT Transition time of CK tIS Input Setup time(all inputs) tIH Input Hold time(all inputs)
tRC Row cycle time
tRCD Row to Column Delay
tRAS Row Active time
tRP Row Precharge time
tWR Write Recovery time
tRRD Act to Act Deley time
tCCD Col to Col Delay time
tRSC Mode Register Set Cycle time tSRX Self Refresh Exit time
tREF Refresh Interval time
CL=2
MITSUBISHI LSIs
MH8S72BBFD-7, -8
Limits
-7
Min.
10 10CL=3 10
3 3 1 8 0
70 20 50 20 10 20 10 20
10
Max.
10 ns
100000 ns
64 ms
Min.
13
70 20 50 20 10 20 10 20
10
-8 Max.
4 4 1 8 0
10
100000
64
Unit
ns ns
ns ns
ns ns
ns ns
ns ns ns ns ns
ns
Note:1 The timing requirements are assumed tT=1ns. If tT is longer than 1ns, (tT-1)ns should be added to the parameter.
SWITCHING CHARACTERISTICS
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
LATCH MODE
Limits
Symbol Parameter
tAC Access time from CK
tOH
tOLZ
tOHZ
Output Hold time from CK Delay time, output low
impedance from CK
Delay time, output high
impedance from CK
CL=3 CL=4
-7
Min. Max.
6 6 6
3 0
3 6
-8
Min. Max.
3 0
3 6
Unit
7
ns
ns ns
ns
MITSUBISHI ELECTRIC
29/Oct. /1998
17
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