603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Spec.
Spec.
PRELIMINARY
Some of contents are subject to change without notice.
DESCRIPTION
The MH8S72BBFD is 8388608 - word x 72-bit
Synchronous DRAM module. This consist of nine industry
standard 8M x 8 Synchronous DRAMs in TSOP.
The mounting of TSOP on a card edge dual in-line package
provides any application where high densities and large of
quantities memory are required.
This is a socket-type memory module ,suitable for easy
interchange or addition of module.
MITSUBISHI LSIs
MH8S72BBFD-7, -8
85pin
1pin
FEATURES
Type name
Utilizes industry standard 8M X 8 Synchronous DRAMs in
TSOP package , industry standard Resistered buffer in
TSSOP package and industry standard PLL in TSSOP
package
Single 3.3V +/- 0.3V supply
LVTTL Interface
Burst length 1/2/4/8/Full Page(programmable)
Burst Write / Single Write(programmable)
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycles every 64ms
Discrete IC and module design conform to
PC/100 specification.
(module Spec. Rev. 1.1 and SPD 1.2A)
Max.
Frequency
100MHz
CLK
Access Time
[component level]
6ns (CL = 2, 3)MH8S72BBFD-7
6ns (CL = 3)MH8S72BBFD-8100MHz
94pin
95pin
124pin
125pin
Back side
10pin
11pin
Front side
40pin
41pin
APPLICATION
Main memory unit for computers, Microcomputer memory.
MIT-DS-0228-0.2
MITSUBISHI
ELECTRIC
168pin
84pin
29/Oct. /1998
1
Preliminary
Preliminary
Spec.
Spec.
PIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAME
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN FUNCTION
MITSUBISHI LSIs
MH8S72BBFD-7, -8
CK0
CKE0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
Combination of /RAS,/CAS,/W defines basic commands.
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-8.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
BA0-1
DQ0-63
CB0-7
DQM0-7
Vdd,Vss
REGE
Bank Address:BA0,1 is not simply BA.BA0,1 specifies
Input
Input/Output
Input
Power Supply Power Supply for the memory mounted module.
Output
the bank to which a command is applied.BA must be set
with ACT,PRE,READ,WRITE commands
Data In and Data out are referenced to the rising edge of
CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high
in burst read,Dout is disabled at the next but one cycle.
Register enable:When REGE is low,All control signals and
address are buffered. (Buffer mode) When REGE is
high,All control and address are latched. (Latch mode)
MIT-DS-0228-0.2
MITSUBISHI
ELECTRIC
29/Oct. /1998
4
MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
Preliminary
Spec.
Spec.
BASIC FUNCTIONS
The MH8S72BBFD provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge
option,respectively.
To know the detailed definition of commands please see the command truth table.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks are
deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address are
generated internally. After this command, the banks are precharged automatically.
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29/Oct. /1998
MITSUBISHI
ELECTRIC
5
Preliminary
Preliminary
Spec.
Spec.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH8S72BBFD-7, -8
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Precharge All BankPREAHXLLHLVHX
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
ACTHXLLHHVVV
WRITEHXLLHHLVLV
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
CK
n-1CKn
/RAS /CAS/WEBAA10A0-9
/S
Auto-RefreshREFAHHLHLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSXLHHLXXXXXX
LHLHHHXXX
Burst TerminateTERMHXLHHLXXX
Mode Register SetMRSHXLLLLLLV*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
MIT-DS-0228-0.2
MITSUBISHI
ELECTRIC
29/Oct. /1998
6
MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
Preliminary
Spec.
Spec.
FUNCTION TRUTH TABLE
Current State/S/RAS /CAS/WEAddressCommandAction
IDLEHXXXXDESELNOP
ROW ACTIVEHXXXXDESELNOP
READHXXXXDESELNOP(Continue Burst to END)
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
LHHHXNOPNOP
LHHLBATBSTILLEGAL*2
LHLXBA,CA,A10READ/WRITE ILLEGAL*2
LLHHBA,RAACTBank Active,Latch RA
LLHLBA,A10PRE/PREANOP*4
LLLHXREFAAuto-Refresh*5
LLLL
LHHHXNOPNOP
LHHLBATBSTNOP
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
LLLL
LHHHXNOPNOP(Continue Burst to END)
LHHLBATBSTTerminate Burst
other thanHLXXXXXBegin CK0 Suspend at Next Cycle*3
listed aboveLHXXXXXExit CK0 Suspend at Next Cycle*3
LLXXXXXMaintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
MIT-DS-0228-0.2
29/Oct. /1998
MITSUBISHI
ELECTRIC
11
MITSUBISHI LSIs
MH8S72BBFD-7, -8
Preliminary
Preliminary
Spec.
Spec.
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a
SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB high and NOP
condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 500µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which may
be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is
ready for new command.
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
LATENCY
MODE
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9A8A7 A6A5A4 A3A2A1 A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
LENGTH
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
CK
/S
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
WRITE
MODE
MIT-DS-0228-0.2
BURST
0
1
SINGLE BIT
R:Reserved for Future Use
FP: Full Page
29/Oct. /1998
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MITSUBISHI
ELECTRIC
Preliminary
Preliminary
Spec.
Spec.
CK
MITSUBISHI LSIs
MH8S72BBFD-7, -8
603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM