Mitsubishi MH32S72AVJA-6 Datasheet

Preliminary Spec.
DESCRIPTION
APPLICATION
FEATURES
-6
Frequency
133MHz
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH32S72AVJA is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 32M x 4 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. This is a socket-type memory module ,suitable for easy interchange or addition of module.
MITSUBISHI LSIs
MH32S72AVJA-6
85pin
1pin
Max.
Utilizes industry standard 32M X 4 Synchronous DRAMs in TSOP package , industry standard Resistered buffer in TSSOP package,industry standard PLL in TSSOP package Single 3.3V +/- 0.3V supply Max.Clock frequency 133MHz Fully synchronous operation referenced to clock rising edge 4-bank operation controlled by BA0,BA1(Bank Address) /CAS latency -2/3(programmable,at buffer mode) LVTTL Interface Burst length 1/2/4/8/Full Page(programmable) Burst type- Sequential and interleave burst (programmable) Random column access Burst Write / Single Write(programmable) Auto precharge / All bank precharge controlled by A10 Auto refresh and Self refresh 4096 refresh cycles every 64ms
Discrete IC and module design conform to PC133 specification.
Access Time from CLK [component level]
5.4ns (CL = 4 at Latch mode)
94pin 95pin
124pin
125pin
10pin 11pin
40pin
41pin
Main memory or graphic memory in computer systems
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
168pin
84pin
17.Mar.2000
1
Preliminary Spec.
/WE
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO. PIN NAME PIN NO. PIN NAME PIN NO. PIN NAME PIN NO. PIN NAME
1 2 DQ0 44 NC 3 DQ1 45 /S2 4 DQ2 46 DQMB2 5 DQ3 47 DQMB3 6 VDD 48 NC 7 DQ4 49 VDD 8 DQ5 50 NC
9 DQ6 51 NC 10 DQ7 52 11 DQ8 53 12 13 DQ9 55 DQ16 14 DQ10 56 DQ17 15 DQ11 57 DQ18 16 DQ12 58 DQ19 17 DQ13 59 VDD 18 VDD 60 DQ20 19 DQ14 61 NC 20 DQ15 62 21 22 23 VSS 65 DQ21 24 NC 66 DQ22 25 NC 67 DQ23 26 VDD 68 27 28 DQMB0 70 DQ25 29 DQMB1 71 DQ26 30 /S0 72 DQ27 31 NC 73 VDD 32 VSS 74 DQ28 33 A0 75 DQ29 34 A2 76 DQ30 35 A4 77 DQ31 36 A6 78 VSS 37 A8 79 38 39 40 VDD 82 SDA 41 VDD 83 SCL
42 CK0 84 VDD
VSS
VSS
CB0 CB1
A10
BA1
43
54 VSS
63 64 VSS
69 DQ24
80 NC 81
VSS 85
CB2 CB3
100 101 102 103
NC
CKE1
VSS 110
CK2
WP
104 105 106 107 108 109
111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126
86 87 88 89 90 91 92 93 94 95 96 97 98 99
VSS 127 DQ32 128 DQ33 129 DQ34 130 DQMB6 DQ35 131 DQMB7
VDD 132 DQ36 133 VDD DQ37 134 NC DQ38 135 NC DQ39 136 DQ40 137
VSS 138 VSS DQ41 139 DQ48 DQ42 140 DQ49 DQ43 141 DQ50 DQ44 142 DQ51 DQ45 143 VDD
VDD 144 DQ52 DQ46 145 NC DQ47 146
CB4
CB5
VSS 149 DQ53
NC 150 DQ54 NC 151 DQ55
VDD 152 VSS
/CAS 153 DQ56 DQMB4 154 DQ57 DQMB5 155 DQ58
NC
/RAS 157 VDD
VSS 158 DQ60
A1 159 DQ61 A3 160 DQ62 A5 161 DQ63 A7 162 VSS A9 163
BA0
A11 VDD 166 SA1 CK1 167 SA2
NC
147 148 VSS
156 DQ59
164 NC 165 SA0
168 VDD
VSS
CKE0
NC
NC
CB6 CB7
NC
REGE
CK3
NC = No Connection
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
17.Mar.2000
2
Preliminary Spec.
D0
D1
D2D3D4
D5D6D7
D8D9D10
D11
D12
D13
D14
D15
D16
D17
R/S0,2
RDQM 0
RDQM 1
RDQM 4
RDQM 3
RDQM 2
RDQM 7
RDQM 5
RDQM 6
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH32S72AVJA-6
Add CKE0
/S0,2
DQM0-7
/W
/RAS
/CAS
10K
VDD
REGE
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
CB0 CB1
CB2 CB3
DQ16 DQ17 DQ18 DQ19
DQ20 DQ21 DQ22 DQ23
RCKE0
RDQM0-7
DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39
DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47
CB4 CB5 CB6 CB7
DQ48 DQ49
DQ50 DQ51
DQ52 DQ53 DQ54 DQ55
DQ24 DQ25 DQ26 DQ27
DQ28 DQ29 DQ30 DQ31
From PLL
CK0 CK1 - CK3 Terminated
RCKE0 R/S0 R/S2
PLL
D0-17 D0-4,9-13 D5-8,14-17
MIT-DS-0376-0.2
D0-1 D2-4 D5-6
D7-8 D9-10 D11-13 D14-15 D16-17
MITSUBISHI ELECTRIC
DQ56 DQ57
DQ58 DQ59
DQ60 DQ61
DQ62 DQ63
SCL
WP
47K
VDD
VSS
SERIAL PD
A0 A1 A2
SA0 SA1 SA2
17.Mar.2000
SDA
D0 to D17
D0 to D17
3
Preliminary Spec.
PIN FUNCTION
CKE0
Register enable:When REGE is low,All control signals and
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH32S72AVJA-6
CK0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising edge of CK
Clock Enable:CKE controls internal clock.When CKE is low,internal clock for the following cycle is ceased. CKE is also used to select auto / self refresh. After self refresh mode is started, CKE E becomes asynchronous input.Self refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means No Operation.
Combination of /RAS,/CAS,/W defines basic commands. A0-11 specify the Row/Column Address in conjunction with BA.The Row Address is specified by A0-11.The Column Address is specified by A0-10.A10 is also used to indicate precharge option.When A10 is high at a read / write command, an auto precharge is performed. When A10 is
BA0-1
DQ0-63 CB0-7
DQM0-7
Vdd,Vss
REGE
Input
Input/Output
Input
Power Supply
Input
high at a precharge command, both banks are precharged. Bank Address:BA0,1 is specifies the four bank to which
a command is applied.BA must be set with ACT ,PRE ,READ ,WRITE commands
Data In and Data out are referenced to the rising edge of CK
Din Mask/Output Disable:When DQMB is high in burst write.Din for the current cycle is masked.When DQMB is high in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted module.
address are buffered. (Buffer mode) When REGE is high,All control and address are latched. (Latch mode)
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
17.Mar.2000
4
Preliminary Spec.
BASIC FUNCTIONS
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH32S72AVJA provides basic functions,bank(row)activate,burst read / write, bank(row)precharge,and auto / self refresh. Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge option,respectively. To know the detailed definition of commands please see the command truth table.
CK
/S
Chip Select : L=select, H=deselect
/RAS
/CAS
/WE CKE A10
Command Command Command
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output data appears after /CAS latency. When A10 =H at this command,the bank is deactivated after the burst read(auto-precharge, READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also terminates burst read / write operation. When A10 =H at this command, both banks are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
REFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
17.Mar.2000
5
Preliminary Spec.
Precharge All Bank
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH32S72AVJA-6
COMMAND
Deselect DESEL H X H X X X X X X
No Operation NOP H X L H H H X X X
Row Adress Entry &
Bank Activate
Single Bank Precharge PRE H X L L H L V L X
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
MNEMONIC
ACT H X L L H H V V V
PREA
WRITE
WRITEA H X L H L L V H V
READ H X L H L H V L V
READA H X L H L H V H V
CKE
CKE
n-1
H X L L H L X H X H X L H L L V L V
n
/S
/RAS
/CAS
/WE BA0,1 A10
A11
X X
V
X X
V
V
V
V
A0-9
Auto-Refresh REFA H H L L L H X X X
Self-Refresh Entry REFS H L L L L H X X X
Self-Refresh Exit REFSX L H H X X X X X X
L H L H H H X X X
Burst Terminate TERM
Mode Register Set
MRS
H X L H H L X X X H X L L L L L L
X X X X X L
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
V*1
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
17.Mar.2000
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Preliminary Spec.
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH32S72AVJA-6
Current State /S /RAS /CAS /WE Address
IDLE H X X X X DESEL NOP
L H H H X NOP NOP L H H L L H L X L L H H L L H L L L L H X REFA
L L L L
ROW ACTIVE H X X X X DESEL NOP
L H H H X NOP NOP L H H L BA
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10 L L H H BA,RA ACT Bank Active/ILLEGAL*2
L L H L BA,A10 PRE/PREA Precharge/Precharge All L L L H X REFA ILLEGAL
L L L L
READ H X X X X DESEL NOP(Continue Burst to END)
L H H H X NOP NOP(Continue Burst to END) L H H L
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10 WRITE/WRITEA
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Terminate Burst,Precharge L L L H X REFA ILLEGAL
L L L L
BA TBST ILLEGAL*2 BA,CA,A10
BA,RA BA,A10 PRE/PREA NOP*4
Op-Code, Mode-Add
Op-Code, Mode-Add
BA
Op-Code, Mode-Add
Command
READ/WRITE ILLEGAL*2
ACT Bank Active,Latch RA
Auto-Refresh*5
MRS Mode Register Set*5
TBST
WRITE/
WRITEA
MRS ILLEGAL
TBST Terminate Burst
MRS ILLEGAL
NOP Begin Read,Latch CA, Determine Auto-Precharge Begin Write,Latch CA, Determine Auto-Precharge
Terminate Burst,Latch CA, Begin New Read,Determine Auto-Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3
Action
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
17.Mar.2000
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Preliminary Spec.
Some contents are subject to change without notice.
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
MITSUBISHI LSIs
Current State /S /RAS /CAS /WE Address
WRITE H X X X X DESEL NOP(Continue Burst to END)
L H H H X NOP NOP(Continue Burst to END) L H H L BA TBST Terminate Burst
L H L H BA,CA,A10
L H L L BA,CA,A10
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Terminate Burst,Precharge
L L L H X REFA ILLEGAL L L L L
READ with H X X X X DESEL NOP(Continue Burst to END)
AUTO L H H H X NOP NOP(Continue Burst to END)
PRECHARGE L H H L BA TBST ILLEGAL
L H L H BA,CA,A10 READ/READA ILLEGAL L H L L BA,CA,A10 L L H H BA,RA ACT Bank Active/ILLEGAL*2
L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
WRITE with H X X X X DESEL NOP(Continue Burst to END)
AUTO L H H H X NOP NOP(Continue Burst to END)
PRECHARGE L H H L
L H L H BA,CA,A10 READ/READA ILLEGAL L H L L BA,CA,A10 L L H H
L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code, Mode-Add
Op-Code, Mode-Add
BA
BA,RA
Op-Code, Mode-Add
Command
Terminate Burst,Latch CA,
READ/READA
WRITE/
WRITEA
MRS ILLEGAL
WRITE/
WRITEA
MRS ILLEGAL
TBST ILLEGAL
WRITE/
WRITEA
ACT Bank Active/ILLEGAL*2
MRS ILLEGAL
Begin Read,Determine Auto­Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3
ILLEGAL
ILLEGAL
Action
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
17.Mar.2000
8
Preliminary Spec.
Some contents are subject to change without notice.
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
MITSUBISHI LSIs
Current State /S /RAS /CAS /WE Address
PRE - H X X X X DESEL NOP(Idle after tRP)
CHARGING L H H H X NOP NOP(Idle after tRP)
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2
L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA NOP*4(Idle after tRP) L L L H X REFA ILLEGAL
L L L L
ROW H X X X X DESEL NOP(Row Active after tRCD
ACTIVATING L H H H X NOP NOP(Row Active after tRCD
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2 L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code, Mode-Add
Op-Code, Mode-Add
Command
MRS ILLEGAL
MRS ILLEGAL
Action
WRITE RE- H X X X X DESEL NOP
COVERING L H H H X NOP NOP
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2 L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
MIT-DS-0376-0.2
Op-Code,
MRS ILLEGAL
Mode-Add
MITSUBISHI ELECTRIC
17.Mar.2000
9
Preliminary Spec.
1. All entries assume that CKE was High during the preceding clock cycle and the current
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
Current State /S /RAS /CAS /WE Address Command Action
RE- H X X X X DESEL NOP(Idle after tRC)
FRESHING L H H H X NOP
L H H L BA TBST ILLEGAL L H L X BA,CA,A10 READ/WRITE ILLEGAL
L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL
L L L L
MODE H X X X X DESEL NOP(Idle after tRSC)
REGISTER L H H H X NOP NOP(Idle after tRSC)
SETTING L H H L BA TBST ILLEGAL
L H L X BA,CA,A10 READ/WRITE ILLEGAL L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL
L L L L
Op-Code,
MRS ILLEGAL
Mode-Add
Op-Code,
MRS ILLEGAL
Mode-Add
NOP(Idle after tRC)
ABBREVIATIONS: H = Hige Level, L = Low Level, X = Don't Care BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0376-0.2
MITSUBISHI
17.Mar.2000
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Preliminary Spec.
Some contents are subject to change without notice.
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
MITSUBISHI LSIs
Current State
SELF - H X X X X X X
REFRESH*1 L H H X X X X
POWER H X X X X X X
DOWN L H X X X X X
ALL BANKS H H X X X X X
IDLE*2 H L L L L H X
CKE
CKE
n-1
L H L H H H X L H L H H L X
L H L H L X X L H L L X X X L L X X X X X
L L X X X X X
H L H X X X X H L L H H H X H L L H H L X H L L H L X X H L L L X X X
n
/RAS /CAS /WE Add Action
/S
INVALID Exit Self-Refresh(Idle after tRC) Exit Self-Refresh(Idle after tRC) ILLEGAL ILLEGAL ILLEGAL NOP(Maintain Self-Refresh) INVALID Exit Power Down to Idle NOP(Maintain Self-Refresh) Refer to Function Truth Table Enter Self-Refresh Enter Power Down Enter Power Down ILLEGAL ILLEGAL ILLEGAL
L X X X X X X
ANY STATE H H X X X X X
other than H L X X X X X
listed above L H X X X X X
L L X X X X X
Refer to Current State = Power Down
Refer to Function Truth Table Begin CK0 Suspend at Next Cycle*3 Exit CK0 Suspend at Next Cycle*3 Maintain CK0 Suspend
ABBREVIATIONS: H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All banks idle State.
3. Must be legal command.
MIT-DS-0376-0.2
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Preliminary Spec.
POWER ON SEQUENCE
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
LENGTH
BURST
LATENCY
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB0-7 high and NOP condition at the inputs.
2. Maintain stable power, stable clock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode register(MRS). The mode register stores these date until the next MRS command, which may be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is ready for new command.
CK
/S /RAS /CAS /WE
BT= 0 BT= 1
1 2 4 8 R R R
FP
SEQUENTIAL INTERLEAVED
V
1 2 4 8 R R R R
MODE
00
CL 0 0 0 0 0 1
0 1 0 0 1 1
1 0 0 1 0 1 1 1 0 1 1 1
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0BA1BA0
0 0
/CAS LATENCY
WM
R R 2 3 R R R R
0 0
LTMODE BT BL
BURST
TYPE
BA0,1 A11-0
BL
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0
1 0 1 1 1 0 1 1 1
0
1
WRITE
MODE
MIT-DS-0376-0.2
0
1
BURST SINGLE BIT
MITSUBISHI
R:Reserved for Future Use FP: Full Page
17.Mar.2000
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Preliminary Spec.
Write
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CK
Command
Read
MITSUBISHI LSIs
MH32S72AVJA-6
Address
DQ
Initial Address
A2 A1 A0
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0
CL= 3 BL= 4
BL
8
Y
Q0 Q1 Q2 Q3
/CAS Latency
Sequential Interleaved
0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3
Burst Length
Column Addressing
Burst Type
Y
D0 D1
Burst Length
D2
D3
1 0 1 1 1 0 1 1 1
- 0 0
- 0 1
- 1 0
- 1 1
- - 0
- - 1
MIT-DS-0376-0.2
5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1 7 0 1 2 0 1 2 3 1 2 3 0
4
2 3 0 1 3 0 0 1
2
1 0
3 4 5 6 3 2 1 0
1 2
7 6 5 4 0 1 2 3 1 0 3 2 2 3 0 1 3 2 0 1 1 0
1 0
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Preliminary Spec.
ABSOLUTE MAXIMUM RATINGS
Parameter
mA
RECOMMENDED OPERATING CONDITION
Parameter
CAPACITANCE
Parameter
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH32S72AVJA-6
Symbol
Vdd
VI
VO
IO
Pd
Topr
Tstg
(Ta=0 ~ 70°C, unless otherwise noted)
Symbol
Supply Voltage
Input Voltage Output Voltage Output Current
Power Dissipation
Operating Temperature
Storage Temperature
Condition Ratings Unit
with respect to Vss with respect to Vss with respect to Vss
Ta=25°C
Limits
Min. Typ. Max.
-0.5 ~ 4.6
-0.5 ~ 4.6
-0.5 ~ 4.6 50
22
0 ~ 70
-40 ~ 100
V V V
W
°C °C
Unit
Vdd Vss
VIH*1
VIL*2
Note) 1:VIH(max)=5.5V for pulse width less than 10ns.
2.VIL(min)=-1.0 for pulse width less than 10ns.
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
Symbol
CI(A) CI(C)
CI(K)
CI/O
High-Level Input Voltage all inputs
Low-Level Input Voltage all inputs
Input Capacitance, address pin
Input Capacitance, control pin
Input Capacitance, CK0 pin
Input Capacitance, I/O pin
Supply Voltage Supply Voltage
3.0 0
2.0
-0.3
Test Condition Limits(max.) Unit
1MHz,
1.4V bias 200mV swing
3.3 0
16.5
Vdd+0.3
25 25
35
3.6 0
0.8
V V
V V
pF pF pF pF
MIT-DS-0376-0.2
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Preliminary Spec.
AVERAGE SUPPLY CURRENT from Vdd
AC OPERATING CONDITIONS AND CHARACTERISTICS
Limits
Unit
IOH=-2mA
Limits
(max)
precharge stanby
in power-down mode
precharge stanby current
in non power-down mode
active stanby current
one bank active (discrete)
Some contents are subject to change without notice.
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
(Ta=0 ~70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
MITSUBISHI LSIs
Parameter
operating current one bank active (discrete)
current
in non power-down mode
burst current
auto-refresh current self-refresh current
Note)
1.Icc(max) is specified at the output open condition.
Symbol
Icc1
Icc2P
Icc2PS
Icc2N Icc2NS
Icc3N Icc3NS
Icc4 Icc5
Icc6
tRC=min.tCLK=min, BL=1,CL=3 CKE=L,tCLK=15ns, /CS>Vcc-0.2V
CKE=CLK=L, /CS>Vcc-0.2V
CKE=H,tCLK=15ns,VIH>Vcc-0.2V,VIL<0.2V CKE=H,CLK=L,VIH>Vcc-0.2V,VIL<0.2V(fixed)
CKE=H,tCLK=15ns CKE=H,CLK=L
tCLK=min, BL=4, CL=3,all banks active(discerte) mA
tRC=min, tCLK=min CKE <0.2V
Test Condition
-6
2050
286 268
700 520
790 610
2770 3130
286
Unit
mA
mA mA
mA mA
mA
mA
mA mA
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Symbol Parameter Test Condition
VOH(DC) High-Level Output Voltage(DC) VOL(DC) Low-Level Output Voltage(DC) IOL=2mA
IOZ Off-stare Output Current Q floating VO=0 ~ Vdd
Ii Input Current VIH=0 ~ Vdd+0.3V -10 10 uA
MIT-DS-0376-0.2
MITSUBISHI
Min. Max.
2.4 V
-10
0.4 V uA
10
17.Mar.2000
15
Preliminary Spec.
AC TIMING REQUIREMENTS
Parameter
Self Refresh Exit time
Some contents are subject to change without notice.
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted) Input Pulse Levels: 0.8V to 2.0V
Input Timing Measurement Level: 1.4V
LATCH MODE
Symbol
tCLK CK cycle time tCH CK High pulse width
tCL CK Low pulse width tT Transition time of CK tIS Input Setup time(all inputs) tIH Input Hold time(all inputs) tRC Row Cycle time tRCD Row to Column Delay tRAS Row Active time tRP Row Precharge time tWR
Write Recovery time tRRD Act to Act Deley time tRSC Mode Register Set Cycle time tSRX tPDE Power Down Exit time tREF Refresh Interval time
CL=3 CL=4 7.5 ns
Min. Max.
10
2.5
2.5 1
1.5
0.8
67.5 20
45 20
15 15
15
7.5
7.5
MITSUBISHI LSIs
Limits
Unit
10
100K
64
ms
ns
ns ns ns ns ns ns
ns ns ns ns ns ns
ns ns
CK
Signal
MIT-DS-0376-0.2
MITSUBISHI ELECTRIC
1.4V
1.4V
Any AC timing is referenced to the input signal crossing through 1.4V.
17.Mar.2000
16
Preliminary Spec.
SWITCHING CHARACTERISTICS
, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
Parameter
Output Hold time
Parameter
Self Refresh Exit time
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AVJA-6
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Limits
Symbol
CL=2
tCLK CK cycle time
CL=3 ns tCH CK High pulse width ns tCL CK Low pulse width
tT Transition time of CK tIS Input Setup time(all inputs) tIH Input Hold time(all inputs) ns tRC Row Cycle time
tRCD Row to Column Delay tRAS Row Active time tRP Row Precharge time
tWR
Write Recovery time tRRD Act to Act Deley time tRSC Mode Register Set Cycle time tSRX tPDE Power Down Exit time
tREF Refresh Interval time
Min. Max.
10
7.5
2.5
2.5 1
6.5
0
67.5 20 45
20 15 15
10
7.5
7.5
10
100K
64
Unit
ns
ns ns ns
ns ns ns ns ns ns ns ns ns
ms
(Ta=0 ~ 70°C
LATCH MODE
Limits
Symbol
Unit
Min. Max.
6
ns
5.4 ns
tAC Access time from CK
tOH
from CK
CL=3
CL=4
CL=3 CL=4
3
2.7
Delay time, output low
tOLZ tOHZ
impedance from CK
Delay time, output high
impedance from CK
0
2.7 5.4
ns ns
NOTE)
1.If clock rising time is longer than 1ns, (tr /2-0.5ns) should be added to the parameter.
MIT-DS-0376-0.2
MITSUBISHI
17.Mar.2000
17
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